JP2007194510A - Ceramic electronic part jig, and method for manufacturing ceramic electronic part using same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic electronic part jig capable of significantly improving attachment of a copper terminal electrode and reducing a defect in attachment thereof. <P>SOLUTION: The jig is one used to thermally treat the ceramic electronic part. At least parts 41, 42 for receiving the ceramic electronic part are configured by titanium or a titanium alloy, or are covered with a coating including a principal component of titanium. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a jig for a ceramic electronic component suitable for use in baking a Cu terminal electrode of a ceramic electronic component such as a multilayer ceramic capacitor, and a method for manufacturing a ceramic electronic component using the jig.

  In a ceramic electronic component such as a multilayer ceramic capacitor, an electrode paste (conductor paste) containing Cu powder and an organic binder is applied to both ends of a chip obtained by firing a green chip, and then baked, whereby an internal electrode and an electric Cu terminal electrodes to be connected are formed.

In baking of the Cu terminal electrode, in a nitrogen (N ₂ ) atmosphere, that is, in a neutral atmosphere, 700 ° C. to 900 ° C. so that the tomographic plane of the internal electrode is not oxidized and poor conduction with the Cu terminal electrode does not occur. Bake in the temperature range. In this baking process, ceramic electronic components coated with electrode paste are randomly stored in a jig made of a mesh made of stainless steel wire, and this jig is placed on a frame made of stainless steel wire, The frame is placed on a mesh belt and passed through a firing furnace.

  However, ceramic electronic components randomly stacked and accommodated in jigs have Cu terminal electrodes in contact with Cu terminal electrodes of other adjacent ceramic electronic components, and are baked in contact with each other to adhere to each other. . If the ceramic electronic components attached to each other are forcibly peeled off, the Cu terminal electrode is partially peeled off, so that a part of the Cu terminal electrode is damaged and the yield is deteriorated as a defective Cu terminal electrode.

In order to solve this problem, for example, Patent Document 1 discloses a technique of using a jig in which ZrO ₂ powder is attached to the surface of a Ni mesh, dropping a chip component provided with a Cu terminal electrode on each mesh mesh, and baking it. is doing. Patent Document 2 discloses a jig in which an oxide film made of NiO is formed on the surface of a network formed of Ni.

  However, when the jigs disclosed in Patent Documents 1 and 2 are used, the Cu terminal electrode adheres to the surface of the mesh or mesh, and as a trace of adhesion, scratches remain on a part of the Cu terminal electrode, and Cu Yield is deteriorated as a terminal electrode failure.

In addition, when the Cu terminal electrode adheres to the surface of the mesh or mesh, the Cu component constituting the Cu terminal electrode remains after peeling, which is the cause of promoting the adhesion of the Cu terminal electrode in the next baking process. It becomes. For this reason, there also existed a problem of shortening the lifetime of a jig.
JP-A-11-354377 JP 2004-47584 A

  An object of the present invention is to provide a jig for a ceramic electronic component capable of remarkably reducing adhesion and adhesion failure of a Cu terminal electrode, and a method for manufacturing a ceramic electronic component using the jig.

  Another object of the present invention is to provide a jig for a ceramic electronic component that significantly extends the service life and contributes to cost reduction, and a method for manufacturing a ceramic electronic component using the jig.

  The jig for a ceramic electronic component according to the present invention is used for heat-treating a ceramic electronic component, and at least the portion that receives the ceramic electronic component is made of a material mainly composed of titanium, or It is covered with a film mainly composed of titanium.

  The jig described above is applied to the implementation of a method for manufacturing a ceramic electronic component including a Cu terminal electrode baking formation step. In application, a ceramic electronic component having an unbaked Cu terminal electrode coating composed mainly of Cu on the surface of the jig is supplied. Next, the jig and the ceramic electronic component are heat-treated, and the Cu terminal electrode coating film is baked.

  In the above-described baking process for the Cu terminal electrode coating film, the jig used in the processing is configured such that the portion that receives the ceramic electronic component is made of a material mainly containing titanium, or a film mainly containing titanium. Therefore, the adhesion of the Cu terminal electrode and the adhesion failure rate can be significantly reduced.

