JP7365423B2 - 加熱冷却装置及び加熱冷却方法 - Google Patents
加熱冷却装置及び加熱冷却方法 Download PDFInfo
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Description
先ず、本実施形態にかかるウェハ処理装置の構成について説明する。図1は、本実施形態にかかるウェハ処理装置1の構成の概略を示す平面図である。本実施形態においては、ウェハ処理装置1が、基板としてのウェハWにCOR処理、PHT処理、CST(Cooling Storage)処理、及びオリエント処理を行う、各種処理モジュールを備える場合を例に説明する。なお、本開示のウェハ処理装置1のモジュール構成はこれに限られず、任意に選択され得る。
本実施形態にかかるウェハ処理装置1は以上のように構成されている。次に、ウェハ処理装置1におけるウェハ処理について説明する。
次に、加熱冷却装置としてのPHTモジュール62の構成について説明する。図2は、PHTモジュール62の構成の概略を示す縦断面図である。図3は、PHTモジュール62の内部構成の概略を示す平面図である。なお、本実施形態のPHTモジュール62では、複数、例えば2枚のウェハWに対して処理を行う。
本実施形態にかかるPHTモジュール62は以上のように構成されている。次に、PHTモジュール62におけるPHT処理(加熱冷却処理)について説明する。図5は、PHTモジュール62においてPHT処理を行う様子を示す説明図である。なお、図5は、チャンバ100の半分(例えばバッファ101a、透過窓114a、シャワーヘッド140a、LED光源150a等)、すなわち1枚のウェハWを示しているが、実際には2枚のウェハWが同時に処理される。
次に、LED光源150a、150bとLED実装基板151a、151bの構成について説明する。図7は、LED光源150a、150bとLED実装基板151a、151bの構成を示す説明図である。図7(a)は本実施形態のLED光源150a、150bとLED実装基板151a、151bの構成を示す説明図であり、(b)は比較例のLED光源500とLED実装基板501の構成を示す説明図である。
(1)チャンバと、前記チャンバの内部に設けられる複数の基板保持部であり、各基板保持部は、基板を保持するように構成される、複数の基板保持部と、前記チャンバの外部に設けられる複数のLED光源であり、前記複数のLED光源は、前記複数の基板保持部にそれぞれ対応し、各LED光源は、対応する前記基板保持部に保持された基板にLED光を照射するように構成され、前記LED光は、当該基板を加熱する波長を有する、複数のLED光源と、前記複数の基板保持部と前記複数のLED光源との間に設けられる複数の透過窓であり、前記複数の透過窓は、前記複数のLED光源にそれぞれ対応し、各透過窓は、対応する前記LED光源から照射された前記LED光を透過するように構成される、複数の透過窓と、前記チャンバの内部に設けられる複数のガス分配部であり、前記複数のガス分配部は、前記複数の基板保持部にそれぞれ対応し、各ガス分配部は、対応する前記基板保持部に保持された基板に冷却ガスを分配して供給するように構成される、複数のガス分配部と、を有する、加熱冷却装置。
前記(1)によれば、加熱冷却装置では、LED光源を用いて基板を加熱し、その加熱速度は、従来用いられているヒータによる加熱速度より速い。したがって、基板の加熱処理を短時間で効率よく行うことができる。また、加熱冷却装置では、ガス分配部からの冷却ガスの供給量を大流量にして基板を冷却し、その冷却速度は、従来の自然冷却の冷却速度より速い。したがって、基板の冷却処理を短時間で効率よく行うことができる。その結果、基板処理のスループットを向上させることができる。
前記(2)によれば、移動機構により基板保持部(基板)を任意の高さ位置に配置させることができる。したがって、基板の加熱処理を行う位置と冷却処理を行う位置を適切に調整することができる。
前記(3)によれば、温度測定部により基板の温度を測定することで、LED光源をフィードバック制御することができ、基板の加熱温度を適切に調整することができる。
