JP7429732B2 - Multi-head multi-wavelength PCB laser drilling device and method - Google Patents

Description

The present invention relates to the technical field of PCB processing and manufacturing equipment, particularly to a multi-head multi-wavelength PCB laser drilling apparatus and method.

In recent years, electronic products such as mobile phones, notebook computers, and digital cameras have rapidly become more sophisticated. In order to improve the functionality of these electronic products, the size and performance of semiconductor electronic devices mounted on them must be reduced, the PCBs on which these electronic devices are mounted must be made denser and multilayered, and the diameter of conductive holes must be made smaller. Both of these improvements are essential.

With the development of HDI (High Density Interconnect) PCB technology, laser drilling is gradually replacing mechanical drilling, because mechanical drilling technology cannot meet the market needs of small hole diameter, high precision and high efficiency. supersede.

With the different requirements of drilling, at present, most laser drilling equipment on the market adopts the double-head single wavelength processing mode, which cannot meet the efficiency requirements of PCB drilling and has different When processing the copper foil layer and resin layer, it requires pre-treatment of thinning and blackening, which reduces the drilling efficiency and drilling accuracy, and in order to solve the above problems, the drilling efficiency is high. , requires multi-head multi-wavelength PCB laser drilling equipment with high drilling accuracy.

In order to solve the problems existing in the above prior art, the present invention aims to provide a multi-head multi-wavelength PCB laser drilling apparatus and method.

In order to realize the above object, the present invention provides the following solutions, namely, the present invention provides a multi-head multi-wavelength PCB laser drilling device, comprising a pedestal on which a plurality of PCB processing lines are arranged in parallel. ,
The PCB processing line includes a Y-direction axis fixedly attached to the pedestal, and a first X-direction axis and a second X-direction axis are provided above the Y-direction axis in parallel, and the first X-direction axis and the second X-direction axis are parallel to each other. The direction of movement of the 2X direction axis is perpendicular to the movement direction of the Y direction axis,
A first hole punching module is fixedly attached to the first X-direction axis, a second hole punch module is fixedly attached to the second X-direction axis, and the first hole punch module and the second hole punch module are respectively fixed to the first hole punch module. arranged to correspond to the Y direction axis,
The first hole punching module is fixedly attached to the first X direction axis and includes a first laser unit corresponding to the Y direction axis, and the second hole punching module is fixedly attached to the second X direction axis. and a second laser unit arranged to correspond to the Y-direction axis,
The first drilling module and the second drilling module both include a positioning monitoring unit.

Preferably, the pedestal includes a base, the Y-direction axis is fixedly attached to a ceiling surface of the base, a gantry beam perpendicular to the Y-direction axis is provided at a center position of the base, and the first X-direction axis The axis and the second X-direction axis are respectively provided on two sides of the gantry beam.

Preferably, the first laser unit includes an ultraviolet laser device fixedly attached to the ceiling surface of the base and an ultraviolet optical system fixedly attached to the first X-direction axis, and the ultraviolet laser device is connected to the ultraviolet optical system. , the ultraviolet optical system is arranged to correspond to the Y-direction axis, and the second laser unit is connected to a carbon dioxide laser device fixedly attached to the tip of the gantry beam, and the second laser unit is connected to the first X-direction axis. a fixedly mounted carbon dioxide optical system, the carbon dioxide laser device communicates with the carbon dioxide optical system, and the carbon dioxide optical system is arranged to correspond to the Y-direction axis.

Preferably, a Y-axis rotor is movably arranged on the Y-direction axis, a negative pressure suction cup is fixedly attached to the Y-axis rotor, a first X-axis rotor is provided on the first X-direction axis, and the ultraviolet rays An optical system is fixedly mounted on the first X-axis rotor, a second X-axis rotor is disposed on the second X-direction axis, and the carbon dioxide optical system is fixedly mounted on the second X-axis rotor.