  Moreover, since the adhesion of the Cu terminal electrode to the surface of the mesh or network is remarkably reduced, the residual Cu component on the surface of the mesh or network is extremely reduced. For this reason, the lifetime of a jig becomes remarkably long and can contribute to cost reduction.

  The jig according to the present invention has a large number of concave receiving portions that individually receive ceramic electronic components having unbaked Cu terminal electrode coating films. The simplest means for forming the concave receiving portion is to use a net-like body. As another means, it is also effective to combine a plurality of plate materials having cut-out holes to form a specific concave receiving portion suitable for the baking process.

  In any case, the part that receives the ceramic electronic component is made of a material mainly composed of titanium, or is covered with a film mainly composed of titanium.

  As described above, according to the present invention, it is possible to provide a jig for a ceramic electronic component capable of significantly reducing the adhesion of an unbaked Cu terminal electrode and an adhesion failure, and a method for manufacturing a ceramic electronic component using the jig. be able to. In addition, it is possible to provide a jig for a ceramic electronic component that significantly extends the service life and contributes to cost reduction, and a method for manufacturing a ceramic electronic component using the jig.

  Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. However, the attached drawings are merely examples.

  1 is a plan view showing one embodiment of a jig for ceramic electronic parts according to the present invention, FIG. 2 is an enlarged plan view of an arrow A portion shown in FIG. 1, and FIG. 3 is taken along line 3-3 in FIG. It is sectional drawing. The illustrated ceramic electronic component jig includes a base plate 2 and a net 4. The base plate 2 is made of a metal material and includes a flat plate surface 200 on one surface.

  Referring to FIG. 3, the mesh body 4 is woven with vertical metal wires 41 and horizontal metal wires 42, and includes a large number of intersecting portions 43 and a concave receiving portion 45 composed of a large number of meshes. Both the vertical metal wire 41 and the horizontal metal wire 42 use titanium. Titanium hardly adheres to the Cu terminal electrode when the Cu terminal electrode is baked. The base plate 2 and the net-like body 4 can be formed of titanium or a titanium alloy, and may be formed as a titanium coating film on the surface of a metal base material such as stainless steel by means such as plating or coating.

  The intersecting portion 43 is formed by overlapping the metal wires 41 and 42 in the thickness direction of the mesh body 4. More specifically, the intersecting portion 43 is a portion adjacent to each other, and is alternately woven so that the upper and lower sides of the metal wires 41 and 42 are alternated. The form of the mesh body 4 is not limited to the present embodiment, and any form may be employed as long as the intersecting portion 43 is formed so as to overlap in the thickness direction of the mesh body 4. Moreover, if the crossing part 43 exists for every component storage section, metal diffusion joining can be performed for every component storage section, and the clearance gap between the base board 2 and the mesh body 4 can be kept small.

  The concave receiving portion 45 formed of a mesh forms a component storage section surrounded by the intersecting portion 43 and the metal wires 41 and 42. The base plate 2 and the net-like body 4 are fixed to the intersecting portion 43 on the flat plate surface 200 by, for example, diffusion bonding.

  If the height of the recess 45 is too low, the accommodated ceramic electronic component 50 is likely to drop off, and if it is too high, it is difficult to accommodate the ceramic electronic component. Therefore, the height of the concave receiving portion 45 is set to such a height that the above-described problems do not occur in consideration of the height dimension of the ceramic electronic component 50. Since the height of the concave receiving portion 45 is mainly determined by the diameters of the metal wires 41 and 42 constituting the mesh body 4, the diameter of the metallic wires 41 and 42 is selected when setting the height of the concave receiving portion 45. It will be.

  The above-described jig is applied to the Cu terminal electrode baking forming process for ceramic electronic components. FIG. 4 is a partial cross-sectional view showing a state in which the ceramic electronic component 50 is accommodated in the ceramic electronic component jig shown in FIG. A Cu terminal electrode coating film 502 before baking is applied to the ceramic body 501 of the ceramic electronic component 50. If the ceramic electronic component 50 is, for example, a multilayer ceramic capacitor, the Cu terminal electrode coating film 502 is applied to both ends of the ceramic electronic component 50 in the longitudinal direction.

