CN216313508U - Semifinished product for producing a component carrier and device for processing the semifinished product - Google Patents

Abstract

The application provides a semi-finished product (100) and a processing device (120), the semi-finished product (100) being used for manufacturing a component carrier (102), wherein the semi-finished product (100) comprises: a stack (104) comprising at least one electrically conductive layer structure (106) and/or at least one electrically insulating layer structure (108); and a first alignment mark (110) and a second alignment mark (112) located at different vertical heights of the stack (104), wherein the first alignment mark (110) has an opening (114) in which the second alignment mark (112) is located at least partially in a vertical viewing direction (116) on the stack (104).

Description

Semifinished product for producing a component carrier and device for processing the semifinished product

Technical Field

The utility model relates to a semifinished product for producing a component carrier and to a device for processing a semifinished product for producing a component carrier.

Background

In the case of product functionality growth of component carriers equipped with one or more electronic components and the progressive miniaturization of such components and the increasing number of components to be mounted on component carriers such as printed circuit boards, increasingly powerful array-like components or packages with several components are employed, which have a plurality of contact portions or connection portions, wherein the spacing between the contacts is getting smaller. The removal of heat generated by such components and the component carriers themselves during operation is an increasingly significant problem. At the same time, the component carrier should be mechanically stable and electrically reliable in order to be able to operate even under severe conditions. All these requirements are closely linked to the continuous miniaturization of the component carrier and its constituent components.

However, it may be difficult to manufacture a component carrier structure with high spatial accuracy.

Therefore, it may be necessary to reliably manufacture a component carrier structure with high spatial accuracy.

SUMMERY OF THE UTILITY MODEL

According to the utility model, a semi-finished product for producing a component carrier is provided, wherein the semi-finished product comprises: a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; and first and second alignment marks located at different vertical heights of the stack, wherein the first alignment mark has an opening in which the second alignment mark is located at least partially in a vertical viewing direction on the stack.

According to the utility model, there is provided an apparatus for processing a semifinished product for manufacturing a component carrier having the above-mentioned features, wherein the apparatus comprises an imaging device for capturing a pattern of an interior of the semifinished product in a vertical viewing direction on the stack, such that the pattern comprises projections of a first alignment mark and a second alignment mark on a pattern plane; and a determination unit for determining the alignment information based on the respective identification of the first and second alignment marks in the captured pattern.

In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components on and/or in the component carrier to provide mechanical support and/or electrical connection. In other words, the component carrier can be configured as a mechanical and/or electronic carrier for the component. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different ones of the above-mentioned types of component carriers.

In the context of the present application, the term "semi-finished product" may particularly denote a physical structure used or obtained during the manufacturing of the component carrier. For example, the semi-finished product may be a preform of the component carrier and/or a part of a component carrier structure, such as a panel for manufacturing a printed circuit board.

In the context of the present application, the term "stack" may particularly denote an arrangement of a plurality of planar layer structures, which are mounted in parallel on top of each other.

In the context of the present application, the term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in the same plane.

In the context of the present application, the term "alignment mark" may particularly denote a physical structure for alignment or registration of the component carrier or different parts of the preform of the component carrier during the manufacturing process, particularly with respect to further devices such as laser drilling devices or lithographic devices.

According to the utility model, the different alignment marks at different levels of the semi-finished product for manufacturing the component carrier are arranged such that: one of the alignment marks, e.g. the smaller circle or ring, is arranged partially or preferably completely within the opening of the other alignment mark, e.g. the larger ring, in a viewing direction perpendicular to the stack. When the pattern, preferably an X-ray pattern, of the interior of the stack is then captured along the viewing direction, the smaller alignment marks located within the openings of the larger alignment marks may be suitably distinguished from the larger alignment marks, even in the case of an overlap or distortion. This may allow for improved alignment or registration accuracy. More specifically, the described alignment method may make subsequent processes, such as X-ray drilling of alignment through holes and laser drilling of laser holes in the component carrier more accurate.

Next, further exemplary embodiments of the semi-finished product and the device will be explained.

