CN114503230B

CN114503230B - Setter for chip electronic component

Info

Publication number: CN114503230B
Application number: CN202080070079.9A
Authority: CN
Inventors: 田中雄太
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2019-12-03
Filing date: 2020-11-27
Publication date: 2023-09-15
Anticipated expiration: 2040-11-27
Also published as: JP7244808B2; JPWO2021111993A1; WO2021111993A1; CN114503230A; KR20220049586A

Abstract

The invention provides a setter for a chip electronic component, which can cope with elimination of a cause of quality deviation among a plurality of chip electronic components. The setter (11) for sheet-like electronic components is provided with X-direction linear members (X1, X2) each extending in the X direction and Y-direction linear members (Y1, Y2) each extending in the Y direction, and is provided with a plurality of layers (12, 13) each including the X-direction linear members and the Y-direction linear members intersecting with the X-direction linear members and arranged in the Z direction. In the layers (12, 13) located at the ends in the Z direction, openings (15, 16) defined by the X-direction linear members adjacent in the Y direction among the X-direction linear members (X1, X2) and the Y-direction linear members adjacent in the X direction among the Y-direction linear members (Y1, Y2) are set so as not to pass through the sheet-like electronic component (14). For example, the arrangement pitch of the linear members (Y1, Y2) in the Y direction is partially different in the X direction.

Description

Setter for chip electronic component

Technical Field

The present invention relates to a setter (setter) for a chip electronic component for accommodating a plurality of chip electronic components to be processed, and more particularly, to morphological improvement of the setter for a chip electronic component.

Background

As a technique of interest in the present invention, there is a ceramic lattice described in, for example, japanese patent application laid-open No. 2018-193274 (patent document 1). The ceramic lattice body has a plurality of 1 st line portions and a plurality of 2 nd line portions. The 1 st line portion and the 2 nd line portion intersect each other. At any intersection point of the 1 st line portion and the 2 nd line portion, the 2 nd line portion is disposed on the 1 st line portion. Therefore, when the ceramic lattice is regarded as a flat plate, the 1 st line portion is arranged on the 1 st main surface side thereof, and the 2 nd line portion is arranged on the 2 nd main surface side opposite to the 1 st main surface.

The 1 st line portion has a flat shape on the 1 st main surface side and a convex curved surface shape on the 2 nd main surface side of the ceramic lattice body in cross section. On the other hand, the cross section of the 2 nd line portion has a circular or elliptical shape. Therefore, for example, when a ceramic lattice is used as a setter for setting a sheet-like firing target in a process of firing the firing target such as a ceramic electronic component, the ceramic lattice is used in a method of using the 1 st main surface of the ceramic lattice to be upward when firing the firing target requiring flatness, and the ceramic lattice is used in a method of using the 2 nd main surface of the ceramic lattice to be upward when the contact area with the firing target is to be reduced as much as possible (paragraphs 0028 to 0030).

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open publication No. 2018-193274

Disclosure of Invention

Problems to be solved by the invention

As described above, for example, when the ceramic green sheet described in patent document 1 is used as a setter for placing a plurality of chip electronic components in the step of firing the chip electronic components, there is a problem to be improved as follows.

Fig. 6 is a front view of a setter 1 for chip electronic components configured by showing a ceramic grid described in reference to patent document 1. The setter 1 for chip electronic components has a configuration in which two ceramic lattices 4 are stacked, and the ceramic lattices 4 have a plurality of 1 st line portions 2 and a plurality of 2 nd line portions 3.

When a plurality of sheet-like electronic components 5 are mounted on the setter 1 for sheet-like electronic components shown in fig. 6 in a "scattered" state and subjected to a firing step, particularly, when a degreasing step is performed, a gas due to a binder is generated from the sheet-like electronic components 5. The space is opened at the end of the sheet-like electronic component setter 1, so that the gas is easily diffused, but the gas is less likely to be diffused at the center of the sheet-like electronic component setter 1, and thus is more likely to remain.

When a plurality of the chip electronic components 5 are randomly (randomly) placed in the chip electronic component placement machine 1 in a "scattered" state, the aggregate of the chip electronic components 5 is in a form of being high at the center and low at the end of the chip electronic component placement machine 1 as indicated by a dotted line 6, and is in a form of having a gentle slope peak on the left and right when viewed in cross section, for example. Therefore, more sheet-like electronic components 5 are present in the central portion of the sheet-like electronic component setter 1 than in the end portions, and as a result, more gas is generated.

