CN114502325B - Clamp for sheet-like electronic component - Google Patents
Clamp for sheet-like electronic component Download PDFInfo
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- CN114502325B CN114502325B CN202080070177.2A CN202080070177A CN114502325B CN 114502325 B CN114502325 B CN 114502325B CN 202080070177 A CN202080070177 A CN 202080070177A CN 114502325 B CN114502325 B CN 114502325B
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- Prior art keywords
- linear members
- electronic component
- direction linear
- sheet
- adjacent
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- 238000009423 ventilation Methods 0.000 claims abstract description 58
- 239000000919 ceramic Substances 0.000 claims description 5
- 230000000630 rising effect Effects 0.000 claims description 2
- 238000013022 venting Methods 0.000 claims 2
- 230000035699 permeability Effects 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000003252 repetitive effect Effects 0.000 description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910003465 moissanite Inorganic materials 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a clamp for a sheet-shaped electronic component, which has good air permeability and can ensure the air permeability even if being stacked into a plurality of layers. The X-direction linear members (X1-X5) extending in the X direction and the Y-direction linear members (Y1-Y6) extending in the Y direction are provided, and a plurality of sheet accommodating sections (13) are formed by the X-direction linear members and the Y-direction linear members. The sheet housing portion (13) has a1 st opening (16) for housing the sheet-like electronic component (12). A ventilation trap (17) having a2 nd opening (18) in which a chip electronic component (12) cannot be accommodated is provided between adjacent ones of the chip accommodating sections (13). The ventilation trap (17) has ventilation properties with respect to the sheet accommodating section (13).
Description
Technical Field
The present invention relates to a clip for a sheet-like electronic component having a plurality of sheet-receiving portions each receiving and holding one sheet-like electronic component, and more particularly, to an improvement in the form of the clip for a sheet-like electronic component.
Background
A clip for a chip electronic component, which is of interest in the present invention, is described in, for example, japanese patent application laid-open No. 2008-177188 (patent document 1). The clip for a sheet-like electronic component described in patent document 1 is a clip for processing a sheet-like electronic component, and includes a support member and a carrier member. The support member comprises a metallic material. The support member is planar as a whole, and has a plurality of through-hole pieces inserted into the surface thereof. The bearing member is a net body woven by metal warp yarns and metal weft yarns. The carrier member is engaged with one surface of the support member such that at least one intersection is present in the opening surface of the sheet insertion hole.
When the above-described clip for a chip electronic component is used and a plurality of chip electronic components are processed by a reactive gas, one chip electronic component is inserted into each of a plurality of chip insertion holes formed in the clip for a chip electronic component. The carrier member of the clip for a chip electronic component is formed of a mesh body, and thus has air permeability. Therefore, in the processing step, the reaction gas can flow into the periphery of the sheet-like electronic component.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2008-177188
Disclosure of Invention
Problems to be solved by the invention
However, in the processing step, a plurality of sheet-like electronic component jigs may be stacked in a plurality of layers and used. In this case, the air permeability with respect to the sheet insertion hole accommodating the sheet-like electronic component is deteriorated. Accordingly, improvement of ventilation is desired for further improvement.
Accordingly, an object of the present invention is to provide a clip for a sheet-like electronic component, which can further improve air permeability.
Means for solving the problems
In the clip for a chip electronic component according to the present invention, when the X direction and the Y direction are mutually intersecting and the Z direction is a direction orthogonal to the X direction and the Y direction, the clip for a chip electronic component includes a plurality of X-direction linear members each extending in the X direction and a plurality of Y-direction linear members each extending in the Y direction. The plurality of X-direction linear members and the plurality of Y-direction linear members form a plurality of sheet accommodating portions for accommodating one sheet-like electronic component each, and are arranged in both the X-direction and the Y-direction.
Each of the sheet accommodating portions has a bottom wall portion for carrying the sheet-like electronic component and a side wall portion standing in the Z direction from the bottom wall portion, and the side wall portion has a1 st opening formed on the opposite side to the bottom wall portion for accommodating the sheet-like electronic component in the sheet accommodating portion.
The 1 st opening has a quadrangular shape defined by an X-direction linear member adjacent in the Y-direction among the plurality of X-direction linear members and a Y-direction linear member adjacent in the X-direction among the plurality of Y-direction linear members.
