JP7354659B2 - 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 - Google Patents
半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 Download PDFInfo
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Priority Applications (13)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019142425A JP7354659B2 (ja) | 2019-06-13 | 2019-08-01 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
| KR1020247034030A KR20240152968A (ko) | 2019-06-13 | 2020-05-26 | 반도체 나노 입자 복합체, 반도체 나노 입자 복합체 분산액, 반도체 나노 입자 복합체 조성물 및 반도체 나노 입자 복합체 경화막 |
| KR1020217042662A KR102809556B1 (ko) | 2019-06-13 | 2020-05-26 | 반도체 나노 입자 복합체, 반도체 나노 입자 복합체 분산액, 반도체 나노 입자 복합체 조성물 및 반도체 나노 입자 복합체 경화막 |
| CN202080043418.4A CN114127225A (zh) | 2019-06-13 | 2020-05-26 | 半导体纳米粒子复合体、半导体纳米粒子复合体分散液、半导体纳米粒子复合体组合物和半导体纳米粒子复合体固化膜 |
| US17/618,768 US12054657B2 (en) | 2019-06-13 | 2020-05-26 | Semiconductor nanoparticle complex, semiconductor nanoparticle complex dispersion liquid, semiconductor nanoparticle complex composition, and semiconductor nanoparticle complex cured film |
| CN202311018670.1A CN117229769A (zh) | 2019-06-13 | 2020-05-26 | 半导体纳米粒子复合体、及其分散液、组合物和固化膜 |
| PCT/JP2020/020686 WO2020250663A1 (ja) | 2019-06-13 | 2020-05-26 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
| TW109119121A TWI833967B (zh) | 2019-06-13 | 2020-06-08 | 半導體奈米粒子複合體、半導體奈米粒子複合體分散液、半導體奈米粒子複合體組成物及半導體奈米粒子複合體硬化膜 |
| TW113132271A TWI909650B (zh) | 2019-06-13 | 2020-06-08 | 半導體奈米粒子複合體、半導體奈米粒子複合體分散液、半導體奈米粒子複合體組成物及半導體奈米粒子複合體硬化膜 |
| TW112145285A TWI857867B (zh) | 2019-06-13 | 2020-06-08 | 半導體奈米粒子複合體、半導體奈米粒子複合體分散液、半導體奈米粒子複合體組成物及半導體奈米粒子複合體硬化膜 |
| JP2023126371A JP7574889B2 (ja) | 2019-06-13 | 2023-08-02 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
| US18/763,347 US12365836B2 (en) | 2019-06-13 | 2024-07-03 | Semiconductor nanoparticle complex, semiconductor nanoparticle complex dispersion liquid, semiconductor nanoparticle complex composition, and semiconductor nanoparticle complex cured film |
| JP2024177848A JP7804892B2 (ja) | 2019-06-13 | 2024-10-10 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019110307 | 2019-06-13 | ||
| JP2019110307 | 2019-06-13 | ||
| JP2019142425A JP7354659B2 (ja) | 2019-06-13 | 2019-08-01 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023126371A Division JP7574889B2 (ja) | 2019-06-13 | 2023-08-02 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
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| JP2020204756A JP2020204756A (ja) | 2020-12-24 |
| JP2020204756A5 JP2020204756A5 (https=) | 2022-08-03 |
| JP7354659B2 true JP7354659B2 (ja) | 2023-10-03 |
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| JP2019142425A Active JP7354659B2 (ja) | 2019-06-13 | 2019-08-01 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
| JP2023126371A Active JP7574889B2 (ja) | 2019-06-13 | 2023-08-02 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
| JP2024177848A Active JP7804892B2 (ja) | 2019-06-13 | 2024-10-10 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2023126371A Active JP7574889B2 (ja) | 2019-06-13 | 2023-08-02 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
| JP2024177848A Active JP7804892B2 (ja) | 2019-06-13 | 2024-10-10 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12054657B2 (https=) |
| JP (3) | JP7354659B2 (https=) |
| KR (2) | KR102809556B1 (https=) |
| CN (2) | CN114127225A (https=) |
| TW (3) | TWI909650B (https=) |
| WO (1) | WO2020250663A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116390997A (zh) * | 2020-10-15 | 2023-07-04 | Dic株式会社 | 含纳米结晶的组合物、油墨组合物、光转换层及发光元件 |
| CN116420439A (zh) * | 2021-08-30 | 2023-07-11 | 京东方科技集团股份有限公司 | 量子点材料、量子点发光器件及其制备方法 |
| JP2023036307A (ja) * | 2021-09-02 | 2023-03-14 | Dic株式会社 | 発光性ナノ粒子複合体、インク組成物、光変換層およびカラーフィルタ |
