JP7381806B2 - 積層部品、及びその製造方法、並びに、積層体、及びその製造方法 - Google Patents

積層部品、及びその製造方法、並びに、積層体、及びその製造方法 Download PDF

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Publication number
JP7381806B2
JP7381806B2 JP2023511868A JP2023511868A JP7381806B2 JP 7381806 B2 JP7381806 B2 JP 7381806B2 JP 2023511868 A JP2023511868 A JP 2023511868A JP 2023511868 A JP2023511868 A JP 2023511868A JP 7381806 B2 JP7381806 B2 JP 7381806B2
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Japan
Prior art keywords
resin
plate
semi
cured
cured resin
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Active
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JP2023511868A
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English (en)
Japanese (ja)
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JPWO2023054031A1 (https=
JPWO2023054031A5 (https=
Inventor
仁孝 南方
政秀 金子
亮 吉松
真也 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2023054031A1 publication Critical patent/JPWO2023054031A1/ja
Publication of JPWO2023054031A5 publication Critical patent/JPWO2023054031A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023511868A 2021-09-28 2022-09-16 積層部品、及びその製造方法、並びに、積層体、及びその製造方法 Active JP7381806B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021157493 2021-09-28
JP2021157493 2021-09-28
PCT/JP2022/034810 WO2023054031A1 (ja) 2021-09-28 2022-09-16 積層部品、及びその製造方法、並びに、積層体、及びその製造方法

Publications (3)

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JPWO2023054031A1 JPWO2023054031A1 (https=) 2023-04-06
JPWO2023054031A5 JPWO2023054031A5 (https=) 2023-09-06
JP7381806B2 true JP7381806B2 (ja) 2023-11-16

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JP2023511868A Active JP7381806B2 (ja) 2021-09-28 2022-09-16 積層部品、及びその製造方法、並びに、積層体、及びその製造方法

Country Status (2)

Country Link
JP (1) JP7381806B2 (https=)
WO (1) WO2023054031A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005235968A (ja) 2004-02-19 2005-09-02 Toshiba Corp 接着性高熱伝導樹脂シートおよびそれを用いた電子機器装置
JP2012114314A (ja) 2010-11-26 2012-06-14 Denki Kagaku Kogyo Kk 放熱基板及び電子部品
WO2015022956A1 (ja) 2013-08-14 2015-02-19 電気化学工業株式会社 窒化ホウ素－樹脂複合体回路基板、窒化ホウ素－樹脂複合体放熱板一体型回路基板
WO2019172345A1 (ja) 2018-03-07 2019-09-12 デンカ株式会社 セラミックス樹脂複合体と金属板の仮接着体、その製造方法、当該仮接着体を含んだ輸送体、およびその輸送方法
JP7217391B1 (ja) 2021-03-31 2023-02-02 デンカ株式会社 複合体及びその製造方法、並びに、積層体及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005235968A (ja) 2004-02-19 2005-09-02 Toshiba Corp 接着性高熱伝導樹脂シートおよびそれを用いた電子機器装置
JP2012114314A (ja) 2010-11-26 2012-06-14 Denki Kagaku Kogyo Kk 放熱基板及び電子部品
WO2015022956A1 (ja) 2013-08-14 2015-02-19 電気化学工業株式会社 窒化ホウ素－樹脂複合体回路基板、窒化ホウ素－樹脂複合体放熱板一体型回路基板
WO2019172345A1 (ja) 2018-03-07 2019-09-12 デンカ株式会社 セラミックス樹脂複合体と金属板の仮接着体、その製造方法、当該仮接着体を含んだ輸送体、およびその輸送方法
JP7217391B1 (ja) 2021-03-31 2023-02-02 デンカ株式会社 複合体及びその製造方法、並びに、積層体及びその製造方法

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JPWO2023054031A1 (https=) 2023-04-06
WO2023054031A1 (ja) 2023-04-06

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