CN216313769U - Device for handling a component carrier structure and arrangement - Google Patents

Abstract

The present application relates to a device for handling a component carrier structure and an arrangement, the device comprising: at least one movable carrier table, at least one of the at least one carrier table for carrying the component carrier structure such that a first side of the component carrier structure is exposed; a flipper for flipping the component carrier structure and placing the flipped component carrier structure on at least one movable carrier table such that a second side of the component carrier structure is exposed; and a plurality of fixed cameras, at least some of the plurality of fixed cameras being configured to capture images of at least some of the alignment marks located on the first side of the component carrier structure substantially simultaneously, and at least some of the plurality of fixed cameras being configured to capture images of at least some of the alignment marks located on the second side of the component carrier structure substantially simultaneously.

Description

Device for handling a component carrier structure and arrangement

Technical Field

The present invention relates to a device for handling a component carrier structure, and an arrangement comprising the device and the component carrier structure.

Background

Against the background of the ever increasing product functionality of component carriers equipped with one or more electronic components and the increasing miniaturization of such components and the increasing number of components to be mounted on the component carriers, such as printed circuit boards, increasingly larger array-like components or packages with a plurality of components are being employed, which have a plurality of contact portions or connection portions, wherein the spacing between these contact portions is increasingly smaller. Removing the heat generated by these components and the component carriers themselves during operation is an increasing problem. At the same time, the component carrier should be mechanically robust and electrically reliable in order to be able to operate even under severe conditions. All these requirements are closely linked to the continued miniaturization of the component carrier and its constituent parts.

However, handling thin component carrier structures, such as panels, may be difficult during manufacturing of the component carrier, such as during manufacturing of printed circuit boards. Thin plate-like component carrier structures may be susceptible to deformation.

Accordingly, a reliable system for manipulating a component carrier structure may be desired.

SUMMERY OF THE UTILITY MODEL

According to the utility model, a device for handling a component carrier structure is provided, wherein the device comprises: at least one movable carrier table, at least one of which is configured for carrying the component carrier structure such that the component carrier structure is exposed on a first side (in particular a front side) of the component carrier structure; a flipper for flipping the component carrier structure and placing the flipped component carrier structure on at least one of the at least one carrier station to expose a second side (in particular a rear side) of the component carrier structure; and a plurality of stationary cameras, at least some of the plurality of stationary cameras configured to: with the first side exposed, capturing images of at least some of the alignment marks located on the first side of the component carrier structure substantially simultaneously when at least one of the at least one carrier table has moved the component carrier structure in the field of view of the camera, and at least some of the plurality of stationary cameras are configured for: with the second side exposed, images of at least some of the alignment marks located on the second side of the component carrier structure are captured substantially simultaneously when at least one of the at least one carrier table has moved the flipped component carrier structure in the field of view of the camera.

According to the present invention, there is provided an arrangement comprising an apparatus having the above-mentioned features and a component carrier arrangement on one of the at least one movable carrier table.

In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components on and/or in the component carrier to provide mechanical support and/or electrical connection. In other words, the component carrier may be configured as a mechanical carrier and/or as an electronic carrier for the component. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different types of component carriers of the above-mentioned types of component carriers.

In the context of the present application, the term "component carrier structure" may particularly denote a thin sheet of material, such as a panel, an array (e.g. a quarter panel or a panel portion with a plurality of component carriers), or the component carrier itself, in particular a Printed Circuit Board (PCB) or an Integrated Circuit (IC) substrate, which is handled and processed during manufacturing of the component carrier.

According to the utility model, one or more movable carrier tables may be used to move the component carrier structure to the following positions: at this position, the spatially fixed camera may capture an image of the component carrier structure having the plurality of alignment marks. Images of the alignment marks of the component carrier structure are captured from both the first side and the second side of the component carrier structure. The flipper may flip the component carrier structure to selectively expose the first side or the second side of the component carrier structure to the camera. These images may provide information useful for alignment or registration purposes during processing of the component carrier structure (e.g. deformation information and/or position information of the component carrier structure). Such a configuration of the spatially fixed camera and the one or more movable carrier tables may allow for a precise alignment and registration of the component carrier structure, wherein the one or more movable carrier tables carry the component carrier structure and expose the component carrier structure from the first and second sides of the component carrier structure, respectively, by performing an operation on the flipper. Thus, a component carrier having high reliability and performance can be obtained.

