JPWO2023054031A1 - - Google Patents

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Publication number
JPWO2023054031A1
JPWO2023054031A1 JP2023511868A JP2023511868A JPWO2023054031A1 JP WO2023054031 A1 JPWO2023054031 A1 JP WO2023054031A1 JP 2023511868 A JP2023511868 A JP 2023511868A JP 2023511868 A JP2023511868 A JP 2023511868A JP WO2023054031 A1 JPWO2023054031 A1 JP WO2023054031A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023511868A
Other languages
Japanese (ja)
Other versions
JPWO2023054031A5 (https=
JP7381806B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed filed Critical
Publication of JPWO2023054031A1 publication Critical patent/JPWO2023054031A1/ja
Publication of JPWO2023054031A5 publication Critical patent/JPWO2023054031A5/ja
Application granted granted Critical
Publication of JP7381806B2 publication Critical patent/JP7381806B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023511868A 2021-09-28 2022-09-16 積層部品、及びその製造方法、並びに、積層体、及びその製造方法 Active JP7381806B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021157493 2021-09-28
JP2021157493 2021-09-28
PCT/JP2022/034810 WO2023054031A1 (ja) 2021-09-28 2022-09-16 積層部品、及びその製造方法、並びに、積層体、及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2023054031A1 true JPWO2023054031A1 (https=) 2023-04-06
JPWO2023054031A5 JPWO2023054031A5 (https=) 2023-09-06
JP7381806B2 JP7381806B2 (ja) 2023-11-16

Family

ID=85782512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511868A Active JP7381806B2 (ja) 2021-09-28 2022-09-16 積層部品、及びその製造方法、並びに、積層体、及びその製造方法

Country Status (2)

Country Link
JP (1) JP7381806B2 (https=)
WO (1) WO2023054031A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005235968A (ja) * 2004-02-19 2005-09-02 Toshiba Corp 接着性高熱伝導樹脂シートおよびそれを用いた電子機器装置
JP2012114314A (ja) * 2010-11-26 2012-06-14 Denki Kagaku Kogyo Kk 放熱基板及び電子部品
WO2015022956A1 (ja) * 2013-08-14 2015-02-19 電気化学工業株式会社 窒化ホウ素－樹脂複合体回路基板、窒化ホウ素－樹脂複合体放熱板一体型回路基板
WO2019172345A1 (ja) * 2018-03-07 2019-09-12 デンカ株式会社 セラミックス樹脂複合体と金属板の仮接着体、その製造方法、当該仮接着体を含んだ輸送体、およびその輸送方法
JP7217391B1 (ja) * 2021-03-31 2023-02-02 デンカ株式会社 複合体及びその製造方法、並びに、積層体及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005235968A (ja) * 2004-02-19 2005-09-02 Toshiba Corp 接着性高熱伝導樹脂シートおよびそれを用いた電子機器装置
JP2012114314A (ja) * 2010-11-26 2012-06-14 Denki Kagaku Kogyo Kk 放熱基板及び電子部品
WO2015022956A1 (ja) * 2013-08-14 2015-02-19 電気化学工業株式会社 窒化ホウ素－樹脂複合体回路基板、窒化ホウ素－樹脂複合体放熱板一体型回路基板
WO2019172345A1 (ja) * 2018-03-07 2019-09-12 デンカ株式会社 セラミックス樹脂複合体と金属板の仮接着体、その製造方法、当該仮接着体を含んだ輸送体、およびその輸送方法
JP7217391B1 (ja) * 2021-03-31 2023-02-02 デンカ株式会社 複合体及びその製造方法、並びに、積層体及びその製造方法

Also Published As

Publication number Publication date
WO2023054031A1 (ja) 2023-04-06
JP7381806B2 (ja) 2023-11-16

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