JP7424542B2 - ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法 - Google Patents

ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法 Download PDF

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Publication number
JP7424542B2
JP7424542B2 JP2023522512A JP2023522512A JP7424542B2 JP 7424542 B2 JP7424542 B2 JP 7424542B2 JP 2023522512 A JP2023522512 A JP 2023522512A JP 2023522512 A JP2023522512 A JP 2023522512A JP 7424542 B2 JP7424542 B2 JP 7424542B2
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Japan
Prior art keywords
heat sink
circuit board
insulating layer
layer
circuit
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JP2023522512A
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Japanese (ja)
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JPWO2023090013A1 (https=
JPWO2023090013A5 (https=
Inventor
茂幸 八木
昭仁 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Publication of JPWO2023090013A1 publication Critical patent/JPWO2023090013A1/ja
Publication of JPWO2023090013A5 publication Critical patent/JPWO2023090013A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
JP2023522512A 2021-11-19 2022-10-14 ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法 Active JP7424542B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021188502 2021-11-19
JP2021188502 2021-11-19
JP2022007786 2022-01-21
JP2022007786 2022-01-21
PCT/JP2022/038417 WO2023090013A1 (ja) 2021-11-19 2022-10-14 ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法

Publications (3)

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JPWO2023090013A1 JPWO2023090013A1 (https=) 2023-05-25
JPWO2023090013A5 JPWO2023090013A5 (https=) 2023-10-24
JP7424542B2 true JP7424542B2 (ja) 2024-01-30

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JP2023522512A Active JP7424542B2 (ja) 2021-11-19 2022-10-14 ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法

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JP (1) JP7424542B2 (https=)
WO (1) WO2023090013A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025013919A1 (https=) * 2023-07-12 2025-01-16

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057406A (ja) 1999-06-11 2001-02-27 Matsushita Electric Ind Co Ltd 放熱基板及びその製造方法
JP2001203313A (ja) 1999-11-09 2001-07-27 Matsushita Electric Ind Co Ltd 熱伝導基板およびその製造方法
JP2014090103A (ja) 2012-10-31 2014-05-15 Denso Corp モールドパッケージおよびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210764A (ja) * 2000-01-26 2001-08-03 Matsushita Electric Works Ltd 熱伝導基板及びその製造方法
JP2007311770A (ja) * 2006-04-17 2007-11-29 Mitsubishi Electric Corp 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057406A (ja) 1999-06-11 2001-02-27 Matsushita Electric Ind Co Ltd 放熱基板及びその製造方法
JP2001203313A (ja) 1999-11-09 2001-07-27 Matsushita Electric Ind Co Ltd 熱伝導基板およびその製造方法
JP2014090103A (ja) 2012-10-31 2014-05-15 Denso Corp モールドパッケージおよびその製造方法

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JPWO2023090013A1 (https=) 2023-05-25
WO2023090013A1 (ja) 2023-05-25

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