JP7388004B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP7388004B2 JP7388004B2 JP2019101618A JP2019101618A JP7388004B2 JP 7388004 B2 JP7388004 B2 JP 7388004B2 JP 2019101618 A JP2019101618 A JP 2019101618A JP 2019101618 A JP2019101618 A JP 2019101618A JP 7388004 B2 JP7388004 B2 JP 7388004B2
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Images
Description
(準備工程)
準備工程は、支持面及びその反対側の裏面を有する支持基板と支持面上に設けられた仮固定材層とを備え、仮固定材層の一部又は全部が、光を吸収して熱を発生する光吸収層である仮固定用積層体であって、仮固定材層が、仮固定材層の少なくとも一方の最表面を含む硬化性樹脂層を有する、仮固定用積層体を準備する工程である。
仮固定工程は、半導体部材を、仮固定材層を介して支持基板に対して仮固定する工程である。
加工工程は、支持基板に対して仮固定された半導体部材を加工する工程である。
封止工程は、加工された半導体部材を封止する封止層を形成する工程である。
仮固定用積層体に対して裏面側から光を照射し、半導体部材を支持基板から分離する工程である。
<硬化性樹脂層の作製>
水添スチレン・ブタジエンエラストマー(商品名:ダイナロン2324P、JSR株式会社)をトルエンに溶解して、濃度40質量%のエラストマー溶液を調製した。80質量部の水添スチレン・ブタジエンエラストマーを含むエラストマー溶液と、1,9-ノナンジオールジアクリレ-ト(商品名:FA-129AS、日立化成株式会社)20質量部と、パーオキシエステル(商品名:パーヘキサ25O、日油株式会社)1質量部とを混合して、樹脂ワニスを得た。
支持基板として、20mm×20mmのサイズを有する矩形のスライドガラスを準備した。準備したスライドガラス上に、スパッタリングによってチタン層、銅層の順で形成して、チタン層(厚み:20nm)/銅層(厚み:200nm)の2層からなる光吸収層を作製した。スパッタリングにおいて、逆スパッタリングによる前処理の後、RFスパッタリングによってチタン層及び銅層を形成した。
スライドガラス上に形成された光吸収層上に、10mm×10mmのサイズに切り出した硬化性樹脂層を配置した。真空ラミネートによって光吸収層に硬化性樹脂層を密着させて、支持基板/仮固定材層(支持基板/光吸収層/硬化性樹脂層)の構成を有する仮固定用積層体を得た。
仮固定用積層体の硬化性樹脂層上に、半導体部材としての半導体チップ(サイズ:10mm×10mm)を配置した。180℃で1時間の加熱によって硬化性樹脂層を硬化させて、支持基板に対して仮固定された半導体部材を有する試験用積層体を得た。
(実施例1)
試験用積層体の支持基板側から仮固定材層(光吸収層)に対してパルス光を照射した。キセノンランプとして、NovaCentrix社製のPulseForge(登録商標)1300を用いた。出射される光の波長範囲は200~1500nmである。印加電圧800V及びパルス幅150μsのパルス光を、照射周期200μsで間歇的に3回照射した。照射されたパルス光のエネルギー量の合計は5.6J/cm2であった。
実施例1と同様に、試験用積層体の支持基板側から仮固定材層(光吸収層)に対してパルス光を照射した。印加電圧800V及びパルス幅400μsのパルス光を、仮固定材層(光吸収層)に対して1回照射した。照射されたパルス光のエネルギー量の合計は5.6J/cm2であった。
実施例1と同様に、試験用積層体の支持基板側から仮固定材層(光吸収層)に対してパルス光を照射した。光照射の条件は、表1に示すとおりである。いずれの条件においても、光照射によって、スライドガラスから半導体チップがはく離した。また、仮固定材層の光吸収層を観察したところ、光吸収層の破壊、こげ等は観察されなかった。
Claims (3)
- 支持面及びその反対側の裏面を有する支持基板と前記支持面上に設けられた仮固定材層とを備え、前記仮固定材層の一部が、光を吸収して熱を発生する光吸収層である仮固定用積層体であって、前記仮固定材層が、前記支持基板の前記支持面上に、前記光吸収層及び硬化性樹脂層を前記支持基板側からこの順に有する、仮固定用積層体を準備する準備工程と、
半導体部材を、前記仮固定材層を介して前記支持基板に対して仮固定する仮固定工程と、
前記支持基板に対して仮固定された前記半導体部材を加工する加工工程と、
前記仮固定用積層体に対して前記裏面側から光を間歇的に照射し、前記半導体部材を前記支持基板から分離する分離工程と、
を備え、
前記支持基板が、無機ガラス基板又は透明樹脂基板であり、
前記光吸収層が、単層又は複数の層からなる金属層である、半導体装置の製造方法。 - 前記光がインコヒーレント光である、請求項1に記載の半導体装置の製造方法。
- 前記インコヒーレント光の光源が、キセノンランプである、請求項2に記載の半導体装置の製造方法。
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