In an embodiment, the second alignment mark is located entirely within the first alignment mark in a vertical viewing direction on the stack. In the vertical viewing direction, the entire second alignment mark can thus be identified separately from the first alignment mark in the X-ray pattern. Preferably, the second alignment marks may be arranged in a vertical viewing direction on the stack such that: the second alignment mark has a gap between the second alignment mark and the first alignment mark with respect to the first alignment mark. This may further simplify the distinction between two alignment marks and the respective identification of two alignment marks.

In an embodiment, the first alignment mark is a ring-shaped structure. For example, the first alignment mark has a circular or polygonal contour. When the first alignment mark is a ring, the second alignment mark may be located in an opening of the ring in a vertical viewing direction on the stack and may thus be correctly identified.

In an embodiment, the second alignment mark is in the shape of a ring, a circle, or a polygon. These contours can be clearly identified in the opening of the first alignment mark.

In an embodiment, at least one of the first alignment mark and the second alignment mark forms a part of at least one electrically conductive layer structure. In particular, the alignment marks may be copper pads and may be manufactured in a process of patterning copper foils of a stack during forming a build-up layer of the component carrier to be manufactured, substantially without additional work.

In an embodiment, the alignment information comprises relative position information about the first alignment mark and the second alignment mark. In other words, the graphical processing of the pattern captured by the X-ray camera and the projection of the first and second alignment marks onto the pattern plane may allow obtaining relative positioning information about the mutual position and orientation of the first and second alignment marks.

In an embodiment, the apparatus comprises a balancing (or compensating) unit for balancing (or compensating) the position and/or orientation of the semi-finished product based on the determined alignment information. Such a balancing unit may take into account deviations between the actual relative positioning between the first and second alignment marks on the one hand and deviations between the target relative positioning between the first and second alignment marks on the other hand. The balancing unit may partially or completely compensate for this difference, thereby reducing or even eliminating misalignment.

In an embodiment, the apparatus comprises a drilling device configured for forming a drill hole in the semi-finished product extending through both the first and the second alignment marks based on the determined alignment information. In particular, the drilling may remove a portion of the material of each of the first and second alignment marks. Preferably, the drilling means comprises X-ray drilling means (or alternatively, mechanical drilling means or laser drilling means). The semi-finished product may be drilled with a through hole to remove at least a portion of at least one of the first and second alignment marks by X-ray drilling, i.e. by X-ray beam drilling. Drilling may be performed in consideration of predetermined alignment information, thereby improving registration accuracy.

In an embodiment, the apparatus comprises a laser treatment device configured for laser treatment of the semi-finished product using the formed bore hole for alignment. Preferably, the laser processing apparatus comprises a laser drilling apparatus. For example, laser through-holes or laser blind-holes can be drilled in the semifinished product by means of a laser beam. Laser apertures may be formed in one or both of the opposing major surfaces of the stack. Previously formed bores (e.g. X-ray bores, laser bores or mechanical bores) may be used for alignment purposes between the laser source and the semifinished product.

In an embodiment, the imaging device comprises an X-ray camera. Thus, an X-ray pattern may be captured to determine the relative positioning between the first and second alignment marks.

Based on the semi-finished product, the component carrier of the utility model can be manufactured.

In an embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the mentioned electrically insulating layer structure(s) and electrically conductive layer structure(s), in particular formed by applying mechanical pressure and/or thermal energy. The mentioned stack may provide a plate-like component carrier which is able to provide a large mounting surface for further components and which is still very thin and compact. The term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in the same plane.

In an embodiment, the manufactured component carrier is shaped as a plate. This contributes to a compact design, wherein the component carrier nevertheless provides a large base for mounting components on the component carrier. Further, in particular, a bare chip as an example of an embedded electronic component can be easily embedded in a thin plate such as a printed circuit board due to its small thickness.

In an embodiment, the component carrier is configured as one of a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and/or by supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg or FR4 material. The electrically conductive layer structures can be connected to each other in a desired manner by forming through-holes through the laminate, for example by laser drilling or mechanical drilling, and by filling the through-holes with an electrically conductive material, in particular copper, so as to form through-holes as through-hole connections. In addition to one or more components that may be embedded in a printed circuit board, printed circuit boards are typically configured to receive one or more components on one surface or two opposing surfaces of a plate-like printed circuit board. The one or more components may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may include a resin with reinforcing fibers, such as glass fibers.