As a result of the above, uneven distribution such as difference in concentration of gas is likely to occur between the center portion and the end portion of the setter 1 for sheet-like electronic components. Such uneven distribution of the gas may cause variation in quality among the plurality of sheet-like electronic components 5.

In addition, as described above, when the aggregate of the sheet-like electronic components 5 on the sheet-like electronic component mounter 1 is in the form shown by the dotted line 6, the heat capacity of the aggregate of the sheet-like electronic components 5 and the sheet-like electronic component mounter 1 added together becomes larger in the central portion of the sheet-like electronic component mounter 1 than in the end portions. Therefore, in the firing step, a temperature rise rate difference and a temperature difference caused by the temperature rise rate difference are caused in the center portion and the end portion of the setter 1 for the chip electronic component. This also causes variations in quality among the plurality of chip electronic components 5.

Accordingly, an object of the present invention is to provide a setter for a chip electronic component capable of coping with elimination of the cause of quality deviation between a plurality of chip electronic components as described above.

Means for solving the problems

In the setter for a chip electronic component according to the present invention, when the X direction and the Y direction are intersecting each other and the Z direction is orthogonal to the X direction and the Y direction, the setter for a chip electronic component includes: a plurality of X-direction linear members each extending in the X-direction; and a plurality of Y-direction linear members each extending in the Y direction, the sheet-like electronic component mounting device having a plurality of layers each including a plurality of X-direction linear members and a plurality of Y-direction linear members intersecting the plurality of X-direction linear members and arranged in the Z direction.

Among the plurality of layers, at least one of the layers located at one end in the Z direction, an opening defined by an X-direction linear member adjacent in the Y direction among the plurality of X-direction linear members and a Y-direction linear member adjacent in the X direction among the plurality of Y-direction linear members is set so as not to pass through the sheet-like electronic component.

In order to solve the above-described technical problems, the present invention is characterized in that the arrangement pitch of at least one of the plurality of X-direction linear members and the plurality of Y-direction linear members is partially different in at least one of the X-direction, Y-direction, and Z-direction.

The sheet-like electronic component handled by the setter for a sheet-like electronic component according to the present invention is not limited to a completed sheet-like electronic component, and includes, for example, a sheet-like electronic component as a semi-finished product in the middle of manufacturing such as an unfired sheet-like electronic component as a fired object.

Effects of the invention

According to the present invention, in the setter for a sheet-like electronic component, a configuration is allowed in which the arrangement pitch of at least one of the plurality of X-direction linear members and the plurality of Y-direction linear members is partially different in at least one of the X-direction, Y-direction, and Z-direction.

Accordingly, the air permeability through the sheet-like electronic component mounting device or the heat capacity of each portion of the sheet-like electronic component mounting device can be adjusted by the size of the arrangement pitch.

More specifically, in order to cope with uneven distribution of the gas, it is sufficient to increase the arrangement pitch of at least one of the X-direction linear members and the Y-direction linear members at the portion where more gas is retained or generated, so that more excellent ventilation can be obtained. In order to reduce the difference in heat capacity, it is sufficient to increase the arrangement pitch of at least one of the X-direction linear members and the Y-direction linear members at the portion having a larger heat capacity so as to reduce the heat capacity of the sheet-like electronic component mounting device itself.

Drawings

Fig. 1 is a front view of a setter 11 for a chip electronic component according to embodiment 1 of the present invention, showing a chip electronic component 14 as well.

Fig. 2 is a right side view of the setter 11 for chip electronic components shown in fig. 1, together with the chip electronic components 14.

Fig. 3 is a plan view of the setter 11 for chip electronic components shown in fig. 1, showing a state in which the chip electronic components are removed.

Fig. 4 is a bottom view of the setter 11 for chip electronic components shown in fig. 1, shown with the chip electronic components removed.

Fig. 5 is a front view of a setter 21 for a chip electronic component according to embodiment 2 of the present invention, showing the chip electronic component 14 as well.

Fig. 6 is a front view of the setter 1 for chip electronic components configured with reference to the ceramic grid body described in patent document 1, and shows the chip electronic components 5.