  The Cu terminal electrode coating film 502 is obtained by applying a conductive paste containing copper powder as a main component and an organic binder and mixing them to the ceramic body 501 and drying the paste.

  In FIG. 4, the ceramic electronic components 50 are accommodated one by one in the concave receiving portion 45. Next, the coated ceramic electronic component 50 accommodated in the ceramic electronic component jig is placed in a baking furnace together with the ceramic electronic component jig, and is heated to about 700 ° C. to 900 ° C. to be baked with a Cu terminal electrode. . At this time, a binder removal process for removing the organic binder from the Cu terminal electrode coating film 502 applied to the ceramic electronic component 50 is performed. The binder removal process is performed through a gap G <b> 1 formed by steps between the intersecting portions 43 on the four surfaces around the concave receiving portion 45 and the metal wires 41 and 42. Since the gap G1 exists uniformly over the entire surface of the mesh body 4, the binder removal process can be performed satisfactorily, and the baking temperature and the baking atmosphere can be made uniform. Moreover, as shown in FIG. 4, if the through-hole 23 is provided in the thickness direction of the base plate 2, the binder removal processing, the baking temperature, and the baking atmosphere can be made uniform.

  In addition, the mesh body 4 is woven with metal wires 41 and 42 and includes a large number of metal wire crossing portions 43 and a large number of concave receiving portions 45, so that the single concave receiving portion 45 is made into one ceramic electron. One ceramic electronic component 50 can be accommodated in each concave receiving portion 45 as a component accommodating section. Therefore, the Cu terminal electrode coating films 502 of the ceramic electronic component 50 do not contact each other.

  In addition, since the base plate 2 and the mesh body 4 are fixed on the flat plate surface 200 by the intersection 43 and the diffusion bonding 5, the intersection 43 is fixed to the base plate 2 over the entire surface of the mesh 4 and the base plate 2. The gap between the mesh body 4 can be kept small. Therefore, it is possible to prevent a problem that the ceramic electronic component enters the gap between the base plate 2 and the mesh body 4.

  Moreover, since the portion fixed to the base plate 2 is the intersecting portion 43 of the mesh body 4, basically, all the concave receiving portions 45 can be used as component storage sections. For this reason, the jig for ceramic electronic components with a large accommodation quantity of the ceramic electronic components 50 can be provided.

  Furthermore, as a configuration unique to the present invention, the base plate 2 and the mesh body 4 that receive the ceramic electronic component are made of titanium or a titanium alloy, or a titanium coating film is attached to the surface of a metal substrate such as stainless steel. Since it has the structure made to adhere, adhesion of Cu terminal electrode coating film 502 and adhesion failure can be reduced significantly.

  Next, Table 1 shows the results of baking experiments for each material of the base plate 2 and the mesh body 4. In Table 1, the adhesion rate (%) indicates the adhesion rate (N = 10,000) of the Cu terminal electrode coating film 502 to the mesh 4.

  Referring to Table 1, when the mesh body 4 is composed of SUS304 (Fe-18Cr-Ni), MN (63Ni-30Cu) and HA (Ni-Cr-Mo), the adhesion rate is 11 to 76.62 (%). In contrast, when Ti is used, it is 0.37 (%), which is significantly lower than other materials described above. This means that when the base plate 2 and the reticulated body 4 are formed using Ti, the adhesion rate is extremely low, and damage to the Cu terminal electrode coating film 502 due to adhesion is minimized. Similar results were obtained when a titanium coating film was formed on the surface of a metal substrate such as stainless steel by means of plating or coating. In the alloy MN described in 4 of Table 1, the material component (63Ni-30Cu) indicates that it contains 63% or more of Ni and about 30% of Cu.

  In addition, since the adhesion of the Cu terminal electrode coating film 502 to the surfaces of the base plate 2 and the mesh body 4 is remarkably reduced, the Cu component remains on the surfaces of the base plate 2 and the mesh body 4 very little. For this reason, the lifetime of a jig becomes remarkably long and can contribute to cost reduction. Next, this point will be described with reference to Table 2. Table 2 shows data indicating the adhesion rate and the adhesion failure rate when the base plate 2 and the net-like body 4 are made of Ti and are repeatedly used (number of inputs).

