CN116783701A - 半导体封装体以及使用该半导体封装体的电子装置 - Google Patents

半导体封装体以及使用该半导体封装体的电子装置 Download PDF

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Publication number
CN116783701A
CN116783701A CN202180086569.2A CN202180086569A CN116783701A CN 116783701 A CN116783701 A CN 116783701A CN 202180086569 A CN202180086569 A CN 202180086569A CN 116783701 A CN116783701 A CN 116783701A
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CN
China
Prior art keywords
semiconductor
semiconductor package
semiconductor elements
bridge member
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180086569.2A
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English (en)
Chinese (zh)
Inventor
长濑升
川本一平
藤田敏博
斋藤敦
株根秀树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN116783701A publication Critical patent/CN116783701A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202180086569.2A 2020-12-23 2021-12-03 半导体封装体以及使用该半导体封装体的电子装置 Pending CN116783701A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-213686 2020-12-23
JP2020213686A JP7331827B2 (ja) 2020-12-23 2020-12-23 半導体パッケージおよびこれを用いた電子装置
PCT/JP2021/044454 WO2022138068A1 (ja) 2020-12-23 2021-12-03 半導体パッケージおよびこれを用いた電子装置

Publications (1)

Publication Number Publication Date
CN116783701A true CN116783701A (zh) 2023-09-19

Family

ID=82159548

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180086569.2A Pending CN116783701A (zh) 2020-12-23 2021-12-03 半导体封装体以及使用该半导体封装体的电子装置

Country Status (4)

Country Link
US (1) US20230326817A1 (https=)
JP (1) JP7331827B2 (https=)
CN (1) CN116783701A (https=)
WO (1) WO2022138068A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI909704B (zh) * 2023-09-29 2025-12-21 加拿大商萬國半導體國際有限合夥公司 具有傾斜引線框架的半導體封裝

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7559638B2 (ja) 2021-03-18 2024-10-02 株式会社デンソー 電子装置
JPWO2023171792A1 (https=) 2022-03-11 2023-09-14
JP2024037592A (ja) * 2022-09-07 2024-03-19 株式会社デンソー 半導体パッケージ
TWI879544B (zh) * 2024-04-29 2025-04-01 同欣電子工業股份有限公司 功率晶片封裝結構

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897335A (ja) * 1994-09-29 1996-04-12 Toshiba Corp 半導体封止用樹脂組成物およびそれを用いた半導体パッケージ
JP2009295763A (ja) 2008-06-05 2009-12-17 Fujitsu Ltd 半導体実装装置及び電子機器
US8981539B2 (en) * 2013-06-10 2015-03-17 Alpha & Omega Semiconductor, Inc. Packaged power semiconductor with interconnection of dies and metal clips on lead frame
JP2015095619A (ja) * 2013-11-14 2015-05-18 株式会社デンソー モールドパッケージ
JP2015135895A (ja) 2014-01-17 2015-07-27 パナソニックＩｐマネジメント株式会社 半導体モジュール
JP6470938B2 (ja) * 2014-10-06 2019-02-13 日立オートモティブシステムズ株式会社 パワーモジュール及び電力変換装置
WO2016082138A1 (en) * 2014-11-27 2016-06-02 Dow Global Technologies Llc Composition for electrically insulating polymer-inorganic hybrid material with high thermal conductivity
JP6180646B1 (ja) * 2016-02-25 2017-08-16 三菱電機株式会社 半導体パッケージ、及びモジュール
DE102017108172B4 (de) * 2017-04-18 2022-01-13 Infineon Technologies Austria Ag SMD-Package und Verfahren zur Herstellung eines SMD-Packages
JP7119817B2 (ja) * 2018-09-18 2022-08-17 昭和電工マテリアルズ株式会社 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI909704B (zh) * 2023-09-29 2025-12-21 加拿大商萬國半導體國際有限合夥公司 具有傾斜引線框架的半導體封裝

Also Published As

Publication number Publication date
WO2022138068A1 (ja) 2022-06-30
JP7331827B2 (ja) 2023-08-23
JP2022099720A (ja) 2022-07-05
US20230326817A1 (en) 2023-10-12

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