| US20240425656A1 (en) * | 2021-09-06 | 2024-12-26 | Sharp Kabushiki Kaisha | Nanoparticle composition, nanoparticle-containing film, light-emitting element, wavelength conversion member, display device, and method for producing nanoparticle-containing film |
| CN119310124B (zh) * | 2024-11-06 | 2025-12-05 | 武汉纺织大学 | 一种基于核磁共振波谱半高宽的磁纳米粒子质量浓度计算方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002121549A (ja) | 2000-06-26 | 2002-04-26 | Mitsubishi Chemicals Corp | 半導体超微粒子 |
| JP2002162501A (ja) | 2000-11-28 | 2002-06-07 | Mitsubishi Chemicals Corp | 半導体結晶粒子を含有する薄膜状成形体、及びその用途 |
| CN106479503A (zh) | 2016-09-29 | 2017-03-08 | Tcl集团股份有限公司 | 一种量子点固态膜及其制备方法 |
| WO2017188300A1 (ja) | 2016-04-26 | 2017-11-02 | 昭栄化学工業株式会社 | 量子ドット材料及び量子ドット材料の製造方法 |
| WO2018016589A1 (ja) | 2016-07-20 | 2018-01-25 | 富士フイルム株式会社 | 量子ドット含有組成物、波長変換部材、バックライトユニット、および液晶表示装置 |
| WO2018224459A1 (en) | 2017-06-08 | 2018-12-13 | Merck Patent Gmbh | A composition comprising semiconducting light-emitting nanoparticles having thiol functional surface ligands |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4234849B2 (ja) * | 1999-06-10 | 2009-03-04 | 株式会社トッパンTdkレーベル | 遊離砥粒スラリー組成物 |
| US20040007169A1 (en) * | 2002-01-28 | 2004-01-15 | Mitsubishi Chemical Corporation | Semiconductor nanoparticles and thin film containing the same |
| JP5393051B2 (ja) * | 2008-04-28 | 2014-01-22 | 富士フイルム株式会社 | 有機顔料組成物及びその製造方法、並びにそれを用いた着色感光性樹脂組成物、カラーフィルタ |
| JP5881045B2 (ja) | 2011-10-11 | 2016-03-09 | 国立研究開発法人産業技術総合研究所 | 量子ドット含有チタン化合物及びその製造方法、並びに該量子ドット含有チタン化合物を用いた光電変換素子 |
| JP6171548B2 (ja) * | 2013-05-14 | 2017-08-02 | セイコーエプソン株式会社 | インクジェット記録装置、およびインクジェット記録方法 |
| WO2017082116A1 (ja) * | 2015-11-12 | 2017-05-18 | 富士フイルム株式会社 | コアシェル粒子、コアシェル粒子の製造方法およびフィルム |
| WO2017150297A1 (ja) * | 2016-02-29 | 2017-09-08 | 富士フイルム株式会社 | 半導体ナノ粒子、分散液およびフィルム |
| CN108110144B (zh) * | 2016-11-25 | 2021-11-26 | 三星电子株式会社 | 包括量子点的发光器件和显示器件 |
| CN106905497B (zh) * | 2017-03-22 | 2021-01-12 | 京东方科技集团股份有限公司 | 量子点复合物、中间体及其制备方法和应用 |
| US12359123B2 (en) * | 2019-06-13 | 2025-07-15 | Shoei Chemical Inc. | Semiconductor nanoparticle complex, semiconductor nanoparticle complex dispersion liquid, semiconductor nanoparticle complex composition, semiconductor nanoparticle complex cured film, and purification method for semiconductor nanoparticle complex |
| JP7468525B2 (ja) * | 2019-06-13 | 2024-04-16 | 昭栄化学工業株式会社 | 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜 |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002121549A (ja) | 2000-06-26 | 2002-04-26 | Mitsubishi Chemicals Corp | 半導体超微粒子 |
| JP2002162501A (ja) | 2000-11-28 | 2002-06-07 | Mitsubishi Chemicals Corp | 半導体結晶粒子を含有する薄膜状成形体、及びその用途 |
| WO2017188300A1 (ja) | 2016-04-26 | 2017-11-02 | 昭栄化学工業株式会社 | 量子ドット材料及び量子ドット材料の製造方法 |
| WO2018016589A1 (ja) | 2016-07-20 | 2018-01-25 | 富士フイルム株式会社 | 量子ドット含有組成物、波長変換部材、バックライトユニット、および液晶表示装置 |
| CN106479503A (zh) | 2016-09-29 | 2017-03-08 | Tcl集团股份有限公司 | 一种量子点固态膜及其制备方法 |
| WO2018224459A1 (en) | 2017-06-08 | 2018-12-13 | Merck Patent Gmbh | A composition comprising semiconducting light-emitting nanoparticles having thiol functional surface ligands |
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| TWI857867B (zh) | 2024-10-01 |
| US12054657B2 (en) | 2024-08-06 |
| US20240352311A1 (en) | 2024-10-24 |
| JP7574889B2 (ja) | 2024-10-29 |
| CN117229769A (zh) | 2023-12-15 |
| KR102809556B1 (ko) | 2025-05-19 |
| TWI909650B (zh) | 2025-12-21 |
| CN114127225A (zh) | 2022-03-01 |
| JP2023155249A (ja) | 2023-10-20 |
| TWI833967B (zh) | 2024-03-01 |
| KR20240152968A (ko) | 2024-10-22 |
| US12365836B2 (en) | 2025-07-22 |
| TW202108736A (zh) | 2021-03-01 |
| TW202411401A (zh) | 2024-03-16 |
| US20220259492A1 (en) | 2022-08-18 |
| JP7804892B2 (ja) | 2026-01-23 |
| JP2024180509A (ja) | 2024-12-26 |
| TW202500716A (zh) | 2025-01-01 |
| WO2020250663A1 (ja) | 2020-12-17 |
| JP2020204756A (ja) | 2020-12-24 |
| KR20220024185A (ko) | 2022-03-03 |
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