Next, further exemplary embodiments of the device and the arrangement will be explained.

In an embodiment, for traceability reasons, the machine may be able to register the lot number and the panel number. Further, the system may be able to identify whether the front side or the back side faces the camera.

In an embodiment, the at least one carrier table comprises a first carrier table for carrying the component carrier structure with the first side exposed and a second carrier table for carrying the component carrier structure with the second side exposed. One of the two separate movable carrier stages is for exposing a first side of the component carrier structure and the other movable carrier stage is for exposing a second side of the component carrier structure, such that the two separate movable carrier stages simplify handling of the component carrier structure. Alternatively, only a single movable carrier table may be used to first move the component carrier structure from the first side into the field of view of the camera and then to move the component carrier structure from the second side into the field of view of the camera.

In an embodiment, each of the carrier tables is configured to move forward and backward along only one track. In particular, by moving the two movable carrier tables only in a single linear direction of motion (e.g. along a common linear guide), a simple construction of the device and a high accuracy of registration can be achieved. Thus, the same track can be used by moving both carrier tables forward and backward in the same direction. This may reduce or even minimize the offset between the structures on the first side and the structures (e.g. pads) on the second side of the component carrier structure.

In one embodiment, the plurality of cameras comprises four cameras for capturing images of respective four alignment marks on respective four corners on the first and second sides of the component carrier structure, respectively. With four fixed cameras, four alignment marks can be detected, providing accurate registration information with modest hardware effort.

In an embodiment, the plurality of cameras comprises six cameras for capturing images of respective six alignment marks on respective four corners and two edges, respectively on the first and second sides of the component carrier structure. With six fixed cameras, six alignment marks can be detected, providing highly accurate registration information. Capturing six alignment marks by six cameras may allow obtaining a proper alignment or registration, in particular edge information is advantageous, even in case of a deformation of the component carrier structure.

In an embodiment, the device comprises a processor configured to process images captured by the camera to adjust further processing of the component carrier structure. Such a processor may be, for example, a computer or at least one microprocessor, or a portion of a computer or microprocessor. Such a processor may apply image processing techniques, in particular image recognition techniques, for recognizing alignment marks of the component carrier structure in the image.

In an embodiment, the processor is configured to determine information indicative of a deformation of the component carrier structure based on the captured image. Such a deformation of a thin plate-like component carrier structure, such as a panel, is meaningful information for adapting the further processing of the component carrier structure for manufacturing the component carrier with high accuracy.

In an embodiment, the device comprises an exposure machine for exposing the component carrier structure, in particular a circuit pattern of the component carrier structure. Such an exposure machine may be, for example, a UV (ultraviolet) dry film exposure machine for PCB manufacturing. In such an exposure machine, proper alignment accuracy is very important. For operating on the component carrier structure, the exposure machine may use the determined deformation information about the component carrier structure obtained from the captured image. The exposure may be adjusted to at least partially compensate for the determined deformation.

In an embodiment, the component carrier structure comprises an alignment mark configured as a plated through hole extending between the first side and the second side of the component carrier structure. Such through holes may be formed by mechanical drilling or by laser drilling. The vias may preferably be partially (or alternatively completely) filled with, for example, a conductive material, such as copper. However, other alignment marks are also possible, such as blind vias, non-plated through holes, or copper pads. However, plated through holes provide excellent alignment accuracy.

In an embodiment, the component carrier structure and/or the manufactured component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a stack of the mentioned electrically insulating layer structure and electrically conductive layer structure, in particular a stack of an electrically insulating layer structure and an electrically conductive layer structure formed by applying mechanical pressure and/or thermal energy. The mentioned stack may provide a plate-like component carrier which is capable of providing a large mounting surface for other components, but which is still very thin and compact. The term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.

In an embodiment, the component carrier structure and/or the manufactured component carrier is shaped as a plate. This contributes to a compact design, wherein the component carrier nevertheless provides a large base for the mounting components on the component carrier. Further, in particular, a bare chip (die), which is an example of an embedded electronic component, can be easily embedded in a thin plate such as a printed circuit board because of its small thickness.