In the context of the present application, the term "substrate" may particularly denote a small component carrier. The substrate may be a relatively small component carrier to which one or more components may be mounted, relative to the PCB, and may serve as a connection medium between one or more chips and another PCB. For example, the substrate may have substantially the same size as the components (in particular electronic components) to be mounted on the substrate (e.g. in the case of Chip Scale Packages (CSP)). More specifically, a substrate may be understood as a carrier for electrical connections or electrical networks and a component carrier comparable to a Printed Circuit Board (PCB) but with a relatively high density of laterally and/or vertically arranged connections. The transverse connections are, for example, conductive paths, while the vertical connections may be, for example, boreholes. These lateral and/or vertical connections are arranged within the base plate and can be used to provide an electrical, thermal and/or mechanical connection of a received or non-received component (such as a bare wafer), in particular an IC chip, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrates". The dielectric part of the substrate may comprise a resin with reinforcing particles, such as reinforcing spheres, in particular glass spheres.

The substrate or interposer may comprise or consist of: at least one layer of glass, silicon (Si) or a photoimageable or dry-etchable organic material such as an epoxy-based build-up material (e.g. epoxy-based build-up film), or a polymer composite such as a polyimide, polybenzoxazole or benzocyclobutene functionalized polymer.

In an embodiment, the at least one electrically insulating layer structure comprises at least one of: resins (such as reinforced or non-reinforced resins, for example epoxy or bismaleimide-triazine resins), cyanate ester resins, polyphenylene derivatives, glass (especially glass fibers, multiple layers of glass, glassy materials), prepregs (such as FR-4 or FR-5), polyimides, polyamides, Liquid Crystal Polymers (LCP), epoxy laminates, polytetrafluoroethylene (PTFE, teflon), ceramics and metal oxides. Reinforcing structures, such as meshes, fibers or spheres, for example made of glass (multiple layers of glass) may also be used. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based build-up films and photoimageable dielectric materials, may be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins, low temperature co-fired ceramics (LTCC) or other low DK materials, lower DK materials or ultra low DK materials can be applied in the component carrier as the electrically insulating layer structure.

In an embodiment, the at least one electrically conductive layer structure comprises at least one of copper, aluminum, nickel, silver, gold, palladium, and tungsten. Although copper is generally preferred, other materials or other types of coatings thereof are possible, in particular coated with superconducting materials such as graphene.

The at least one component that may be embedded in the stack and/or may be surface mounted on the stack may be selected from: a non-conductive inlay, a conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), a light guide element (e.g., a light guide or light guide connector), an optical element (e.g., a lens), an electronic component, or a combination thereof. For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a storage device (e.g., DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light emitting diode, an opto-coupler, a voltage converter (e.g., a DC/DC converter or an AC/DC converter), a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, a sensor, an actuator, a micro-electro-mechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductance, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components may be embedded in the component carrier. For example, a magnetic element may be used as the component. Such a magnetic element may be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element, a multiferroic element, or a ferrimagnetic element, e.g., a ferrite core), or such a magnetic element may be a paramagnetic element. However, the component may also be a substrate, an interposer or another component carrier, for example in a plate-in-plate configuration. The component may be surface mounted on the component carrier and/or may be embedded inside the component carrier. Furthermore, other components may also be used as components, in particular those which generate and emit electromagnetic radiation and/or which are sensitive to electromagnetic radiation propagating from the environment.

In an embodiment, the component carrier is a laminate type component carrier. In such embodiments, the component carrier is a composite of multiple layers that are stacked and joined together by the application of pressure and/or heat.

After processing the inner layer structure of the component carrier, one or both opposing main surfaces of the processed layer structure may be covered (in particular by lamination) symmetrically or asymmetrically with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, lamination may continue until the desired number of layers is obtained.

After completion of the formation of the stack of the electrically insulating layer structure and the electrically conductive layer structure, the surface treatment of the obtained layer structure or component carrier may be continued.

In particular, in the case of surface treatment, an electrically insulating solder resist may be applied to one or both of the opposite main surfaces of the layer stack or the component carrier. For example, such a solder resist may be formed over the entire main surface and subsequently patterned to expose one or more electrically conductive surface portions for electrically coupling the component carrier with the electronic periphery. The surface portion of the component carrier, in particular the copper-containing surface portion, which remains covered with the solder resist, can be effectively protected from oxidation or corrosion.

