JP7356287B2 - 半導体レーザ駆動装置、および、電子機器 - Google Patents
半導体レーザ駆動装置、および、電子機器 Download PDFInfo
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- JP7356287B2 JP7356287B2 JP2019144174A JP2019144174A JP7356287B2 JP 7356287 B2 JP7356287 B2 JP 7356287B2 JP 2019144174 A JP2019144174 A JP 2019144174A JP 2019144174 A JP2019144174 A JP 2019144174A JP 7356287 B2 JP7356287 B2 JP 7356287B2
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Description
1.実施の形態(半導体レーザ駆動装置)
2.適用例(電子機器)
[半導体レーザ駆動装置]
図1は、本技術の実施の形態における半導体レーザ駆動装置10の上面図の一例を示す図である。
上述のように、半導体レーザ300とレーザドライバ200との間の接続においては、配線インダクタンスが問題となる。全ての導体には誘導成分があり、ToFシステムのような高周波領域では、極めて短いリード線のインダクタンスでも悪影響をおよぼすおそれがある。すなわち、高周波動作した際に、配線インダクタンスの影響によりレーザドライバ200から半導体レーザ300を駆動するための駆動波形が歪んでしまい、動作が不安定になるおそれがある。
IDC=0.0002L・(ln(2L/(W+H))
+0.2235((W+H)/L)+0.5)
図8および図9は、本技術の実施の形態のレーザドライバ200の製造過程において銅ランドおよび銅配線層(RDL:Redistribution Layer)を加工する工程の一例を示す図である。
上述の実施の形態では、サーマルビア104に接続された導体103は、レーザドライバ200に密着していなかったが、放熱性能向上の観点から、密着させることが望ましい。この実施の形態の変形例の半導体レーザ駆動装置10は、放熱性能をさらに向上させた点において実施の形態と異なる。
[電子機器]
図16は、本技術の実施の形態の適用例である電子機器800のシステム構成例を示す図である。
d=(c/4πf)×arctan{(Q3-Q4)/(Q1-Q2)}
(1)レーザドライバを内蔵する基板と、
前記基板の一方の面に実装された半導体レーザと、
前記レーザドライバと前記半導体レーザとを0.5ナノヘンリー以下の配線インダクタンスにより電気接続する接続配線と、
前記レーザドライバと前記基板の他方の面との間に設けられて前記レーザドライバで生じた熱を前記他方の面へ放出するドライバ側サーマルビアと
を具備する半導体レーザ駆動装置。
(2)前記基板の前記一方の面とは反対の面において外部との接続端子をさらに具備し、
前記ドライバ側サーマルビアの一端は、前記接続端子に接続される
前記(1)記載の半導体レーザ駆動装置。
(3)前記基板は、絶縁層および導体を含み、
前記導体と前記レーザドライバとの間には前記絶縁層が配置され、
前記ドライバ側サーマルビアの他端は、前記導体に接続される
前記(2)記載の半導体レーザ駆動装置。
(4)前記レーザドライバの所定平面に形成された金属膜をさらに具備し、
前記ドライバ側サーマルビアの他端は、前記金属膜に接続される
前記(2)記載の半導体レーザ駆動装置。
(5)前記接続端子は、半田ボール、銅コアボール、銅ピラーバンプ、および、ランドグリッドアレイの少なくとも何れか1つにより形成される
前記(2)から(4)のいずれかに記載の半導体レーザ駆動装置。
(6)前記接続配線は、0.5ミリメートル以下の長さを備える
前記(1)から(5)のいずれかに記載の半導体レーザ駆動装置。
(7)前記接続配線は、前記基板に設けられる接続ビアを介する
前記(1)から(6)のいずれかに記載の半導体レーザ駆動装置。
(8)前記半導体レーザは、その一部が前記レーザドライバの上方に重ねて配置される
前記(1)から(7)のいずれかに記載の半導体レーザ駆動装置。
(9)前記半導体レーザは、その面積の50%以下の部分が前記レーザドライバの上方に重ねて配置される
前記(8)記載の半導体レーザ駆動装置。
(10)前記基板は、前記半導体レーザが実装された位置においてレーザ側サーマルビアを備える
前記(1)から(9)のいずれかに記載の半導体レーザ駆動装置。
(11)前記基板の前記一方の面において前記半導体レーザを含む領域を囲う外壁と、
前記外壁に囲まれた領域の上方を覆う拡散板と
をさらに具備する前記(1)から(10)のいずれかに記載の半導体レーザ駆動装置。
(12)前記基板の前記一方の面に実装されて前記半導体レーザから照射されたレーザ光の光強度を監視するフォトダイオードをさらに具備する前記(1)から(11)のいずれかに記載の半導体レーザ駆動装置。
