JP7419497B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP7419497B2
JP7419497B2 JP2022510704A JP2022510704A JP7419497B2 JP 7419497 B2 JP7419497 B2 JP 7419497B2 JP 2022510704 A JP2022510704 A JP 2022510704A JP 2022510704 A JP2022510704 A JP 2022510704A JP 7419497 B2 JP7419497 B2 JP 7419497B2
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JP
Japan
Prior art keywords
wall
flow path
electronic device
heat
circuit board
Prior art date
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JP2022510704A
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English (en)
Japanese (ja)
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JPWO2021193879A1 (https=
JPWO2021193879A5 (https=
Inventor
聡 水戸
康宏 鳳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Interactive Entertainment Inc
Original Assignee
Sony Interactive Entertainment Inc
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Publication date
Application filed by Sony Interactive Entertainment Inc filed Critical Sony Interactive Entertainment Inc
Publication of JPWO2021193879A1 publication Critical patent/JPWO2021193879A1/ja
Publication of JPWO2021193879A5 publication Critical patent/JPWO2021193879A5/ja
Application granted granted Critical
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20181Filters; Louvers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2022510704A 2020-03-27 2021-03-25 電子機器 Active JP7419497B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020059183 2020-03-27
JP2020059183 2020-03-27
PCT/JP2021/012747 WO2021193879A1 (ja) 2020-03-27 2021-03-25 電子機器

Publications (3)

Publication Number Publication Date
JPWO2021193879A1 JPWO2021193879A1 (https=) 2021-09-30
JPWO2021193879A5 JPWO2021193879A5 (https=) 2022-12-07
JP7419497B2 true JP7419497B2 (ja) 2024-01-22

Family

ID=77892690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022510704A Active JP7419497B2 (ja) 2020-03-27 2021-03-25 電子機器

Country Status (5)

Country Link
US (1) US12324124B2 (https=)
EP (1) EP4132242A4 (https=)
JP (1) JP7419497B2 (https=)
CN (1) CN115245063B (https=)
WO (1) WO2021193879A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12267984B2 (en) * 2021-11-30 2025-04-01 Delta Electronics, Inc. Heat dissipation assembly
EP4510799A4 (en) * 2022-04-11 2026-04-15 Sony Interactive Entertainment Inc ELECTRONIC DEVICE
JP7767586B2 (ja) 2022-04-11 2025-11-11 株式会社ソニー・インタラクティブエンタテインメント 電子機器
EP4617506A1 (en) 2022-11-11 2025-09-17 Sony Interactive Entertainment Inc. Cooling fan and electronic device
CN120641716A (zh) 2023-02-21 2025-09-12 索尼互动娱乐股份有限公司 热管、电子装置、仪器及制造热管的方法

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JP2013501373A (ja) 2009-08-03 2013-01-10 ブイ エル システム カンパニー リミテッド 集塵機能付きファンモジュール及びこれに用いる集塵装置
JP2014518002A (ja) 2011-09-28 2014-07-24 株式会社日立製作所 制御装置
CN107023517A (zh) 2016-02-02 2017-08-08 宏碁股份有限公司 风扇模块及电子装置
CN207219283U (zh) 2017-09-22 2018-04-10 北京小米移动软件有限公司 风扇及除尘散热系统

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JP3749171B2 (ja) 2001-12-27 2006-02-22 三洋電機株式会社 電源装置の電子部品保護構造
JP4269103B2 (ja) 2003-05-23 2009-05-27 株式会社安川電機 電気制御装置
JP3994948B2 (ja) 2003-09-16 2007-10-24 ソニー株式会社 冷却装置及び電子機器
TWI284017B (en) * 2005-09-22 2007-07-11 Delta Electronics Inc Heat dissipating system and dissipating method thereof
CN100538595C (zh) 2005-09-28 2009-09-09 力竑科技股份有限公司 可携式影音转接装置
DE102005053620A1 (de) 2005-11-10 2007-05-16 Stihl Ag & Co Kg Andreas Handgeführtes Sauggerät
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JP2007149007A (ja) 2005-11-30 2007-06-14 Toshiba Corp 電子機器
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JP4892078B2 (ja) 2010-05-11 2012-03-07 株式会社東芝 電子機器
JP4982590B2 (ja) 2010-06-18 2012-07-25 株式会社東芝 表示装置及び電子機器
CN102403015A (zh) 2010-09-17 2012-04-04 延锋伟世通汽车电子有限公司 新型汽车音响光碟机芯散热模块
BR112013026340B1 (pt) 2011-04-18 2021-03-23 Sony Computer Entertainment, Inc Aparelho eletrônico
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JP5883774B2 (ja) 2012-12-20 2016-03-15 株式会社日立製作所 制御装置及び制御装置の冷却方法
WO2014185311A1 (ja) 2013-05-17 2014-11-20 株式会社ソニー・コンピュータエンタテインメント 電子機器及びその製造方法
CN104279169B (zh) * 2013-07-09 2017-10-03 华硕电脑股份有限公司 离心式风扇模块及应用其的电子装置
TWM525399U (zh) * 2015-11-27 2016-07-11 宏碁股份有限公司 風扇模組及電子裝置
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CN108087340A (zh) * 2016-11-21 2018-05-29 英业达科技有限公司 离心式风扇结构
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JP7275380B2 (ja) 2020-03-27 2023-05-17 株式会社ソニー・インタラクティブエンタテインメント 電子機器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196504A (ja) 2005-01-11 2006-07-27 Mitsubishi Electric Corp 冷却装置及びこれを用いた電気機器
JP2013501373A (ja) 2009-08-03 2013-01-10 ブイ エル システム カンパニー リミテッド 集塵機能付きファンモジュール及びこれに用いる集塵装置
JP2012227296A (ja) 2011-04-18 2012-11-15 Sony Computer Entertainment Inc 電子機器
JP2014518002A (ja) 2011-09-28 2014-07-24 株式会社日立製作所 制御装置
CN107023517A (zh) 2016-02-02 2017-08-08 宏碁股份有限公司 风扇模块及电子装置
CN207219283U (zh) 2017-09-22 2018-04-10 北京小米移动软件有限公司 风扇及除尘散热系统

Also Published As

Publication number Publication date
JPWO2021193879A1 (https=) 2021-09-30
EP4132242A1 (en) 2023-02-08
CN115245063A (zh) 2022-10-25
US20230127566A1 (en) 2023-04-27
EP4132242A4 (en) 2024-04-24
US12324124B2 (en) 2025-06-03
WO2021193879A1 (ja) 2021-09-30
CN115245063B (zh) 2025-11-11

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