In an embodiment, the component carrier is constructed as one of the group comprising a printed circuit board, a substrate, in particular an IC substrate, and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and/or by supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg, or FR4 material. The individual electrically conductive layer structures can be connected to each other in a desired manner by forming through-holes through the laminate, for example by laser drilling or mechanical drilling, and by filling these through-holes with an electrically conductive material, in particular copper, so as to form vias as through-hole connections. In addition to one or more components that may be embedded in a printed circuit board, printed circuit boards are typically configured for housing one or more components on one surface or both opposing surfaces of a plate-like printed circuit board. The one or more components may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may be composed of a resin with reinforcing fibers (e.g., glass fibers).

In the context of the present application, the term "substrate" may particularly denote a small component carrier. The substrate may be a relatively small component carrier with respect to the PCB, on which one or more components may be mounted and which may serve as a connection medium between one or more chips and another PCB. For example, the substrate may have substantially the same size as the components (in particular, electronic components) to be mounted on the substrate (for example, in the case of Chip Scale Package (CSP)). More specifically, a substrate can be understood as a carrier: carriers for electrical connections or grids and component carriers comparable to Printed Circuit Boards (PCBs) but with a relatively high density of laterally and/or vertically arranged connections. The transverse connections are, for example, conduction channels, while the vertical connections may be, for example, bores. These lateral and/or vertical connections are arranged within the base plate and can be used to provide electrical, thermal and/or mechanical connection of accommodated or not accommodated components (such as bare wafers), in particular IC chips, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrates". The dielectric portion of the substrate may be composed of a resin with reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).

The substrate or interposer may comprise or consist of at least one layer of: glass; silicon (Si); a photosensitive or dry-etchable organic material such as an epoxy-based laminate material (e.g., an epoxy-based laminate film); or a polymer compound such as polyimide, polybenzoxazole or benzocyclobutene-functional polymer.

In an embodiment, the at least one electrically insulating layer structure comprises at least one of: resins (e.g. reinforced or non-reinforced resins, such as epoxy or bismaleimide-triazine resins), cyanate ester resins, polyphenylene derivatives, glass (especially glass fibre, multiple layer glass, glassy materials), prepregs (e.g. FR-4 or FR-5), polyimides, polyamides, Liquid Crystal Polymers (LCP), epoxy laminates, polytetrafluoroethylene (PTFE, Teflon)

) Ceramic, polyvinylidene fluoride (PVDF) anda metal oxide. Reinforcing structures, such as meshes, fibers or spheres, for example made of glass (multiple layers of glass) may also be used. Although prepreg, in particular FR4, is generally preferred for rigid PCBs, other materials, in particular epoxy based laminate films or photosensitive dielectric materials, may also be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins, low temperature co-fired ceramics (LTCC) or other low, very low or ultra low DK materials can be implemented in the component carrier as an electrically insulating layer structure.

In an embodiment, the at least one electronically conductive layer structure comprises at least one of: copper, aluminum, nickel, silver, gold, palladium, carbon, silicon (preferably doped), platinum and tungsten. Although copper is generally preferred, other materials or coated variants thereof, in particular coated with superconducting materials such as graphene, are also possible.

The at least one component that may be embedded in the stack and/or surface mounted on the stack may be selected from: a non-electrically conductive inlay, an electrically conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), a light directing element (e.g., an optical waveguide or a photoconductor connection), an optical element (e.g., a lens), an electronic component, or a combination thereof. For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a storage device (e.g., DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light emitting diode, an optocoupler, a voltage converter (e.g., a DC/DC converter or an AC/DC converter), a cryptography component, a transmitter and/or receiver, an electromechanical transducer, a sensor, an actuator, a micro-electro-mechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductance, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components may also be embedded in the component carrier. For example, a magnetic element may be used as the component. Such a magnetic element may be a permanent magnetic element (e.g. a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, e.g. a ferrite core) or may be a paramagnetic element. However, the component may also be a substrate, an interposer or other component carrier, for example in a board-in-board configuration. The component may be surface mounted on the component carrier and/or may be embedded in the interior of the component carrier. Furthermore, other components, in particular components which generate and emit electromagnetic radiation and/or which are sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

In an embodiment, the component carrier is a laminate type component carrier. In such an embodiment, the component carrier is a composite of a multilayer structure that is stacked and joined together by the application of pressure and/or heat.

