JP7367766B2 - 熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体 - Google Patents

熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体 Download PDF

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Publication number
JP7367766B2
JP7367766B2 JP2021551143A JP2021551143A JP7367766B2 JP 7367766 B2 JP7367766 B2 JP 7367766B2 JP 2021551143 A JP2021551143 A JP 2021551143A JP 2021551143 A JP2021551143 A JP 2021551143A JP 7367766 B2 JP7367766 B2 JP 7367766B2
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Japan
Prior art keywords
group
compound
formula
resin composition
thermosetting resin
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JP2021551143A
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English (en)
Japanese (ja)
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JPWO2021070416A1 (https=
Inventor
千佳 峯崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021551143A 2019-10-09 2020-06-16 熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体 Active JP7367766B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019185745 2019-10-09
JP2019185745 2019-10-09
PCT/JP2020/023639 WO2021070416A1 (ja) 2019-10-09 2020-06-16 熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体

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JPWO2021070416A1 JPWO2021070416A1 (https=) 2021-04-15
JP7367766B2 true JP7367766B2 (ja) 2023-10-24

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JP2021551143A Active JP7367766B2 (ja) 2019-10-09 2020-06-16 熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体

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JP (1) JP7367766B2 (https=)
TW (1) TWI747338B (https=)
WO (1) WO2021070416A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016028129A (ja) 2014-07-08 2016-02-25 昭和電工株式会社 ポリアルケニルフェノール化合物の製造方法
WO2018047417A1 (ja) 2016-09-09 2018-03-15 昭和電工株式会社 硬化性樹脂混合物及び硬化性樹脂組成物の製造方法
JP2018095690A (ja) 2016-12-09 2018-06-21 昭和電工株式会社 熱硬化性樹脂組成物
JP2019048933A (ja) 2017-09-08 2019-03-28 昭和電工株式会社 硬化性樹脂組成物、その硬化物、該硬化性樹脂組成物を用いた構造体の製造方法、及び該硬化物を含む構造体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5767610A (en) * 1980-10-15 1982-04-24 Semedain Kk Anaerobic curable composition
JPS62161820A (ja) * 1986-01-10 1987-07-17 Hitachi Chem Co Ltd エポキシ樹脂組成物
US20170048974A1 (en) * 2014-04-25 2017-02-16 Taiyo Ink Mfg. Co., Ltd. Resin composition for permanent insulating film, permanent insulating film, multilayer printed wiring board, and process for producing the same
EP3613781A4 (en) * 2017-04-19 2020-12-30 Showa Denko K.K. COMPOSITION OF HARDENABLE RESIN, ASSOCIATED HARDENED OBJECT, AND STRUCTURE CONTAINING THIS HARDENED OBJECT

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016028129A (ja) 2014-07-08 2016-02-25 昭和電工株式会社 ポリアルケニルフェノール化合物の製造方法
WO2018047417A1 (ja) 2016-09-09 2018-03-15 昭和電工株式会社 硬化性樹脂混合物及び硬化性樹脂組成物の製造方法
JP2018095690A (ja) 2016-12-09 2018-06-21 昭和電工株式会社 熱硬化性樹脂組成物
JP2019048933A (ja) 2017-09-08 2019-03-28 昭和電工株式会社 硬化性樹脂組成物、その硬化物、該硬化性樹脂組成物を用いた構造体の製造方法、及び該硬化物を含む構造体

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Publication number Publication date
JPWO2021070416A1 (https=) 2021-04-15
TWI747338B (zh) 2021-11-21
TW202116908A (zh) 2021-05-01
WO2021070416A1 (ja) 2021-04-15

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