Detailed Description

The structure of a setter 11 for a chip electronic component according to embodiment 1 of the present invention will be described with reference to fig. 1 to 4. In the explanation, the X direction, the Y direction, and the Z direction are defined as illustrated in fig. 1 to 4. The X direction and the Y direction are intersected with each other, and the Z direction is orthogonal to the X direction and the Y direction. In addition, the X direction and the Y direction are preferably orthogonal to each other.

The setter 11 for a chip electronic component has a 1 st layer 12 including a plurality of X-direction linear members X1 and a plurality of Y-direction linear members Y1, the plurality of X-direction linear members X1 are arranged at intervals on a surface orthogonal to the Z direction, the plurality of Y-direction linear members Y1 are arranged at intervals on a surface orthogonal to the Z direction, and the plurality of Y-direction linear members Y1 intersect the plurality of X-direction linear members X1 and are joined to the plurality of X-direction linear members X1 in this state. The setter 11 for a chip electronic component has a 2 nd layer 13 including a plurality of X-direction linear members X2 and a plurality of Y-direction linear members Y2 intersecting with the same. The 1 st layer 12 and the 2 nd layer 13 are arranged in the Z direction and bonded to each other.

In this embodiment, the plurality of Y-direction linear members Y1 and the plurality of X-direction linear members X2 are joined at positions where they intersect with each other. As a modification thereof, other members such as a joint member, not shown, may be disposed between the X-direction linear member X2 and the Y-direction linear member Y1 at positions where the plurality of X-direction linear members X2 and the plurality of Y-direction linear members Y1 are joined to each other and intersect with each other. Further, there may be a non-joined crossing position without joining the X-direction linear member X2 and the Y-direction linear member Y1 to each other at all crossing positions.

Here, the distance between adjacent ones of the plurality of linear members in each of the 1 st layer 11 and the 2 nd layer 12 is selected to be, for example, in the range of 0.1mm to 5.0mm, the distance between each of the X-direction linear members X1 and X2 and each of the Y-direction linear members Y1 and Y2. As will be described later, the "arrangement pitch of the linear members" is defined by the distance between the centers of the adjacent linear members, and thus a value obtained by adding the wire diameters of the linear members to the distance between the adjacent linear members becomes the arrangement pitch.

In the present specification, when referring to the "center portion" and the "end portion" of the setter 11 for the sheet-like electronic component, the target ranges of these "center portion" and "end portion" are the "range in which the sheet-like electronic component can be substantially placed" defined by the X-direction linear member and the Y-direction linear member, and even if there is a "member in which the sheet-like electronic component cannot be substantially placed" such as a frame or a handle "or a" member in which the sheet-like electronic component is not supposed to be placed "outside the range, they are not included in the target ranges of the" center portion "and the" end portion ". When the target range is observed in any direction perpendicular to the Z direction, the range in the center of the target range divided by 3 is referred to as a "center portion", and the range not in the center is referred to as an "end portion".

The X-direction linear members X1 and X2 and the Y-direction linear members Y1 and Y2 may include, for example, ceramics such as SiC, zirconia, yttria-stabilized zirconia, alumina, mullite, or the like, metals such as nickel, aluminum, nichrome (registered trademark), or stainless steel, polytetrafluoroethylene, polypropylene, acrylic resin, ABS (Acrylonitrile butadiene styrene), acrylonitrile-butadiene-styrene), resin materials such as other heat-resistant resins, carbon, or composite materials composed of metals and ceramics.

The diameters of the X-direction linear members X1 and X2 and the Y-direction linear members Y1 and Y2 are, for example, 0.1mm to 2.0 mm. The wire diameters of the wire members may be the same as or different from each other, but in this embodiment, they are the same as each other.

In this embodiment, the X-direction linear members X1 and X2 and the Y-direction linear members Y1 and Y2 include ceramics. Therefore, the joining of the X-direction linear members X1 and X2 and the Y-direction linear members Y1 and Y2 to each other is preferably achieved by sintering.

The surfaces of the X-direction linear members X1 and X2 and the Y-direction linear members Y1 and Y2 may be further coated with a ceramic such as SiC, zirconia, yttria-stabilized zirconia, alumina, mullite, or a metal such as nickel.

