JP7327489B2 - Jigs for chip-shaped electronic components - Google Patents

Description

The present invention relates to a jig for chip-shaped electronic components.

Japanese Patent Application Laid-Open No. 2008-177188 (Patent Document 1) and Japanese Patent No. 6259943 (Patent Document 2) are prior art documents that disclose jigs for chip-shaped electronic components.

A jig for chip-shaped electronic components described in Patent Document 1 includes a support member and a receiving member, and is a jig used for processing chip-shaped electronic components. The support member is made of metal material. The support member has a planar shape as a whole and has a large number of chip insertion holes penetrating therethrough. The receiving member is a net-like body in which metal meridians and metal wefts are woven. The receiving member is joined to one surface of the supporting member, and has at least one intersection within the opening surface of the chip insertion hole.

The jig for chip-shaped electronic components described in Patent Document 2 is a ceramic lattice body and has a plurality of first filamentary portions and a plurality of second filamentary portions. Each of the plurality of first filaments is made of ceramics and extends in one direction. Each of the plurality of second filamentary portions is made of ceramics and extends in a direction intersecting with the first filamentary portions. The second filamentary portion is arranged on the first filamentary portion at any intersection of the first filamentary portion and the second filamentary portion. At the crossing portion, the first filamentary portion has a shape whose cross section is composed of a linear portion and a convex curved portion having ends at both ends of the linear portion. At the intersection, the second filaments have a circular or elliptical shape in cross section. In a vertical cross-sectional view of the crossing portion, the first filament portion and the second filament portion are the top of the convex curved portion of the first filament portion and the circular or elliptical shape of the second filament portion. Only the downwardly convex tops of the shapes are in contact.

JP 2008-177188 A Japanese Patent No. 6259943

In the conventional chip-shaped electronic component jig, after scattering a plurality of chip-shaped electronic components on the chip-shaped electronic component jig from the opening side of the plurality of chip storage portions, the chip-shaped electronic component jig is removed. oscillate. Thereby, a chip-like electronic component is inserted into each of the plurality of chip storage portions. The chip-shaped electronic components that do not fit in the chip storage section and remain on the chip-shaped electronic component jig are shaken off by tilting the chip-shaped electronic component jig.

For this reason, in order to insert one chip-like electronic component into one of the plurality of chip housings, it is necessary to appropriately set the depth dimension and opening area of the chip housing. For example, if the opening area of the chip-shaped electronic component is too small, it will take time to insert the chip-shaped electronic component into the chip storage portion. Also, if the opening area of the chip-shaped electronic component is too large, two chip-shaped electronic components can be accommodated in one chip storage portion. As a result, uneven firing may occur in the firing of chip-shaped electronic components using the chip-shaped electronic component jig. Further, if the depth of the chip storage portion is too small, there is a risk that the electronic chip components stored in the chip storage portion may also be shaken off when the surplus chip-shaped electronic components are shaken off. Furthermore, if the depth dimension of the chip storage portion is too large, when two chip-like electronic components are inserted side by side in the depth direction, there is a possibility that only the upper chip-like electronic component cannot be shaken off. .

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a jig for chip-shaped electronic components that allows one chip-shaped electronic component to be easily inserted into one of a plurality of chip housings. for the purpose.

A jig for chip-shaped electronic components according to the present invention includes a plurality of chip storage units for storing chip-shaped electronic components. Each of the plurality of chip storages includes a bottom and side walls. The bottom supports chip-like electronic components. The side wall is open so that the chip-like electronic component can be inserted. In each of the plurality of chip storage portions, the dimension of the diameter D of the inscribed circle of the side wall when viewed from the direction orthogonal to the bottom and the dimension of the depth Z of each of the plurality of chip storage portions are calculated by the following formula. It satisfies the relationship of (1).

(D/2)<Z<(3√2/2)D (1)

According to the present invention, one chip-shaped electronic component can be easily inserted into one chip storage portion among a plurality of chip storage portions.

1 is a plan view showing the configuration of a jig for chip-shaped electronic components according to Embodiment 1 of the present invention; FIG. It is the figure which looked at the jig|tool for chip-shaped electronic components shown in FIG. 1 from the arrow II direction. FIG. 3 is a plan view showing the configuration of a chip storage portion in the chip-shaped electronic component jig according to Embodiment 1 of the present invention; FIG. 4 is a cross-sectional view of the chip storage portion shown in FIG. 3 as viewed from the direction of the arrows on line IV-IV. FIG. 5 is a front view showing a configuration of a part of a jig for chip-like electronic components according to a comparative example; FIG. 5 is a plan view showing the configuration of a jig for chip-shaped electronic components according to Embodiment 2 of the present invention; It is the figure which looked at the jig|tool for chip-shaped electronic components shown in FIG. 6 from the arrow VII direction. FIG. 10 is a plan view showing the configuration of a jig for chip-shaped electronic components according to Embodiment 3 of the present invention;

Hereinafter, jigs for chip-shaped electronic components according to respective embodiments of the present invention will be described. In the following description of the embodiments, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

(Embodiment 1)
FIG. 1 is a plan view showing the configuration of a jig for chip-shaped electronic components according to Embodiment 1 of the present invention. FIG. 2 is a view of the chip-shaped electronic component jig shown in FIG. 1 as viewed in the direction of arrow II. FIG. 3 is a plan view showing the configuration of a chip storage portion in the chip-shaped electronic component jig according to Embodiment 1 of the present invention. FIG. 4 is a cross-sectional view of the chip storage portion shown in FIG. 3 as viewed in the direction of arrows IV-IV.