After the processing of the inner layer structure of the component carrier, one main surface or the two opposite main surfaces of the processed layer structure may be covered symmetrically or asymmetrically (in particular by lamination) with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, stacking may continue until a desired number of layers is obtained.

After the formation of the stack with the electrically insulating layer structure and the electrically conductive layer structure is completed, the resulting layer structure or component carrier may be subjected to a surface treatment.

In particular, in terms of surface treatment, an electrically insulating solder resist may be applied to one main surface or both opposite main surfaces of the layer stack or the component carrier. For example, a layer such as solder resist may be formed over the entire major surface and subsequently patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to the electronic periphery. The surface portion of the component carrier which remains covered with solder resist, in particular the surface portion which comprises copper, can be effectively protected against oxidation or corrosion.

In terms of surface treatment, a surface finish may also be selectively applied to exposed electrically conductive surface portions of the component carrier. Such a surface finish may be an electrically conductive covering material on an exposed electrically conductive layer structure (e.g., a pad, a conductive trace, etc., particularly comprising or consisting of copper) on the surface of the component carrier. If such an exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (in particular copper) will be oxidized, resulting in a lower reliability of the component carrier. The surface finishing may then be formed, for example, as a joint between the surface mount component and the component carrier. The surface finish has the function of protecting the exposed electrically conductive layer structure, in particular the copper circuitry, and the surface finish may be brought into a joining process with one or more components, for example by soldering. Examples of suitable materials for the surface finish are Organic Solderability Preservative (OSP), Electroless Nickel Immersion Gold (ENIG), gold (especially hard gold), chemical tin, nickel gold, nickel palladium, Electroless Nickel Immersion Palladium Immersion Gold (ENIPIG), and the like.

The aspects defined above and further aspects of the present invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment. Exemplary embodiments of the present invention will be described in more detail hereinafter with reference to examples of embodiments, but the scope of the present invention is not limited to these exemplary embodiments.

Drawings

Fig. 1 shows an arrangement according to the utility model with a device for handling a component carrier arrangement.

Fig. 2 shows a further arrangement according to the utility model with a device for handling the component carrier arrangement.

Fig. 3 shows a front-to-back offset of the pads, wherein through-holes are shown that can be realized by the arrangement of fig. 2.

Fig. 4 shows a plan view of a component carrier structure for a device according to the utility model.

Fig. 5 shows a cross-sectional view of a component carrier structure for a device according to the utility model.

Fig. 6 shows a further arrangement according to the utility model with a device for handling the component carrier arrangement.

Detailed Description

The illustration in the drawings is schematically.

Before the exemplary embodiments will be described in more detail with reference to the accompanying drawings, some basic considerations upon which exemplary embodiments of the present invention have been developed will be summarized.

During the manufacture of a component carrier, such as a PCB, the layers are processed. For example, the following process may be repeated: pressing the layers, patterning the layers, forming laser via connections, and the like. This may involve processes such as electroless plating, photolithography, circuit pattern exposure, development, and the like. To improve registration during PCB manufacturing, alignment marks, such as plated through holes, may be used, particularly in connection with circuit pattern exposure.

Conventionally, in the case of panel-based printed circuit board manufacturing, a CCD camera may be provided during alignment hole registration. The front layer circuit pattern and the bottom layer circuit pattern are exposed using a CCD camera of a separate unit. Different exposure tracks may be used for travel during exposure of the front layer circuit pattern and the bottom layer circuit pattern.

According to the utility model, a plurality of (in particular three or more, preferably six) cell CCD cameras may be provided for aligning the aperture registration. The existing front layer circuit pattern and the bottom layer circuit pattern may be exposed using an integrated CCD camera unit. Advantageously, during the exposure of the front layer circuit patterns and the bottom layer circuit patterns of the currently processed component carrier structure (in particular the panel), the same or an integrated exposure track can be used for the travel.

Advantageously, the present invention enables precision control during registration of the front-to-back alignment marks or pads images. In particular, front and back pad image registration accuracy of less than 10 μm can be achieved with integrated exposure tracks for the top and bottom layers. In conventional approaches, registration accuracy has exceeded 15 μm (e.g., 25 μm). Advantageously, the high accuracy of the front-to-back alignment mark image registration according to the present invention may prevent rejection of component carrier structures due to misalignment of circuit patterns between layers of a multi-layer stack. According to the present invention, circuit pattern registration using alignment holes or tool holes and vias in the active area may allow for a minimum shift of less than 10 μm to be achieved. Advantageously, the improved front-to-back pad image registration accuracy may prevent processing of the component carrier structure beyond specifications between pad image registration with vias or through-holes. In addition, the utility model can enlarge the compensation tolerance of the annular ring size (annular ring size) and improve the registration capability of any layer.