In the case of surface treatment, it is also possible to selectively apply a surface finish to the exposed electrically conductive surface portions of the component carrier. Such a surface finish may be an electrically conductive covering material on an exposed electrically conductive layer structure (such as, in particular, pads, conductive tracks, etc. comprising or consisting of copper) on the surface of the component carrier. If such an exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (particularly copper) may oxidize, making the component carrier less reliable. The surface finish may then be formed, for example, as a joint between the surface-mounted component and the component carrier. The surface finish has the function of protecting the exposed electrically conductive layer structure (in particular the copper circuit or the copper pads) and of carrying out the bonding process with one or more components, for example by soldering. Examples of suitable materials for the surface finish are Organic Solderability Preservative (OSP), Electroless Nickel Immersion Gold (ENIG), gold (particularly hard gold), electroless tin, nickel-gold, nickel-palladium, Electroless Nickel Immersion Palladium Immersion Gold (ENIPIG), and the like.

The aspects defined above and further aspects of the utility model are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment. Exemplary embodiments of the present invention will be described in more detail below with reference to examples of embodiments, but the scope of the present invention is not limited thereto.

Drawings

Fig. 1 shows a schematic view of a device according to the utility model for processing a semi-finished product for producing a component carrier.

FIG. 2 illustrates a cross-sectional view of a blank constructed in accordance with the present invention having a first alignment mark and a second alignment mark.

Fig. 3 shows a vertical view of a first and a second alignment mark of a semi-finished product according to the utility model.

Fig. 4 shows two vertical views of a first and a second alignment mark of a semi-finished product according to the utility model.

Fig. 5 shows a cross-sectional view of a component carrier according to the utility model.

Fig. 6 shows two vertical views of a first and a second alignment mark of a semi-finished product according to the utility model.

Fig. 7 shows a cross-sectional view of a conventional semi-finished product having a first alignment mark and a second alignment mark.

Fig. 8 shows a cross-sectional view of the conventional semi-finished product of fig. 7 after the through-hole has been drilled.

Fig. 9 shows two vertical views of the first and second alignment marks of a conventional semi-finished product.

Fig. 10 shows a cross-sectional view of a conventional component carrier.

Detailed Description

The illustration in the drawings is schematically.

Before proceeding to a more detailed description of exemplary embodiments with reference to the accompanying drawings, some general considerations upon which exemplary embodiments of the present invention may be developed will be outlined.

According to an exemplary embodiment of the present invention, a first alignment mark and a second alignment mark having different sized separate ring designs for the front and back sides may be provided. Therefore, the centers of the front side mark (e.g., the first alignment mark) and the rear side mark (e.g., the second alignment mark) can be accurately measured as expected. Furthermore, the direction of the front and back offset can be clearly defined. The offset of the front and back marks may be balanced by forming the through-holes by an X-ray drilling machine, or a laser drilling machine, or a mechanical drilling machine. Thus, the risk of registration problems of the laser perforation with the core pad may be reduced.

Advantageously, exemplary embodiments of the present invention allow layer-to-layer offsets to be identified in the first horizontal direction and/or the second horizontal direction, which facilitates monitoring of alignment accuracy. In particular, exemplary embodiments of the present invention allow for improved laser perforation offset with an inner layer pattern. By correspondingly adapting the software of the X-ray drilling machine, layer-to-layer offset data of a component carrier, such as a PCB, can be monitored online with high quality. Exemplary embodiments of the present invention may be particularly useful for improving the registration capability of laser and lithographic processes. By running appropriate software on an X-ray drilling machine, the accuracy of the alignment of the through-holes with the front/back marks can be accurately measured. Exemplary embodiments of the present invention also help control the accuracy stability of the X-ray drilling process.

According to an exemplary embodiment of the present invention, an X-ray bore using a ring design of pairs of alignment marks is provided. Such ring marks may allow top and bottom layer offsets to be well balanced and may allow the offsets to be accurately measured. Thus, exemplary embodiments may balance top/bottom pattern shifts by X-ray, which may result in improvements in alignment accuracy for smaller annular rings. By providing the second alignment mark inside the first alignment mark in the viewing direction of the X-ray camera, the alignment hole exhibits good accuracy performance. Therefore, reliable layer-to-layer bias information can be obtained. A good balance of top and bottom layers can be achieved. The relative coordinates of the layer-to-layer offsets can be accurately measured.