Preferably, the positioning monitoring unit includes a laser power probe fixedly attached to a side wall of the negative pressure suction cup, and the laser power probe is arranged to correspond to the ultraviolet optical system and the carbon dioxide optical system, respectively.

Preferably, the positioning monitoring unit further includes a CCD positioning unit, the CCD positioning units are fixedly attached to the first X-axis rotor and the second X-axis rotor, respectively, and the CCD positioning unit is sucked onto the negative pressure suction cup. and is arranged to correspond to the circuit board to which it is fixedly connected.

Preferably, the negative pressure suction cup includes a housing fixedly attached to the Y-axis rotor, a honeycomb plate is provided on a ceiling surface of the housing, and the laser power probe is fixedly attached to a side wall of the housing.

Preferably, a Z-axis focus adjustment device is provided between the ultraviolet optical system and the first X-axis rotor, a fixed end of the Z-axis focus adjustment device is fixedly connected to the first X-axis rotor, and a movable end thereof is Fixedly connected to the ultraviolet optical system and between the carbon dioxide optical system and the second X-axis rotor, the Z-axis focus adjustment device is likewise provided.

A multi-head multi-wavelength PCB laser drilling method, comprising:
Step S1 of fixing and mounting a circuit board to be drilled;
Step S2 of transferring the circuit board for the first time;
step S3 of positioning the circuit board for the first time and drilling a hole;
Step S4 of transferring the circuit board for a second time;
step S5 of positioning the circuit board a second time and drilling a hole;
Step S6 of transferring the circuit board for the third time;
step S7 of positioning the circuit board for the third time and drilling a hole;
Step S8 of detecting and transferring the processed circuit board.

Preferably, when a blind hole is drilled in the circuit board, step S6 and step S7 are skipped, and step S8 is directly performed.

The present invention discloses the following technical effects, the present invention discloses a multi-head multi-wavelength PCB laser drilling device and method, the pedestal is provided with a plurality of PCB processing lines, and the drilling operation is performed simultaneously and independently. This greatly increases the drilling efficiency, and the single PCB production line is equipped with a Y axis, a first X axis, and a second It can complete the drilling of various forms of circuit boards, reduce the positioning error caused by re-clamping, improve the drilling accuracy and the quality of the final product, and arrange the independent optical system and positioning monitoring unit as a set. Easily detect power, ensure consistency of drilling power, and further ensure consistency of drilling. The structure of the present invention is compact, the arrangement is reasonable, there is no need for multiple clamping, the drilling process of the circuit board can be completed in one time, the drilling efficiency is high, the drilling error is small, With high drilling accuracy, increasing the number of Y-direction axes and drilling modules enables drilling of 4 heads, 6 heads, 8 heads, 10 heads, and more, increasing the efficiency of circuit board processing and manufacturing. to meet market needs.

In order to clearly explain the embodiments of the present invention or the technical solutions of the prior art, the following briefly introduces the necessary figures of the embodiments, and obviously the figures described below are used for multiple implementations of the present invention. These figures are given by way of example only, and a person skilled in the art can derive other figures based on these figures without any effort worthy of inventive step.
1 is a perspective view of a multi-head multi-wavelength PCB laser drilling apparatus of the present invention; FIG. 1 is a plan view of a multi-head multi-wavelength PCB laser drilling apparatus of the present invention; FIG. 1 is a front view of a multi-head multi-wavelength PCB laser drilling apparatus of the present invention; FIG. 1 is a perspective view of an ultraviolet optical system of the present invention; FIG. 5 is a locally enlarged view of location A in FIG. 4. FIG.

The following combines the figures of the embodiments of the present invention to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously the described embodiments are not all the embodiments, but the embodiments of the present invention. Only some examples. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without any effort worthy of inventive step will fall within the protection scope of the present invention.

In order to make the above objects, features and advantages of the present invention more clear and understandable, the present invention will be described in more detail below by combining figures and specific embodiments.