According to embodiments of the present invention, front and back pad image registration accuracy control can be improved by using multiple (in particular three or more) cameras (preferably CCD cameras) and a single path for front and back layer alignment control before pattern exposure. Advantageously, laser vias can be utilized as alignment marks to achieve anterior and posterior pad image registration accuracy better than 10 μm. Therefore, when the front and rear pad pattern registration capability is improved, scrap of manufactured component carriers can be reduced. Furthermore, this may allow to prevent any out of specification pad registration. Advantageously, this may increase the throughput and may improve the yield during the manufacturing of the component carrier, such as a PCB.

In particular, embodiments of the utility model may allow for the manufacture of Printed Circuit Boards (PCBs), including High Density Integration (HDI) and improved semi-additive processing (mSAP) component carriers. In view of the improved anterior posterior pad image registration capabilities, increased capabilities for smaller annulus size registration may be obtained. Furthermore, this may improve the ability to produce cavity component carriers with tight tolerances and improved yield.

According to the embodiments of the present invention, various advantages in the manufacture of the PCB may be achieved. The tolerance of the orifice ring dimensional registration may be expanded with vias or through holes. Furthermore, any layer registration offset may be reduced or even minimized. Furthermore, by sharing a CCD camera, a small or even minimal alignment deviation can be obtained. A single path for top and bottom layer exposure can be implemented, which reduces hardware and processing effort and improves accuracy. In addition, the front-to-back offset can be reduced.

More specifically, front and back pad image registration accuracy control can prevent misalignment of the exposure pattern between the top and bottom layers. In a single path of panel flow, with integrated exposure cameras for the top and bottom layers, the front and back pad image registration offset can be less than 10 μm. With the applied front and back pad image registration accuracy control, a strict annular ring size can be achieved. Since the registration accuracy can be improved, the design rule of the size of the hole ring can be widened. Furthermore, the risk of rejection of the component carrier due to registration offset is low. This can improve throughput and yield.

Fig. 1 shows an arrangement 120 according to the utility model, which arrangement 120 has a device 100 for handling a component carrier structure 102, such as a panel for manufacturing a Printed Circuit Board (PCB).

The arrangement 120 comprises the apparatus 100 and the component carrier structure 102, the component carrier structure 102 being placeable on one of the two movable carrier tables 104, 106. More specifically, a first movable carrier table 104 and a second movable carrier table 106 are provided, wherein the component carrier structure 102 may be placed on the first movable carrier table 104 or on the second movable carrier table 106. Fig. 1 shows the component carrier structure 102 with a first side 108 of the component carrier structure 102 exposed upwards and a second side 110 of the component carrier structure 102 facing the first movable carrier stage 104. Furthermore, fig. 1 also shows the component carrier arrangement 102, wherein a second side 110 of the component carrier arrangement 102 is exposed upwards and a first side 108 of the component carrier arrangement 102 faces the second movable carrier table 106. The component carrier structure 102 may be flipped upside down by the flipper 130 when being transported between the first movable carrier stage 104 and the second movable carrier stage 106. In other words, the flipper 130 can transition the component carrier structure 102 between a configuration in which the first side 108 is oriented upward and another configuration in which the second side 110 is oriented upward.

As shown, the component carrier structure 102 comprises alignment marks 114, the alignment marks 114 being detectable from each of the two opposing major surfaces (i.e. the first side 108 and the second side 110) of the component carrier structure 102, because the alignment marks 114 are configured as plated through holes.