Fig. 1 shows a schematic view of an apparatus 120 for processing a semi-finished product 100 for producing a component carrier according to the utility model. The semi-finished product 100 may be a preform of a component carrier (such as a printed circuit board, PCB) currently being manufactured. The semi-finished product 100 may also be a component carrier structure (such as a panel or an array of a plurality of component carriers to be manufactured) before being divided into individual component carriers or preforms of individual component carriers. In processing the semi-finished product 100, lamination may be performed after the core is provided. Thereafter, frame drilling (e.g., X-ray drilling) may be performed, followed by laser drilling.

The illustrated blank 100 may include a laminated layer stack 104 of an electrically-conductive layer structure 106 and an electrically-insulating layer structure 108. As shown in fig. 1 and also in fig. 2, the electrically conductive layer structure 106 may comprise a patterned copper foil or a continuous copper foil. Although not shown in fig. 1, the electrically conductive layer structure 106 may also include vertical through-connections, such as copper-filled laser perforations that may be produced by plating. The one or more electrically insulating layer structures 108 may comprise a respective resin (such as a respective epoxy resin), preferably including reinforcing particles (e.g. glass fibers or glass spheres) in the respective resin. For example, the electrically insulating layer structure 108 may be made of prepreg or FR 4.

The illustrated apparatus 120 is used for processing such a semi-finished product 100 during the manufacture of a (in particular PCB-type) component carrier 102. As shown, the apparatus 120 comprises an imaging device 122, here embodied as an X-ray camera, for capturing an X-ray pattern of the interior of the semi-finished product 100 along a vertical viewing direction 116 (see also fig. 2) on the stack 104, such that the pattern comprises projections of the first and second alignment marks 110, 112 embedded in the stack 104. Each of the alignment marks 110, 112 is made of copper in a surrounding resin matrix, and each of the alignment marks 110, 112 is disposed near a respective one of two opposite main surfaces of the semi-finished product 100. A particularly advantageous configuration of the alignment marks 110, 112 will be described with reference to fig. 2. The illustrated X-ray camera includes an X-ray source 150 for generating X-rays and an X-ray detector 152 for detecting X-rays after interaction with the semi-finished product 100.

Furthermore, the device 120 comprises a determination unit 124, the determination unit 124 being configured to determine the alignment information based on the captured pattern. For this purpose, the alignment marks 110, 112 may be identified separately on the captured pattern, e.g. by pattern recognition, and the mutual position between the alignment marks 110, 112 may be used to obtain alignment or registration information. Accordingly, the alignment information includes relative position information about the first and second alignment marks 110 and 112. Furthermore, the apparatus 120 may comprise a balancing unit 126 for balancing the position and/or orientation of the semi-finished product 100 based on the determined alignment information. For example, the determination unit 124 and the balancing unit 126 may form part of the control unit or processor 154.

As also shown in fig. 1, the apparatus 120 may further include a drilling device 128 (e.g., an X-ray drilling device), the drilling device 128 configured for forming a bore (not shown in fig. 1, compare reference numeral 162 in fig. 5) in the semi-finished product 100 that extends through both the first alignment mark 110 and the second alignment mark 112 based on the determined alignment information. The alignment drill may then be used for alignment purposes during a subsequent laser drilling process.

For example, the apparatus 120 may include a laser processing device 130 (the laser processing device 130, for example, includes a laser source 180 and a camera 182), and the laser processing device 130 may be configured as a laser drilling device configured for laser processing the semi-finished product 100 using the drilled holes formed for alignment. In connection with drilling one or more laser bores in the stack 104, the laser processing device 130 may align the laser processing device 130 relative to the semi-finished product 100 using alignment information derived from the detection of the alignment bores. Thereafter, the one or more laser drilled holes may be partially or completely filled with an electrically conductive material (e.g., copper) by plating.