As shown in FIGS. 1 and 2, a chip-shaped electronic component jig 100 according to Embodiment 1 of the present invention is configured by stacking a plurality of linear members 110 on each other. In this embodiment, each of the plurality of linear members 110 is linear.

As shown in FIGS. 1 and 2, the chip-shaped electronic component jig 100 according to the present embodiment includes a plurality of first linear members 111 and a plurality of second linear members 112 as the plurality of linear members 110. , a plurality of third linear members 113 , a plurality of fourth linear members 114 , a plurality of fifth linear members 115 , a plurality of sixth linear members 116 and a plurality of seventh linear members 117 . The plurality of first linear members 111 constitute a layer of linear members by being arranged on substantially the same plane. As with the plurality of first linear members 111, the plurality of second linear members 112 to the plurality of seventh linear members 117 also form a layer made up of a plurality of linear members. Details of the plurality of linear members 110 will be described later.

The chip-shaped electronic component jig 100 according to Embodiment 1 of the present invention includes a plurality of chip storage sections 140 that store the chip-shaped electronic components 10 . Each of the plurality of chip storage portions 140 includes a bottom portion 120 and side wall portions 130 . The bottom part 120 supports the chip-like electronic component 10 . The side wall portion 130 is open so that the chip-like electronic component 10 can be inserted.

As shown in FIG. 2 , in each of the plurality of chip storage portions 140 , the bottom portion 120 has a first linear member 111 and a second linear member 112 . The bottom portion 120 may have at least the second linear members 112 that directly support the chip-like electronic component 10 , and may not have the first linear members 111 . The bottom portion 120 may further have an additional layer on the side wall portion 130 side of the second linear member 112 or on the side of the first linear member 111 opposite to the second linear member 112 side. The bottom 120 may have one additional layer or multiple additional layers as the additional layers. The side wall portion 130 includes two third linear members 113, two fourth linear members 114, two fifth linear members 115, two sixth linear members 116, and two linear members 116. It has a book seventh linear member 117 . Side wall portion 130 has two third linear members 113 and two linear members 113 and 2 linear members 113 from the viewpoint of forming an opening of chip storage portion 140 when viewed from the side opposite to bottom portion 120 in a direction perpendicular to bottom portion 120 . at least the fourth linear member 114 . Side wall portion 130 may not have fifth linear member 115 , sixth linear member 116 and seventh linear member 117 .

Note that the chip-shaped electronic component jig 100 may be entirely composed of a plate-shaped member instead of the plurality of linear members 110 . When the chip-shaped electronic component jig 100 is entirely composed of a plate-shaped member, a plurality of holes are formed in the plate-shaped member from one side surface, thereby forming the plurality of holes. may be used as a plurality of chip storage units 140 . In this case, in the plate-shaped member, the bottom portion 120 of each of the plurality of holes constitutes the bottom portion, and the peripheral side portion of each of the plurality of holes constitutes the side wall portion 130 .

A plurality of linear members 110 constituting the chip-shaped electronic component jig 100 according to the present embodiment will be described.

As shown in FIGS. 1 and 2, each of the plurality of first linear members 111 extends in one direction at equal intervals. When viewed from the direction perpendicular to the bottom portion 120, each of the plurality of second linear members 112 extends perpendicular to each of the plurality of first linear members 111 and is aligned with each other at equal intervals. . Each of the plurality of second linear members 112 is positioned above the plurality of first linear members 111 .

In this embodiment, one second linear member 112 directly supports one chip-like electronic component 10 housed in one chip housing portion 140 . When viewed from the direction orthogonal to the bottom portion 120 , one second linear member 112 is positioned in the center between the mutually adjacent sixth linear members 116 and one first linear member 111 . is located at the center between the seventh linear members 117 adjacent to each other. In other words, one first linear member 111 and one second linear member 112 are perpendicular to each other at substantially the center of the chip storage portion 140 . In addition, when viewed from the direction orthogonal to the bottom portion 120, a plurality of the second linear members 112 may be present between the sixth linear members 116 adjacent to each other. It may be located at a non-central location between 116 .

The plurality of third linear members 113 are positioned above the plurality of second linear members 112 . Each of the plurality of third linear members 113 crosses each of the plurality of second linear members 112 at right angles when viewed from a direction perpendicular to the bottom portion 120, and is arranged at regular intervals from each other. extended. That is, each of the plurality of third linear members 113 extends parallel to the extending direction of the plurality of first linear members 111 when viewed from the direction perpendicular to the bottom portion 120 . In the present embodiment, each of the plurality of third linear members 113 is positioned so as to overlap each of some of the plurality of first linear members 111 when viewed from the direction perpendicular to the bottom portion 120 . there is When viewed in a direction parallel to the bottom portion 120, the layer composed of the plurality of second linear members 112 is positioned between the layer composed of the plurality of first linear members 111 and the layer composed of the plurality of third linear members 113. Therefore, between the first linear member 111 and the third linear member 113 that overlap each other when viewed from the direction orthogonal to the bottom portion 120, the position where the second linear member 112 does not exist , a gap is formed.