The side wall portion is formed of a plurality of X-direction linear members arranged in the Z-direction and a plurality of Y-direction linear members arranged in the Z-direction.
The bottom wall portion is formed of at least one of an X-direction linear member and a Y-direction linear member that traverse a space in the side wall portion.
In order to solve the above-described technical problem, a clip for a chip electronic component having such a structure is characterized in that a vent well (pocket) having a2 nd opening that is not capable of accommodating a chip electronic component is provided between adjacent ones of the chip accommodating portions.
The sheet-like electronic component processed by the jig for a sheet-like electronic component according to the present invention is not limited to a completed sheet-like electronic component, and includes, for example, a sheet-like electronic component as a semi-finished product in the middle of manufacturing such as an unfired sheet-like electronic component as a fired object.
Effects of the invention
According to the present invention, in the clip for a sheet-like electronic component, since the ventilation trap is provided in addition to the sheet accommodating portion, a space through which gas can pass through the ventilation trap is larger. Therefore, even when a plurality of the sheet-like electronic component jigs are stacked in a plurality of layers and used in the processing step, good air permeability can be ensured throughout all of the plurality of the sheet-like electronic component jigs. As a result, many sheet-like electronic components can be uniformly processed at once.
Further, the 2 nd opening in the ventilation trap cannot accommodate the chip-like electronic component, and thus erroneous insertion of the chip-like electronic component into the ventilation trap can be prevented.
Drawings
Fig. 1 is a plan view schematically showing a clip 11 for a chip electronic component according to embodiment 1 of the present invention.
Fig. 2 is a front view of a part of the clip 11 for a chip electronic component shown in fig. 1, which is enlarged, and shows the chip electronic component 12 housed therein.
Fig. 3 is a plan view of a part of the clip 11 for a chip electronic component shown in fig. 1, showing the chip electronic component 12 accommodated therein in dotted lines.
Fig. 4 is a diagram corresponding to fig. 2, showing a sheet-like electronic component holder 11H as a comparative example of the sheet-like electronic component holder 11 shown in fig. 2.
Fig. 5 is a front view schematically showing a state in which the sheet-like electronic component jigs 11 shown in fig. 1 to 3 are stacked in multiple layers.
Fig. 6 is a view corresponding to fig. 2 showing a clip 11a for a chip electronic component according to embodiment 2 of the present invention.
Fig. 7 is a view corresponding to fig. 2 showing a clip 11b for a chip electronic component according to embodiment 3 of the present invention.
Fig. 8 is a view corresponding to fig. 1 showing a clip 11c for a chip electronic component according to embodiment 4 of the present invention.
Detailed Description
The basic structure of the clip 11 for a chip electronic component will be described with reference to fig. 1 to 3. In the explanation, the X direction, the Y direction, and the Z direction are defined as illustrated in fig. 1 to 3. The X direction and the Y direction are intersected with each other, and the Z direction is orthogonal to the X direction and the Y direction. In addition, the X direction and the Y direction are preferably orthogonal to each other.
The clip 11 for a chip electronic component includes a plurality of X-direction linear members X1, and the plurality of X-direction linear members X1 are arranged so as to form layers parallel to the X-direction and the Y-direction, are spaced apart from each other, and extend in the X-direction. The clip 11 for a sheet-like electronic component includes a plurality of X-direction linear members X2, a plurality of X-direction linear members X3, a plurality of X-direction linear members X4, and a plurality of X-direction linear members X5, which are arranged in the same manner as in the case of the X-direction linear member X1.
The sheet-like electronic component holder 11 further includes a plurality of Y-direction linear members Y1, and the plurality of Y-direction linear members Y1 are arranged so as to form layers parallel to the X-direction and the Y-direction, are spaced apart from each other, and extend in the Y-direction. The clip 11 for a chip electronic component includes a plurality of Y-direction linear members Y2, a plurality of Y-direction linear members Y3, a plurality of Y-direction linear members Y4, a plurality of Y-direction linear members Y5, and a plurality of Y-direction linear members Y6, which are arranged in the same manner as in the case of the Y-direction linear members Y1.