As an alternative to the apparatus 100 according to fig. 1, the function of the laser processing device 130 (e.g. laser drilling device) may be replaced by a drilling device 128 (e.g. laser drilling device). This means that one drilling device can be used to form the alignment holes 162 and to form product holes, such as laser perforations 163 (compare fig. 5). In such an embodiment, the laser processing device 130 may be omitted.

Optionally, the apparatus 120 may be configured to perform image processing using the bore hole formed for alignment.

Due to the described registration principle by the alignment marks 110, 112 and the alignment bore holes, PCB manufacturing can be rendered highly accurate in view of precise alignment.

Fig. 2 shows a cross-sectional view of a semi-finished product 100 having a first alignment mark 110 and a second alignment mark 112 according to the present invention. Such a semi-finished product 100 may be used in connection with an apparatus 120 according to fig. 1 for manufacturing a component carrier 102, such as the one shown in fig. 5.

The blank 100 comprises the above-mentioned stack 104, the stack 104 comprising an electrically conductive layer structure 106 and an electrically insulating layer structure 108. The first alignment mark 110 mentioned above may be embedded in a bottom portion of the stack 104. However, the first alignment mark 110 may be an inner layer of the stack 104, i.e. the first alignment mark 110 is not an outer or surface layer. Correspondingly, the second alignment mark 112 described above may be embedded in the top portion of the stack 102 such that the alignment marks 110, 112 are located at different vertical heights of the stack 104. However, the second alignment mark 112 may be an inner layer of the stack 104, i.e., the second alignment mark 112 is not an outer or surface layer. As shown, the first alignment mark 110 has a central opening 114 in which the second alignment mark 112 is located entirely in a vertical viewing direction 116 on the stack 104. Advantageously, the first alignment mark 110 is a closed ring-shaped structure having a circular contour. Correspondingly, the second alignment mark 112 may also be a closed ring-shaped structure having a circular contour. Advantageously, the outer diameter of the second alignment mark 112 is smaller than the inner diameter of the first alignment mark 110. Thus, both alignment marks 110, 112 may be fully and independently identified in the X-ray pattern captured by the X-ray camera, denoted by reference numeral 122 in fig. 1.

More advantageously, each of the first alignment mark 110 and the second alignment mark 112 forms part of the electrically conductive layer structure 106, i.e. each of the first alignment mark 110 and the second alignment mark 112 may be formed by structuring a corresponding copper layer in the stack 104. Therefore, substantially no additional work is done to form the first and second alignment marks 110, 112 during the build-up of the component carrier 102.

Fig. 3 shows a vertical view of the first alignment mark 110 and the second alignment mark 112 of the semi-finished product 100 according to the utility model. The alignment marks 110, 112 serve as front and back marks, respectively.

Illustratively, FIG. 3 shows a ring-shaped design of alignment marks 110, 112 captured by an X-ray camera of device 120. Due to the geometry of the alignment marks 110, 112 described with reference to FIG. 2, each alignment mark 110, 112 may be separately identified in the captured image of FIG. 4. Referring again to fig. 1, the determination unit 124 may be configured for determining the alignment information based on identifying the first alignment mark 110 and the second alignment mark 112, respectively, in the captured pattern. Thus, concentric pad-type alignment marks 110, 112 may be formed adjacent to the front and back sides of the stack 104, respectively. Thus, the X-ray diagram shows two separate rings corresponding to the front and back faces, of different sizes and not superimposed.

Based on the ring design of fig. 2 and 3, the corresponding X-ray image shows two concentric copper rings with different sizes, which can be clearly distinguished by the hardware and software of the X-ray camera and subsequent image processing. Thus, the X-ray drilling can be made more precise and, as a further effect, the laser drilling process can be made more accurate, since the laser drilling process can use X-ray drilling for alignment purposes.

Fig. 4 shows two vertical views of the first alignment mark 110 and the second alignment mark 112 of the semi-finished product 100 according to the utility model.

The left side of fig. 4 shows the X-ray pattern of two separate rings with a gap 186 between them, which trace back to the concentric alignment marks 110, 112, but are slightly off-center due to registration inaccuracies, etc. On the right side of fig. 4, reference numeral 156 shows the center of the second alignment mark 112 (also denoted as the back mark), and reference numeral 158 shows the center of the first alignment mark 110 (also denoted as the front mark). Due to the eccentricity of the alignment marks 110, 112, the two mentioned centers are offset from each other. Further, the right side of fig. 4 shows the expected center of the front mark/back mark, and thus the result of the balance calculation, with reference numeral 160. More specifically, since the front-to-back offset is identified in the X-ray pattern, subsequent X-ray drilling procedures can be balanced to at least partially compensate for such offset.

