CN113825589B - 槽加工装置以及槽加工方法 - Google Patents

槽加工装置以及槽加工方法 Download PDF

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Publication number
CN113825589B
CN113825589B CN202080035314.9A CN202080035314A CN113825589B CN 113825589 B CN113825589 B CN 113825589B CN 202080035314 A CN202080035314 A CN 202080035314A CN 113825589 B CN113825589 B CN 113825589B
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CN
China
Prior art keywords
laser beam
shielding plate
angle
polygon mirror
optical system
Prior art date
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Active
Application number
CN202080035314.9A
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English (en)
Chinese (zh)
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CN113825589A (zh
Inventor
滨村秀行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel and Sumitomo Metal Corp
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Publication date
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Publication of CN113825589A publication Critical patent/CN113825589A/zh
Application granted granted Critical
Publication of CN113825589B publication Critical patent/CN113825589B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/125—Details of the optical system between the polygonal mirror and the image plane
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/005—Diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
CN202080035314.9A 2019-05-14 2020-05-13 槽加工装置以及槽加工方法 Active CN113825589B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-091043 2019-05-14
JP2019091043 2019-05-14
PCT/JP2020/019105 WO2020230816A1 (ja) 2019-05-14 2020-05-13 溝加工装置及び溝加工方法

Publications (2)

Publication Number Publication Date
CN113825589A CN113825589A (zh) 2021-12-21
CN113825589B true CN113825589B (zh) 2024-03-29

Family

ID=73288869

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080035314.9A Active CN113825589B (zh) 2019-05-14 2020-05-13 槽加工装置以及槽加工方法

Country Status (6)

Country Link
US (1) US12397373B2 (https=)
EP (1) EP3970903A4 (https=)
JP (1) JP7332940B2 (https=)
KR (1) KR102604473B1 (https=)
CN (1) CN113825589B (https=)
WO (1) WO2020230816A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL3970904T3 (pl) * 2019-05-14 2023-08-28 Nippon Steel Corporation Urządzenie do obróbki rowków i sposób obróbki rowków

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07108394A (ja) * 1993-10-08 1995-04-25 Omron Corp レーザ加工装置
JPH07334602A (ja) * 1994-06-13 1995-12-22 Olympus Optical Co Ltd バーコード読み取り装置
JPH10235484A (ja) * 1997-02-24 1998-09-08 Mitsubishi Electric Corp レーザ加工装置
CN101144904A (zh) * 2006-09-11 2008-03-19 三星电子株式会社 激光扫描单元及具有该激光扫描单元的成像设备
JP2008122614A (ja) * 2006-11-10 2008-05-29 Kyocera Mita Corp 走査光学装置および画像形成装置
CN102161131A (zh) * 2011-01-18 2011-08-24 施政辉 激光表面加工装置及方法
WO2013161863A1 (ja) * 2012-04-27 2013-10-31 新日鐵住金株式会社 方向性電磁鋼板及びその製造方法
JP2014161899A (ja) * 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232303A (ja) * 1988-03-14 1989-09-18 Nippon Telegr & Teleph Corp <Ntt> 光ファイバ心線被覆除去方法及び除去装置
JPH05277776A (ja) 1992-03-31 1993-10-26 Toshiba Corp レーザビーム用マスク装置
JPH07178581A (ja) 1993-12-21 1995-07-18 Toshiba Corp レーザ加工装置
JP3711586B2 (ja) * 1995-06-02 2005-11-02 株式会社ニコン 走査露光装置
JP3377165B2 (ja) * 1997-05-19 2003-02-17 キヤノン株式会社 半導体露光装置
JP2002028798A (ja) * 2000-07-11 2002-01-29 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法
JP4340943B2 (ja) * 2000-09-11 2009-10-07 澁谷工業株式会社 レーザ照射装置
JP2002292484A (ja) 2001-03-30 2002-10-08 Nippon Steel Corp レーザによる溝加工装置
CN102724628B (zh) 2012-06-08 2016-04-27 中兴通讯股份有限公司 信息处理的方法及服务器
US10160229B2 (en) * 2015-05-28 2018-12-25 University Of West Bohemia Method of laser beam writing with shifted laser surface texturing
JP6456558B2 (ja) 2016-06-28 2019-01-23 株式会社アスカネット 立体像表示装置及び立体像表示方法
CN112088146A (zh) * 2018-03-06 2020-12-15 康宁公司 控制基板厚度的设备和方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07108394A (ja) * 1993-10-08 1995-04-25 Omron Corp レーザ加工装置
JPH07334602A (ja) * 1994-06-13 1995-12-22 Olympus Optical Co Ltd バーコード読み取り装置
JPH10235484A (ja) * 1997-02-24 1998-09-08 Mitsubishi Electric Corp レーザ加工装置
CN101144904A (zh) * 2006-09-11 2008-03-19 三星电子株式会社 激光扫描单元及具有该激光扫描单元的成像设备
JP2008122614A (ja) * 2006-11-10 2008-05-29 Kyocera Mita Corp 走査光学装置および画像形成装置
CN102161131A (zh) * 2011-01-18 2011-08-24 施政辉 激光表面加工装置及方法
WO2013161863A1 (ja) * 2012-04-27 2013-10-31 新日鐵住金株式会社 方向性電磁鋼板及びその製造方法
JP2014161899A (ja) * 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置

Also Published As

Publication number Publication date
EP3970903A1 (en) 2022-03-23
KR102604473B1 (ko) 2023-11-22
US20220219261A1 (en) 2022-07-14
JPWO2020230816A1 (https=) 2020-11-19
BR112021022645A2 (pt) 2021-12-28
JP7332940B2 (ja) 2023-08-24
US12397373B2 (en) 2025-08-26
WO2020230816A1 (ja) 2020-11-19
CN113825589A (zh) 2021-12-21
EP3970903A4 (en) 2022-07-20
KR20220005084A (ko) 2022-01-12

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