Regarding each of the linear members X1 to X5 and each of the linear members Y1 to Y6, the interval between adjacent linear members, for example, the interval between adjacent X-direction linear members X1 among the X-direction linear members X1 is selected in the range of 0.1mm to 5.0mm, for example.
As shown in fig. 2, the plurality of X-direction linear members X1, the plurality of X-direction linear members X2, the plurality of X-direction linear members X3, the plurality of X-direction linear members X4, and the plurality of X-direction linear members X5 are arranged to constitute mutually different layers. As shown in fig. 2, the plurality of Y-direction linear members Y1, the plurality of Y-direction linear members Y2, the plurality of Y-direction linear members Y3, the plurality of Y-direction linear members Y4, the plurality of Y-direction linear members Y5, and the plurality of Y-direction linear members Y6 are arranged to constitute mutually different layers. The plurality of X-direction linear members X1 to X5 and the plurality of Y-direction linear members Y1 to Y6 are alternately arranged in the Z direction.
In order to accommodate one sheet-like electronic component 12 illustrated in fig. 2, the plurality of sheet accommodating portions 13 are constituted by the plurality of X-direction linear members X1 to X5 and the plurality of Y-direction linear members Y1 to Y6 described above. As shown in fig. 1, the plurality of sheet accommodating portions 13 are arranged in both the X direction and the Y direction.
In this embodiment, as shown in fig. 2 for the Y-direction linear members Y1 to Y6, the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 have a bar shape with a circular cross section. Accordingly, the contact area between the sheet-like electronic component 12 in the sheet accommodating portion 13 and the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y5 can be reduced, and the gas can be smoothly circulated around the sheet-like electronic component 12.
Although the linear members X1 to X5 and Y1 to Y6 are illustrated as bar members having circular cross sections, the cross sections are not limited to circular, and may have, for example, rectangular, elliptical, oblong, semicircular, or polygonal cross sections other than rectangular. The forms of the plurality of linear members X1 to X5 and Y1 to Y6 may be the same or different from each other.
The sheet housing portions 13 each have a bottom wall portion 14 for carrying the sheet-like electronic component 12 and a side wall portion 15 rising in the Z direction from the bottom wall portion 14, and the side wall portion 15 has a1 st opening 16 formed on the opposite side to the bottom wall portion 14 for housing the sheet-like electronic component 12 in the sheet housing portion 13.
As shown in fig. 3, the 1 st opening 16 has a quadrangular shape defined by the X-direction linear member X1 adjacent in the Y-direction among the plurality of X-direction linear members X1 and the Y-direction linear member Y1 adjacent in the X-direction among the plurality of Y-direction linear members Y1. In this embodiment, the 1 st opening 16 has a square shape.
The size of the 1 st opening 16 is selected to accommodate one chip electronic component 12 each. More specifically, the 1 st opening 16 is sized to accommodate a specific end face of the chip electronic component 12 but not an end face other than the end face, and is sized not to accommodate two end faces of the chip electronic component 12.
As shown in fig. 2, the side wall portion 15 is formed of a plurality of X-direction linear members X1 to X4 arranged in the Z direction and a plurality of Y-direction linear members Y1 to Y5 arranged in the Z direction.
As seen through the 1 st opening 16 in fig. 3, the bottom wall portion 14 is formed by the X-direction linear member X5 of the lowermost X-direction linear member X5 crossing the space in the side wall portion 15 and the Y-direction linear member Y6 of the lowermost Y-direction linear member Y6 crossing the space in the side wall portion 15. Either one of the X-direction linear member X5 crossing the space in the side wall portion 15 and the Y-direction linear member Y6 crossing the space in the side wall portion 15 may be omitted. Thus, the through hole provided in the bottom wall portion 14 has at least one of a size, a shape, and an arrangement that prohibits the passage of the sheet-like electronic component 12 accommodated in the sheet accommodation portion 13.
The bottom wall 14 may be formed of a free-shaped member instead of the X-direction linear member X5 and the Y-direction linear member Y6 within a range that does not inhibit air permeability. For example, the bottom wall portion 14 may be constituted by a plurality of parallel linear members arranged along a surface parallel to the X-direction and the Y-direction, extending in a direction different from the X-direction and the Y-direction, and spaced apart from each other. Alternatively, the bottom wall portion 14 may be formed of a plate-like member having a plurality of through holes formed therein. However, among them, the through hole provided in the bottom wall portion 14 is also required to have at least one of a size, a shape, and a configuration that prohibits the passage of the chip electronic component 12 accommodated in the chip accommodating portion 13.