In fig. 1 to 4, the sheet-like electronic component setter 11 is illustrated in a simplified manner as compared with an actual sheet-like electronic component setter, and for example, the number of X-direction linear members X1 and X2 and the number of Y-direction linear members Y1 and Y2 are smaller than the actual number, and the lengths of the respective linear members are also illustrated as being shorter than the illustrated size of the sheet-like electronic component 14. The same applies to fig. 5 described later.

The layers located at both ends in the Z direction among the plurality of layers 12 and 13, that is, the 1 st layer 12 and the 2 nd layer 13 in this embodiment, are configured as follows. In the 1 st layer 12, the 1 st opening 15 defined by the X-direction linear member X1 adjacent in the Y-direction among the plurality of X-direction linear members X1 and the Y-direction linear member Y1 adjacent in the X-direction among the plurality of Y-direction linear members Y1 is set so as not to pass through the sheet-like electronic component 14. In the 2 nd layer 13, the 2 nd opening 16 defined by the X-direction linear member X2 adjacent in the Y-direction among the plurality of X-direction linear members X2 and the Y-direction linear member Y2 adjacent in the X-direction among the plurality of Y-direction linear members Y2 is set so as not to pass through the sheet-like electronic component 14.

In this embodiment, as shown in fig. 2 and 3, the interval between adjacent X-direction linear members X1 among the X-direction linear members X1 defining the 1 st opening 15 in the 1 st layer 12 is set to prohibit the passage of the sheet-like electronic component 14. As shown in fig. 2 and 4, the interval between adjacent X-direction linear members X2 among the X-direction linear members X2 defining the 2 nd opening 16 in the 2 nd layer 13 is set to prohibit the passage of the sheet-like electronic component 14. In this way, the action of prohibiting the passage of the sheet-like electronic component 14 is borne by the X-direction linear members X1 and X2.

In this embodiment, the arrangement pitch of each of the X-direction linear members X1 and X2 is fixed throughout the entire setter 11 for the sheet-like electronic component, but the arrangement pitch may be made different within a range in which passage of the sheet-like electronic component 14 can be inhibited.

On the other hand, the Y-direction linear members Y1 and Y2 have functions of adjusting air permeability or increasing or decreasing heat capacity by making the arrangement pitches of the respective linear members in the directions orthogonal to the Y-direction and the Z-direction different. More specifically, the arrangement pitch of the Y-direction linear members Y1 and Y2 is set to be larger at the center portion and smaller at the end portions of the sheet-like electronic component setter 11.

The term "arrangement pitch of the linear members" as used herein is defined by the distance between the centers of adjacent linear members, and the term "to make the arrangement pitch different" means to make the maximum value of the arrangement pitch of the linear members in the same direction in a single layer be 120% or more of the minimum value. For example, the maximum value of the arrangement pitch of the Y-direction linear members Y1 is set to 120% or more of the minimum value.

Further, the term "the arrangement pitch of the central portion is wider than the arrangement pitch of the end portions" means that the maximum value of the arrangement pitch of the central portion is 120% or more of the minimum value of the arrangement pitch of the end portions.

In this way, a more excellent air permeability can be obtained in the central portion of the sheet-like electronic component setter 11. For example, in a setter for a sheet-like electronic component, the maximum value of the arrangement pitch of the central portion is set to 120% of the minimum value of the arrangement pitch of the end portions, and the air permeability is evaluated, and as a result, the air permeability of the central portion becomes 160% of the air permeability of the end portions. As a result, the gas that is more retained or generated in the central portion of the sheet-like electronic component setter 11 can be rapidly diffused. Therefore, the concentration of the gas can be made uniform at the center and the end portions of the sheet-like electronic component setter 11, and variation in quality among the plurality of sheet-like electronic components 14 can be made less likely to occur.

The heat capacity of the sheet-like electronic component setter 11 itself is set to be larger at the end portions and smaller at the center portion. On the other hand, when a plurality of sheet-like electronic components 14 are randomly (randomly) placed on the sheet-like electronic component placement machine 11 in a "scattered" state, the heat capacity provided by the sheet-like electronic components 14 themselves is larger at the center than at the end portions of the sheet-like electronic component placement machine 1. Therefore, the distribution state of the heat capacity of the sheet-like electronic component setter 11 itself serves to make the distribution state of the heat capacity provided by the sheet-like electronic component 14 itself more uniform. As a result, for example, in the firing step, the temperature rise rate difference and the temperature difference caused by the temperature rise rate difference can be reduced at the center and the end portions of the setter 11 for the chip electronic components, and thus, variation in quality among the plurality of chip electronic components 14 can be made less likely to occur.

