JPWO2023090013A5 - - Google Patents
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- Publication number
- JPWO2023090013A5 JPWO2023090013A5 JP2023522512A JP2023522512A JPWO2023090013A5 JP WO2023090013 A5 JPWO2023090013 A5 JP WO2023090013A5 JP 2023522512 A JP2023522512 A JP 2023522512A JP 2023522512 A JP2023522512 A JP 2023522512A JP WO2023090013 A5 JPWO2023090013 A5 JP WO2023090013A5
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- insulating layer
- circuit
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 18
- 239000011347 resin Substances 0.000 claims 18
- 238000007789 sealing Methods 0.000 claims 18
- 239000004065 semiconductor Substances 0.000 claims 12
- 238000000034 method Methods 0.000 claims 9
- 239000003822 epoxy resin Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 8
- 229920000647 polyepoxide Polymers 0.000 claims 8
- 239000000463 material Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- NQMUGNMMFTYOHK-UHFFFAOYSA-N 1-Methoxynaphthalene Natural products C1=CC=C2C(OC)=CC=CC2=C1 NQMUGNMMFTYOHK-UHFFFAOYSA-N 0.000 claims 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 1
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical group C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 238000000748 compression moulding Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 230000005484 gravity Effects 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 1
- 125000001624 naphthyl group Chemical group 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000001721 transfer moulding Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021188502 | 2021-11-19 | ||
| JP2021188502 | 2021-11-19 | ||
| JP2022007786 | 2022-01-21 | ||
| JP2022007786 | 2022-01-21 | ||
| PCT/JP2022/038417 WO2023090013A1 (ja) | 2021-11-19 | 2022-10-14 | ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023090013A1 JPWO2023090013A1 (https=) | 2023-05-25 |
| JPWO2023090013A5 true JPWO2023090013A5 (https=) | 2023-10-24 |
| JP7424542B2 JP7424542B2 (ja) | 2024-01-30 |
Family
ID=86396839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023522512A Active JP7424542B2 (ja) | 2021-11-19 | 2022-10-14 | ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7424542B2 (https=) |
| WO (1) | WO2023090013A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2025013919A1 (https=) * | 2023-07-12 | 2025-01-16 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3605547B2 (ja) * | 1999-06-11 | 2004-12-22 | 松下電器産業株式会社 | 放熱基板及びその製造方法 |
| JP2001203313A (ja) | 1999-11-09 | 2001-07-27 | Matsushita Electric Ind Co Ltd | 熱伝導基板およびその製造方法 |
| JP2001210764A (ja) * | 2000-01-26 | 2001-08-03 | Matsushita Electric Works Ltd | 熱伝導基板及びその製造方法 |
| JP2007311770A (ja) * | 2006-04-17 | 2007-11-29 | Mitsubishi Electric Corp | 半導体装置 |
| JP2014090103A (ja) | 2012-10-31 | 2014-05-15 | Denso Corp | モールドパッケージおよびその製造方法 |
-
2022
- 2022-10-14 WO PCT/JP2022/038417 patent/WO2023090013A1/ja not_active Ceased
- 2022-10-14 JP JP2023522512A patent/JP7424542B2/ja active Active
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