(13)レーザドライバを内蔵する基板と、
前記基板の一方の面に実装された半導体レーザと、
前記レーザドライバと前記半導体レーザとを0.5ナノヘンリー以下の配線インダクタンスにより電気接続する接続配線と、
前記レーザドライバと前記基板の他方の面との間に設けられて前記レーザドライバで生じた熱を前記他方の面へ放出するドライバ側サーマルビアと
を具備する電子機器。
100 基板
101 接続ビア
102、104 サーマルビア
103 導体
105 接続端子
106 金属膜
110 支持板
120 接着性樹脂層
130 ピーラブル銅箔
131 キャリア銅箔
132 極薄銅箔
140、180 ソルダーレジスト
150 配線パターン
161~163 層間絶縁性樹脂
170~172 ビアホール
200 レーザドライバ
210 I/Oパッド
220 保護絶縁層
230 表面保護膜
240 密着層/シード層
250 フォトレジスト
260 銅ランドおよび銅配線層(RDL)
290 ダイアタッチフィルム(DAF)
300 半導体レーザ
400 フォトダイオード
500 受動部品
600 側壁
700 拡散板
800 電子機器
801 筐体
810 撮像部
830 シャッタボタン
840 電源ボタン
850 制御部
860 記憶部
870 無線通信部
880 表示部
890 バッテリ
Claims (9)
- レーザドライバを内蔵する基板と、
前記基板の一方の面に実装された半導体レーザと、
前記レーザドライバと前記半導体レーザとを0.5ナノヘンリー以下の配線インダクタンスにより電気接続する接続配線と、
前記レーザドライバと前記基板の他方の面との間に設けられて前記レーザドライバで生じた熱を前記他方の面へ放出する複数のドライバ側サーマルビアと
を具備し、
前記他方の面において外部との接続端子をさらに具備し、
前記複数のドライバ側サーマルビアのそれぞれの一端は、前記接続端子に接続され、
前記レーザドライバの所定平面に形成された金属膜をさらに具備し、
前記複数のドライバ側サーマルビアのそれぞれの他端は、前記金属膜に共通に接続される
半導体レーザ駆動装置。 - 前記接続端子は、半田ボール、銅コアボール、銅ピラーバンプ、および、ランドグリッドアレイの少なくとも何れか1つにより形成される
請求項1記載の半導体レーザ駆動装置。 - 前記接続配線は、0.5ミリメートル以下の長さを備える
請求項1記載の半導体レーザ駆動装置。 - 前記接続配線は、前記基板に設けられる接続ビアを介する
請求項1記載の半導体レーザ駆動装置。 - 前記半導体レーザは、その一部が前記レーザドライバの上方に重ねて配置される
請求項1記載の半導体レーザ駆動装置。 - 前記半導体レーザは、その面積の50%以下の部分が前記レーザドライバの上方に重ねて配置される
請求項5記載の半導体レーザ駆動装置。 - 前記基板は、前記半導体レーザが実装された位置においてレーザ側サーマルビアを備える
請求項1記載の半導体レーザ駆動装置。 - 前記基板の前記一方の面において前記半導体レーザを含む領域を囲う外壁と、
前記外壁に囲まれた領域の上方を覆う拡散板と
をさらに具備する請求項1記載の半導体レーザ駆動装置。 - 前記基板の前記一方の面に実装されて前記半導体レーザから照射されたレーザ光の光強度を監視するフォトダイオードをさらに具備する請求項1記載の半導体レーザ駆動装置。
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JP2019144174A JP7356287B2 (ja) | 2019-08-06 | 2019-08-06 | 半導体レーザ駆動装置、および、電子機器 |
EP20742950.7A EP4010952A1 (en) | 2019-08-06 | 2020-07-01 | Light emitting device, and electronic apparatus |
CN202080055289.0A CN114556722A (zh) | 2019-08-06 | 2020-07-01 | 发光设备与电子装置 |
US17/626,278 US20220293545A1 (en) | 2019-08-06 | 2020-07-01 | Light emitting device, and electronic apparatus |
PCT/JP2020/025772 WO2021024652A1 (en) | 2019-08-06 | 2020-07-01 | Light emitting device, and electronic apparatus |
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JP2015092524A (ja) | 2013-11-08 | 2015-05-14 | 日立金属株式会社 | 電子部品の放熱構造 |
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