KR20240025621A - 네거티브형 감광성 폴리머, 폴리머 용액, 네거티브형 감광성 수지 조성물, 경화막 및 반도체 장치 - Google Patents

네거티브형 감광성 폴리머, 폴리머 용액, 네거티브형 감광성 수지 조성물, 경화막 및 반도체 장치 Download PDF

Info

Publication number
KR20240025621A
KR20240025621A KR1020247002186A KR20247002186A KR20240025621A KR 20240025621 A KR20240025621 A KR 20240025621A KR 1020247002186 A KR1020247002186 A KR 1020247002186A KR 20247002186 A KR20247002186 A KR 20247002186A KR 20240025621 A KR20240025621 A KR 20240025621A
Authority
KR
South Korea
Prior art keywords
negative photosensitive
general formula
group
photosensitive polymer
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247002186A
Other languages
English (en)
Korean (ko)
Inventor
게이타 이마이
아키히코 오토구로
가즈야 나카시마
Original Assignee
스미또모 베이크라이트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미또모 베이크라이트 가부시키가이샤 filed Critical 스미또모 베이크라이트 가부시키가이샤
Publication of KR20240025621A publication Critical patent/KR20240025621A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/30—Nitriles
    • C08F222/32—Alpha-cyano-acrylic acid; Esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/065—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020247002186A 2021-06-25 2022-06-22 네거티브형 감광성 폴리머, 폴리머 용액, 네거티브형 감광성 수지 조성물, 경화막 및 반도체 장치 Pending KR20240025621A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021105682 2021-06-25
JPJP-P-2021-105682 2021-06-25
JPJP-P-2022-019323 2022-02-10
JP2022019323 2022-02-10
PCT/JP2022/024912 WO2022270546A1 (ja) 2021-06-25 2022-06-22 ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置

Publications (1)

Publication Number Publication Date
KR20240025621A true KR20240025621A (ko) 2024-02-27

Family

ID=84545449

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247002186A Pending KR20240025621A (ko) 2021-06-25 2022-06-22 네거티브형 감광성 폴리머, 폴리머 용액, 네거티브형 감광성 수지 조성물, 경화막 및 반도체 장치

Country Status (4)

Country Link
US (1) US20240301115A1 (https=)
JP (2) JP7405309B2 (https=)
KR (1) KR20240025621A (https=)
WO (1) WO2022270546A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240025621A (ko) * 2021-06-25 2024-02-27 스미또모 베이크라이트 가부시키가이샤 네거티브형 감광성 폴리머, 폴리머 용액, 네거티브형 감광성 수지 조성물, 경화막 및 반도체 장치
WO2026071165A1 (ja) * 2024-09-30 2026-04-02 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、半導体デバイス、及び、ポリイミド

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018070829A (ja) 2016-11-02 2018-05-10 東レ株式会社 樹脂組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7795370B2 (en) * 2005-11-15 2010-09-14 Mitsubishi Chemical Corporation Tetracarboxylic acid compound, polyimide thereof, and production method thereof
JP7289353B2 (ja) * 2019-06-17 2023-06-09 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリイミド、又は、ポリイミド前駆体
WO2020255825A1 (ja) 2019-06-17 2020-12-24 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリイミド、ポリベンゾオキサゾール、ポリイミド前駆体、又は、ポリベンゾオキサゾール前駆体
KR20240025621A (ko) * 2021-06-25 2024-02-27 스미또모 베이크라이트 가부시키가이샤 네거티브형 감광성 폴리머, 폴리머 용액, 네거티브형 감광성 수지 조성물, 경화막 및 반도체 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018070829A (ja) 2016-11-02 2018-05-10 東レ株式会社 樹脂組成物

Also Published As

Publication number Publication date
JP7405309B2 (ja) 2023-12-26
US20240301115A1 (en) 2024-09-12
JPWO2022270546A1 (https=) 2022-12-29
WO2022270546A1 (ja) 2022-12-29
TW202309194A (zh) 2023-03-01
JP2024019205A (ja) 2024-02-08

Similar Documents

Publication Publication Date Title
JP7556263B2 (ja) ネガ型感光性樹脂組成物、ネガ型感光性ポリマー及びその用途
KR101719045B1 (ko) 네거티브형 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법, 및 반도체 장치
JP7131557B2 (ja) 感光性樹脂組成物
WO2022270541A1 (ja) ネガ型感光性樹脂組成物、ネガ型感光性ポリマー、硬化膜および半導体装置
JP2022135427A (ja) ネガ型感光性樹脂組成物およびその用途
TWI890801B (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜之製造方法及半導體器件
TW201835128A (zh) 負型感光性樹脂組成物、樹脂膜及電子裝置
US20250251663A1 (en) Photosensitive resin composition, production method for polyimide cured film using same, and polyimide cured film
TW202204476A (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜之製造方法、及半導體器件
KR102740861B1 (ko) 패턴 형성 방법, 감광성 수지 조성물, 적층체의 제조 방법, 및, 반도체 디바이스의 제조 방법
JP2024019205A (ja) ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置
TW202311240A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法、及半導體元件、以及化合物
CN117881745A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件、以及化合物
JP2026065026A (ja) 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス
CN116724071A (zh) 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件
JP2024024621A (ja) 感光性樹脂組成物、硬化膜および半導体装置
WO2022270544A1 (ja) ネガ型感光性樹脂組成物、ネガ型感光性ポリマー、硬化膜および半導体装置
JP7700536B2 (ja) ネガ型感光性ポリマー
JP7435110B2 (ja) ポリヒドロキシイミド、ポリマー溶液、感光性樹脂組成物およびその用途
WO2022259933A1 (ja) 感光性樹脂組成物、樹脂膜、電子装置および電子装置の製造方法
JP2024024620A (ja) 感光性樹脂組成物、硬化膜および半導体装置
WO2022270527A1 (ja) ネガ型感光性樹脂組成物、ネガ型感光性ポリマー、硬化膜および半導体装置
TWI915567B (zh) 負型感光性聚合物、聚合物溶液、負型感光性樹脂組成物、硬化膜及半導體裝置
JP7736225B1 (ja) 感光性樹脂組成物、硬化物および半導体装置
JP7786648B2 (ja) 感光性樹脂組成物、硬化物および半導体装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000