JPWO2023090013A1 - - Google Patents
Info
- Publication number
- JPWO2023090013A1 JPWO2023090013A1 JP2023522512A JP2023522512A JPWO2023090013A1 JP WO2023090013 A1 JPWO2023090013 A1 JP WO2023090013A1 JP 2023522512 A JP2023522512 A JP 2023522512A JP 2023522512 A JP2023522512 A JP 2023522512A JP WO2023090013 A1 JPWO2023090013 A1 JP WO2023090013A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021188502 | 2021-11-19 | ||
| JP2021188502 | 2021-11-19 | ||
| JP2022007786 | 2022-01-21 | ||
| JP2022007786 | 2022-01-21 | ||
| PCT/JP2022/038417 WO2023090013A1 (ja) | 2021-11-19 | 2022-10-14 | ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023090013A1 true JPWO2023090013A1 (https=) | 2023-05-25 |
| JPWO2023090013A5 JPWO2023090013A5 (https=) | 2023-10-24 |
| JP7424542B2 JP7424542B2 (ja) | 2024-01-30 |
Family
ID=86396839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023522512A Active JP7424542B2 (ja) | 2021-11-19 | 2022-10-14 | ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7424542B2 (https=) |
| WO (1) | WO2023090013A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2025013919A1 (https=) * | 2023-07-12 | 2025-01-16 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001057406A (ja) * | 1999-06-11 | 2001-02-27 | Matsushita Electric Ind Co Ltd | 放熱基板及びその製造方法 |
| JP2001203313A (ja) * | 1999-11-09 | 2001-07-27 | Matsushita Electric Ind Co Ltd | 熱伝導基板およびその製造方法 |
| JP2014090103A (ja) * | 2012-10-31 | 2014-05-15 | Denso Corp | モールドパッケージおよびその製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001210764A (ja) * | 2000-01-26 | 2001-08-03 | Matsushita Electric Works Ltd | 熱伝導基板及びその製造方法 |
| JP2007311770A (ja) * | 2006-04-17 | 2007-11-29 | Mitsubishi Electric Corp | 半導体装置 |
-
2022
- 2022-10-14 WO PCT/JP2022/038417 patent/WO2023090013A1/ja not_active Ceased
- 2022-10-14 JP JP2023522512A patent/JP7424542B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001057406A (ja) * | 1999-06-11 | 2001-02-27 | Matsushita Electric Ind Co Ltd | 放熱基板及びその製造方法 |
| JP2001203313A (ja) * | 1999-11-09 | 2001-07-27 | Matsushita Electric Ind Co Ltd | 熱伝導基板およびその製造方法 |
| JP2014090103A (ja) * | 2012-10-31 | 2014-05-15 | Denso Corp | モールドパッケージおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023090013A1 (ja) | 2023-05-25 |
| JP7424542B2 (ja) | 2024-01-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230412 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230412 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20230412 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230725 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230919 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231219 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240101 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 7424542 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |