JP7405309B2 - ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置 - Google Patents

ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置 Download PDF

Info

Publication number
JP7405309B2
JP7405309B2 JP2023530097A JP2023530097A JP7405309B2 JP 7405309 B2 JP7405309 B2 JP 7405309B2 JP 2023530097 A JP2023530097 A JP 2023530097A JP 2023530097 A JP2023530097 A JP 2023530097A JP 7405309 B2 JP7405309 B2 JP 7405309B2
Authority
JP
Japan
Prior art keywords
general formula
group
carbon atoms
negative photosensitive
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023530097A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022270546A1 (https=
JPWO2022270546A5 (https=
Inventor
啓太 今井
昭彦 乙黒
数矢 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of JPWO2022270546A1 publication Critical patent/JPWO2022270546A1/ja
Publication of JPWO2022270546A5 publication Critical patent/JPWO2022270546A5/ja
Priority to JP2023198341A priority Critical patent/JP2024019205A/ja
Application granted granted Critical
Publication of JP7405309B2 publication Critical patent/JP7405309B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/30—Nitriles
    • C08F222/32—Alpha-cyano-acrylic acid; Esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/065—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2023530097A 2021-06-25 2022-06-22 ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置 Active JP7405309B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023198341A JP2024019205A (ja) 2021-06-25 2023-11-22 ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021105682 2021-06-25
JP2021105682 2021-06-25
JP2022019323 2022-02-10
JP2022019323 2022-02-10
PCT/JP2022/024912 WO2022270546A1 (ja) 2021-06-25 2022-06-22 ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023198341A Division JP2024019205A (ja) 2021-06-25 2023-11-22 ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022270546A1 JPWO2022270546A1 (https=) 2022-12-29
JPWO2022270546A5 JPWO2022270546A5 (https=) 2023-07-13
JP7405309B2 true JP7405309B2 (ja) 2023-12-26

Family

ID=84545449

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023530097A Active JP7405309B2 (ja) 2021-06-25 2022-06-22 ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置
JP2023198341A Pending JP2024019205A (ja) 2021-06-25 2023-11-22 ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023198341A Pending JP2024019205A (ja) 2021-06-25 2023-11-22 ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置

Country Status (4)

Country Link
US (1) US20240301115A1 (https=)
JP (2) JP7405309B2 (https=)
KR (1) KR20240025621A (https=)
WO (1) WO2022270546A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240025621A (ko) * 2021-06-25 2024-02-27 스미또모 베이크라이트 가부시키가이샤 네거티브형 감광성 폴리머, 폴리머 용액, 네거티브형 감광성 수지 조성물, 경화막 및 반도체 장치
WO2026071165A1 (ja) * 2024-09-30 2026-04-02 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、半導体デバイス、及び、ポリイミド

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020255825A1 (ja) 2019-06-17 2020-12-24 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリイミド、ポリベンゾオキサゾール、ポリイミド前駆体、又は、ポリベンゾオキサゾール前駆体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7795370B2 (en) * 2005-11-15 2010-09-14 Mitsubishi Chemical Corporation Tetracarboxylic acid compound, polyimide thereof, and production method thereof
JP2018070829A (ja) 2016-11-02 2018-05-10 東レ株式会社 樹脂組成物
JP7289353B2 (ja) * 2019-06-17 2023-06-09 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリイミド、又は、ポリイミド前駆体
KR20240025621A (ko) * 2021-06-25 2024-02-27 스미또모 베이크라이트 가부시키가이샤 네거티브형 감광성 폴리머, 폴리머 용액, 네거티브형 감광성 수지 조성물, 경화막 및 반도체 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020255825A1 (ja) 2019-06-17 2020-12-24 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリイミド、ポリベンゾオキサゾール、ポリイミド前駆体、又は、ポリベンゾオキサゾール前駆体

Also Published As

Publication number Publication date
US20240301115A1 (en) 2024-09-12
JPWO2022270546A1 (https=) 2022-12-29
WO2022270546A1 (ja) 2022-12-29
TW202309194A (zh) 2023-03-01
JP2024019205A (ja) 2024-02-08
KR20240025621A (ko) 2024-02-27

Similar Documents

Publication Publication Date Title
JP7556263B2 (ja) ネガ型感光性樹脂組成物、ネガ型感光性ポリマー及びその用途
KR101719045B1 (ko) 네거티브형 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법, 및 반도체 장치
WO2022270541A1 (ja) ネガ型感光性樹脂組成物、ネガ型感光性ポリマー、硬化膜および半導体装置
JP2022135427A (ja) ネガ型感光性樹脂組成物およびその用途
TWI890801B (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜之製造方法及半導體器件
JP2024019205A (ja) ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置
TW201835128A (zh) 負型感光性樹脂組成物、樹脂膜及電子裝置
US20250251663A1 (en) Photosensitive resin composition, production method for polyimide cured film using same, and polyimide cured film
KR20200104303A (ko) 절연막용 수지 조성물
CN116724071A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件
JP5054158B2 (ja) ポジティブ型感光性組成物
JP2024024621A (ja) 感光性樹脂組成物、硬化膜および半導体装置
WO2022270544A1 (ja) ネガ型感光性樹脂組成物、ネガ型感光性ポリマー、硬化膜および半導体装置
JP7435110B2 (ja) ポリヒドロキシイミド、ポリマー溶液、感光性樹脂組成物およびその用途
JP7700536B2 (ja) ネガ型感光性ポリマー
CN117940516A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件
WO2022259933A1 (ja) 感光性樹脂組成物、樹脂膜、電子装置および電子装置の製造方法
JP7502384B2 (ja) ネガ型感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
TWI915567B (zh) 負型感光性聚合物、聚合物溶液、負型感光性樹脂組成物、硬化膜及半導體裝置
WO2022270527A1 (ja) ネガ型感光性樹脂組成物、ネガ型感光性ポリマー、硬化膜および半導体装置
JP2024024620A (ja) 感光性樹脂組成物、硬化膜および半導体装置
JP7786648B2 (ja) 感光性樹脂組成物、硬化物および半導体装置
JP7736225B1 (ja) 感光性樹脂組成物、硬化物および半導体装置
JP7409564B2 (ja) ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置
JP2023116922A (ja) ポリノルボルネンの製造方法、ポリノルボルネン含有溶液、ポリノルボルネン粉末、感光性樹脂組成物、および半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230526

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230526

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230526

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230822

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230908

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231114

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231127

R151 Written notification of patent or utility model registration

Ref document number: 7405309

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151