前記(4)によれば、冷却板によってLED光源を冷却することで、当該LED光源を適切に動作させることができる。
前記(5)によれば、冷却板によってLED制御基板の部品を冷却することで、当該部品を適切に動作させることができる。しかも、冷却板は、LED光源とLED制御基板を同時に冷却できるので効率がよい。
前記(6)によれば、隣接するLED素子の極性を同一方向において同じにでき、当該隣接するLED素子の電位差を小さくして、絶縁距離を小さくすることができる。その結果、LED実装基板におけるLED素子の密度を大きくすることができ、基板の加熱処理を効率よく行うことができる。
前記(7)によれば、LED実装基板を複数のゾーンに区画することにより、より精度のよい加熱処理を実現することができる。
前記(8)によれば、400nm~1100nmの波長範囲を有するLED光は、透過窓を透過しつつ、基板に吸収される。したがって、基板を効率よく加熱することができる。
前記(9)によれば、基板の外周部が保持されるので、LED光が基板保持部に邪魔されず、当該LED光を基板に適切に照射することができる。
前記(10)によれば、保持部材がLED光を透過させるので、当該LED光を基板に適切に照射することができる。
前記(11)によれば、加熱板で透過窓を加熱することにより、透過窓に付着物が付着するのを抑制し、透過窓が曇るのを抑制することができる。しかも、加熱板はLED光を透過させるので、当該LED光を基板に適切に照射することができる。
(13)前記c)工程において、前記ガス分配部から前記チャンバの内部にパージガスを供給し、前記e)工程における前記冷却ガスの供給量は、前記c)工程における前記パージガスの供給量よりも多い、前記(12)に記載の加熱冷却方法。
(14)前記e)工程における前記チャンバの内部の圧力は、前記c)工程における前記チャンバの内部の圧力より高い、前記(12)又は(13)に記載の加熱冷却方法。
(15)前記c)工程において、前記基板保持部に保持された基板の温度を測定し、前記基板の温度の測定結果に基づいて、前記LED光源をフィードバック制御する、前記(12)~(14)のいずれかに記載の加熱冷却方法。
100 チャンバ
114a、114b 透過窓
140a、140b シャワーヘッド
150a、150b LED光源
W ウェハ
Claims (15)
- チャンバと、
前記チャンバの内部に設けられる複数の基板保持部であり、各基板保持部は、基板を保持するように構成される、複数の基板保持部と、
前記チャンバの外部に設けられる複数のLED光源であり、前記複数のLED光源は、前記複数の基板保持部にそれぞれ対応し、各LED光源は、対応する前記基板保持部に保持された基板にLED光を照射するように構成され、前記LED光は、当該基板を加熱する波長を有する、複数のLED光源と、
前記複数の基板保持部と前記複数のLED光源との間に設けられる複数の透過窓であり、前記複数の透過窓は、前記複数のLED光源にそれぞれ対応し、各透過窓は、対応する前記LED光源から照射された前記LED光を透過するように構成される、複数の透過窓と、
前記チャンバの内部に設けられる複数のガス分配部であり、前記複数のガス分配部は、前記複数の基板保持部にそれぞれ対応し、各ガス分配部は、対応する前記基板保持部に保持された基板に冷却ガスを分配して供給するように構成される、複数のガス分配部と、
前記複数のLED光源に対応して設けられる複数のLED実装基板であり、各LED実装基板の表面には、前記LED光源が実装される、複数のLED実装基板と、
前記複数のLED実装基板に対応して設けられる複数の冷却板であり、各冷却板は、前記LED実装基板の裏面に設けられ、前記LED光源を冷却するように構成される、複数の冷却板と、を有する、加熱冷却装置。 - 前記複数の基板保持部に対応して設けられる複数の移動機構であり、各移動機構は、前記透過窓と前記ガス分配部との間で前記基板保持部を移動させるように構成される、複数の移動機構をさらに有する、請求項1に記載の加熱冷却装置。
- 前記複数の基板保持部に対応して設けられる複数の温度測定部であり、各温度測定部は、前記基板保持部に保持された基板の温度を測定するように構成される、複数の温度測定部をさらに有する、請求項1又は2に記載の加熱冷却装置。