  Referring to Table 2, when the base plate 2 and the mesh body 4 are made of Ti, the adhesion rate tends to increase with an increase in the number of inputs, but the adhesion failure rate in which scratches remain on the terminals is a maximum of 6 times. It can be seen that even in the repeated use, it is 0.0 (%), and the service life of the jig is remarkably increased, which can contribute to cost reduction.

  The present invention can be applied to various types of jigs. Specific examples are shown below. 5 is a plan view showing another embodiment of the jig according to the present invention, FIG. 6 is an exploded view of the jig shown in FIG. 5, and FIG. 7 is a partially enlarged view of the jig shown in FIGS. It is.

  Referring to FIGS. 5 and 6, the illustrated jig includes a first thin plate member 10, second thin plate members 21 and 22, and a third thin plate member 30. The third thin plate member 30 is disposed on the second thin plate member 22, the second thin plate member 22 is disposed on the second thin plate member 21, and the second thin plate member 21 is the first thin plate member 21. The thin plate member 10 is disposed. Each of the first to third thin plate members 10 to 30 is preferably subjected to diffusion bonding or thermocompression bonding.

  The first to third thin plate members 10, 21, 22, and 30 are made of titanium. Unlike this, a titanium coating film may be formed on the surface of a metal substrate such as stainless steel by means of plating, coating, or the like. The thickness of each of the first to third thin plate members 10 to 30 is preferably about 1 to 10 mm, for example.

  The first thin plate member 10 includes a substrate 100 and a vent hole 101. There are a plurality of vent holes 101, which penetrate through the substrate 100 in the thickness direction. Each of the vent holes 101 is arranged in a lattice pattern.

  The second thin plate member 21 includes a substrate 210 and a first slit 211. The first slit 211 penetrates in the thickness direction of the substrate 210. The second thin plate member 22 includes a substrate 220 and a second slit 221. The second slit 221 penetrates in the thickness direction of the substrate 220. The second slit 221 is preferably orthogonal to the first slit 211 when viewed in the thickness direction, but the intersecting angle is arbitrary.

  The third thin plate member 30 includes a substrate 300 and a concave receiving portion 301. The concave receiving portions 301 are arranged in a lattice shape, and each penetrates in the thickness direction of the substrate 300. The interval between the concave receiving portions 301-301 is arbitrary.

  The slits 211 and 221 and the concave receiving portion 301 are combined so as to communicate with each other in the thickness direction. The communicating portions (communication paths) A 1 and B 1 have an inner diameter that allows the chip to pass through, and are at least partially blocked by the holding portion 102 of the substrate 100.

  FIG. 8 is a partial cross-sectional view for explaining the usage state of the jig shown in FIGS. In FIG. 8, each of the ceramic electronic components 50 is guided from the concave receiving portion 301 to the slits 211 and 221 and held by the holding portion 102, and in this state, a binder removal process or a firing process is performed.

  As a structure peculiar to the present invention, the first to third thin plate members 10, 21, 22, and 30 that receive ceramic electronic components are made of titanium, or are plated or coated on the surface of a metal substrate such as stainless steel. Since the titanium coating film is formed by such means, adhesion of the Cu terminal electrode coating film 502 and adhesion failure can be remarkably reduced in the binder removal step and the firing step.

  Since the slits 211 and 221 of the second thin plate members 21 and 22 and the concave receiving portion 301 of the third thin plate member 30 communicate with each other in the thickness direction, the ceramic electronic component 50 is separated from the concave receiving portion 301 by the slit 211, Guided to 221 and individually stored in a jig. The slits 211 and 221 and the at least two concave receiving portions 301 form a flow path (see FIG. 5) that passes through one side of the concave receiving portion 301-slit 221-slit 211-slit 221-the other side of the concave receiving portion 301. Therefore, the air permeability is improved, the firing atmosphere is made uniform and the firing temperature is made uniform, and the degassing gas is easily released. For this reason, uneven heating is less likely to occur, and the time required for binder removal is shortened.