The plurality of fourth linear members 114 are positioned above the plurality of third linear members 113 . When viewed from the direction orthogonal to the bottom portion 120, each of the plurality of fourth linear members 114 crosses each of the plurality of third linear members 113 at right angles, and is spaced apart from each other at regular intervals. extended. That is, each of the plurality of fourth linear members 114 extends parallel to the extending direction of the plurality of second linear members 112 when viewed from the direction perpendicular to the bottom portion 120 . In the present embodiment, each of the plurality of fourth linear members 114 is positioned so as to partially overlap each of the plurality of second linear members 112 when viewed from the direction orthogonal to the bottom portion 120. . When viewed in a direction parallel to the bottom portion 120, the layer composed of the plurality of third linear members 113 is positioned between the layer composed of the plurality of second linear members 112 and the layer composed of the plurality of fourth linear members 114. Therefore, between the second linear member 112 and the fourth linear member 114 that overlap each other when viewed from the direction orthogonal to the bottom portion 120, the position where the third linear member 113 does not exist , a gap is formed.

The plurality of fifth linear members 115 are positioned above the plurality of fourth linear members 114 . The plurality of fifth linear members 115 are positioned so as to overlap the plurality of third linear members 113 in one-to-one correspondence when viewed from the direction orthogonal to the bottom portion 120 . The plurality of sixth linear members 116 are positioned above the plurality of fifth linear members 115 . The plurality of sixth linear members 116 are positioned so as to overlap the plurality of fourth linear members 114 in one-to-one correspondence when viewed from the direction orthogonal to the bottom portion 120 . The plurality of seventh linear members 117 are positioned above the plurality of sixth linear members 116 . The plurality of seventh linear members 117 are positioned so as to overlap the plurality of fifth linear members 115 in one-to-one correspondence when viewed from the direction perpendicular to the bottom portion 120 .

The chip-shaped electronic component jig 100 according to the present embodiment may further include additional linear members above the plurality of seventh linear members 117 as the plurality of linear members 110 . At this time, the additional linear members may be laminated according to the regularity shown in the explanation of the fifth linear member 115, the sixth linear member 116 and the seventh linear member 117 described above.

As described above, in the chip-shaped electronic component jig 100 according to the present embodiment, a plurality of linear linear members 110 are arranged parallel to each other and spaced apart from each other on each of a plurality of virtual planes. By arranging them, a plurality of layers composed of a plurality of linear members 110 are formed. These multiple layers are stacked together, and in these multiple layers, each of the linear members 110 included in a layer and each of the linear members 110 included in the layer adjacent to the layer are , cross each other when viewed from the stacking direction.

As shown in FIG. 3, in the present embodiment, the distance X between the third linear members 113 is equal to the distance Y between the fourth linear members 114 . In the present embodiment, each of the length of the separation distance X and the length of the separation distance Y is, for example, 0.1 mm or more and 5.0 mm or less. Note that the distance X between the third linear members 113 and the distance Y between the fourth linear members 114 may be different from each other.

As shown in FIG. 2, in this embodiment, each of the plurality of linear members 110 has a substantially circular outer shape when viewed from the extending direction. Each of these linear members may have a rectangular, semicircular, or polygonal shape other than a rectangular shape when viewed from the extending direction. As shown in FIG. 4 , the wire diameter R of each of the plurality of linear members 110 is the same among the plurality of linear members 110 aligned in the direction parallel to the bottom portion 120 . The wire diameter R of each of the plurality of linear members 110 may be the same or different between the linear members 110 that are not aligned in the direction parallel to the bottom portion 120 . In this embodiment, the wire diameters R of the plurality of linear members 110 are all the same, for example, 0.3 mm. The wire diameter R of the linear member located farthest from the bottom portion 120 among the plurality of linear members 110 may be, for example, 0.2 mm.

When the chip-shaped electronic component jig 100 is entirely made of a plate member, the thickness of the bottom portion 120 is, for example, 0.2 mm or more and 2.0 mm or less, and the height of the side wall portion 130 is, for example, It is 0.1 mm or more and 8.0 mm or less.

In this embodiment, each of the plurality of linear members 110 is made of, for example, SiC, zirconia, yttria-stabilized zirconia, ceramics such as alumina or mullite, nickel, aluminum, metals such as Inconel (registered trademark) or SUS, polytetra Composed of resin materials such as fluoroethylene (PTFE: polytetrafluoroethylene), polypropylene (PP: polypropylene), acrylic resin, ABS (Acrylonitrile butadiene styrene)-like resin or other heat-resistant resins, carbon, or composite materials consisting of metal and ceramics , and in this embodiment, it is made of ceramics. In this embodiment, the plurality of linear members 110 are joined together by sintering or the like. Each surface of the plurality of linear members 110 may be further coated with ceramics such as SiC, zirconia, yttria, yttria-stabilized zirconia, alumina or mullite, or metal such as nickel. Note that even when the chip-shaped electronic component jig 100 is entirely composed of a plate-shaped member, the chip-shaped electronic component jig 100 can form the plurality of linear members 110 as described above. It can be made up of materials.