Referring to FIGS. 1 to 5, the present invention provides a multi-head multi-wavelength PCB laser drilling device, comprising a pedestal 1 on which a plurality of PCB processing lines are arranged in parallel;
The PCB processing line includes a Y-direction axis 2 fixedly attached to a pedestal 1, and above the Y-direction axis 2, a first X-direction axis 4 and a second X-direction axis 6 are provided which are parallel to each other. and the direction of movement of the second X-direction axis 6 is perpendicular to the movement direction of the Y-direction axis 2;
A first hole punching module is fixedly attached to the first X direction shaft 4, a second hole punch module is fixedly attached to the second X direction shaft 6, and the first hole punch module and the second hole punch module are respectively attached to the Y direction axis. arranged to correspond to 2,
The first hole punching module is fixedly attached to the first X direction axis 4 and includes a first laser unit corresponding to the Y direction axis 2, and the second hole punching module is fixedly attached to the second X direction axis 6. and a second laser unit arranged so as to correspond to the Y-direction axis 2,
Both the first drilling module and the second drilling module include a positioning monitoring unit.

According to the multi-head multi-wavelength PCB laser drilling device and method disclosed by the present invention, the pedestal 1 is provided with a plurality of PCB processing lines, and the drilling operations can be performed simultaneously and independently, greatly increasing the drilling efficiency. The single PCB production line is equipped with a Y direction axis 2, a first X direction axis 4 and a second It can complete the drilling of the shape, reduce the positioning error due to re-clamping, improve the drilling accuracy and the quality of the final product, and the independent optical system and positioning monitoring unit can be arranged as a set, making it easy to power the table. detecting, ensuring consistency of drilling power, and further ensuring consistency of drilling.

As a further optimization solution, the pedestal 1 is equipped with a base 8, the Y-direction axis 2 is fixedly attached to the ceiling surface of the base 8, and a gantry beam 9 perpendicular to the Y-direction axis 2 is installed at the center position of the base 8. The first X-direction axis 4 and the second X-direction axis 6 are provided on two sides of the gantry beam 9, respectively. The Y-direction axis 2 is fixedly attached to the ceiling surface of the base 8, the Y-direction axis 2 passes through a hole between the gantry beam 9 and the base 8, and the first X-direction axis 4 and the second X-direction axis 6 are connected to the gantry beam 9. The first X-direction axis 4 and the second X-direction axis 6 are both located above the Y-direction axis 2, and the Y-direction axis 2 is connected to the circuit. When the substrate 20 is moved and passes through the first X-direction axis 4 and the second X-direction axis 6 during the movement, the first hole punching module and the second hole punching module sequentially punch holes in the circuit board 20.

As a further optimization solution, the first laser unit includes an ultraviolet laser device 10 fixedly mounted on the ceiling surface of the base 8 and an ultraviolet optical system 11 fixedly mounted on the first X-direction axis 4. communicates with an ultraviolet optical system 11, the ultraviolet optical system 11 is arranged to correspond to the Y direction axis 2, a second laser unit is connected to a carbon dioxide laser device 12 fixedly attached to the tip of the gantry beam 9, and a first X It comprises a carbon dioxide optical system 13 fixedly mounted on the direction axis 4 , the carbon dioxide laser device 12 communicates with the carbon dioxide optical system 13 , and the carbon dioxide optical system 13 is arranged to correspond to the Y direction axis 2 . When the circuit board 20 passes under the UV optical system 11 by the Y direction axis 2, the first X direction axis 4 drives the UV optical system 11 for positioning, and the UV laser device 10 emits a high power laser. , the laser enters the ultraviolet optical system 11, and then is outputted to make a hole in the copper foil on the surface of the circuit board 20, exposing the resin underneath, and the Y direction axis 2 reaches the bottom of the carbon dioxide optical system 13. As the circuit board 20 continues to move forward, the second X-direction axis 6 drives the carbon dioxide optical system 13 to position the drilled hole of the ultraviolet optical system 11, and the carbon dioxide laser device 12 is emitted from the carbon dioxide optical system 13 and excites the laser so that it falls on the positioning point, removes the resin under the copper foil and forms the necessary hole,
Furthermore, if the required hole is a through hole, the resin at the position to be drilled between the two layers of copper foil is completely removed, and the UV optical system 11 is inserted in the opposite direction by the Y direction axis 2. Move and remove another layer of copper foil, form a through hole, the required hole is a blind hole, remove the resin under the carbon dioxide optical system 13, without drilling through. , a hole drilled in the copper foil and a blind hole are formed by the ultraviolet optical system 11 .

