JP2021093507A5 - - Google Patents

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Publication number
JP2021093507A5
JP2021093507A5 JP2019224921A JP2019224921A JP2021093507A5 JP 2021093507 A5 JP2021093507 A5 JP 2021093507A5 JP 2019224921 A JP2019224921 A JP 2019224921A JP 2019224921 A JP2019224921 A JP 2019224921A JP 2021093507 A5 JP2021093507 A5 JP 2021093507A5
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JP
Japan
Prior art keywords
wiring
wiring board
differential signal
board according
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019224921A
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English (en)
Japanese (ja)
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JP7423294B2 (ja
JP2021093507A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2019224921A priority Critical patent/JP7423294B2/ja
Priority claimed from JP2019224921A external-priority patent/JP7423294B2/ja
Priority to US17/112,465 priority patent/US11553586B2/en
Priority to CN202011450420.1A priority patent/CN112996228B/zh
Publication of JP2021093507A publication Critical patent/JP2021093507A/ja
Publication of JP2021093507A5 publication Critical patent/JP2021093507A5/ja
Priority to JP2024004628A priority patent/JP7581545B2/ja
Application granted granted Critical
Publication of JP7423294B2 publication Critical patent/JP7423294B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019224921A 2019-12-12 2019-12-12 配線基板および電子機器 Active JP7423294B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019224921A JP7423294B2 (ja) 2019-12-12 2019-12-12 配線基板および電子機器
US17/112,465 US11553586B2 (en) 2019-12-12 2020-12-04 Wiring substrate and electronic device
CN202011450420.1A CN112996228B (zh) 2019-12-12 2020-12-11 布线基板和电子设备
JP2024004628A JP7581545B2 (ja) 2019-12-12 2024-01-16 配線基板および電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019224921A JP7423294B2 (ja) 2019-12-12 2019-12-12 配線基板および電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024004628A Division JP7581545B2 (ja) 2019-12-12 2024-01-16 配線基板および電子機器

Publications (3)

Publication Number Publication Date
JP2021093507A JP2021093507A (ja) 2021-06-17
JP2021093507A5 true JP2021093507A5 (enExample) 2022-12-14
JP7423294B2 JP7423294B2 (ja) 2024-01-29

Family

ID=76312792

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019224921A Active JP7423294B2 (ja) 2019-12-12 2019-12-12 配線基板および電子機器
JP2024004628A Active JP7581545B2 (ja) 2019-12-12 2024-01-16 配線基板および電子機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024004628A Active JP7581545B2 (ja) 2019-12-12 2024-01-16 配線基板および電子機器

Country Status (3)

Country Link
US (1) US11553586B2 (enExample)
JP (2) JP7423294B2 (enExample)
CN (1) CN112996228B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022207738A1 (de) 2021-07-30 2023-02-02 Canon Kabushiki Kaisha Flexible leiterplatte, herstellungsverfahren, elektronisches modul, elektronische einheit und elektronische vorrichtung
JP2023049844A (ja) * 2021-09-29 2023-04-10 キヤノン株式会社 フレキシブル配線板、電子モジュール、電子ユニットおよび電子機器
KR102561829B1 (ko) * 2022-05-24 2023-07-31 주식회사 원캐스트 통합 배선반의 장애 관리 시스템
US12426151B2 (en) * 2023-03-09 2025-09-23 Htc Corporation Circuit board and layout method thereof
TWI857632B (zh) * 2023-06-02 2024-10-01 矽品精密工業股份有限公司 承載結構

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6344667B1 (en) * 1998-03-02 2002-02-05 Kabushiki Kaisha Toshiba Wiring board with reduced radiation of undesired electromagnetic waves
TW476229B (en) 1998-08-24 2002-02-11 Adv Flexible Circuits Co Ltd Circuit board having shielding plate with empty-hole opening pattern to control impedance and transmission time
US6590466B2 (en) * 1998-08-31 2003-07-08 Advanced Flexible Circuit Co., Ltd. Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time of differential transmission lines
JP4162630B2 (ja) * 2004-06-08 2008-10-08 Ｔｄｋ株式会社 信号伝送回路並びに同回路を備えた電子機器及びケーブル
US7504904B1 (en) * 2006-04-04 2009-03-17 Unisys Corporation Printed-circuit impedance control using skewed reference mesh
JP5004871B2 (ja) * 2007-07-09 2012-08-22 キヤノン株式会社 プリント配線板
JP2009224489A (ja) * 2008-03-14 2009-10-01 Toshiba Corp 配線基板装置
JP2010212438A (ja) * 2009-03-10 2010-09-24 Sumitomo Bakelite Co Ltd 回路基板
US8248183B2 (en) * 2009-07-30 2012-08-21 Sierra Wireless, Inc. Circuit board pad having impedance matched to a transmission line and method for providing same
JP5441814B2 (ja) * 2010-05-14 2014-03-12 キヤノン株式会社 プリント配線板及びプリント配線板を備えたデバイス
CN102959629B (zh) * 2011-02-17 2015-12-09 松下电器产业株式会社 光盘驱动装置及布线构造
JP2012227211A (ja) * 2011-04-15 2012-11-15 Olympus Corp 差動信号用配線基板
US20130313013A1 (en) * 2012-05-23 2013-11-28 David Sala Porta Printed circuit boards
JP6368078B2 (ja) * 2013-09-25 2018-08-01 日本シイエムケイ株式会社 プリント配線板
JP6508219B2 (ja) * 2015-01-21 2019-05-08 日本電気株式会社 配線基板およびその設計方法
CN113573464B (zh) * 2021-06-30 2022-11-15 武汉天马微电子有限公司 电路板及其制备方法和显示面板

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