Next, the plurality of chip storage units 140 will be described. As shown in FIGS. 3 and 4, in the present embodiment, the open end of each of the plurality of chip storage portions 140 includes two sixth linear members 116 adjacent to each other and two seventh linear members 116 adjacent to each other. It is composed of a member 117 . On the other hand, two adjacent chip storage portions 140 are separated by one sixth linear member 116 or one seventh linear member 117 . For the plurality of third linear members 113 to the plurality of fifth linear members 115 as well, in the layer corresponding to each linear member, one linear member separates the two chip storage portions 140 adjacent to each other. ing.

In the present embodiment, when the plurality of chip storage portions 140 are viewed from the opposite side of the bottom portion 120 in the direction perpendicular to the bottom portion 120, the opening shape of each of the plurality of chip storage portions 140 is rectangular. , specifically square. In the present embodiment, when the plurality of chip storage portions 140 are viewed from the side opposite to the bottom portion 120 side in the direction orthogonal to the bottom portion 120, the opening shape of each of the plurality of chip storage portions 140 is polygonal. There may be.

In this embodiment, the inner side surface of each opening of the plurality of chip storage portions 140 is formed by the plurality of linear members 110 . Specifically, two third linear members 113 adjacent to each other, two fourth linear members 114 adjacent to each other, two fifth linear members 115 adjacent to each other, and two fifth linear members 115 adjacent to each other It is formed by 6 linear members 116 and two seventh linear members 117 adjacent to each other.

As shown in FIG. 4 , in this embodiment, the bottom surface of each of the plurality of chip storage portions 140 is configured by the second linear member 112 . Further, as shown in FIG. 3, when viewed from the side opposite to the bottom portion 120 side in the direction perpendicular to the bottom portion 120, the first linear member 111 and the first linear member 111 The second linear members 112 cross each other.

Here, the chip-shaped electronic component 10 that can be stored in the plurality of chip storage portions 140 according to this embodiment will be described. As shown in FIGS. 1 and 2, the chip-shaped electronic component 10 that can be stored in the plurality of chip storage portions 140 in this embodiment has a substantially rectangular parallelepiped shape. Chip-like electronic component 10 can be used, for example, as a multilayer ceramic capacitor.

The chip-like electronic component 10 that can be stored in the plurality of chip storage portions 140 in this embodiment has a longitudinal direction, a width direction, and a thickness direction. Chip-shaped electronic component 10 is housed in each of chip housing portions 140 such that the direction orthogonal to bottom portion 120 and the longitudinal direction of chip-shaped electronic component 10 are parallel to each other.

As shown in FIGS. 1 and 2, the length L in the longitudinal direction, the width W in the width direction, and the thickness T in the thickness direction of the chip-shaped electronic component 10 are L:W:T= It has a relationship equivalent to a 2:1:1 relationship. The equivalent relationship means that each dimension of the length L, the width W in the width direction, and the thickness T in the thickness direction is different from the relationship of L:W:T=2:1:1. It is meant to include a range within 5%. Note that the chip-like electronic components that can be accommodated in the chip-like electronic component jig 100 according to the present embodiment are not limited to the chip-like electronic components 10 having the above-described dimensional relationships. For example, the chip-shaped electronic component jig 100 according to the present embodiment may accommodate chip-shaped electronic components having a relationship equivalent to the relationship of L:W:T=2:1.25:1.25. good.

The longitudinal length L of the chip-shaped electronic component 10 that can be accommodated in the chip-shaped electronic component jig 100 according to the present embodiment is, for example, 0.6 mm or more and 3.8 mm or less, and the width W in the width direction is For example, it is 0.3 mm or more and 3.0 mm or less, and the thickness T in the thickness direction is, for example, 0.3 mm or more and 3.0 mm or less. When the chip-shaped electronic component 10 is fired using the chip-shaped electronic component jig 100, each dimension of the length L, the width W, and the thickness T of the chip-shaped electronic component 10 after firing is For example, each dimension of the chip-shaped electronic component 10 is appropriately set within the above range before firing so that the chip-like electronic component 10 has appropriate dimensions when used as an electronic component such as a laminated body of a multilayer ceramic capacitor.

In the chip-shaped electronic component jig 100 according to the present embodiment, each dimension related to the shape of each opening of the plurality of chip storage portions 140 is the length L of the chip-shaped electronic component 10 in the present embodiment in the longitudinal direction. , the width W in the width direction, and the thickness T in the thickness direction are set in consideration of the relationship of L:W:T=2:1:1. Hereinafter, each dimension related to the shape of each opening of the plurality of chip storage portions 140 in this embodiment will be described.

As shown in FIGS. 1 and 3, in each of the plurality of tip storage portions 140, the diameter D of the inscribed circle 141 of each of the plurality of tip storage portions 140 when viewed from the direction orthogonal to the bottom portion 120 is When the electronic chip component 10 is accommodated in each of the chip accommodation units 140, the electronic chip component 10 is set so as to be rotatable about the axis along the longitudinal direction. For example, in the present embodiment, if the length of each of the width W in the width direction and the thickness T in the thickness direction is a, the diameter D of the inscribed circle 141 is equal to It is set to be larger than (√2)a, which is the length of the diagonal line of the rectangular shape composed of the ridgeline and the ridgeline in the thickness direction (D>(√2)a). As a result, a plurality of chip storage portions 140 having a size sufficient for the chip-shaped electronic component 10 can be secured, and the time required to insert the chip-shaped electronic component 10 into the chip storage portion can be shortened. When the width W in the width direction and the thickness T in the thickness direction are different from each other, the diameter D of the inscribed circle 141 is set to be larger than approximately √(W ² +T ² ). .

