JP7331827B2 - 半導体パッケージおよびこれを用いた電子装置 - Google Patents

半導体パッケージおよびこれを用いた電子装置 Download PDF

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Publication number
JP7331827B2
JP7331827B2 JP2020213686A JP2020213686A JP7331827B2 JP 7331827 B2 JP7331827 B2 JP 7331827B2 JP 2020213686 A JP2020213686 A JP 2020213686A JP 2020213686 A JP2020213686 A JP 2020213686A JP 7331827 B2 JP7331827 B2 JP 7331827B2
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semiconductor
semiconductor package
semiconductor element
bridging member
semiconductor elements
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Japanese (ja)
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JP2022099720A (ja
JP2022099720A5 (https=
Inventor
昇 長瀬
一平 川本
敏博 藤田
敦 齋藤
秀樹 株根
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Denso Corp
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Denso Corp
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Priority to JP2020213686A priority Critical patent/JP7331827B2/ja
Priority to CN202180086569.2A priority patent/CN116783701A/zh
Priority to PCT/JP2021/044454 priority patent/WO2022138068A1/ja
Publication of JP2022099720A publication Critical patent/JP2022099720A/ja
Publication of JP2022099720A5 publication Critical patent/JP2022099720A5/ja
Priority to US18/334,625 priority patent/US20230326817A1/en
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Publication of JP7331827B2 publication Critical patent/JP7331827B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2020213686A 2020-12-23 2020-12-23 半導体パッケージおよびこれを用いた電子装置 Active JP7331827B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020213686A JP7331827B2 (ja) 2020-12-23 2020-12-23 半導体パッケージおよびこれを用いた電子装置
CN202180086569.2A CN116783701A (zh) 2020-12-23 2021-12-03 半导体封装体以及使用该半导体封装体的电子装置
PCT/JP2021/044454 WO2022138068A1 (ja) 2020-12-23 2021-12-03 半導体パッケージおよびこれを用いた電子装置
US18/334,625 US20230326817A1 (en) 2020-12-23 2023-06-14 Semiconductor package and electronic device having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020213686A JP7331827B2 (ja) 2020-12-23 2020-12-23 半導体パッケージおよびこれを用いた電子装置

Publications (3)

Publication Number Publication Date
JP2022099720A JP2022099720A (ja) 2022-07-05
JP2022099720A5 JP2022099720A5 (https=) 2022-11-14
JP7331827B2 true JP7331827B2 (ja) 2023-08-23

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JP2020213686A Active JP7331827B2 (ja) 2020-12-23 2020-12-23 半導体パッケージおよびこれを用いた電子装置

Country Status (4)

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US (1) US20230326817A1 (https=)
JP (1) JP7331827B2 (https=)
CN (1) CN116783701A (https=)
WO (1) WO2022138068A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7559638B2 (ja) 2021-03-18 2024-10-02 株式会社デンソー 電子装置
JPWO2023171792A1 (https=) 2022-03-11 2023-09-14
JP2024037592A (ja) * 2022-09-07 2024-03-19 株式会社デンソー 半導体パッケージ
US20250112132A1 (en) * 2023-09-29 2025-04-03 Alpha And Omega Semiconductor International Lp Semiconductor package having lead frame with slanted sections
TWI879544B (zh) * 2024-04-29 2025-04-01 同欣電子工業股份有限公司 功率晶片封裝結構

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295763A (ja) 2008-06-05 2009-12-17 Fujitsu Ltd 半導体実装装置及び電子機器
JP2015135895A (ja) 2014-01-17 2015-07-27 パナソニックＩｐマネジメント株式会社 半導体モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897335A (ja) * 1994-09-29 1996-04-12 Toshiba Corp 半導体封止用樹脂組成物およびそれを用いた半導体パッケージ
US8981539B2 (en) * 2013-06-10 2015-03-17 Alpha & Omega Semiconductor, Inc. Packaged power semiconductor with interconnection of dies and metal clips on lead frame
JP2015095619A (ja) * 2013-11-14 2015-05-18 株式会社デンソー モールドパッケージ
JP6470938B2 (ja) * 2014-10-06 2019-02-13 日立オートモティブシステムズ株式会社 パワーモジュール及び電力変換装置
WO2016082138A1 (en) * 2014-11-27 2016-06-02 Dow Global Technologies Llc Composition for electrically insulating polymer-inorganic hybrid material with high thermal conductivity
JP6180646B1 (ja) * 2016-02-25 2017-08-16 三菱電機株式会社 半導体パッケージ、及びモジュール
DE102017108172B4 (de) * 2017-04-18 2022-01-13 Infineon Technologies Austria Ag SMD-Package und Verfahren zur Herstellung eines SMD-Packages
JP7119817B2 (ja) * 2018-09-18 2022-08-17 昭和電工マテリアルズ株式会社 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295763A (ja) 2008-06-05 2009-12-17 Fujitsu Ltd 半導体実装装置及び電子機器
JP2015135895A (ja) 2014-01-17 2015-07-27 パナソニックＩｐマネジメント株式会社 半導体モジュール

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WO2022138068A1 (ja) 2022-06-30
JP2022099720A (ja) 2022-07-05
US20230326817A1 (en) 2023-10-12
CN116783701A (zh) 2023-09-19

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