The X-direction linear members X1 to X5 and Y-direction linear members Y1 to Y6 may include, for example, ceramics such as SiC, zirconia, yttria-stabilized zirconia, alumina, mullite, metals such as nickel, aluminum, nichrome (registered trademark), stainless steel, resin materials such as polytetrafluoroethylene, polypropylene, acrylic resin, ABS (Acrylonitrile butadiene styrene, acrylonitrile-butadiene-styrene) resin, or other heat-resistant resins, carbon, or composite materials composed of metals and ceramics.
The diameters of the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 are, for example, 0.1mm to 2.0 mm. In this embodiment, the wire diameters of the wire members X1 to X5 and Y1 to Y6 are the same as each other, but may be different from each other.
In this embodiment, the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 include ceramics. Therefore, the joining of the linear members that are in contact with each other of the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 is preferably achieved by sintering.
The surfaces of the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 may be further coated with a ceramic such as SiC, zirconia, yttria-stabilized zirconia, alumina, mullite, or a metal such as nickel.
The clip 11 for a chip electronic component having the basic structure described above has the following characteristic structure.
At least one ventilation trap 17 is provided between adjacent ones 13 of the sheet accommodating portions 13. The ventilation trap 17 includes a 2 nd opening 18, and the 2 nd opening 18 has at least one of a size and a shape that cannot accommodate the chip-shaped electronic component 12.
In this embodiment, the ventilation trap 17 is provided between adjacent ones 13 in the X direction among the sheet accommodating portions 13. Preferably, as shown in fig. 1, the ventilation trap 17 is provided between adjacent sheet accommodating parts 13 in the X direction among all the sheet accommodating parts 13.
According to the above configuration, the sheet housing portion 13 and the ventilation trap 17 are partitioned by the Y-direction linear members Y1 to Y6, and any one of the X-direction linear members X1 to X5 is interposed between adjacent ones of the Y-direction linear members Y1 to Y6, thereby forming a space. Therefore, the ventilation trap 17 has ventilation with respect to the sheet accommodating portion 13.
As shown in fig. 3, the 2 nd opening 18 has a quadrangular shape defined by the X-direction linear member X1 adjacent in the Y-direction among the plurality of X-direction linear members X1 and the Y-direction linear member Y1 adjacent in the X-direction among the plurality of Y-direction linear members Y1. In this embodiment, the interval S1 (see fig. 2 and 3) between the Y-direction linear members Y1 adjacent in the X-direction among the Y-direction linear members Y1 defining the 2 nd opening 18 is selected to be a size that prohibits the passage of the sheet-like electronic component 12. More specifically, in this embodiment, the arrangement pitch P2 of the Y-direction linear members Y1 adjacent in the X-direction among the Y-direction linear members Y1 defining the 2 nd opening 18 is set to be shorter than the arrangement pitch P1 of the Y-direction linear members Y1 adjacent in the X-direction among the Y-direction linear members Y1 defining the 1 st opening 16. Thus, the 2 nd opening 18 has a structure having at least one of a size and a shape that cannot accommodate any end face of the chip electronic component 12.
Therefore, in this embodiment, there is also a feature that the 1 st opening 16 in the sheet accommodating portion 13 has a square shape, but the 2 nd opening 18 in the ventilation trap 17 has a rectangular shape (not including a square).
As a modification of the above embodiment, the vent trap 17 may be provided between the sheet accommodating portions 13 adjacent to each other in the Y direction among the sheet accommodating portions 13. In this case, the interval between the X-direction linear members X1 adjacent in the Y-direction among the X-direction linear members X1 defining the 2 nd opening 18 is selected to be a size that prohibits the passage of the sheet-like electronic component 12.
Fig. 4 is a view corresponding to fig. 2, showing a comparative example of the above-described clip 11 for a chip electronic component. In fig. 4, elements corresponding to those shown in fig. 2 are denoted by the same reference numerals, and repetitive description thereof will be omitted.