As already mentioned, the apparatus 100 comprises a first movable carrier table 104 and a second movable carrier table 106 for carrying the component carrier structure 102 for exposing the component carrier structure 102 on a first side 108 of the component carrier structure 102 or a second side 110 of the component carrier structure 102, respectively. The flipper 130, which may be implemented as a robotic arm, may be configured for: the component carrier structure 102 is turned upside down to be placed on the second movable carrier stage 106 when the component carrier structure 102 is arranged on the first movable carrier stage 104, or the component carrier structure 102 is turned upside down to be placed on the first movable carrier stage 104 when the component carrier structure 102 is arranged on the second movable carrier stage 106. This may allow the first side 108 or the second side 110 of the component carrier structure 102 to be selectively exposed towards the camera 112, respectively, when the component carrier structure 102 is placed on the first movable carrier stage 104 or on the second movable carrier stage 106. The flipper 130 can be configured for clamping the component carrier structure 102, flipping the component carrier structure 102, and placing the flipped component carrier structure 102 on a respective one of the carrier stations 104, 106.

Further, the apparatus 100 comprises a plurality of stationary cameras 112, which stationary cameras 112 may be CCD (charge coupled device) cameras. Fig. 1 shows three spatially fixed cameras 112, wherein six spatially fixed cameras 112 may be preferred. The camera 112 may be configured to: with the first side 108 exposed, an image of the alignment mark 114 is captured substantially simultaneously from the first side 108 of the component carrier structure 102 when the first movable carrier stage 104 has moved the component carrier structure 102 in the field of view of the camera 112. In addition, the camera 112 may be configured to: after flipping the component carrier structure 102 by the flipper 130, with the second side 110 exposed, an image of the alignment mark 114 is captured substantially simultaneously from the second side 110 of the component carrier structure 102 when the flipped component carrier structure 102 has been moved by the second movable carrier stage 106 in the field of view of the camera 112. Thus, the first movable carrier table 104 is operative for carrying the component carrier structure 102 with the first side 108 exposed, while the second movable carrier table 106 is operative for carrying the component carrier structure 102 with the second side 110 exposed.

Advantageously, each of the first and second movable carrier tables 104, 106 is configured to move forward and backward along only one track. This is illustrated in fig. 1 by reference numerals 132, 134. As indicated by reference numerals 132, 134, the track for movement of each of the carrier tables 104, 106 is a single linear track. According to fig. 1, a single linear track extends in a horizontal direction.

In one embodiment, the plurality of cameras 112 includes four cameras 112 for capturing images of respective four alignment marks 114 (see fig. 4) located on respective four corners on the first side 108 and the second side 110 of the component carrier structure 102, respectively. However, in a preferred embodiment, the plurality of cameras 112 comprises six cameras 112 for capturing images of respective six alignment marks 114 (see again fig. 4) located on respective four corners and two edges on the first and second sides 108, 110 of the component carrier structure 102, respectively.

As also shown in fig. 1, the apparatus 100 includes a processor 116, the processor 116 being configured to control the movable carrier tables 104, 106, the flipper 130, and the camera 112. For example, the processor 116 is implemented as a computer or one or more microprocessors or portions of microprocessors. In particular, the processor 116 is configured for processing images captured by the camera 112 to adjust the further processing of the component carrier structure 102. More specifically, the processor 116 may identify the position of the alignment mark 114 by processing image data captured by the camera 112. This may involve functions such as image recognition. In particular, the processor 116 is configured for determining potential deformations of the flexible component carrier structure 102 based on the captured images. This deformation information may be used for registering the component carrier structure 102 during processing in connection with the manufacture of the component carrier, e.g. a PCB.

Furthermore, the apparatus 100 comprises an exposure machine 170, which exposure machine 170 is used to expose the circuit pattern of the component carrier structure 102. The exposure machine 170 may operate on the component carrier structure 102 using the alignment information provided from the processor 116. The exposure machine 170 may also be controlled by the processor 116.

During operation of the apparatus 100, a panel or other component carrier structure 102 is placed on a first movable carrier table 104 with a first side 108 exposed upwardly. Under the control of the processor 116, the first movable carrier table 104 carrying the component carrier structure 102 moves along a single linear track indicated by reference numeral 132 until a position below the camera 112 remains spatially fixed. In this position, the camera 112 may capture an image of the component carrier structure 102 and its alignment marks 114 from the first side 108. During this process, the camera 112 remains spatially fixed in the middle and does not move. Thereafter, the flipper 130 moves the component carrier structure 102 from the first movable carrier table 104 to the second movable carrier table 106 and flips the component carrier structure 102 therein such that the second side 110 is upwardly exposed after the component carrier structure 102 is placed on the second movable carrier table 106 by the flipper 130. Now, the second movable carrier table 106 is moved along a single linear track indicated by reference numeral 134 such that the component carrier structure 102 on the second movable carrier table 106 is placed under the spatially fixed camera 112. In this position, an image of the second side 110 of the component carrier structure 102 and its alignment mark 114 located on the second movable carrier stage 106 may be captured by the stationary camera 112. The image captured by the camera 112 may then be processed by the processor 116, and the result may be used for registration purposes during further processing of the component carrier structure 102 (in particular using the exposure machine 170) for producing a component carrier, such as a printed circuit board.

