JP7423294B2 - 配線基板および電子機器 - Google Patents

配線基板および電子機器 Download PDF

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Publication number
JP7423294B2
JP7423294B2 JP2019224921A JP2019224921A JP7423294B2 JP 7423294 B2 JP7423294 B2 JP 7423294B2 JP 2019224921 A JP2019224921 A JP 2019224921A JP 2019224921 A JP2019224921 A JP 2019224921A JP 7423294 B2 JP7423294 B2 JP 7423294B2
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JP
Japan
Prior art keywords
wiring
wiring board
differential signal
layer
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019224921A
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English (en)
Japanese (ja)
Other versions
JP2021093507A (ja
JP2021093507A5 (enExample
Inventor
季行 吉田
優 小川
昇司 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2019224921A priority Critical patent/JP7423294B2/ja
Priority to US17/112,465 priority patent/US11553586B2/en
Priority to CN202011450420.1A priority patent/CN112996228B/zh
Publication of JP2021093507A publication Critical patent/JP2021093507A/ja
Publication of JP2021093507A5 publication Critical patent/JP2021093507A5/ja
Priority to JP2024004628A priority patent/JP7581545B2/ja
Application granted granted Critical
Publication of JP7423294B2 publication Critical patent/JP7423294B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2019224921A 2019-12-12 2019-12-12 配線基板および電子機器 Active JP7423294B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019224921A JP7423294B2 (ja) 2019-12-12 2019-12-12 配線基板および電子機器
US17/112,465 US11553586B2 (en) 2019-12-12 2020-12-04 Wiring substrate and electronic device
CN202011450420.1A CN112996228B (zh) 2019-12-12 2020-12-11 布线基板和电子设备
JP2024004628A JP7581545B2 (ja) 2019-12-12 2024-01-16 配線基板および電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019224921A JP7423294B2 (ja) 2019-12-12 2019-12-12 配線基板および電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024004628A Division JP7581545B2 (ja) 2019-12-12 2024-01-16 配線基板および電子機器

Publications (3)

Publication Number Publication Date
JP2021093507A JP2021093507A (ja) 2021-06-17
JP2021093507A5 JP2021093507A5 (enExample) 2022-12-14
JP7423294B2 true JP7423294B2 (ja) 2024-01-29

Family

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Family Applications (2)

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JP2019224921A Active JP7423294B2 (ja) 2019-12-12 2019-12-12 配線基板および電子機器
JP2024004628A Active JP7581545B2 (ja) 2019-12-12 2024-01-16 配線基板および電子機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024004628A Active JP7581545B2 (ja) 2019-12-12 2024-01-16 配線基板および電子機器

Country Status (3)

Country Link
US (1) US11553586B2 (enExample)
JP (2) JP7423294B2 (enExample)
CN (1) CN112996228B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022207738A1 (de) 2021-07-30 2023-02-02 Canon Kabushiki Kaisha Flexible leiterplatte, herstellungsverfahren, elektronisches modul, elektronische einheit und elektronische vorrichtung
JP2023049844A (ja) * 2021-09-29 2023-04-10 キヤノン株式会社 フレキシブル配線板、電子モジュール、電子ユニットおよび電子機器
KR102561829B1 (ko) * 2022-05-24 2023-07-31 주식회사 원캐스트 통합 배선반의 장애 관리 시스템
US12426151B2 (en) * 2023-03-09 2025-09-23 Htc Corporation Circuit board and layout method thereof
TWI857632B (zh) * 2023-06-02 2024-10-01 矽品精密工業股份有限公司 承載結構

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010010271A1 (en) 1998-08-31 2001-08-02 Gwun-Jin Lin Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time
JP2010212438A (ja) 2009-03-10 2010-09-24 Sumitomo Bakelite Co Ltd 回路基板
JP2012227211A (ja) 2011-04-15 2012-11-15 Olympus Corp 差動信号用配線基板
JP2015065252A (ja) 2013-09-25 2015-04-09 日本シイエムケイ株式会社 プリント配線板
CN113573464A (zh) 2021-06-30 2021-10-29 武汉天马微电子有限公司 电路板及其制备方法和显示面板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6344667B1 (en) * 1998-03-02 2002-02-05 Kabushiki Kaisha Toshiba Wiring board with reduced radiation of undesired electromagnetic waves
TW476229B (en) 1998-08-24 2002-02-11 Adv Flexible Circuits Co Ltd Circuit board having shielding plate with empty-hole opening pattern to control impedance and transmission time
JP4162630B2 (ja) * 2004-06-08 2008-10-08 Ｔｄｋ株式会社 信号伝送回路並びに同回路を備えた電子機器及びケーブル
US7504904B1 (en) * 2006-04-04 2009-03-17 Unisys Corporation Printed-circuit impedance control using skewed reference mesh
JP5004871B2 (ja) * 2007-07-09 2012-08-22 キヤノン株式会社 プリント配線板
JP2009224489A (ja) * 2008-03-14 2009-10-01 Toshiba Corp 配線基板装置
US8248183B2 (en) * 2009-07-30 2012-08-21 Sierra Wireless, Inc. Circuit board pad having impedance matched to a transmission line and method for providing same
JP5441814B2 (ja) * 2010-05-14 2014-03-12 キヤノン株式会社 プリント配線板及びプリント配線板を備えたデバイス
CN102959629B (zh) * 2011-02-17 2015-12-09 松下电器产业株式会社 光盘驱动装置及布线构造
US20130313013A1 (en) * 2012-05-23 2013-11-28 David Sala Porta Printed circuit boards
JP6508219B2 (ja) * 2015-01-21 2019-05-08 日本電気株式会社 配線基板およびその設計方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010010271A1 (en) 1998-08-31 2001-08-02 Gwun-Jin Lin Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time
JP2010212438A (ja) 2009-03-10 2010-09-24 Sumitomo Bakelite Co Ltd 回路基板
JP2012227211A (ja) 2011-04-15 2012-11-15 Olympus Corp 差動信号用配線基板
JP2015065252A (ja) 2013-09-25 2015-04-09 日本シイエムケイ株式会社 プリント配線板
CN113573464A (zh) 2021-06-30 2021-10-29 武汉天马微电子有限公司 电路板及其制备方法和显示面板

Also Published As

Publication number Publication date
US20210185798A1 (en) 2021-06-17
US11553586B2 (en) 2023-01-10
JP7581545B2 (ja) 2024-11-12
CN112996228B (zh) 2025-01-28
JP2021093507A (ja) 2021-06-17
CN112996228A (zh) 2021-06-18
JP2024026783A (ja) 2024-02-28

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