  The holding portion 102 of the first thin plate member 10 closes the communication paths 301, 211, and 221 and holds the ceramic electronic component 50. For this reason, the binder removal process or the firing process can be performed in a state where the ceramic electronic component 50 is stably held in the jig, and the electronic components can be manufactured with a high yield.

  The illustrated first thin plate member 10 includes a vent 101. The ventilation hole 101 leads to the communication passages 301, 211, and 221 and forms a flow path (see FIG. 5) that leads to the concave receiving portion 301-slit 221-slit 211-ventilation hole 101. Uneven heating is less likely to occur, and the time required for binder removal is shortened.

  Further, in the illustrated embodiment, the number of hollow portions increases as the first to third thin plate members 10 to 30 are provided with the communication passages 301, 211, 221, and 101. For this reason, the heat capacity is reduced, and energy saving is achieved in the binder removal and firing processes. Further, the hollow portion can reduce the weight.

  FIG. 9 is an exploded plan view showing another embodiment of the jig according to the present invention, and FIG. 10 is a sectional view of the jig shown in FIG. In these drawings, parts corresponding to the constituent parts appearing in FIGS. 1 to 8 are given the same reference numerals.

  The jig shown in FIGS. 9 and 10 includes a first thin plate member 10, second thin plate members 21 and 22, and a third thin plate member 30. These are composed of titanium, or a titanium coating film is formed on the surface of a metal substrate such as stainless steel by means such as plating or coating. Unlike the embodiment shown in FIGS. 6 to 8, the first thin plate member 10 is not provided with a vent hole.

  In the embodiment shown in FIGS. 9 and 10, the first thin plate member 10, the second thin plate members 21, 22 and the third thin plate member 30 are made of titanium or a titanium alloy, or stainless steel. Since it has the structure which made the titanium coating film adhere to the surface of metal substrates, such as steel, adhesion of Cu terminal electrode coating film 502 and adhesion failure can be reduced remarkably. Other functions and effects are almost the same as those of the above-described embodiment.

  11 is an exploded plan view showing still another embodiment of the jig according to the present invention, and FIG. 12 is a cross-sectional view of the jig shown in FIG. The jig shown in FIGS. 11 and 12 includes a first thin plate member 10, a second thin plate member 21, and a third thin plate member 30. These are composed of titanium or a titanium alloy, or have a structure in which a titanium coating film is attached to the surface of a metal substrate such as stainless steel. Therefore, adhesion of the Cu terminal electrode coating film 502 and adhesion failure can be significantly reduced. Other functions and effects are almost the same as those of the above-described embodiment.

  FIG. 13 is an exploded plan view showing still another embodiment of the jig according to the present invention. The jig shown in FIG. 13 includes a first thin plate member 10, a second thin plate member 21, and a third thin plate member 30. These are composed of titanium or a titanium alloy, or have a structure in which a titanium coating film is attached to the surface of a metal substrate such as stainless steel. Therefore, adhesion of the Cu terminal electrode coating film 502 and adhesion failure can be significantly reduced. Other functions and effects are almost the same as those of the above-described embodiment.

  The second thin plate member 21 includes a substrate 210 and first slits 211 and 212. The first slits 211 and 212 penetrate in the thickness direction of the substrate 210 and are orthogonal to each other when viewed in the thickness direction.

  14 is a plan view showing an embodiment of the jig according to the present invention, FIG. 15 is an exploded plan view of the jig shown in FIG. 14, and FIG. 16 is an enlarged sectional view of the jig shown in FIGS. is there. 14 to 16 includes first thin plate members 11, 12, second thin plate members 21, 22, and a third thin plate member 30. These are composed of titanium or a titanium alloy, or have a structure in which a titanium coating film is attached to the surface of a metal substrate such as stainless steel.

