JP7335085B2 - 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 - Google Patents

転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 Download PDF

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Publication number
JP7335085B2
JP7335085B2 JP2019065394A JP2019065394A JP7335085B2 JP 7335085 B2 JP7335085 B2 JP 7335085B2 JP 2019065394 A JP2019065394 A JP 2019065394A JP 2019065394 A JP2019065394 A JP 2019065394A JP 7335085 B2 JP7335085 B2 JP 7335085B2
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Japan
Prior art keywords
substrate
transfer
chip
transfer substrate
chip component
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JP2019065394A
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English (en)
Japanese (ja)
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JP2020167251A5 (enExample
JP2020167251A (ja
Inventor
宏一 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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Priority to JP2019065394A priority Critical patent/JP7335085B2/ja
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Publication of JP2020167251A5 publication Critical patent/JP2020167251A5/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips

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  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
JP2019065394A 2019-03-29 2019-03-29 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 Active JP7335085B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019065394A JP7335085B2 (ja) 2019-03-29 2019-03-29 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019065394A JP7335085B2 (ja) 2019-03-29 2019-03-29 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法

Publications (3)

Publication Number Publication Date
JP2020167251A JP2020167251A (ja) 2020-10-08
JP2020167251A5 JP2020167251A5 (enExample) 2022-02-07
JP7335085B2 true JP7335085B2 (ja) 2023-08-29

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JP2019065394A Active JP7335085B2 (ja) 2019-03-29 2019-03-29 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法

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JP (1) JP7335085B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113224220A (zh) * 2021-05-12 2021-08-06 东莞市凯格精机股份有限公司 一种芯片转移方法和芯片转移设备
KR20240088797A (ko) * 2021-10-14 2024-06-20 신에쓰 가가꾸 고교 가부시끼가이샤 리셉터 기판, 리셉터 기판의 제조 방법, 이재 방법, led 패널의 제조 방법 및 스탬퍼
JP2023086244A (ja) * 2021-12-10 2023-06-22 三星電子株式会社 ディスプレイ装置、およびディスプレイ装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368282A (ja) 2001-06-05 2002-12-20 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2004273596A (ja) 2003-03-06 2004-09-30 Sony Corp 素子転写方法および表示装置
JP2004281630A (ja) 2003-03-14 2004-10-07 Sony Corp 素子転写方法、素子転写用基板および表示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368282A (ja) 2001-06-05 2002-12-20 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2004273596A (ja) 2003-03-06 2004-09-30 Sony Corp 素子転写方法および表示装置
JP2004281630A (ja) 2003-03-14 2004-10-07 Sony Corp 素子転写方法、素子転写用基板および表示装置

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