Furthermore, preferably, the UV laser device 10 is a high power nanosecond UV laser device, the UV optical system 11 is comprised of a UV optical galvanometer mirror and a UV telecentric lens, and preferably the carbon dioxide laser device 12 is a radio frequency carbon dioxide It is a laser device, and the carbon dioxide optical system 13 is composed of a carbon dioxide optical galvanometer mirror and a carbon dioxide telecentric lens, and the above members are all ordinary optical elements, and their operating principles and usage methods are all conventional technology. So, I'm not exaggerating here.

As a further optimization solution, a Y-axis rotor 3 is movably arranged on the Y-direction axis 2, a negative pressure suction cup 14 is fixedly mounted on the Y-axis rotor 3, and a first A rotor 5 is provided, an ultraviolet optical system 11 is fixedly mounted on the first X-axis rotor 5, a second X-axis rotor 7 is provided on the second X-direction axis 6, and a carbon dioxide optical system 13 is fixed on the second X-axis rotor 7. It will be installed. The Y-axis rotor 3 moves in translation along the Y-direction axis 2 to move the negative pressure sucker 14 together, and in the process of drilling, realizes the movement of the circuit board 20 along the production line direction, and the first X-axis The rotor 5 translates the ultraviolet optical system 11 perpendicularly to the Y-direction axis 2, and in accordance with the movement of the negative pressure suction cup 14 along the Y-direction axis 2, the ultraviolet optical system 11 moves anywhere on the ceiling surface of the circuit board 20. After removing the copper foil on the surface, the second X-axis rotor 7 moves the carbon dioxide optical system 13 in translation along the X-axis direction to open the hole drilled in the copper foil by the ultraviolet optical system 11. Measure the position and drill a hole in the resin below.

Furthermore, by adopting double rotary linear motors for the Y-direction axis 2, the first X-direction axis 4, and the second X-direction axis 6, the Y-axis rotor 3, the first X-axis rotor 5, and the second X-axis rotor 7 are It is a common technique that allows stable translational movement, high movement accuracy, and small errors, and is suitable for drilling holes in high-precision elements such as the circuit board 20, so it will not be overstated here.

As a further optimization solution, the positioning and monitoring unit comprises a laser power probe 15 fixedly mounted on the side wall of the negative pressure suction cup 14, the laser power probe 15 corresponding to the ultraviolet optical system 11 and the carbon dioxide optical system 13, respectively. will be placed in The function of the positioning monitoring unit is mainly to control the accuracy of drilling, and during drilling, the laser power probe 15 monitors the power of the laser emitted from the corresponding optical system, that is, to control the drilling power. Guarantees consistency and also guarantees consistency of drilling.

As a further optimization solution, the positioning monitoring unit further includes a CCD positioning unit 17, which is fixedly attached to the first X-axis rotor 5 and the second X-axis rotor 7, respectively, and is sucked by the negative pressure suction cup 14. and is arranged so as to correspond to the circuit board 20 to which it is fixedly connected. The CCD positioning unit 17 positions the relationship between the optical system and the hole-drilling position of the circuit board 20 and obtains the required moving distance of the optical system. and the operating principle are both conventional techniques.

Furthermore, the device is further provided with a control center (not shown), which controls the operation of each component, receives data returned from the CCD positioning unit 17 and the laser power probe 15, and receives data returned from the CCD positioning unit 17 and the laser power probe 15. Corresponding adjustment control is applied to the operation of the machine to ensure drilling accuracy. The control center is a normal machining control center and is a conventional technique, and the control for each part and the processing for each feedback data are both conventional techniques, so they will not be overstated here.