Next, in each of the plurality of chip housings 140, when viewed from the direction perpendicular to the bottom 120, two or more chip-shaped electronic components 10 are prevented from entering one chip housing 140. , the diameter D of the inscribed circle 141 is set to be less than 2a (D<2a). For example, as shown in FIG. 3, in the present embodiment, the shape of the openings of the plurality of chip storage portions 140 is a square having a side length of D. As shown in FIG. When the width W and the thickness T of the chip-like electronic component 10 are a, if D is 2a or more, there is a possibility that two chip-like electronic components 10 can fit in one chip storage portion 140 . Therefore, the diameter D of the inscribed circle 141 is set to be less than 2a.

Next, the dimension of the height of the side wall portion 130, that is, the dimension of the depth Z of each of the plurality of chip storage portions 140 will be described. When the chip-shaped electronic components 10 are inserted into each of the plurality of chip storage portions 140, the chip-shaped electronic components 10 that do not fit into the chip storage portions 140 and remain on the chip-shaped electronic component jig 100 are removed from the chip-shaped electronic components. The component jig 100 is tilted and shaken off. Therefore, the depth Z of each of the plurality of chip storage portions 140 is such that the chip-shaped electronic components 10 stored in the chip storage portions 140 can be shaken off, and the surplus chip-shaped electronic components 10 can be reliably filtered out. It should be set so that it can be dropped.

As shown in FIGS. 2 and 4, the depth Z of each of the plurality of chip storage portions 140 is larger than half of 2a when the dimension of the length L of the chip-shaped electronic component 10 is 2a. Set (a<Z). By setting in this way, if the center of gravity of the electronic chip component 10 is positioned substantially at the center of the longitudinal direction of the electronic chip component 10, the center of gravity of the electronic chip component 10 accommodated in the chip accommodation section 140 is , are located in the chip storage portion 140 . As a result, when the chip-like electronic component jig 100 is tilted and shaken off, the remaining chip-like electronic components 10 stored in the chip-like electronic component 140 are prevented from falling out of the chip-like electronic component 140 . can be suppressed.

Furthermore, as shown in FIGS. 2 and 4, the depth Z of each of the plurality of chip storage portions 140 is smaller than 3a when the dimension of the length L of the chip-shaped electronic component 10 is 2a. Set (Z<3a). As a result, when the chip-like electronic components 10 are scattered on the chip-like electronic component jig 100 and inserted into the chip storing portion 140 , the chip-like electronic components are placed on the chip-like electronic components 10 stored in the chip storing portion 140 . Even if the component 10 is further positioned, only the upper chip-like electronic component 10 can be screened out. This is because the height of the center of gravity of the upper chip-shaped electronic component 10 is 3 a with respect to the bottom portion 120 , and the center of gravity of the upper chip-shaped electronic component 10 is located outside the chip housing portion 140 .

From the above, when the dimension in the length L direction of the chip-like electronic component 10 is 2a, and each dimension in the width W direction and the thickness T direction is a, the relationship between D and Z is expressed by the above formula (D<2a ) and the above formula (a<Z), (D/2)<a<Z, and therefore (D/2)<Z. Furthermore, the relationship between D and Z is based on the above formula (D>(√2)a) and the above formula (Z<3a), so Z <(3√2/2)D.

As described above, in the present embodiment, in each of the plurality of chip storage portions 140, the dimension of the diameter D of the inscribed circle of the side wall portion 130 when viewed from the direction perpendicular to the bottom portion 120, and the dimension of the depth Z of each satisfies the relationship of the following formula (1).

(D/2)<Z<(3√2/2)D (1)
Furthermore, when the dimension of the length L of the chip-shaped electronic component 10 is 2a, the depth Z of each of the plurality of chip storage portions 140 is preferably set to be smaller than 2a (Z<2a). . That is, it is preferable that a part of the electronic chip component 10 is positioned outside the chip housing portion 140 when the electronic chip component 10 is housed in the chip housing portion 140 . As a result, when the chip-like electronic component 10 stored in the chip storing portion 140 is taken out, the plurality of corners of the chip-like electronic component 10 are caught by the side wall portion 130, and the plurality of corners are fixed. Thus, it is possible to prevent the electronic chip component 10 from being locked by the side wall portion 130 .

Therefore, when the depth is set to (Z<2a), the relationship between D and Z is based on the above formula (Z<2a) and the above formula (D>(√2)a). Since <2a<(√2)D, Z<(√2)D.

As described above, in each of the plurality of chip storage portions 140, the dimension of the diameter D of the inscribed circle of the side wall portion 130 and the dimension of the depth Z of each of the plurality of chip storage portions 240 are further determined by the following formula (2): It is preferable that the relationship of

(D/2)<Z<(√2)D (2)
In this embodiment, the diameter D of the inscribed circle 141 is, for example, 0.1 mm or more and 5.0 mm or less. The depth Z is, for example, 0.1 mm or more and 8.0 mm.

