JPWO2025057387A1 - - Google Patents

Info

Publication number
JPWO2025057387A1
JPWO2025057387A1 JP2023557267A JP2023557267A JPWO2025057387A1 JP WO2025057387 A1 JPWO2025057387 A1 JP WO2025057387A1 JP 2023557267 A JP2023557267 A JP 2023557267A JP 2023557267 A JP2023557267 A JP 2023557267A JP WO2025057387 A1 JPWO2025057387 A1 JP WO2025057387A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023557267A
Other languages
Japanese (ja)
Other versions
JP7406052B1 (ja
JPWO2025057387A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP7406052B1 publication Critical patent/JP7406052B1/ja
Publication of JPWO2025057387A1 publication Critical patent/JPWO2025057387A1/ja
Publication of JPWO2025057387A5 publication Critical patent/JPWO2025057387A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2023557267A 2023-09-14 2023-09-14 はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置 Active JP7406052B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/033629 WO2025057387A1 (ja) 2023-09-14 2023-09-14 はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置

Publications (3)

Publication Number Publication Date
JP7406052B1 JP7406052B1 (ja) 2023-12-26
JPWO2025057387A1 true JPWO2025057387A1 (https=) 2025-03-20
JPWO2025057387A5 JPWO2025057387A5 (https=) 2025-08-20

Family

ID=89307867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023557267A Active JP7406052B1 (ja) 2023-09-14 2023-09-14 はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置

Country Status (2)

Country Link
JP (1) JP7406052B1 (https=)
WO (1) WO2025057387A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6548537B2 (ja) * 2015-09-10 2019-07-24 株式会社弘輝 はんだ合金及びはんだ組成物
CN105195915B (zh) * 2015-10-30 2017-05-24 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
WO2019100445A1 (zh) * 2017-11-22 2019-05-31 深圳市福英达工业技术有限公司 微米/纳米颗粒增强型复合焊料及其制备方法
JP6477965B1 (ja) * 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
CN114850725B (zh) * 2022-05-24 2024-04-26 雅拓莱焊接科技（惠州）有限公司 超薄锡铋系预成型焊环及其制备工艺
JP7161140B1 (ja) * 2022-07-22 2022-10-26 千住金属工業株式会社 はんだ合金、はんだボール、はんだペーストおよびはんだ継手

Also Published As

Publication number Publication date
JP7406052B1 (ja) 2023-12-26
WO2025057387A1 (ja) 2025-03-20

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