Fig. 5 shows a cross-sectional view of a component carrier 102 according to the utility model. The component carrier 102 of fig. 5 may be obtained by X-ray drilling of a semi-finished product 100, such as the semi-finished product 100 shown in fig. 2, using the balancing or compensation according to fig. 4. In particular, FIG. 5 shows an X-ray bore 162 extending through the stack 104 and through a central portion of the alignment marks 110, 112 having a ring design. More specifically, the bore 162 extends through the stack 104 so that the balance information measured in FIG. 4 can be detected in the outer layer used in the next process. Due to the artifact (artifact) shown on the right side of fig. 4, the X-ray bore 162 extends slightly asymmetrically through the alignment marks 110, 112. With reference to the second alignment mark 112, the compensation may be viewed as balancing the X-ray bore 162 near the left in fig. 5. The bore 162 extending through the stack 104 and through the central portion of the alignment marks 110, 112 having the ring design is an alignment hole calculated by balancing. Then, with reference to the alignment hole, a hole is drilled in the left product area using laser processing (see laser processing apparatus 130). This may result in better accuracy of the X-ray drilling and thus of the subsequent laser drilling process.

With regard to the mentioned subsequent laser drilling by a laser drilling device, such as the laser drilling device shown at 130 in fig. 1, a laser perforation 163 may be drilled, for example, in two opposing major surfaces of the stack 104 and the laser perforation 163 may subsequently be filled with an electrically conductive material, such as copper, by plating, thereby producing a plated laser perforation 163 with high accuracy.

Fig. 6 shows two vertical views of the first alignment mark 110 and the second alignment mark 112 of the semi-finished product 100 according to the utility model.

More specifically, the left side of fig. 6 shows the X-ray pattern before X-ray drilling (i.e., the read X-ray marker pattern), while the right side of fig. 6 shows the X-ray pattern after X-ray drilling (i.e., the pattern after drilling the alignment holes).

Fig. 7 shows a cross-sectional view of a conventional semi-finished product 200 having a stack 204 with copper structures 206 and prepreg structures 208, the stack 204 having circular first alignment marks 210 (as pad marks on the back side) and circular second alignment marks 212 (as pad marks on the front side) in the shape of a circle. Both pad indicia have the same center 220. According to fig. 7, the X-ray camera of the X-ray drilling machine may measure the center of both the front pad mark and the back pad mark.

Fig. 8 shows a cross-sectional view of the conventional semi-finished product of fig. 7 after the through-hole has been drilled. According to fig. 8, an X-ray drilled through hole 230 is formed at the intended center of the front and back marks.

Fig. 9 shows two vertical views of the first and second alignment marks 210 and 212 of the conventional semi-finished product 200. The center of the front face indicia is shown with reference numeral 232 and the center of the back face indicia is shown with reference numeral 234. As shown, there is an offset between the front pad indicia and the back pad indicia. Since such an offset of the front pad mark and the back pad mark is unavoidable, the camera of the X-ray drilling machine cannot recognize the offset direction of the front mark/back mark, see the right side of fig. 9. Here, reference numeral 236 shows the center of the identified ellipse, while reference numeral 238 shows the expected center of the front/back. When there is a dimensional gap between the front and back marks, the expected centers of the front and back marks cannot be accurately measured because the camera of the X-ray drilling machine simply recognizes the front and back pad marks as ellipses with centers as follows: the center is always close to the center of the great circle.

Fig. 10 shows a cross-sectional view of a conventional component carrier 202 with copper-filled laser perforations 240. Since the front/back alignment pad size gap is unavoidable, the through holes drilled by the X-ray drilling machine may always be offset to the great circle side, and the offset of the through holes presents a serious registration problem for the laser via to the core pad.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Furthermore, elements described in association with different embodiments may be combined. It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims. The implementation of the embodiments of the utility model is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, many variants are possible using the illustrated solutions and principles according to embodiments of the utility model, even in the case of fundamentally different embodiments.