Further, as shown in FIG. 4, in the present embodiment, the dimension of the wire diameter R of each of the plurality of linear members 110 is less than 1/2 of the dimension of the depth Z of each of the plurality of chip storage portions 140. is.

Here, the relationship between the dimension of the wire diameter R of each of the plurality of linear members and the dimension of the depth Z of each of the plurality of chip storage portions is the same as that of the chip-shaped electronic component jig 100 according to the present embodiment. A different jig for chip-shaped electronic components according to a comparative example will be described.

FIG. 5 is a front view showing a configuration of part of a jig for chip-shaped electronic components according to a comparative example. FIG. 5 shows a cross-sectional view from the same direction as in FIG. As shown in FIG. 5 , in the chip-shaped electronic component jig 900 according to the comparative example, the dimension of the wire diameter R of each of the plurality of linear members is the size of the depth Z of each of the plurality of chip storage portions 940 . It is 1/2 the size.

In the chip-shaped electronic component jig 900 according to the comparative example, the bottom portion 120 is composed of the first linear member 911 and the second linear member 912 . The side wall portion 130 is composed of two third linear members 913 and two fourth linear members 914 .

As shown in FIG. 5, in the chip-shaped electronic component jig 900 according to the comparative example, the dimension of the wire diameter R of each of the plurality of linear members is relatively large. As a result, among the plurality of chip-shaped electronic components 10 housed in each of the plurality of chip housing portions 940, another chip-shaped electronic component 10 enters between the chip-shaped electronic components 10 adjacent to each other. , can be positioned above the third linear member 913 .

On the other hand, as shown in FIGS. 2 and 4, in the chip-shaped electronic component jig 100 according to the first embodiment of the present invention, since the wire diameter R of each of the plurality of linear members is relatively small, To suppress other chip-shaped electronic components from entering between adjacent chip-shaped electronic components 10 among the plurality of chip-shaped electronic components 10 housed in each of the plurality of chip housing portions 140. can be done.

The chip-shaped electronic component jig 100 according to the first embodiment of the present invention is specifically a chip-shaped electronic component firing jig. A plurality of chip-shaped electronic components 10 can be fired by arranging the chip-shaped electronic component jig 100 containing the plurality of chip-shaped electronic components 10 in a firing atmosphere. In addition, the chip-shaped electronic component jig 100 according to the first embodiment of the present invention is configured such that the chip-shaped electronic component jig 100 containing the plurality of chip-shaped electronic components 10 is immersed in a plating solution, thereby forming a plurality of chips. The electronic component 10 can also be plated with metals such as Cu, Ni, Sn, Ag, Au or Pd. Further, for a plurality of chip-shaped electronic components 10 having base electrodes made of Ag or the like formed at their ends, a chip-shaped electronic component jig 100 containing such a plurality of chip-shaped electronic components 10 is placed in a plating solution. It is also possible to plate the underlying electrode by immersion.

As described above, the chip-shaped electronic component jig 100 according to Embodiment 1 of the present invention includes a plurality of chip storage sections 140 for storing chip-shaped electronic components. Each of the plurality of chip storage portions 140 includes a bottom portion 120 and side wall portions 130 . The bottom part 120 supports chip-like electronic components. The side wall portion 130 is open so that the chip-shaped electronic component can be inserted. In each of the plurality of chip storage portions 140, the dimension of the diameter D of the inscribed circle of the side wall portion 130 of each of the plurality of chip storage portions 140 when viewed from the direction orthogonal to the bottom portion 120, and the dimension of the depth Z of each satisfies the relationship of the following formula (1).

(D/2)<Z<(3√2/2)D (1)
Accordingly, one chip-shaped electronic component 10 can be easily inserted into one chip storage portion 140 among the plurality of chip storage portions 140 .

In this embodiment, in each of the plurality of chip storage portions 140, the dimension of the diameter D of the inscribed circle of the side wall portion 130 and the dimension of the depth Z of each of the plurality of chip storage portions 140 are determined by the following formula ( It is more preferable that the relationship of 2) is satisfied.

(D/2)<Z<(√2)D (2)
As a result, the chip-like electronic components 10 inserted one by one into the plurality of chip storage portions 140 can be easily taken out.

In the present embodiment, when the plurality of chip storage portions 140 are viewed from the side opposite to the bottom portion 120 side in the direction orthogonal to the bottom portion 120, the opening shape of each of the plurality of chip storage portions 140 is polygonal. be.

This makes it easier to align the plurality of chip storage units 140 . Furthermore, by storing the electronic chip components 10 in each of the aligned chip storage units 140, the filling rate of the electronic chip components 10 per jig 100 for chip electronic components can be improved.

A chip-shaped electronic component jig 100 according to the present embodiment is configured by stacking a plurality of linear linear members 110 on each other.

As a result, gas or liquid can flow through the gaps formed between the linear members 110, so that the air permeability or liquid permeability of the chip storage section 140 can be improved.

In this embodiment, the dimension of the wire diameter R of each of the plurality of linear members 110 is less than half the dimension of the depth Z of each of the plurality of chip storage portions 140 .

As a result, among the chip-shaped electronic components 10 housed in each of the plurality of chip housing portions 140, it is possible to prevent another chip-shaped electronic component 10 from entering between the chip-shaped electronic components 10 adjacent to each other. .

