JP7430154B2 - 加工装置、及び加工品の製造方法 - Google Patents

加工装置、及び加工品の製造方法 Download PDF

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Publication number
JP7430154B2
JP7430154B2 JP2021055215A JP2021055215A JP7430154B2 JP 7430154 B2 JP7430154 B2 JP 7430154B2 JP 2021055215 A JP2021055215 A JP 2021055215A JP 2021055215 A JP2021055215 A JP 2021055215A JP 7430154 B2 JP7430154 B2 JP 7430154B2
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JP
Japan
Prior art keywords
tray
section
moving
cutting
sorting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021055215A
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English (en)
Japanese (ja)
Other versions
JP2022152439A (ja
Inventor
元樹 深井
聡子 堀
雄哉 坂上
裕子 山本
翔 吉岡
昌一 片岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2021055215A priority Critical patent/JP7430154B2/ja
Priority to PCT/JP2021/048104 priority patent/WO2022209080A1/ja
Priority to CN202180093048.XA priority patent/CN117178352A/zh
Priority to KR1020237026134A priority patent/KR20230124085A/ko
Priority to TW111109726A priority patent/TWI823298B/zh
Publication of JP2022152439A publication Critical patent/JP2022152439A/ja
Application granted granted Critical
Publication of JP7430154B2 publication Critical patent/JP7430154B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Seeds, Soups, And Other Foods (AREA)
  • General Preparation And Processing Of Foods (AREA)
JP2021055215A 2021-03-29 2021-03-29 加工装置、及び加工品の製造方法 Active JP7430154B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021055215A JP7430154B2 (ja) 2021-03-29 2021-03-29 加工装置、及び加工品の製造方法
PCT/JP2021/048104 WO2022209080A1 (ja) 2021-03-29 2021-12-24 加工装置、及び加工品の製造方法
CN202180093048.XA CN117178352A (zh) 2021-03-29 2021-12-24 加工装置及加工品的制造方法
KR1020237026134A KR20230124085A (ko) 2021-03-29 2021-12-24 가공 장치 및 가공품의 제조 방법
TW111109726A TWI823298B (zh) 2021-03-29 2022-03-17 加工裝置及加工品的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021055215A JP7430154B2 (ja) 2021-03-29 2021-03-29 加工装置、及び加工品の製造方法

Publications (2)

Publication Number Publication Date
JP2022152439A JP2022152439A (ja) 2022-10-12
JP7430154B2 true JP7430154B2 (ja) 2024-02-09

Family

ID=83455778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021055215A Active JP7430154B2 (ja) 2021-03-29 2021-03-29 加工装置、及び加工品の製造方法

Country Status (5)

Country Link
JP (1) JP7430154B2 (zh)
KR (1) KR20230124085A (zh)
CN (1) CN117178352A (zh)
TW (1) TWI823298B (zh)
WO (1) WO2022209080A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007026433A1 (ja) 2005-08-31 2007-03-08 Hirata Corporation ワークハンドリング装置
JP2007536727A (ja) 2004-05-07 2007-12-13 ハンミ セミコンダクター カンパニー リミテッド 半導体パッケージ製造工程用切断及びハンドラシステム
KR101689023B1 (ko) 2015-11-10 2016-12-22 주식회사 이노비즈 이중 트레이 이송장치 및 이를 갖는 반도체 검사 및 분류시스템

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100988634B1 (ko) * 2008-06-25 2010-10-18 세크론 주식회사 기판 이송 장치 및 이를 포함하는 다이 본딩 장치
TWM362224U (en) * 2009-02-25 2009-08-01 Hi Lo System Res Co Ltd Chip tester
KR101133188B1 (ko) * 2009-03-27 2012-04-09 (주)제이티 소자소팅장치 및 그 방법
JP5589525B2 (ja) * 2010-04-20 2014-09-17 澁谷工業株式会社 物品分類装置
KR101452095B1 (ko) * 2013-03-27 2014-10-17 세메스 주식회사 트레이 이송 장치
JP6218526B2 (ja) * 2013-09-20 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
KR102401058B1 (ko) * 2015-05-12 2022-05-23 (주)제이티 소자핸들러

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007536727A (ja) 2004-05-07 2007-12-13 ハンミ セミコンダクター カンパニー リミテッド 半導体パッケージ製造工程用切断及びハンドラシステム
WO2007026433A1 (ja) 2005-08-31 2007-03-08 Hirata Corporation ワークハンドリング装置
KR101689023B1 (ko) 2015-11-10 2016-12-22 주식회사 이노비즈 이중 트레이 이송장치 및 이를 갖는 반도체 검사 및 분류시스템

Also Published As

Publication number Publication date
TWI823298B (zh) 2023-11-21
WO2022209080A1 (ja) 2022-10-06
JP2022152439A (ja) 2022-10-12
KR20230124085A (ko) 2023-08-24
CN117178352A (zh) 2023-12-05
TW202237520A (zh) 2022-10-01

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