  Each of the first thin plate members 11 and 12 has the same configuration, and each of the second thin plate members 21 and 22 has the same configuration. The third thin plate member 30 is disposed on the second thin plate member 22, the second thin plate member 22 is disposed on the second thin plate member 21, and the second thin plate member 21 is the first thin plate member 21. The first thin plate member 12 is disposed on the first thin plate member 11. Each of the first to third thin plate members 11 to 30 is preferably subjected to diffusion bonding or thermocompression bonding. The thickness of each of the first to third thin plate members 11 to 30 is preferably about 1 to 10 mm, for example.

  The third thin plate member 30 includes a substrate 300 and a concave receiving portion 301 for component insertion. The concave receiving portions 301 are arranged in a lattice shape, and each penetrates in the thickness direction of the substrate 300. The interval between the concave receiving portions 301-301 is arbitrary.

  The second thin plate member 21 includes a substrate 210 and a cavity 201. The second thin plate member 22 includes a substrate 220 and a cavity 201. The cavity 201 is formed at a position overlapping the concave receiving portion 301 in the thickness direction, and penetrates the substrates 210 and 220 in the thickness direction.

  The maximum passing dimension of the cavity 201 is larger than the maximum passing dimension of the recessed receiving part 301. This is because the chip is necessary for changing the posture in the hollow portion 201.

  The first thin plate member 11 includes a substrate 110, a first support part 111, a second support part 112, and a groove part 113. The first thin plate member 12 includes a substrate 120, a first support part 111, a second support part 112, and a groove part 113.

  At least a part of the first support part 111 is formed at a position where it does not overlap the concave receiving part 301 when viewed in the thickness direction. At least a part of the second support portion 112 is formed at a position overlapping the concave receiving portion 301 when viewed in the thickness direction. The groove 113 is formed around the first and second support portions 111 and 112. The groove 113 is preferably formed in the vicinity of the end of the chip when the first support 111 supports the chip.

  FIG. 16 is a cross-sectional view illustrating a usage state of the jig illustrated in FIGS. 14 and 15. In FIG. 16, the ceramic electronic component 50 is guided from the concave receiving portion 301 to the hollow portion 201 along the longitudinal direction thereof. The communication passages 301 and 201 have an inner diameter that allows the chip to pass along the longitudinal direction, and at least a part of the second support portion 112 is located at a position overlapping the concave receiving portion 301 when viewed in the thickness direction. Since it is formed, the chip inserted along the longitudinal direction is supported by the second support portion 112.

  Next, the chip supported by the second support portion 112 falls. The method of tipping over is arbitrary. For example, a method of tipping the chip by applying vibration to the jig, a method of using a support device, or the like can be given.

  Since the cavity 201 has a space that allows the ceramic electronic component 50 to rotate by approximately 90 degrees, the ceramic electronic component 50 is disposed so that its longitudinal direction is parallel to the second thin plate member.

  Since at least a part of the first support portion 111 is formed at a position that does not overlap the concave receiving portion 301 when viewed in the thickness direction, the tip portion of the tip that has fallen has the first support portion at the center in the longitudinal direction. 111 is supported.

  In the state where the first support part 111 supports the chip, since the groove part 113 is formed near the end part of the chip, contact between the Cu terminal electrode coating film 502 of the chip and the substrates 110 and 120 is avoided. Is done. Thereby, the malfunction which a chip | tip and a jig | tool adhere is avoided.

  Next, a binder removal process and a baking process are performed in this state. In the binder removal step, the first thin plate members 11 and 12, the second thin plate members 21 and 22, and the third thin plate member 30 are made of titanium or a titanium alloy, or the surface of a metal substrate such as stainless steel. Therefore, the adhesion and poor adhesion of the Cu terminal electrode coating film 502 can be remarkably reduced.

  The ceramic electronic component 50 is inserted into the concave receiving portion 301 along the longitudinal direction thereof, and is arranged in the cavity portion 201 so that the longitudinal direction is parallel to the second thin plate member. As a result, each ceramic electronic component 50 has a constant distance from the jig in the longitudinal direction, thereby avoiding the problem of uneven heating along the longitudinal direction of the ceramic electronic component 50.