Claims (21)

1. A semi-finished product (100) for manufacturing a component carrier, the semi-finished product (100) being for manufacturing a component carrier (102), characterized in that the semi-finished product (100) comprises:

a stack (104), the stack (104) comprising at least one electrically conductive layer structure (106) and/or at least one electrically insulating layer structure (108); and

a first alignment mark (110) and a second alignment mark (112), the first alignment mark (110) and the second alignment mark (112) being located at different vertical heights of the stack (104);

wherein the first alignment mark (110) has an opening (114), in which opening (114) the second alignment mark (112) is located at least partially in a vertical viewing direction (116) on the stack (104).

2. Semi-finished product (100) according to claim 1, characterised in that said second alignment mark (112) is located entirely within said first alignment mark (110) in said vertical viewing direction (116) on said stack (104).

3. Semi-finished product (100) according to claim 1, characterised in that said first alignment mark (110) is of annular configuration.

4. Semi-finished product (100) according to claim 1, characterised in that said first alignment mark (110) has a circular or polygonal outline.

5. Semi-finished product (100) according to claim 1, characterised in that said second alignment marks (112) are of annular, circular or polygonal configuration.

6. Semi-finished product (100) according to claim 1, wherein at least one of said first alignment mark (110) and said second alignment mark (112) forms part of said at least one electrically conductive layer structure (106).

7. Semi-finished product (100) according to claim 1, characterised in that a bore (162) extends through said first alignment mark (110) and said second alignment mark (112).

8. Semi-finished product (100) according to claim 7, characterised in that said drilling (162) extends through the entire said stack (104).

9. Semi-finished product (100) according to claim 1, characterized in that at least one of said first alignment mark (110) and said second alignment mark (112) is an inner layer of said stack (104).

10. A processing apparatus (120) for processing a semi-finished product (100) for manufacturing a component carrier (102) according to claim 1, the processing apparatus (120) comprising:

an imaging device (122) for capturing a graphic of an interior of the semi-finished product (100) along the vertical viewing direction (116) on the stack (104), such that the graphic comprises projections of the first alignment mark (110) and the second alignment mark (112); and

a determination unit (124), the determination unit (124) for determining alignment information based on the respective identification of the first alignment mark (110) and the second alignment mark (112) in the captured pattern.

11. The processing apparatus (120) according to claim 10, wherein the alignment information comprises relative position information about the first alignment mark (110) and the second alignment mark (112).

12. The processing apparatus (120) according to claim 10, wherein the processing apparatus (120) comprises a balancing unit (126), the balancing unit (126) being configured to balance a position and/or an orientation of the semi-finished product (100) with respect to at least a part of the processing apparatus (120) based on the determined alignment information.

13. The processing apparatus (120) according to claim 10, wherein the processing apparatus (120) comprises a drilling device (128), the drilling device (128) being configured for forming a drill hole (162) in the semi-finished product (100) extending through both the first alignment mark (110) and the second alignment mark (112) based on the determined alignment information.

14. The processing apparatus (120) according to claim 13, wherein the drilling device (128) comprises an X-ray drilling device, or a laser drilling device, or a mechanical drilling device.

15. The processing apparatus (120) according to claim 13, wherein the drilling device (128) is configured for laser processing the semi-finished product (100) using the drilled hole (162) for the formed alignment.

16. The processing apparatus (120) according to claim 13, wherein the processing apparatus (120) comprises a laser processing device (130), the laser processing device (130) being configured for laser processing the semi-finished product (100) using the formed bore (162) for alignment.

17. The processing apparatus (120) according to claim 16, wherein the laser processing device (130) comprises a laser drilling device.

18. The processing apparatus (120) according to claim 16, wherein the laser processing device (130) comprises a laser source (180) and a camera (182).

19. The processing apparatus (120) of claim 10, wherein the imaging device (122) comprises an X-ray camera.

20. The processing apparatus (120) according to claim 10, wherein the processing apparatus (120) is configured for performing image processing based on the determined alignment information.

21. The processing apparatus (120) according to claim 13, wherein the processing apparatus (120) is configured for performing image processing based on the borehole (162).

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