The chip-shaped electronic component jig 100 according to the present embodiment is made of ceramics.
As a result, the heat resistance of the chip-shaped electronic component jig 100 can be improved as compared with the case where the chip-shaped electronic component jig 100 is made of metal.

(Embodiment 2)
A jig for chip-like electronic components according to Embodiment 2 of the present invention will be described below. The chip-shaped electronic component jig according to the second embodiment of the present invention differs from the chip-shaped electronic component jig 100 according to the first embodiment of the present invention mainly in the opening shape of each of the plurality of chip storage portions. . Therefore, the description of the configuration similar to that of jig 100 for chip-like electronic components according to Embodiment 1 of the present invention will not be repeated.

FIG. 6 is a plan view showing the configuration of a jig for chip-shaped electronic components according to Embodiment 2 of the present invention. FIG. 7 is a view of the chip-like electronic component jig shown in FIG. 6 as viewed in the direction of arrow VII. In FIG. 6, it is illustrated when viewed from the same direction as in FIG. Note that FIG. 6 does not show the plurality of first linear members 111 and the plurality of second linear members 112 .

As shown in FIGS. 6 and 7, a chip-like electronic component jig 200 according to Embodiment 2 of the present invention is composed of a plurality of linear members 210. As shown in FIG. Specifically, in this embodiment, the bottom portion 120 has a plurality of first linear members 111 and a plurality of second linear members 112 . Side wall portion 130 has a plurality of annular eighth linear members 218 and a plurality of annular ninth linear members 219 .

As shown in FIG. 7 , each of the plurality of annular eighth linear members 218 is positioned to form an end portion of the side wall portion 130 opposite to the bottom portion 120 side. As shown in FIG. 6 , each of the plurality of annular eighth linear members 218 overlaps the adjacent eighth linear member 218 . Each of the plurality of annular eighth linear members 218 is positioned so that the annular inner portions do not overlap each other when viewed from the side opposite to the bottom portion 120 side in the direction perpendicular to the bottom portion 120 . there is

As shown in FIG. 7 , each of the plurality of ninth annular linear members 219 is positioned so as to overlap each of the plurality of eighth annular linear members 218 when viewed from the direction perpendicular to the bottom portion 120 . are doing. Each of the plurality of annular ninth linear members 219 overlaps with the adjacent ninth linear member 219 . Each of the plurality of annular ninth linear members 219 is located on the opposite side of the plurality of second linear members 112 from the first linear member 111 side, and is located at the bottom of the plurality of eighth linear members 218. It is located on the 120 side.

In Embodiment 2 of the present invention, the dimension of the depth Z of each of the plurality of chip storage portions 240 is set to , to the end of the eighth linear member 218 opposite to the second linear member 112 side.

Since the jig 200 for chip-shaped electronic components according to the present embodiment is configured as described above, the openings of the plurality of chip storage portions 240 are the inner portions of each of the plurality of eighth linear members 218 and the plurality of openings of the plurality of eighth linear members 218 . It is composed of the inner portion of each of the ninth linear members 219 .

As shown in FIGS. 6 and 7, in the chip-shaped electronic component jig 200 according to the second embodiment of the present invention, when viewed from the side opposite to the bottom portion 120 side in the direction perpendicular to the bottom portion 120, a plurality of The inner portion of each of the eighth linear members 218 and each of the plurality of ninth linear members 219 has a circular shape. That is, when the plurality of tip storage portions 240 are viewed from the side opposite to the bottom portion 120 side in the direction perpendicular to the bottom portion 120, the opening shape of each of the plurality of tip storage portions 240 is circular.

As a result, when viewed from the side opposite to the bottom portion 120 in the direction perpendicular to the bottom portion 120, the plurality of chip storage portions 240 can be densely arranged. As a result, the filling rate of the chip-shaped electronic components 10 per chip-shaped electronic component jig 200 can be improved.

Also in the present embodiment, since the relationship of the above formula (1) is satisfied, one chip-like electronic component 10 can be easily inserted into one chip housing portion 240 among the plurality of chip housing portions 240. can.

In the present embodiment, the inscribed circle 241 of each of the plurality of chip storage portions 240 when viewed from the side opposite to the bottom portion 120 in the direction orthogonal to the bottom portion 120 is the bottom portion 120 in the direction orthogonal to the bottom portion 120 . When viewed from the side opposite to the side, each inner side surface portion of each of the plurality of eighth linear members 218 or each inner side surface portion of each of the plurality of ninth linear members 219 is configured.

(Embodiment 3)
A jig for chip-shaped electronic components according to Embodiment 3 of the present invention will be described below. In the jig for chip-shaped electronic components according to Embodiment 3 of the present invention, the features related to the opening dimensions of each of the plurality of chip storage portions are mainly the jig for chip-shaped electronic components according to Embodiment 1 of the present invention. Different from 100. Therefore, the description of the configuration similar to that of jig 100 for chip-like electronic components according to Embodiment 1 of the present invention will not be repeated.

FIG. 8 is a plan view showing the configuration of a jig for chip-shaped electronic components according to Embodiment 3 of the present invention.

As shown in FIG. 8, in the chip-shaped electronic component jig 300 according to Embodiment 3 of the present invention, each of the plurality of chip storage portions 340 is arranged in a direction orthogonal to the bottom portion 120 from the bottom portion 120 side. The opening dimension increases toward the side opposite to the 120 side.

