JP7332940B2 - 溝加工装置及び溝加工方法 - Google Patents

溝加工装置及び溝加工方法 Download PDF

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Publication number
JP7332940B2
JP7332940B2 JP2021519458A JP2021519458A JP7332940B2 JP 7332940 B2 JP7332940 B2 JP 7332940B2 JP 2021519458 A JP2021519458 A JP 2021519458A JP 2021519458 A JP2021519458 A JP 2021519458A JP 7332940 B2 JP7332940 B2 JP 7332940B2
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Japan
Prior art keywords
laser beam
angle
polygon mirror
shielding plate
optical system
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JP2021519458A
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English (en)
Japanese (ja)
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JPWO2020230816A1 (https=
Inventor
秀行 濱村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
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Nippon Steel Corp
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Publication of JPWO2020230816A1 publication Critical patent/JPWO2020230816A1/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0052Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/12Scanning systems using multifaceted mirrors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/12Scanning systems using multifaceted mirrors
    • G02B26/125Details of the optical system between the polygonal mirror and the image plane
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/005Diaphragms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/18Sheet panels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/02Iron or ferrous alloys
    • B23K2103/04Steel or steel alloys

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
JP2021519458A 2019-05-14 2020-05-13 溝加工装置及び溝加工方法 Active JP7332940B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019091043 2019-05-14
JP2019091043 2019-05-14
PCT/JP2020/019105 WO2020230816A1 (ja) 2019-05-14 2020-05-13 溝加工装置及び溝加工方法

Publications (2)

Publication Number Publication Date
JPWO2020230816A1 JPWO2020230816A1 (https=) 2020-11-19
JP7332940B2 true JP7332940B2 (ja) 2023-08-24

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ID=73288869

Family Applications (1)

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JP2021519458A Active JP7332940B2 (ja) 2019-05-14 2020-05-13 溝加工装置及び溝加工方法

Country Status (6)

Country Link
US (1) US12397373B2 (https=)
EP (1) EP3970903A4 (https=)
JP (1) JP7332940B2 (https=)
KR (1) KR102604473B1 (https=)
CN (1) CN113825589B (https=)
WO (1) WO2020230816A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL3970904T3 (pl) * 2019-05-14 2023-08-28 Nippon Steel Corporation Urządzenie do obróbki rowków i sposób obróbki rowków

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013161863A1 (ja) 2012-04-27 2013-10-31 新日鐵住金株式会社 方向性電磁鋼板及びその製造方法
JP2014161899A (ja) 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232303A (ja) * 1988-03-14 1989-09-18 Nippon Telegr & Teleph Corp <Ntt> 光ファイバ心線被覆除去方法及び除去装置
JPH05277776A (ja) 1992-03-31 1993-10-26 Toshiba Corp レーザビーム用マスク装置
JPH07108394A (ja) * 1993-10-08 1995-04-25 Omron Corp レーザ加工装置
JPH07178581A (ja) 1993-12-21 1995-07-18 Toshiba Corp レーザ加工装置
JPH07334602A (ja) 1994-06-13 1995-12-22 Olympus Optical Co Ltd バーコード読み取り装置
JP3711586B2 (ja) * 1995-06-02 2005-11-02 株式会社ニコン 走査露光装置
JP3292079B2 (ja) 1997-02-24 2002-06-17 三菱電機株式会社 レーザ加工装置
JP3377165B2 (ja) * 1997-05-19 2003-02-17 キヤノン株式会社 半導体露光装置
JP2002028798A (ja) * 2000-07-11 2002-01-29 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法
JP4340943B2 (ja) * 2000-09-11 2009-10-07 澁谷工業株式会社 レーザ照射装置
JP2002292484A (ja) 2001-03-30 2002-10-08 Nippon Steel Corp レーザによる溝加工装置
KR20080023597A (ko) * 2006-09-11 2008-03-14 삼성전자주식회사 광주사장치 및 이를 구비한 화상형성장치
JP2008122614A (ja) * 2006-11-10 2008-05-29 Kyocera Mita Corp 走査光学装置および画像形成装置
CN102161131A (zh) * 2011-01-18 2011-08-24 施政辉 激光表面加工装置及方法
CN102724628B (zh) 2012-06-08 2016-04-27 中兴通讯股份有限公司 信息处理的方法及服务器
US10160229B2 (en) * 2015-05-28 2018-12-25 University Of West Bohemia Method of laser beam writing with shifted laser surface texturing
JP6456558B2 (ja) 2016-06-28 2019-01-23 株式会社アスカネット 立体像表示装置及び立体像表示方法
CN112088146A (zh) * 2018-03-06 2020-12-15 康宁公司 控制基板厚度的设备和方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013161863A1 (ja) 2012-04-27 2013-10-31 新日鐵住金株式会社 方向性電磁鋼板及びその製造方法
JP2014161899A (ja) 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置

Also Published As

Publication number Publication date
EP3970903A1 (en) 2022-03-23
KR102604473B1 (ko) 2023-11-22
US20220219261A1 (en) 2022-07-14
JPWO2020230816A1 (https=) 2020-11-19
CN113825589B (zh) 2024-03-29
BR112021022645A2 (pt) 2021-12-28
US12397373B2 (en) 2025-08-26
WO2020230816A1 (ja) 2020-11-19
CN113825589A (zh) 2021-12-21
EP3970903A4 (en) 2022-07-20
KR20220005084A (ko) 2022-01-12

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