CN112996228B - 布线基板和电子设备 - Google Patents
布线基板和电子设备 Download PDFInfo
- Publication number
- CN112996228B CN112996228B CN202011450420.1A CN202011450420A CN112996228B CN 112996228 B CN112996228 B CN 112996228B CN 202011450420 A CN202011450420 A CN 202011450420A CN 112996228 B CN112996228 B CN 112996228B
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- signal line
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019224921A JP7423294B2 (ja) | 2019-12-12 | 2019-12-12 | 配線基板および電子機器 |
| JP2019-224921 | 2019-12-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112996228A CN112996228A (zh) | 2021-06-18 |
| CN112996228B true CN112996228B (zh) | 2025-01-28 |
Family
ID=76312792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011450420.1A Active CN112996228B (zh) | 2019-12-12 | 2020-12-11 | 布线基板和电子设备 |
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| JP (2) | JP7423294B2 (enExample) |
| CN (1) | CN112996228B (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022207738A1 (de) | 2021-07-30 | 2023-02-02 | Canon Kabushiki Kaisha | Flexible leiterplatte, herstellungsverfahren, elektronisches modul, elektronische einheit und elektronische vorrichtung |
| JP2023049844A (ja) * | 2021-09-29 | 2023-04-10 | キヤノン株式会社 | フレキシブル配線板、電子モジュール、電子ユニットおよび電子機器 |
| KR102561829B1 (ko) * | 2022-05-24 | 2023-07-31 | 주식회사 원캐스트 | 통합 배선반의 장애 관리 시스템 |
| US12426151B2 (en) * | 2023-03-09 | 2025-09-23 | Htc Corporation | Circuit board and layout method thereof |
| TWI857632B (zh) * | 2023-06-02 | 2024-10-01 | 矽品精密工業股份有限公司 | 承載結構 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6344667B1 (en) * | 1998-03-02 | 2002-02-05 | Kabushiki Kaisha Toshiba | Wiring board with reduced radiation of undesired electromagnetic waves |
| TW476229B (en) | 1998-08-24 | 2002-02-11 | Adv Flexible Circuits Co Ltd | Circuit board having shielding plate with empty-hole opening pattern to control impedance and transmission time |
| US6590466B2 (en) | 1998-08-31 | 2003-07-08 | Advanced Flexible Circuit Co., Ltd. | Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time of differential transmission lines |
| JP4162630B2 (ja) * | 2004-06-08 | 2008-10-08 | Ｔｄｋ株式会社 | 信号伝送回路並びに同回路を備えた電子機器及びケーブル |
| US7504904B1 (en) * | 2006-04-04 | 2009-03-17 | Unisys Corporation | Printed-circuit impedance control using skewed reference mesh |
| JP5004871B2 (ja) * | 2007-07-09 | 2012-08-22 | キヤノン株式会社 | プリント配線板 |
| JP2009224489A (ja) * | 2008-03-14 | 2009-10-01 | Toshiba Corp | 配線基板装置 |
| JP2010212438A (ja) | 2009-03-10 | 2010-09-24 | Sumitomo Bakelite Co Ltd | 回路基板 |
| US8248183B2 (en) * | 2009-07-30 | 2012-08-21 | Sierra Wireless, Inc. | Circuit board pad having impedance matched to a transmission line and method for providing same |
| JP5441814B2 (ja) * | 2010-05-14 | 2014-03-12 | キヤノン株式会社 | プリント配線板及びプリント配線板を備えたデバイス |
| CN102959629B (zh) * | 2011-02-17 | 2015-12-09 | 松下电器产业株式会社 | 光盘驱动装置及布线构造 |
| JP2012227211A (ja) | 2011-04-15 | 2012-11-15 | Olympus Corp | 差動信号用配線基板 |
| US20130313013A1 (en) * | 2012-05-23 | 2013-11-28 | David Sala Porta | Printed circuit boards |
| JP6368078B2 (ja) | 2013-09-25 | 2018-08-01 | 日本シイエムケイ株式会社 | プリント配線板 |
| WO2016117320A1 (ja) * | 2015-01-21 | 2016-07-28 | 日本電気株式会社 | 配線基板およびその設計方法 |
| CN113573464B (zh) | 2021-06-30 | 2022-11-15 | 武汉天马微电子有限公司 | 电路板及其制备方法和显示面板 |
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2019
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- 2020-12-11 CN CN202011450420.1A patent/CN112996228B/zh active Active
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| Publication number | Publication date |
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| JP7581545B2 (ja) | 2024-11-12 |
| CN112996228A (zh) | 2021-06-18 |
| US11553586B2 (en) | 2023-01-10 |
| JP2021093507A (ja) | 2021-06-17 |
| US20210185798A1 (en) | 2021-06-17 |
| JP7423294B2 (ja) | 2024-01-29 |
| JP2024026783A (ja) | 2024-02-28 |
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