KR102604473B1 - 홈 가공 장치 및 홈 가공 방법 - Google Patents

홈 가공 장치 및 홈 가공 방법 Download PDF

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Publication number
KR102604473B1
KR102604473B1 KR1020217039937A KR20217039937A KR102604473B1 KR 102604473 B1 KR102604473 B1 KR 102604473B1 KR 1020217039937 A KR1020217039937 A KR 1020217039937A KR 20217039937 A KR20217039937 A KR 20217039937A KR 102604473 B1 KR102604473 B1 KR 102604473B1
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KR
South Korea
Prior art keywords
laser beam
shielding plate
polygon mirror
angle
optical system
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KR1020217039937A
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English (en)
Korean (ko)
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KR20220005084A (ko
Inventor
히데유키 하마무라
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닛폰세이테츠 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/125—Details of the optical system between the polygonal mirror and the image plane
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/005—Diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
KR1020217039937A 2019-05-14 2020-05-13 홈 가공 장치 및 홈 가공 방법 Active KR102604473B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019091043 2019-05-14
JPJP-P-2019-091043 2019-05-14
PCT/JP2020/019105 WO2020230816A1 (ja) 2019-05-14 2020-05-13 溝加工装置及び溝加工方法

Publications (2)

Publication Number Publication Date
KR20220005084A KR20220005084A (ko) 2022-01-12
KR102604473B1 true KR102604473B1 (ko) 2023-11-22

Family

ID=73288869

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217039937A Active KR102604473B1 (ko) 2019-05-14 2020-05-13 홈 가공 장치 및 홈 가공 방법

Country Status (6)

Country Link
US (1) US12397373B2 (https=)
EP (1) EP3970903A4 (https=)
JP (1) JP7332940B2 (https=)
KR (1) KR102604473B1 (https=)
CN (1) CN113825589B (https=)
WO (1) WO2020230816A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL3970904T3 (pl) * 2019-05-14 2023-08-28 Nippon Steel Corporation Urządzenie do obróbki rowków i sposób obróbki rowków

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002086288A (ja) * 2000-09-11 2002-03-26 Shibuya Kogyo Co Ltd レーザ照射装置
JP2014161899A (ja) * 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232303A (ja) * 1988-03-14 1989-09-18 Nippon Telegr & Teleph Corp <Ntt> 光ファイバ心線被覆除去方法及び除去装置
JPH05277776A (ja) 1992-03-31 1993-10-26 Toshiba Corp レーザビーム用マスク装置
JPH07108394A (ja) * 1993-10-08 1995-04-25 Omron Corp レーザ加工装置
JPH07178581A (ja) 1993-12-21 1995-07-18 Toshiba Corp レーザ加工装置
JPH07334602A (ja) 1994-06-13 1995-12-22 Olympus Optical Co Ltd バーコード読み取り装置
JP3711586B2 (ja) * 1995-06-02 2005-11-02 株式会社ニコン 走査露光装置
JP3292079B2 (ja) 1997-02-24 2002-06-17 三菱電機株式会社 レーザ加工装置
JP3377165B2 (ja) * 1997-05-19 2003-02-17 キヤノン株式会社 半導体露光装置
JP2002028798A (ja) * 2000-07-11 2002-01-29 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法
JP2002292484A (ja) 2001-03-30 2002-10-08 Nippon Steel Corp レーザによる溝加工装置
KR20080023597A (ko) * 2006-09-11 2008-03-14 삼성전자주식회사 광주사장치 및 이를 구비한 화상형성장치
JP2008122614A (ja) * 2006-11-10 2008-05-29 Kyocera Mita Corp 走査光学装置および画像形成装置
CN102161131A (zh) * 2011-01-18 2011-08-24 施政辉 激光表面加工装置及方法
JP5935880B2 (ja) 2012-04-27 2016-06-15 新日鐵住金株式会社 方向性電磁鋼板及びその製造方法
CN102724628B (zh) 2012-06-08 2016-04-27 中兴通讯股份有限公司 信息处理的方法及服务器
US10160229B2 (en) * 2015-05-28 2018-12-25 University Of West Bohemia Method of laser beam writing with shifted laser surface texturing
JP6456558B2 (ja) 2016-06-28 2019-01-23 株式会社アスカネット 立体像表示装置及び立体像表示方法
CN112088146A (zh) * 2018-03-06 2020-12-15 康宁公司 控制基板厚度的设备和方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002086288A (ja) * 2000-09-11 2002-03-26 Shibuya Kogyo Co Ltd レーザ照射装置
JP2014161899A (ja) * 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置

Also Published As

Publication number Publication date
EP3970903A1 (en) 2022-03-23
US20220219261A1 (en) 2022-07-14
JPWO2020230816A1 (https=) 2020-11-19
CN113825589B (zh) 2024-03-29
BR112021022645A2 (pt) 2021-12-28
JP7332940B2 (ja) 2023-08-24
US12397373B2 (en) 2025-08-26
WO2020230816A1 (ja) 2020-11-19
CN113825589A (zh) 2021-12-21
EP3970903A4 (en) 2022-07-20
KR20220005084A (ko) 2022-01-12

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