In the embodiment described above, the sheet-like electronic component 14 is not passed through the 1 st layer 12 and the 2 nd layer 13, which are the layers located at both ends in the Z direction, among the plurality of layers, i.e., the 1 st layer 12 and the 2 nd layer 13. Therefore, the sheet-like electronic component setter 11 can use either one of the principal surfaces thereof as a surface on which the sheet-like electronic component 14 is mounted.

If such an advantage is not desired, it is also possible to let the chip electronic component 14 pass through only either of the 1 st layer 12 and the 2 nd layer 13.

In the above embodiment, the X direction in which the X-direction linear members X1 and X2 extend and the Y direction in which the Y-direction linear members Y1 and Y2 extend are relatively determined, and therefore the X-direction linear members X1 and X2 and the Y-direction linear members Y1 and Y2 may be exchanged.

In the above embodiment, the X-direction linear members X1 constituting the 1 st layer 12 and the X-direction linear members X2 constituting the 2 nd layer 13 are arranged at the same arrangement pitch, but may be arranged at different arrangement pitches. The Y-direction linear members Y1 and Y-direction linear members Y2 constituting the 1 st layer 12 and the 2 nd layer 13 are arranged at the same arrangement pitch, but may be arranged at different arrangement pitches.

In the above-described embodiment, the X-direction linear members X1 and X2 serve the 1 st function of prohibiting the passage of the sheet-like electronic component 14, and the Y-direction linear members Y1 and Y2 serve the 2 nd function of adjusting the ventilation property or increasing or decreasing the heat capacity, but the 1 st function may be provided by both the X-direction linear members and the Y-direction linear members, or the 2 nd function may be provided by both the X-direction linear members and the Y-direction linear members.

Next, a setter 21 for a chip electronic component according to embodiment 2 of the present invention will be described with reference to fig. 5. The setter 21 for chip electronic components shown in fig. 5 is different from the aforementioned setter 11 for chip electronic components in that the number of layers arranged in the Z direction is first increased. The description of the sheet-like electronic component setter 21 is the same as that of the sheet-like electronic component setter 11 described above unless otherwise specified.

The setter 21 for a chip electronic component includes a plurality of X-direction linear members X11 to X14 extending in the X-direction and a plurality of Y-direction linear members Y11 to Y14 extending in the Y-direction. The setter 11 for a chip electronic component has a 1 st layer 22 including a plurality of X-direction linear members X11 and a plurality of Y-direction linear members Y11 intersecting therewith, a 2 nd layer 23 including a plurality of X-direction linear members X12 and a plurality of Y-direction linear members Y12 intersecting therewith, a 3 rd layer 24 including a plurality of X-direction linear members X13 and a plurality of Y-direction linear members Y13 intersecting therewith, and a 4 th layer 25 including a plurality of X-direction linear members X14 and a plurality of Y-direction linear members Y14 intersecting therewith.

In this way, the sheet-like electronic component setter 21 secures a thickness equal to or greater than a predetermined thickness than the sheet-like electronic component setter 11, and improves the mechanical strength of the sheet-like electronic component setter 21 itself, so that deformation is less likely to occur.

In the sheet-like electronic component setter 21, the layers located at both ends in the Z direction, that is, the 1 st layer 22 and the 4 th layer 25, out of the plurality of layers 22 to 25, are configured as follows, as in the case of the sheet-like electronic component setter 11. In the 1 st layer 22, the 1 st opening 26 defined by the X-direction linear member X11 adjacent in the Y-direction among the plurality of X-direction linear members X11 and the Y-direction linear member Y11 adjacent in the X-direction among the plurality of Y-direction linear members Y11 is set so as not to pass through the sheet-like electronic component 14. In the 4 th layer 25, the 2 nd opening 27 defined by the X-direction linear member X14 adjacent in the Y-direction among the plurality of X-direction linear members X14 and the Y-direction linear member Y14 adjacent in the X-direction among the plurality of Y-direction linear members Y14 is set so as not to pass through the sheet-like electronic component 14.

