JP7379183B2 - ステージ姿勢推定装置、搬送装置、およびステージ姿勢推定方法 - Google Patents

ステージ姿勢推定装置、搬送装置、およびステージ姿勢推定方法 Download PDF

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JP7379183B2
JP7379183B2 JP2020011638A JP2020011638A JP7379183B2 JP 7379183 B2 JP7379183 B2 JP 7379183B2 JP 2020011638 A JP2020011638 A JP 2020011638A JP 2020011638 A JP2020011638 A JP 2020011638A JP 7379183 B2 JP7379183 B2 JP 7379183B2
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Japan
Prior art keywords
stage
estimation
input data
posture
posture estimation
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JP2020011638A
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English (en)
Japanese (ja)
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JP2021117394A (ja
Inventor
宏昭 臼本
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2020011638A priority Critical patent/JP7379183B2/ja
Priority to PCT/JP2021/000818 priority patent/WO2021153228A1/fr
Priority to KR1020227025709A priority patent/KR20220120645A/ko
Priority to CN202180011089.XA priority patent/CN115023660A/zh
Publication of JP2021117394A publication Critical patent/JP2021117394A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2020011638A 2020-01-28 2020-01-28 ステージ姿勢推定装置、搬送装置、およびステージ姿勢推定方法 Active JP7379183B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020011638A JP7379183B2 (ja) 2020-01-28 2020-01-28 ステージ姿勢推定装置、搬送装置、およびステージ姿勢推定方法
PCT/JP2021/000818 WO2021153228A1 (fr) 2020-01-28 2021-01-13 Dispositif d'estimation d'orientation de platine, dispositif de transport, et procédé d'estimation d'orientation de platine
KR1020227025709A KR20220120645A (ko) 2020-01-28 2021-01-13 스테이지 자세 추정 장치, 반송 장치, 및 스테이지 자세 추정 방법
CN202180011089.XA CN115023660A (zh) 2020-01-28 2021-01-13 载物台姿势推定装置、搬送装置以及载物台姿势推定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020011638A JP7379183B2 (ja) 2020-01-28 2020-01-28 ステージ姿勢推定装置、搬送装置、およびステージ姿勢推定方法

Publications (2)

Publication Number Publication Date
JP2021117394A JP2021117394A (ja) 2021-08-10
JP7379183B2 true JP7379183B2 (ja) 2023-11-14

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JP (1) JP7379183B2 (fr)
KR (1) KR20220120645A (fr)
CN (1) CN115023660A (fr)
WO (1) WO2021153228A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202310131A (zh) * 2021-08-24 2023-03-01 日商東京威力科創股份有限公司 基板處理裝置、模型資料產生裝置、基板處理方法、及模型資料產生方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264133A (ja) 2002-03-08 2003-09-19 Nikon Corp ステージ制御装置、露光装置、デバイス製造方法、及びステージ制御方法
JP2016072434A (ja) 2014-09-30 2016-05-09 株式会社Ｓｃｒｅｅｎホールディングス パターン形成装置およびパターン形成方法
WO2019189661A1 (fr) 2018-03-29 2019-10-03 国立大学法人奈良先端科学技術大学院大学 Procédé et dispositif de création d'ensemble de données d'apprentissage
JP2020001127A (ja) 2018-06-28 2020-01-09 勇貴 高橋 ピッキングシステム，ピッキング処理装置及びプログラム
JP2021033068A (ja) 2019-08-26 2021-03-01 株式会社Ｓｃｒｅｅｎホールディングス ステージ姿勢推定装置、搬送装置、ステージ姿勢推定方法、および搬送方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264133A (ja) 2002-03-08 2003-09-19 Nikon Corp ステージ制御装置、露光装置、デバイス製造方法、及びステージ制御方法
JP2016072434A (ja) 2014-09-30 2016-05-09 株式会社Ｓｃｒｅｅｎホールディングス パターン形成装置およびパターン形成方法
WO2019189661A1 (fr) 2018-03-29 2019-10-03 国立大学法人奈良先端科学技術大学院大学 Procédé et dispositif de création d'ensemble de données d'apprentissage
JP2020001127A (ja) 2018-06-28 2020-01-09 勇貴 高橋 ピッキングシステム，ピッキング処理装置及びプログラム
JP2021033068A (ja) 2019-08-26 2021-03-01 株式会社Ｓｃｒｅｅｎホールディングス ステージ姿勢推定装置、搬送装置、ステージ姿勢推定方法、および搬送方法

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Publication number Publication date
KR20220120645A (ko) 2022-08-30
CN115023660A (zh) 2022-09-06
WO2021153228A1 (fr) 2021-08-05
JP2021117394A (ja) 2021-08-10

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