As a further optimization solution, the negative pressure suction cup 14 is provided with a housing 18 fixedly mounted on the Y-axis rotor 3, a honeycomb plate 19 is provided on the ceiling surface of the housing 18, and the laser power probe 15 is mounted on the side wall of the housing 18. It is fixedly attached to. During use, the surface of the circuit board 20 to be drilled faces the optical system, and the back surface is attracted to the honeycomb plate 19, which ensures the flatness and stability of the circuit board 20 during the processing process and improves the effectiveness of the hole punching. Achieve the requirement that they match.

As a further optimization solution, a Z-axis focus adjustment device 16 is provided between the UV optical system 11 and the first X-axis rotor 5, and the fixed end of the Z-axis focus adjustment device 16 is fixedly connected to the first X-axis rotor 5. The movable end thereof is fixedly connected to the ultraviolet optical system 11, and a Z-axis focus adjustment device 16 is similarly provided between the carbon dioxide optical system 13 and the second X-axis rotor 7. The Z-axis focus adjustment device 16 adjusts the focus height of the optical system and cooperates with the CCD positioning unit 17 to compensate for the problem of mismatched drilling effects due to the deviation of the focal lengths of the two optical systems. I can do it.

A multi-head multi-wavelength PCB laser drilling method, comprising the following steps:
Step S1: The circuit board 20 to be punched is fixedly attached, and the circuit board 20 is placed in the housing 18 of the negative pressure suction cup 14 using the material supply device so that the surface to be punched faces upward, and the bottom surface is It is sucked to the ceiling surface of the honeycomb board 19 and the fixation is completed.

Step S2: Transfer the circuit board 20 for the first time, start the Y-axis rotor 3, and move the negative pressure suction cup 14 and the circuit board 20 below the UV optical system 11.

Step S3: Position the circuit board 20 for the first time and make a hole, start the CCD positioning unit 17 in the ultraviolet optical system 11, position the circuit board 20, and then transmit the positioning information to the control center. controls the first X-axis rotor 5 and Y-axis rotor 3 to interlock with the ultraviolet optical system 11, aligns the lens focus of the ultraviolet optical system 11 with the position to be drilled, and starts the ultraviolet laser device 10; If it is necessary to remove the copper foil on the surface of the circuit board 20 at the focus position of the circuit board 20 and drill a plurality of holes in the circuit board 20, the above steps should be performed until the copper foil at the positions where all the holes are to be drilled is removed. The positioning and drilling process is repeated multiple times.

Step S4: Transfer the circuit board for the 202nd time, restart the Y-axis rotor 3, and move the negative pressure suction cup 14 and the circuit board 20 below the carbon dioxide optical system 13.

Step S5: Position the circuit board 20 for the second time and make a hole, start the CCD positioning unit 17 in the carbon dioxide optical system 13, position the circuit board 20, and then transmit the positioning information to the control center and control it. The center controls the second X-axis rotor 7 and Y-axis rotor 3 to interlock with the carbon dioxide optical system 13, and adjusts the lens focus of the carbon dioxide optical system 13 to the position of the circuit board 20 where the copper foil is removed. , the carbon dioxide laser device 12 is activated, the resin at the hole-pierced focus position of the circuit board 20 is removed, and the above-described positioning and hole-making process is repeated until all hole positions are opened.

Step S6: When the circuit board 20 is transferred for the third time and the drilled hole is a through hole, the Y-axis rotor 3 is started and moved in the opposite direction, and the negative pressure suction cup 14 and the circuit board 20 are moved to the ultraviolet optical system 11. Bring it back down.

Step S7: Position the circuit board 20 for the third time and drill a hole, repeat the positioning process of step S5, position the position of the circuit board 20 to be drilled, and then position the hole from which the resin has been removed. Then, the copper foil on the lower end surface of the circuit board 20 is sequentially removed to form a through hole.