- 前記冷却板に対して前記LED実装基板と反対側に設けられ、前記LED光源を制御するLED制御基板をさらに有し、
前記冷却板は、前記LED制御基板の表面に設けられた部品を冷却する、請求項1~3のいずれか一項に記載の加熱冷却装置。 - 前記LED実装基板は、絶縁基板が複数に積層された構造を有し、
前記LED光源は、最表層の前記絶縁基板の表面において複数列に並べて配置された複数のLED素子を有し、
一列の前記LED素子を接続する配線は、下方に延伸して下層の前記絶縁基板に配設され、さらに上方に延伸して前記一列の隣列の前記LED素子に接続される、請求項1~4のいずれか一項に記載の加熱冷却装置。 - 前記LED実装基板は、平面視において複数のゾーンに区画され、
前記ゾーンには、前記LED素子が複数配置される、請求項5に記載の加熱冷却装置。 - 前記LED光の波長は400nm~1100nmである、請求項1~6のいずれか一項に記載の加熱冷却装置。
- 前記基板保持部は、基板の外周部の複数箇所を保持する、請求項1~7のいずれか一項に記載の加熱冷却装置。
- 前記基板保持部において、基板の外周部を保持する保持部材は、前記LED光源からの前記LED光を透過させるように構成されている、請求項8に記載の加熱冷却装置。
- 前記複数の透過窓に対応して設けられる複数の加熱板であり、各加熱板は、前記透過窓を加熱し、且つ前記LED光源からの前記LED光を透過させるように構成されている、複数の加熱板をさらに有する、請求項1~9のいずれか一項に記載の加熱冷却装置。
- チャンバと、
前記チャンバの内部に設けられる複数の基板保持部であり、各基板保持部は、基板を保持するように構成される、複数の基板保持部と、
前記チャンバの外部に設けられる複数のLED光源であり、前記複数のLED光源は、前記複数の基板保持部にそれぞれ対応し、各LED光源は、対応する前記基板保持部に保持された基板にLED光を照射するように構成され、前記LED光は、当該基板を加熱する波長を有する、複数のLED光源と、
前記複数の基板保持部と前記複数のLED光源との間に設けられる複数の透過窓であり、前記複数の透過窓は、前記複数のLED光源にそれぞれ対応し、各透過窓は、対応する前記LED光源から照射された前記LED光を透過するように構成される、複数の透過窓と、
前記チャンバの内部に設けられる複数のガス分配部であり、前記複数のガス分配部は、前記複数の基板保持部にそれぞれ対応し、各ガス分配部は、対応する前記基板保持部に保持された基板に冷却ガスを分配して供給するように構成される、複数のガス分配部と、
前記複数の基板保持部に対応して設けられる複数の移動機構であり、各移動機構は、前記透過窓と前記ガス分配部との間で前記基板保持部を移動させるように構成される、複数の移動機構と、を有する、加熱冷却装置。 - a)チャンバの内部に複数の基板を搬入し、基板保持部で基板を保持する工程と、
b)前記基板保持部を前記チャンバの外部に設けられたLED光源側に移動させる工程と、
c)前記基板保持部に保持された基板に対して前記LED光源からLED光を照射して、当該基板を加熱する工程と、
d)前記基板保持部を前記チャンバの内部に設けられたガス分配部側に移動させる工程と、
e)前記基板保持部に保持された基板に対して前記ガス分配部から冷却ガスを分配して供給し、当該基板を冷却する工程と、を有する、加熱冷却方法。 - 前記c)工程において、前記ガス分配部から前記チャンバの内部にパージガスを供給し、
前記e)工程における前記冷却ガスの供給量は、前記c)工程における前記パージガスの供給量よりも多い、請求項12に記載の加熱冷却方法。 - 前記e)工程における前記チャンバの内部の圧力は、前記c)工程における前記チャンバの内部の圧力より高い、請求項12又は13に記載の加熱冷却方法。
- 前記c)工程において、前記基板保持部に保持された基板の温度を測定し、
前記基板の温度の測定結果に基づいて、前記LED光源をフィードバック制御する、請求項12~14のいずれか一項に記載の加熱冷却方法。
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