In this embodiment, the interval between adjacent X-direction linear members X11 among the X-direction linear members X11 defining the 1 st opening 26 in the 1 st layer 22 is set to prohibit the passage of the sheet-like electronic component 14. Further, the interval between adjacent Y-direction linear members Y14 among the Y-direction linear members Y14 defining the 2 nd opening 27 in the 4 th layer 25 is set to prohibit the passage of the sheet-like electronic component 14. In addition, regarding the function of prohibiting the passage of the sheet-like electronic component 14, the 1 st layer 22 may be supported by the Y-direction linear member Y11 in addition to the X-direction linear member X11, or may be supported by the Y-direction linear member Y11 instead of the X-direction linear member X11, and the 4 th layer 25 may be supported by the X-direction linear member X14 in addition to the Y-direction linear member Y14, or may be supported by the X-direction linear member X14 instead of the Y-direction linear member Y14.

In this way, the sheet-like electronic component setter 21 can use either one of the principal surfaces as a surface on which the sheet-like electronic component 14 is mounted, but if such an advantage is not desired, the sheet-like electronic component 14 may not pass through only either one of the 1 st layer 22 and the 4 th layer 25.

Focusing on the arrangement pitch of the Y-direction linear members Y11 to 14 shown in fig. 5, the arrangement pitch is partially different in the Z-direction. More specifically, the arrangement pitch of the Y-direction linear members Y12 and Y13 in the direction orthogonal to the Y-direction and Z-direction is larger than the arrangement pitch of the Y-direction linear members Y11 and Y14, and there are a portion where 4Y-direction linear members Y11 to Y14 are arranged and a portion where only two Y-direction linear members Y11 and Y14 are arranged when viewed in the Z-direction.

Here, when the layers other than the layers located at both ends in the Z direction, that is, the 2 nd layer 23 and the 3 rd layer 24, out of the plurality of layers 22 to 25 are taken out for consideration, there are openings defined by the X-direction linear members adjacent in the Y direction among the plurality of X-direction linear members and the Y-direction linear members adjacent in the X direction among the plurality of Y-direction linear members. These openings do not have to communicate in a constant shape to the layers located at both ends in the Z direction, in particular, to the surface on which the chip electronic component 14 is mounted, and thus may be provided so as not to prohibit the passage of the chip electronic component 14.

The sheet-like electronic component setter 21 has 4 layers 22 to 25 and has a larger thickness than the sheet-like electronic component setter 11 described above, but by providing a portion in which only two Y-direction linear members Y11 and Y14 are arranged in the Z-direction, good air permeability can be ensured in the sheet-like electronic component setter 21. This also contributes to reducing the heat capacity of the setter 21 for sheet-like electronic components. Further, by providing the portions where the 4Y-direction linear members Y11 to Y14 are arranged in the Z-direction, the mechanical strength is improved in the setter 21 for sheet-like electronic components, and unwanted deformation is less likely to occur.

Although not shown in fig. 5, the arrangement pitch of the X-direction linear members X11 to X14 may be partially different in the Z-direction.

As described above, the present invention is provided with a characteristic structure in which the arrangement pitch of at least one of the X-direction linear members X11 to X14 and the Y-direction linear members Y11 to 14 in the Z-direction is partially different, and the arrangement pitch of at least one of the plurality of X-direction linear members X11 to X14 and the plurality of Y-direction linear members Y11 to Y14 may be partially different in a direction orthogonal to the direction of the linear members and the Z-direction, as required.

In particular, the arrangement pitch of at least one of the plurality of X-direction linear members and the plurality of Y-direction linear members constituting the central portion of the layers other than the layers located at both ends in the Z-direction, that is, at least one of the 2 nd layer 23 and the 3 rd layer 24, is wider than the arrangement pitch of at least one of the plurality of X-direction linear members and the plurality of Y-direction linear members at the end portions, so that better air permeability can be obtained at the central portion of the sheet-like electronic component setter 12 than at the end portions, and the heat capacity can be set to be larger at the end portions and smaller at the central portion.