The clip 11H for a chip electronic component shown in fig. 4 does not include an air-permeable trap. That is, adjacent sheet accommodating portions 13 among the plurality of sheet accommodating portions 13 sandwich only the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 arranged in the Z-direction. Therefore, the sheet-like electronic component holder 11H shown in fig. 4 is inferior in air permeability in that it does not have an air vent well, as compared with the sheet-like electronic component holder 11 shown in fig. 2.
In fig. 5, a state in which the sheet-like electronic component jigs 11 to be described with reference to fig. 1 to 3 are stacked in multiple layers is schematically shown. As can be seen from fig. 5, the ventilation trap 17 can ensure good ventilation throughout all of the plurality of sheet-like electronic component jigs 11 stacked in multiple layers. Therefore, many sheet-like electronic components 12 can be uniformly processed at once.
Fig. 6 is a view corresponding to fig. 2 showing a clip 11a for a chip electronic component according to embodiment 2 of the present invention. In fig. 6, elements corresponding to those shown in fig. 2 are denoted by the same reference numerals, and repetitive description thereof will be omitted.
In the clip 11a for a sheet-like electronic component shown in fig. 6, similarly to the case of the clip 11 for a sheet-like electronic component described above, the ventilation trap 17a is provided between adjacent sheet-accommodating portions 13 in the X direction among the sheet-accommodating portions 13, but the ventilation trap 17a has the same volume as the sheet-accommodating portions 13. In the ventilation trap 17a, the 2 nd opening 18a has a form in which a quadrangular shape defined by the two X-direction linear members X1 and the two Y-direction linear members Y1 is divided into a plurality of portions, for example, two portions, by the other Y-direction linear members Ya so as to be of a size that inhibits the passage of the sheet-like electronic component 12.
In the ventilation trap 17a, in order to divide the quadrangular shape of the 2 nd opening 18a into a plurality of portions so as to be a size that inhibits the passage of the sheet-like electronic component 12, another Y-direction linear member Ya is disposed in the above-described embodiment. On the other hand, in the case where the ventilation trap is provided between the sheet accommodating portions adjacent in the Y direction among the sheet accommodating portions, another X-direction linear member is arranged to divide the 2 nd opening.
In addition, the 2 nd opening 18a may be divided by an arbitrary member. For example, the 2 nd opening 18a may be divided by a plurality of linear members which are arranged along a plane parallel to the X-direction and the Y-direction, extend in a direction different from the X-direction and the Y-direction, and extend in parallel at a distance from each other. Alternatively, the 2 nd opening 18a may be divided by disposing the linear members independently of each of the 2 nd openings 18a.
In the embodiment shown in fig. 6, the ventilation trap 17a has the same volume as the sheet accommodating portion 13. However, this structure is not essential, and the ventilation trap 17a may have a different volume from the sheet accommodating portion 13.
Fig. 7 is a view corresponding to fig. 2 showing a clip 11b for a chip electronic component according to embodiment 3 of the present invention. In fig. 7, elements corresponding to those shown in fig. 2 are denoted by the same reference numerals, and repetitive description thereof will be omitted.
In the clip 11b for a sheet-like electronic component shown in fig. 7, similarly to the clip 11a for a sheet-like electronic component shown in fig. 6, the ventilation trap 17b is provided between adjacent sheet-accommodating portions 13 in the X direction among the sheet-accommodating portions 13, and has the same volume as the sheet-accommodating portions 13. In the clip 11b for a chip electronic component shown in fig. 7, similarly to the clip 11 for a chip electronic component shown in fig. 2, the 2 nd opening 18b in the ventilation trap 17b has a quadrangular shape defined by the X-direction linear member X1 adjacent in the Y-direction among the plurality of X-direction linear members X1 and the Y-direction linear member Y1 adjacent in the X-direction among the plurality of Y-direction linear members Y1.
Note that, the interval S2 between the Y-direction linear members Y1 adjacent in the X-direction among the Y-direction linear members Y1 defining the 2 nd opening 18b is selected to be a size that prohibits the passage of the sheet-like electronic component 12, and this is the same as in the case of the clip 11 for a sheet-like electronic component shown in fig. 2. However, the structure for achieving this is different from the case of the clip 11 for a chip electronic component shown in fig. 2.