Step S8: Detect and transfer the processed circuit board 20. A quality inspection unit (not shown) performs a quality inspection on the circuit board 20 that has been processed and drilled, and if it passes the quality inspection, the circuit board 20 is transferred to the next process by a material dispensing unit (not shown).

The structure of the present invention is compact, the arrangement is reasonable, the drilling process of the circuit board 20 can be completed once without the need for multiple clamping, the drilling efficiency is high, the drilling error is small, By increasing the accuracy of hole drilling and increasing the number of Y axis and hole drilling modules, it is possible to drill holes of 4 heads, 6 heads, 8 heads, 10 heads, and more, making it possible to process and manufacture circuit boards 20. Dramatically increase efficiency to meet market needs.

In describing the present invention, it should be understood that the terms "vertical", "lateral", "above", "bottom", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "ceiling", "bottom", "inside", "outside", etc. is the orientation or positional relationship as shown in the diagram, and the pointed device or element is specified. The invention is not intended to indicate or imply that it must be constructed or operated in any particular orientation, but is merely a convenient description of the invention and should therefore be construed as a limitation on the invention. isn't it.

The above examples do not limit the scope of the invention, but are merely to describe preferred forms of the invention, and are intended to be used by those skilled in the art to describe the invention without departing from the design spirit of the invention. Various modifications and improvements to the technical solution should fall within the scope of protection determined by the claims of the present invention.

1 pedestal,
2 Y direction axis,
3 Y-axis rotor,
4 1st X direction axis,
5 1st X-axis rotor,
6 second X direction axis,
7 2nd X-axis rotor,
8 base,
9 Gantry beam,
10 ultraviolet laser device,
11 UV optical system,
12 carbon dioxide laser device,
13 Carbon dioxide optical system,
14 Negative pressure sucker,
15 Laser power probe,
16 Z-axis focus adjustment device,
17 CCD positioning unit,
18 housing,
19 Honeycomb board,
20 Circuit board

Claims (10)

