JP7406052B1 - はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置 - Google Patents

はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置 Download PDF

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Publication number
JP7406052B1
JP7406052B1 JP2023557267A JP2023557267A JP7406052B1 JP 7406052 B1 JP7406052 B1 JP 7406052B1 JP 2023557267 A JP2023557267 A JP 2023557267A JP 2023557267 A JP2023557267 A JP 2023557267A JP 7406052 B1 JP7406052 B1 JP 7406052B1
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Japan
Prior art keywords
mass
joint
solder
solder alloy
joined
Prior art date
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JP2023557267A
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English (en)
Japanese (ja)
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JPWO2025057387A5 (https=
JPWO2025057387A1 (https=
Inventor
貴則 嶋崎
正也 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
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Tamura Corp
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Publication of JPWO2025057387A1 publication Critical patent/JPWO2025057387A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2023557267A 2023-09-14 2023-09-14 はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置 Active JP7406052B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/033629 WO2025057387A1 (ja) 2023-09-14 2023-09-14 はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置

Publications (3)

Publication Number Publication Date
JP7406052B1 true JP7406052B1 (ja) 2023-12-26
JPWO2025057387A1 JPWO2025057387A1 (https=) 2025-03-20
JPWO2025057387A5 JPWO2025057387A5 (https=) 2025-08-20

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JP2023557267A Active JP7406052B1 (ja) 2023-09-14 2023-09-14 はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置

Country Status (2)

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JP (1) JP7406052B1 (https=)
WO (1) WO2025057387A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105195915A (zh) * 2015-10-30 2015-12-30 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
JP2017051984A (ja) * 2015-09-10 2017-03-16 株式会社弘輝 はんだ合金及びはんだ組成物
JP2019155471A (ja) * 2018-03-08 2019-09-19 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
JP2021504139A (ja) * 2017-11-22 2021-02-15 深▲チェン▼市福英達工業技術有限公司 マイクロ／ナノ粒子強化型複合はんだ及びその調製方法
CN114850725A (zh) * 2022-05-24 2022-08-05 雅拓莱焊接科技（惠州）有限公司 超薄锡铋系预成型焊环及其制备工艺
JP7161140B1 (ja) * 2022-07-22 2022-10-26 千住金属工業株式会社 はんだ合金、はんだボール、はんだペーストおよびはんだ継手

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017051984A (ja) * 2015-09-10 2017-03-16 株式会社弘輝 はんだ合金及びはんだ組成物
CN105195915A (zh) * 2015-10-30 2015-12-30 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
JP2021504139A (ja) * 2017-11-22 2021-02-15 深▲チェン▼市福英達工業技術有限公司 マイクロ／ナノ粒子強化型複合はんだ及びその調製方法
JP2019155471A (ja) * 2018-03-08 2019-09-19 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
CN114850725A (zh) * 2022-05-24 2022-08-05 雅拓莱焊接科技（惠州）有限公司 超薄锡铋系预成型焊环及其制备工艺
JP7161140B1 (ja) * 2022-07-22 2022-10-26 千住金属工業株式会社 はんだ合金、はんだボール、はんだペーストおよびはんだ継手

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JPWO2025057387A1 (https=) 2025-03-20
WO2025057387A1 (ja) 2025-03-20

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