JP7412662B1 - レーザ装置およびレーザ加工装置 - Google Patents

レーザ装置およびレーザ加工装置 Download PDF

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Publication number
JP7412662B1
JP7412662B1 JP2023565635A JP2023565635A JP7412662B1 JP 7412662 B1 JP7412662 B1 JP 7412662B1 JP 2023565635 A JP2023565635 A JP 2023565635A JP 2023565635 A JP2023565635 A JP 2023565635A JP 7412662 B1 JP7412662 B1 JP 7412662B1
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laser
fast
laser beam
gap
axis
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JPWO2025013243A1 (https=
JPWO2025013243A5 (https=
Inventor
正人 河▲崎▼
宏昌 藤井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Lasers (AREA)
  • Laser Beam Processing (AREA)
JP2023565635A 2023-07-12 2023-07-12 レーザ装置およびレーザ加工装置 Active JP7412662B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/025727 WO2025013243A1 (ja) 2023-07-12 2023-07-12 レーザ装置およびレーザ加工装置

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JP7412662B1 true JP7412662B1 (ja) 2024-01-12
JPWO2025013243A1 JPWO2025013243A1 (https=) 2025-01-16
JPWO2025013243A5 JPWO2025013243A5 (https=) 2025-06-17

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JP2023565635A Active JP7412662B1 (ja) 2023-07-12 2023-07-12 レーザ装置およびレーザ加工装置

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JP (1) JP7412662B1 (https=)
WO (1) WO2025013243A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118137292A (zh) * 2024-03-13 2024-06-04 武汉锐科光纤激光技术股份有限公司 半导体激光器和激光装置
WO2025189880A1 (zh) * 2024-03-15 2025-09-18 华为技术有限公司 激光器及激光设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091670A (ja) * 1998-09-07 2000-03-31 Nec Corp 固体レーザ発生装置
JP2007225989A (ja) * 2006-02-24 2007-09-06 Ricoh Co Ltd マルチビーム光源ユニット、それを備えた光走査装置および画像形成装置
JP2011205061A (ja) * 2010-03-04 2011-10-13 Komatsu Ltd レーザ装置、レーザシステムおよび極端紫外光生成装置
US20190214786A1 (en) * 2018-01-09 2019-07-11 Daylight Solutions, Inc. Laser assembly with spectral beam combining
JP2021524161A (ja) * 2018-05-22 2021-09-09 パナソニックＩｐマネジメント株式会社 波長合成技術用レーザシステムにおけるパワー及びスペクトラムのモニタリング
JP2022508765A (ja) * 2018-10-15 2022-01-19 パナソニックＩｐマネジメント株式会社 階段状スロー軸コリメータを有するレーザシステム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091670A (ja) * 1998-09-07 2000-03-31 Nec Corp 固体レーザ発生装置
JP2007225989A (ja) * 2006-02-24 2007-09-06 Ricoh Co Ltd マルチビーム光源ユニット、それを備えた光走査装置および画像形成装置
JP2011205061A (ja) * 2010-03-04 2011-10-13 Komatsu Ltd レーザ装置、レーザシステムおよび極端紫外光生成装置
US20190214786A1 (en) * 2018-01-09 2019-07-11 Daylight Solutions, Inc. Laser assembly with spectral beam combining
JP2021524161A (ja) * 2018-05-22 2021-09-09 パナソニックＩｐマネジメント株式会社 波長合成技術用レーザシステムにおけるパワー及びスペクトラムのモニタリング
JP2022508765A (ja) * 2018-10-15 2022-01-19 パナソニックＩｐマネジメント株式会社 階段状スロー軸コリメータを有するレーザシステム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118137292A (zh) * 2024-03-13 2024-06-04 武汉锐科光纤激光技术股份有限公司 半导体激光器和激光装置
WO2025189880A1 (zh) * 2024-03-15 2025-09-18 华为技术有限公司 激光器及激光设备

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JPWO2025013243A1 (https=) 2025-01-16
WO2025013243A1 (ja) 2025-01-16

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