  Moreover, the arrangement | positioning in parallel with the 2nd thin plate members 21 and 22 avoids the malfunction which the ceramic electronic component 50 and a jig | tool adhere by the dead weight of the ceramic electronic component 50. FIG. This is because the weight of the ceramic electronic component 50 is not concentrated on one point by being arranged in parallel with the second thin plate members 21 and 22.

  The first thin plate members 11 and 12 at least partially block the communication passages 301 and 201 and hold the ceramic electronic component 50. Accordingly, the binder removal process or the firing process can be performed while the ceramic electronic component 50 is stably held in the jig, and the electronic component can be manufactured with a high yield.

  Further, each ceramic electronic component 50 is individually held in the cavity 201 and does not overlap with each other, so that air permeability is improved. For this reason, uneven heating is less likely to occur, and the time required for binder removal is shortened.

  Further, in the illustrated embodiment, since the groove 113 penetrates in the thickness direction of the substrates 110 and 120, it reaches from the third thin plate member 30 side to the concave receiving portion 301 and the cavity 201, and through the groove 113. A flow path (communication path) that exits toward the first thin plate member 11 is formed. With this configuration, air permeability is improved, heating unevenness is less likely to occur, and time required for binder removal is reduced.

  In particular, according to the communication paths 301, 201, and 103, the outside air that faces the first thin plate member 11 and the outside air that faces the third thin plate member 30 are vented, and the ceramic electronic component 50 is evenly distributed. External air is added, and extremely good binder removal and firing characteristics can be obtained.

  Further, in the illustrated embodiment, the first to third thin plate members 11 to 30 have more hollow portions as much as the communication paths 301, 201, and 103 are provided. For this reason, the heat capacity is reduced, and energy saving is achieved in the binder removal and firing processes. Further, the hollow portion can reduce the weight.

  17 is an exploded plan view showing another embodiment of the jig according to the present invention, FIG. 18 is a cross-sectional view taken along line 18-18 in FIG. 17, and FIG. 19 is taken along line 19-19 in FIG. It is sectional drawing.

  The jig shown in FIGS. 17 to 19 includes a first thin plate member 11, second thin plate members 21 and 22, and a third thin plate member 30. These are composed of titanium or a titanium alloy, or have a structure in which a titanium coating film is attached to the surface of a metal substrate such as stainless steel.

  The first thin plate member 11 includes a substrate 110, a first support part 111, a second support part 112, and a groove part 113. The first support part 111 is separated into two parts and has a taper (V-shaped groove) from one surface facing the second thin plate member 21 to the groove part 113.

  In FIG. 17, the groove 113 includes an elliptical portion 103A along the longitudinal direction of the chip and an elliptical portion 103B in a direction orthogonal to the longitudinal direction. The elliptical portions 103 </ b> A and 103 </ b> B are formed corresponding to the shape of the ceramic electronic component 50.

  In FIG. 18, the ceramic electronic component 50 is guided from the concave receiving portion 301 to the hollow portion 201 along the longitudinal direction thereof, and then the ceramic electronic component 50 falls out of balance.

  In the illustrated embodiment, since the first support portion 111 is tapered (V-shaped groove), the ceramic electronic component 50 is positioned by the taper. For this reason, the ceramic electronic component 50 contacts the wall surface of the cavity part 201, and the malfunction that a chip | tip and a jig | tool adhere can be avoided.

  In addition, since a groove 113 corresponding to the shape of the ceramic electronic component 50 is formed around the first support portion 111, the chip is positioned in a state where the ceramic electronic component 50 is positioned by the first support portion 111. Can be reliably avoided.

  20 is an exploded plan view showing still another embodiment of the jig according to the present invention, and FIG. 21 is a sectional view taken along line 21-21 of FIG.

  The jig shown in FIGS. 20 and 21 includes a first thin plate member 11, second thin plate members 21 and 22, a third thin plate member 30, and a fourth thin plate member 70. These are composed of titanium or a titanium alloy, or have a structure in which a titanium coating film is attached to the surface of a metal substrate such as stainless steel.

  The fourth thin plate member 70 includes a substrate 700 and a vent hole 701. In the illustrated embodiment, the communication passages 301, 201, 103, and 701 are formed, so that air permeability is improved, heating unevenness is less likely to occur, and time required for debinding is shortened.