Thus, when the chip-shaped electronic component jig 300 is swung, the chip-shaped electronic component 10 can be easily slid into each of the plurality of chip storage portions 340 .

Also in this embodiment, since the relationship of the above formula (1) is satisfied, one chip-shaped electronic component 10 can be easily inserted into one chip housing portion 340 among the plurality of chip housing portions 340. can.

In addition, in Embodiment 3 of the present invention, the opening dimension is the dimension of the distance between the linear members 310 adjacent to each other in the direction parallel to the bottom portion 120 .

In the chip-shaped electronic component jig 300 according to Embodiment 3 of the present invention, the wire diameters of the plurality of linear members 310 are different from each other for some of the plurality of linear members 310 . Specifically, the wire diameters of the plurality of linear members 310 are the seventh linear member 317, the sixth linear member 316, the fifth linear member 315, the fourth linear member 314, and the third linear member 313. is increasing in the order of

Since the wire diameter of each of the plurality of linear members 310 increases in order as described above, the dimension of the distance between the linear members 310 adjacent to each other in the direction parallel to the bottom portion 120 is equal to that of the seventh linear member 317, sixth linear member 316, fifth linear member 315, fourth linear member 314, and third linear member 313 are smaller in this order.

In addition, in this embodiment, the diameter D of the inscribed circle 141 is set so that the above formula (1) is always satisfied at any position in the direction perpendicular to the bottom portion 120 .

Note that the chip-shaped electronic component jig according to each embodiment of the present invention may include a chip storage portion that does not satisfy the above formula (1). In the chip storage portion that does not satisfy the above formula (1), the flow of gas flowing between the linear members can be controlled. Also, the linear members forming the side wall may be densely arranged. Thereby, the strength of the jig for chip-shaped electronic components can be increased. Furthermore, the chip-shaped electronic component jig according to each embodiment of the present invention may have a simple gap of a size that cannot insert the chip-shaped electronic component.

In the above description of the embodiments, combinable configurations may be combined with each other. For example, a jig for chip-like electronic components may be configured by combining a bottom portion made up of a plate-like member and a side wall portion made up of a plurality of linear members. That is, the shape of the bottom and the position of the bottom relative to the linear member are not particularly limited as long as the bottom can prevent the chip-like electronic component from falling out of the chip storage portion. When the linear members constitute the bottom portion, the extending direction in the plane of each of the plurality of first linear members and the plurality of second linear members is not particularly limited. The plurality of linear members may be configured such that a plurality of first linear members or a plurality of second linear members form the bottom of one chip storage portion. The cross-sectional shape of the linear member may be polygonal. The jig for chip-shaped electronic components may have side walls that are open on both sides of the bottom so that the chip-shaped electronic components can be inserted.

It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the scope of the claims rather than the above description, and is intended to include all changes within the meaning and scope equivalent to the scope of the claims.

10 Chip-shaped electronic component 100,200,300,900 Chip-shaped electronic component jig 110,210,310 Linear member 111,911 First linear member 112,912 Second linear member 113, 313,913 Third linear member 114,314,914 Fourth linear member 115,315 Fifth linear member 116,316 Sixth linear member 117,317 Seventh linear member 120 Bottom, 130 side wall portion, 140, 240, 340, 940 chip storage portion, 141, 241 inscribed circle, 218 eighth linear member, 219 ninth linear member.

Claims (6)

A chip-shaped electronic component jig comprising a plurality of chip storage units for storing chip-shaped electronic components ,
The chip-shaped electronic component jig is configured by stacking a plurality of linear linear members on each other, and is configured of ceramics,
each of the plurality of chip storage units,
a bottom supporting the chip-like electronic component;
a side wall portion that is open so that the chip-like electronic component can be inserted;
In each of the plurality of tip storage portions, the dimension of the diameter D of the inscribed circle of the side wall portion when viewed from the direction orthogonal to the bottom portion, and the dimension of the depth Z of each of the plurality of tip storage portions. is a jig for chip-shaped electronic components that satisfies the relationship of the following formula (1).
(D/2)<Z<(3√2/2)D (1) In each of the plurality of chip storage portions, the dimension of the diameter D of the inscribed circle of the side wall portion and the dimension of the depth Z of each of the plurality of chip storage portions satisfy the following formula (2): A jig for chip-like electronic parts according to claim 1.
(D/2)<Z<(√2)D (2) 2. An opening shape of each of said plurality of chip storage portions is polygonal when viewed from a side opposite to a bottom portion side in a direction orthogonal to said bottom portion. 3. A jig for chip-like electronic components according to item 2. 2. An opening shape of each of said plurality of tip storage portions is circular when viewed from a side opposite to a bottom portion side in a direction orthogonal to said bottom portion. 3. A jig for chip-like electronic components according to item 2. 5. Any one of claims 1 to 4, wherein each of the plurality of chip storage portions has an opening dimension that increases from the bottom side toward the side opposite to the bottom side in a direction perpendicular to the bottom. 1. A jig for chip-shaped electronic components according to claim 1. 6. The dimension of the wire diameter R of each of the plurality of linear members is less than 1/2 of the dimension of the depth Z of each of the plurality of chip storage portions. The jig for chip-like electronic components according to 1.

Images