Advantageously, the same track may be used for both carrier tables 104, 106 and the same camera 112 may be used for imaging the first side 108 and the second side 110 of the component carrier structure 102. This may reduce systematic errors. Since the same camera 112 may be shared by the first side 108 and the second side 110, errors of the different cameras 112 themselves may be reduced. Each carrier table 104, 106 can be moved together with the component carrier structure 102 arranged on the carrier table 104, 106 using the same rails as for the imaging of the first and second side. Each camera 112 may capture one or more images of each of the first side 108 and the second side 110 of the component carrier structure 102.

Fig. 2 shows a further arrangement 120 according to the utility model, which further arrangement 120 has a device 100 for handling a component carrier arrangement 102. Fig. 2 shows a top layer 136 and a bottom layer 138 of the panel-type component carrier structure 102. The top layer exposure is shown by reference numeral 140 and the bottom layer exposure is shown by reference numeral 142. According to fig. 2, three cameras 112 (which three cameras 112 may be integrated into a common module 154) are provided for alignment hole registration.

Fig. 3 illustrates the front-to-back offset of the through-holes that can be achieved by the arrangement 120 of fig. 2. Advantageously, with the arrangement 120 according to fig. 2, the front-to-back offset may be less than 10 μm, wherein the arrangement 120 has a plurality of cameras 112 and has a single-stage path image exposure for the first side 108 and the second side 110. Also shown in fig. 3 is a pad 148 on first side 108 and another pad 150 at second side 110.

Fig. 4 shows a plan view of a component carrier structure 102 for a device 100 according to the utility model. The illustrated plate-like panel-type component carrier structure 102 has six alignment marks 114, which alignment marks 114 serve as registration holes and are implemented as plated through holes. Four of the alignment marks 114 are arranged in the corners of the component carrier structure 102 and the remaining two alignment marks 114 are arranged at the edges between the respective corners of the component carrier structure 102. Alignment marks 114, implemented as plated through holes, serve as dedicated registration holes on first side 108 and on second side 110 (e.g., for exposure machine 170). Reference numeral 158 shows a flipping axis about which the component carrier arrangement 102 can be flipped by the flipper 130.

Fig. 5 shows a cross-sectional view of a component carrier structure 102 for a device 100 according to the utility model. The component carrier structure 102 according to fig. 5 has a prepreg layer 144 between the top layer 136 and the bottom layer 138. The alignment marks 114 are implemented as plated through holes, i.e. through holes extending completely vertically through the component carrier structure 102 and having a metal plating 146 on the side walls. Further, fig. 5 shows a pad 147 on the first side portion 108 and another pad 149 on the second side portion 110. The pads 147, 149 advantageously show only a very small lateral displacement 152, i.e. a small front-to-back displacement due to the manufacturing of the pads 147 and 149 with the arrangement according to fig. 1, 2 or 6.

Fig. 6 shows a further arrangement 120 according to the utility model, which further arrangement 120 has a device 100 for handling a component carrier arrangement 102.

During the manufacturing of the component carrier based on the component carrier structure 102, various processing stages are performed. The processing stages include an electroless plating stage, a photolithographic preclean and lamination stage, a circuit pattern exposure stage, a circuit pattern development stage, a circuit pattern etching stage, and the like. The device 120 according to fig. 6 can be assigned to a circuit pattern exposure phase (including pad image registration).