  FIG. 22 is an exploded plan view showing still another embodiment of the jig according to the present invention, and FIG. 23 is a sectional view of the jig shown in FIG.

  The jig shown in FIGS. 22 and 23 includes a first thin plate member 11, second thin plate members 21 and 22, and a third thin plate member 30. These are composed of titanium or a titanium alloy, or have a structure in which a titanium coating film is attached to the surface of a metal substrate such as stainless steel. The second thin plate member 21 includes a substrate 210 and a first slit 211. The second thin plate member 22 includes a substrate 220 and a second slit 221.

  The slits 211 and 221 intersect with each other when viewed in the thickness direction, and a cavity 201 is formed at the intersecting portion. The angle at which the slits 211 and 221 intersect is arbitrary, but is preferably orthogonal.

  In the illustrated embodiment, not only the communication passages 301, 201, and 103, but one side of the concave receiving portion 301-a slit 221-a flow path (communication passage) that leads to the other side of the concave receiving portion 301, one of the concave receiving portions 301- Slit 221-Slit 211-Slit 221-A flow path (communication path) that goes out to the other of the recess receiving part 301 and a flow path (communication path) that goes out from one side of the slit 113-slit 211-the other of the groove part 113 are formed. The air permeability is further improved.

  The present invention has been described in detail with reference to the preferred embodiments. However, the present invention is not limited to these embodiments, and various modifications can be made by those skilled in the art based on the basic technical idea and teachings. It is self-evident that

The top view which shows one Example of the jig for ceramic electronic components which concerns on this invention. FIG. 2 is an enlarged plan view of an arrow A portion illustrated in FIG. 1. FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. 2. It is sectional drawing which shows the state which accommodated the ceramic electronic component in the jig for ceramic electronic components shown in FIG. It is a top view which shows another Example of the jig | tool which concerns on this invention. FIG. 6 is an exploded view of the jig shown in FIG. 5. It is the elements on larger scale of the jig | tool shown in FIG. 5, FIG. It is a fragmentary sectional view explaining the use condition of the jig | tool shown in FIGS. It is an exploded top view which shows another one Example of the jig | tool which concerns on this invention. It is sectional drawing of the jig | tool shown in FIG. It is a disassembled top view which shows another Example of the jig | tool which concerns on this invention. It is sectional drawing of the jig | tool shown in FIG. It is a disassembled top view which shows another one Example of the jig | tool which concerns on this invention. It is a top view which shows one Example of the jig | tool which concerns on this invention. FIG. 15 is an exploded plan view of the jig shown in FIG. 14. It is sectional drawing explaining the use condition of the jig | tool shown in FIG. 14, FIG. It is an exploded top view which shows another Example of the jig | tool which concerns on this invention. FIG. 18 is a cross-sectional view taken along line 18-18 in FIG. FIG. 19 is a cross-sectional view taken along line 19-19 of FIG. It is a disassembled top view which shows another Example of the jig | tool which concerns on this invention. It is sectional drawing along the 21-21 line of FIG. It is a disassembled top view which shows another Example of the jig | tool which concerns on this invention. It is sectional drawing of the jig | tool shown in FIG.

Explanation of symbols

502 paint film
2 Base plate 200 Flat plate surface
4 Net body 41, 42 Metal wire 43 Intersection 45 Recessed part

Claims (3)

A jig used to heat-treat ceramic electronic components,
At least the portion that receives the ceramic electronic component is made of a material mainly composed of titanium, or is covered with a film mainly composed of titanium,
Jig.   The jig according to claim 1, wherein the jig has a large number of recessed receiving portions that individually receive the ceramic electronic components. A method of manufacturing a ceramic electronic component including a Cu terminal electrode baking formation step,
Using the jig according to claim 1 or 2, supplying a ceramic electronic component having an unbaked Cu terminal electrode coating film mainly composed of Cu on the surface of the jig,
Next, the jig and the ceramic electronic component are heat-treated, and the Cu terminal electrode coating film is baked.
A method of manufacturing a ceramic electronic component including a process.

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