A multi-head multi-wavelength PCB laser drilling device, comprising a pedestal (1) on which a plurality of PCB processing lines are arranged in parallel,
The PCB processing line includes a Y-direction axis (2) that is fixedly attached to the pedestal (1) and moves the circuit board (20) to be drilled , and above the Y-direction axis (2) there is a parallel A first X-direction axis (4) and a second X-direction axis (6) are provided, and the movement direction of the first X-direction axis (4) and the second perpendicular to the direction of motion,
A first hole-drilling module is fixedly attached to the first X-direction axis (4), a second hole-drilling module is fixedly attached to the second X-direction axis (6), and the first hole-drilling module and the second hole-drilling module are fixedly attached to the second X-direction axis (6). The drilling modules are each arranged to correspond to the Y-direction axis (2),
The first hole punching module includes a first laser unit that is fixedly attached to the first X axis (4) and corresponds to the Y axis (2), and the second hole punch module includes a first laser unit that is fixedly attached to the first X axis (4) and corresponds to the Y axis (2). a second laser unit fixedly attached to the direction axis (6) and arranged to correspond to the Y direction axis (2);
The first hole punching module and the second hole punching module both include a positioning monitoring unit,
a laser power probe (15), wherein the positioning monitoring unit monitors the power of the laser emitted from the ultraviolet optical system (11) of the first laser unit and the carbon dioxide optical system (13) of the second laser unit; A multi-head multi-wavelength device comprising an ultraviolet optical system (11) and a CCD positioning unit (17) for positioning the relationship between the carbon dioxide optical system (13) and the perforation position of the circuit board (20). PCB laser drilling equipment. The pedestal (1) includes a base (8), the Y-direction axis (2) is fixedly attached to the ceiling surface of the base (8), and the Y-direction axis (2) is mounted at the center of the base (8). 2) is provided with a gantry beam (9) perpendicular to the gantry beam (9), and the first X-direction axis (4) and the second X-direction axis (6) are provided on two sides of the gantry beam (9), respectively. The multi-head multi-wavelength PCB laser drilling apparatus according to claim 1. The first laser unit includes an ultraviolet laser device (10) fixedly attached to the ceiling surface of the base (8), and the ultraviolet optical system (11) fixedly attached to the first X-direction axis (4). , the ultraviolet laser device (10) communicates with the ultraviolet optical system (11), the ultraviolet optical system (11) is arranged to correspond to the Y-direction axis (2), and the second laser unit: The carbon dioxide laser device (12) is fixedly attached to the tip of the gantry beam (9), and the carbon dioxide optical system (13) is fixedly attached to the first X-direction axis (4). 2. A laser device (12) communicating with said carbon dioxide optical system (13), said carbon dioxide optical system (13) being arranged to correspond to said Y-direction axis (2). The multi-head multi-wavelength PCB laser drilling device described in . A Y-axis rotor (3) is movably arranged on the Y-direction axis (2), a negative pressure suction cup (14) is fixedly attached to the Y-axis rotor (3), and the first X-direction axis (4) is provided with a first X-axis rotor (5), the ultraviolet optical system (11) is fixedly mounted on the first X-axis rotor (5), and the second X-axis (6) is provided with a second X-axis rotor (7). ) and the carbon dioxide optical system (13) is fixedly mounted on the second X-axis rotor (7). The positioning monitoring unit includes the laser power probe (15) fixedly attached to the side wall of the negative pressure suction cup (14), and the laser power probe (15) is connected to the ultraviolet optical system (11) and the carbon dioxide optical system. 5. The multi-head multi-wavelength PCB laser drilling apparatus according to claim 4, wherein the multi-head multi-wavelength PCB laser drilling apparatus is arranged to correspond to (13), respectively. The positioning monitoring unit further includes the CCD positioning unit (17), the CCD positioning unit (17) is fixedly attached to the first X-axis rotor (5) and the second X-axis rotor (7), and the CCD positioning The multi-head multi-head unit according to claim 4, wherein the unit (17) is sucked by the negative pressure suction cup (14) and arranged to correspond to the circuit board (20) to which it is fixedly connected. Wavelength PCB laser drilling equipment. The negative pressure suction cup (14) includes a housing (18) fixedly attached to the Y-axis rotor (3), and a honeycomb plate (19) is provided on the ceiling surface of the housing (18), and the laser power probe The multi-head multi-wavelength PCB laser drilling apparatus according to claim 5, characterized in that (15) is fixedly attached to the side wall of the housing (18). A Z-axis focus adjustment device (16) is provided between the ultraviolet optical system (11) and the first X-axis rotor (5), and a fixed end of the Z-axis focus adjustment device (16) is connected to the first X-axis rotor. (5), the movable end of which is fixedly connected to the ultraviolet optical system (11), and between the carbon dioxide optical system (13) and the second X-axis rotor (7), the The multi-head multi-wavelength PCB laser drilling device according to claim 4, characterized in that a Z-axis focus adjustment device (16) is provided. A multi-head multi-wavelength PCB laser drilling method using the multi-head multi-wavelength PCB laser drilling device according to any one of claims 1 to 8,
a step S1 of fixing and mounting the circuit board (20) to be drilled;
Step S2 of transferring the circuit board (20) for the first time;
step S3 of positioning the circuit board (20) for the first time and drilling a hole;
Step S4 of transferring the circuit board (20) for a second time;
step S5 of positioning the circuit board (20) for a second time and drilling a hole;
Step S6 of transferring the circuit board (20) for a third time;
Step S7 of positioning the circuit board (20) for the third time and drilling a hole;
A multi-head multi-wavelength PCB laser drilling method, comprising step S8 of detecting and transferring a processed circuit board (20). The multi-head according to claim 9, characterized in that when a blind hole is drilled in the circuit board ( 20), the step S6 and the step S7 are skipped, and the step S8 is directly executed. Multi-wavelength PCB laser drilling method.