As a modification of the setter 21 for chip electronic components shown in fig. 5, for example, the Y-direction linear member Y14 constituting the 4 th layer 25 may be omitted. In this case, the X-direction linear member X14 and the Y-direction linear member Y13 constitute the lowermost layer corresponding to the 4 th layer 25. Therefore, the 3 rd layer 24 is constituted only by the X-direction linear members 13, and there is a layer which is not constituted by both the X-direction linear members and the Y-direction linear members intersecting with the X-direction linear members.

The present invention has been described above in connection with the illustrated embodiment, but various modifications are possible within the scope of the present invention.

The number of the X-direction linear members and the Y-direction linear members arranged in the X-direction and the Y-direction can be arbitrarily changed according to the mounting area for the chip electronic components required in the setter for chip electronic components. The number of the linear members in the X direction and the linear members in the Y direction arranged in the Z direction can be arbitrarily changed according to the mechanical strength required in the setter for the sheet-like electronic component.

Although the cross-sectional shapes of the X-direction linear member and the Y-direction linear member are shown as circles, they may be elliptical, semicircular, triangular, quadrangular, or other polygons.

The setter for a chip electronic component according to the present invention can be used in a plating process, a cleaning process, a drying process, and the like, in addition to a firing process for manufacturing a chip electronic component.

When used in at least one of the plating step and the cleaning step, liquid permeability is required for the setter for the sheet-like electronic component. Therefore, in this case, the term "air permeability" used in the above description will be replaced with "liquid permeability".

The embodiments described in the present specification are illustrative, and partial replacement or combination of structures can be performed between different embodiments.

Description of the reference numerals

X1, X2, X11 to X14: an X-direction linear member;

y1, Y2, Y11 to Y14: a Y-direction linear member;

11. 21: a setter for a sheet-like electronic component;

12. 13, 22, 23, 24, 25: a layer;

14: a sheet-like electronic component;

15. 16, 26, 27: an opening.

Claims

1. A setter for a sheet-like electronic component, wherein,

when the X direction and the Y direction are mutually crossed and the Z direction is orthogonal to the X direction and the Y direction,

the setter for a sheet-like electronic component includes:

a plurality of X-direction linear members each extending in the X-direction; and

a plurality of Y-direction linear members each extending in the Y direction,

the setter for a sheet-like electronic component includes:

a plurality of layers each including a plurality of the X-direction linear members and a plurality of the Y-direction linear members intersecting the X-direction linear members and arranged in the Z-direction,

in the layers located at least one end in the Z direction, openings defined by the X-direction linear members adjacent in the Y direction among the X-direction linear members and the Y-direction linear members adjacent in the X direction among the Y-direction linear members are set so as not to pass through the sheet-like electronic component,

the arrangement pitch of at least one of the plurality of X-direction linear members and the plurality of Y-direction linear members is partially different in at least one of the X-direction, Y-direction, and Z-direction.

2. The setter for a sheet-like electronic component according to claim 1, wherein,

among the plurality of layers, among the layers located at both ends in the Z direction, an opening defined by the X-direction linear member adjacent in the Y direction among the plurality of X-direction linear members and the Y-direction linear member adjacent in the X direction among the plurality of Y-direction linear members is set so as not to pass through a sheet-like electronic component.

3. The setter for a sheet-like electronic component according to claim 2, wherein,

among the plurality of layers, the arrangement pitch of at least one of the plurality of X-direction linear members and the plurality of Y-direction linear members is wider than the arrangement pitch of at least one of the plurality of X-direction linear members and the plurality of Y-direction linear members in the layers located at both ends in the Z-direction.

4. The setter for a sheet-like electronic component according to claim 1, wherein,

at least one of the plurality of X-direction linear members and the plurality of Y-direction linear members in the central portion of the main surface formed by the setter for the chip electronic component is arranged at a wider pitch than at least one of the plurality of X-direction linear members and the plurality of Y-direction linear members in the end portion of the main surface.

5. The setter for a chip electronic component according to any one of claim 1 to 4, wherein,

the X direction and the Y direction are orthogonal to each other.

6. The setter for a chip electronic component according to any one of claims 1 to 5, wherein,

the X-direction linear member and the Y-direction linear member include ceramic.

7. The setter for a chip electronic component according to any one of claims 1 to 6, wherein,

the X-direction linear member and the Y-direction linear member are circular in cross section.