The arrangement 120 according to fig. 6 comprises six CCD cameras 112, which six CCD cameras 112 are assigned to the six alignment marks 114 of the component carrier structure 102 of fig. 4. The cameras 112 may be arranged in a single module 154 for the top layer 136 and for the bottom layer 138. Reference numeral 160 in fig. 6 indicates the flipping (in terms of U-shaped rotational descriptive terms) of the panel-type component carrier structure 102 about the flipping axis 158 shown in fig. 4. Reference numerals 164, 166 denote low maximum offsets (e.g., maximum offsets of no more than 7.5 μm) for the front pad 148 and the back pad 150 relative to the via-type alignment mark 114.

According to the embodiment of the utility model shown in fig. 6, 3 CCD camera units (in a single module) are attached to the front and back exposure stages for alignment hole registration. Since the panel needs to be flipped from the first side layer to the second side layer, the front and rear exposure stages can be built into a single (preferably integrated) exposure track during circuit pattern exposure of the front and rear layers. The integrated CCD camera module and exposure stage is a travel rail for front and back layer pad image registration with high precision registration with an annular ring size as small as 15 μm.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Furthermore, elements described in association with different embodiments may be combined. It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims. The implementation of the embodiments of the utility model is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, many variants are possible using the solutions and principles shown according to embodiments of the utility model, even in the case of fundamentally different embodiments.

Claims (12)

1. An apparatus for handling a component carrier structure, characterized in that the apparatus (100) comprises:

at least one movable carrier table, at least one of the at least one carrier table being configured for carrying the component carrier structure (102) such that the component carrier structure (102) is exposed on a first side (108) of the component carrier structure (102);

a flipper (130) for flipping the component carrier structure (102) and for placing the flipped component carrier structure (102) on at least one of the at least one carrier station such that a second side (110) of the component carrier structure (102) is exposed; and

a plurality of stationary cameras (112), at least some of the plurality of stationary cameras (112) configured to: -with the first side (108) exposed, capturing images of at least some of the alignment marks (114) located on the first side (108) of the component carrier structure (102) substantially simultaneously when at least one of the at least one carrier table has moved the component carrier structure (102) in the field of view of the stationary cameras, and at least some of the plurality of stationary cameras (112) are configured for: -with the second side (110) exposed, capturing images of at least some of the alignment marks (114) located on the second side (110) of the component carrier structure (102) substantially simultaneously when at least one of the at least one carrier table moves the flipped component carrier structure (102) in the field of view of the stationary camera.

2. The apparatus according to claim 1, characterized in that the at least one carrier table comprises a first carrier table (104), the first carrier table (104) being adapted to move and carry the component carrier structure (102) with the first side (108) exposed, and the at least one carrier table comprises a second carrier table (106), the second carrier table (106) being adapted to move and carry the component carrier structure (102) with the second side (110) exposed.

3. The apparatus of claim 2, wherein each of the first carrier table (104) and the second carrier table (106) is configured to move forward and backward along only one common rail.

4. The apparatus according to claim 1, wherein the at least one carrier table comprises only one carrier table for moving and carrying the component carrier structure (102) with the first side portion (108) exposed and for moving and carrying the component carrier structure (102) with the second side portion (110) exposed.

5. The apparatus of claim 1, wherein the plurality of stationary cameras (112) comprises four cameras for capturing images of respective four alignment marks on respective four corners on the first side (108) and the second side (110) of the component carrier structure (102), respectively.

6. The apparatus of claim 1, wherein the plurality of fixed cameras (112) comprises six cameras for capturing images of respective four corners and two edges of respective six alignment marks on the first and second sides (108, 110) of the component carrier structure (102).

7. The apparatus of claim 1, wherein the apparatus (100) comprises a processor (116), the processor (116) being configured for processing the images captured by the plurality of stationary cameras (112) for adjusting the further processing of the component carrier structure (102).

8. The apparatus of claim 7, wherein the processor (116) is configured for determining a deformation of the component carrier structure (102) based on the captured image.

9. An apparatus according to claim 1, wherein the apparatus (100) comprises an exposure machine (170), the exposure machine (170) being configured to expose the component carrier structure (102) in dependence on information obtained from the captured image.

10. An arrangement, characterized in that the arrangement (120) comprises the apparatus (100) according to claim 1 and a component carrier structure (102) on one of the at least one movable carrier table.

11. The arrangement according to claim 10, wherein the component carrier structure (102) comprises one of the group consisting of a panel, an array and a component carrier.

12. The arrangement according to claim 10, wherein the component carrier structure (102) comprises an alignment mark (114) configured as a plated through hole.

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