JP7386259B2 - 蛍光ｘ線分析装置 - Google Patents

蛍光ｘ線分析装置 Download PDF

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JP7386259B2
JP7386259B2 JP2021562655A JP2021562655A JP7386259B2 JP 7386259 B2 JP7386259 B2 JP 7386259B2 JP 2021562655 A JP2021562655 A JP 2021562655A JP 2021562655 A JP2021562655 A JP 2021562655A JP 7386259 B2 JP7386259 B2 JP 7386259B2
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ray
rays
fluorescent
liquid sample
detector
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Japanese (ja)
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JPWO2021112080A1 (https=
Inventor
肇 二位
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Horiba Advanced Techno Co Ltd
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Horiba Advanced Techno Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/223—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/2204—Specimen supports therefor; Sample conveying means therefore
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/07—Investigating materials by wave or particle radiation secondary emission
    • G01N2223/076—X-ray fluorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/10—Different kinds of radiation or particles
    • G01N2223/101—Different kinds of radiation or particles electromagnetic radiation
    • G01N2223/1016—X-ray
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/20—Sources of radiation
    • G01N2223/204—Sources of radiation source created from radiated target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/30—Accessories, mechanical or electrical features
    • G01N2223/302—Accessories, mechanical or electrical features comparative arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/30—Accessories, mechanical or electrical features
    • G01N2223/307—Accessories, mechanical or electrical features cuvettes-sample holders
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/637—Specific applications or type of materials liquid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/652—Specific applications or type of materials impurities, foreign matter, trace amounts

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2021562655A 2019-12-02 2020-12-01 蛍光ｘ線分析装置 Active JP7386259B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019218357 2019-12-02
JP2019218357 2019-12-02
PCT/JP2020/044668 WO2021112080A1 (ja) 2019-12-02 2020-12-01 蛍光ｘ線分析装置

Publications (2)

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JPWO2021112080A1 JPWO2021112080A1 (https=) 2021-06-10
JP7386259B2 true JP7386259B2 (ja) 2023-11-24

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JP2021562655A Active JP7386259B2 (ja) 2019-12-02 2020-12-01 蛍光ｘ線分析装置

Country Status (6)

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US (1) US20220404297A1 (https=)
EP (1) EP4071465A1 (https=)
JP (1) JP7386259B2 (https=)
KR (1) KR20220104178A (https=)
CN (1) CN114746744A (https=)
WO (1) WO2021112080A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12480892B2 (en) 2020-12-07 2025-11-25 Sigray, Inc. High throughput 3D x-ray imaging system using a transmission x-ray source
WO2023168204A1 (en) * 2022-03-02 2023-09-07 Sigray, Inc. X-ray fluorescence system and x-ray source with electrically insulative target material
JP7716116B2 (ja) * 2023-03-31 2025-07-31 株式会社リガク 試料パウチセル及び蛍光ｘ線分析方法
US12429437B2 (en) 2023-11-07 2025-09-30 Sigray, Inc. System and method for x-ray absorption spectroscopy using spectral information from two orthogonal planes
US12429436B2 (en) 2024-01-08 2025-09-30 Sigray, Inc. X-ray analysis system with focused x-ray beam and non-x-ray microscope
WO2025155719A1 (en) 2024-01-18 2025-07-24 Sigray, Inc. Sequential array of x-ray imaging detectors
WO2025174966A1 (en) 2024-02-15 2025-08-21 Sigray, Inc. System and method for generating a focused x‑ray beam

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006038822A (ja) 2004-07-26 2006-02-09 Tadashi Uko 蛍光ｘ線分析装置
JP2008039772A (ja) 2006-07-14 2008-02-21 Japan Science & Technology Agency Ｘ線分析装置及びｘ線分析方法
JP2009022615A (ja) 2007-07-23 2009-02-05 Takeo Katsuta カップ容器
JP2011107005A (ja) 2009-11-19 2011-06-02 Seiko Instruments Inc 蛍光ｘ線検査装置及び蛍光ｘ線検査方法
JP2013108759A (ja) 2011-11-17 2013-06-06 Fuji Electric Co Ltd 半導体ウェハプロセス用ふっ酸溶液の不純物分析方法および該ふっ酸溶液の交換時期の管理方法
JP2017083346A (ja) 2015-10-29 2017-05-18 株式会社堀場製作所 液体試料分析装置
WO2020008727A1 (ja) 2018-07-04 2020-01-09 株式会社リガク 蛍光ｘ線分析装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3117833B2 (ja) * 1993-03-01 2000-12-18 セイコーインスツルメンツ株式会社 蛍光ｘ線分析装置
JP3287069B2 (ja) * 1993-08-13 2002-05-27 住友電気工業株式会社 全反射蛍光ｘ線分析の測定方法及びその装置
IL120429A (en) * 1997-03-12 2000-09-28 Jordan Valley Applied Radiation Ltd X-ray fluorescence analyzer
JP4838821B2 (ja) * 2008-03-18 2011-12-14 株式会社リガク 蛍光ｘ線分析用試料保持具ならびにそれを用いる蛍光ｘ線分析方法および装置
US8008087B1 (en) 2010-03-25 2011-08-30 Eci Technology, Inc. Analysis of silicon concentration in phosphoric acid etchant solutions
JP6994755B2 (ja) * 2017-09-06 2022-01-14 株式会社日立ハイテクサイエンス 蛍光ｘ線分析装置及び蛍光ｘ線分析方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006038822A (ja) 2004-07-26 2006-02-09 Tadashi Uko 蛍光ｘ線分析装置
JP2008039772A (ja) 2006-07-14 2008-02-21 Japan Science & Technology Agency Ｘ線分析装置及びｘ線分析方法
JP2009022615A (ja) 2007-07-23 2009-02-05 Takeo Katsuta カップ容器
JP2011107005A (ja) 2009-11-19 2011-06-02 Seiko Instruments Inc 蛍光ｘ線検査装置及び蛍光ｘ線検査方法
JP2013108759A (ja) 2011-11-17 2013-06-06 Fuji Electric Co Ltd 半導体ウェハプロセス用ふっ酸溶液の不純物分析方法および該ふっ酸溶液の交換時期の管理方法
JP2017083346A (ja) 2015-10-29 2017-05-18 株式会社堀場製作所 液体試料分析装置
WO2020008727A1 (ja) 2018-07-04 2020-01-09 株式会社リガク 蛍光ｘ線分析装置

Also Published As

Publication number Publication date
CN114746744A (zh) 2022-07-12
JPWO2021112080A1 (https=) 2021-06-10
EP4071465A1 (en) 2022-10-12
US20220404297A1 (en) 2022-12-22
WO2021112080A1 (ja) 2021-06-10
KR20220104178A (ko) 2022-07-26

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