In the clip 11b for a chip electronic component shown in fig. 7, at least one of the Y-direction linear members Y1 adjacent in the X-direction among the Y-direction linear members Y1 defining the 2 nd opening 18b in the ventilation well 17b is provided so as to be thicker than the other Y-direction linear members Y2 to Y6, and is provided so as to protrude, so that the 2 nd opening 18b is reduced. In the illustrated embodiment, the Y-direction linear members Y1 adjacent to each other in the X-direction among the Y-direction linear members Y1 defining the 2 nd opening 18b are thicker than the other Y-direction linear members Y2 to Y6.
In addition, as a modification of the above embodiment, when the vent trap 17 is provided between the sheet accommodating portions 13 adjacent in the Y direction among the sheet accommodating portions 13, at least one of the X-direction linear members X1 adjacent in the Y direction among the X-direction linear members X1 defining the 2 nd opening 18 is thicker than the other X-direction linear members X2 to X5.
The cross-sectional shape of the linear member defining the 2 nd opening 18b may be the same as or different from that of the other linear members. The linear member defining the 2 nd opening 18b may have a cross section of, for example, a rectangle, an ellipse, a long circle, a semicircle, or a polygon other than a rectangle. In the clip 11b for a chip electronic component shown in fig. 7, the width and thickness of the Y-direction linear member Y1 are set to be larger than those of the other Y-direction linear members Y2 to Y6, but the thickness of the Y-direction linear member Y1 may be made equal to those of the other Y-direction linear members Y2 to Y6 or smaller than those of the other Y-direction linear members Y2 to Y6 by making the cross-sectional shape of the Y-direction linear member Y1 different from that of the other Y-direction linear members Y2 to Y6.
Fig. 8 is a view corresponding to fig. 1 showing a clip 11c for a chip electronic component according to embodiment 4 of the present invention. In fig. 8, elements corresponding to those shown in fig. 1 are denoted by the same reference numerals, and repetitive description thereof will be omitted.
In the clip 11c for a sheet-like electronic component shown in fig. 8, the 1 st ventilation trap 17c is provided between adjacent ones 13 in the X direction among the sheet accommodating portions 13, and the 2 nd ventilation trap 17d is provided between adjacent ones 13 in the Y direction among the sheet accommodating portions 13. Further, it is preferable that the 1 st ventilation trap 17c is provided between adjacent sheet accommodating parts 13 in the X direction among all the sheet accommodating parts 13, and the 2 nd ventilation trap 17d is provided between adjacent sheet accommodating parts 13 in the Y direction among all the sheet accommodating parts 13. If the 2 nd ventilation trap 17d is provided in addition to the 1 st ventilation trap 17c, further improvement of ventilation is facilitated.
Further, in the clip 11c for a chip electronic component shown in fig. 8, the 3 rd ventilation trap 17e is provided between the 1 st ventilation trap 17c adjacent in the Y direction among the 1 st ventilation traps 17c and between the 2 nd ventilation trap 17d adjacent in the X direction among the 2 nd ventilation traps 17 d. The addition of such 3 rd ventilation trap 17e contributes to further improvement of ventilation.
The openings of the 1 st ventilation trap 17c, the 2 nd ventilation trap 17d, and the 3 rd ventilation trap 17e have a structure adopted in at least one of the 2 nd openings 18, 18a, 18b in embodiment 1 to 3 rd embodiments of the present invention. The opening of the 3 rd ventilation hole 17e may be square as long as it has at least one of a size and a shape that cannot accommodate any end face of the chip-shaped electronic component 12.
The present invention has been described above in connection with the illustrated embodiment, but various modifications are possible within the scope of the present invention.
In the illustrated embodiment, the ventilation trap is provided between adjacent ones of the all of the sheet accommodating portions in the X direction or the Y direction, but may be provided only between adjacent ones of the part of the sheet accommodating portions in the X direction or the Y direction.
The number of the linear members in the X direction and the linear members in the Y direction and the number of the linear members in the X direction can be arbitrarily changed according to the number of the required sheet accommodating portions. The number of the linear members in the X direction and the linear members in the Y direction in the Z direction can be arbitrarily changed according to the depth required for the sheet accommodating portion.
The jig for a chip electronic component according to the present invention can be used in a plating process or the like in addition to a firing process for manufacturing a chip electronic component.
In the case of use in the wet plating step, since liquid permeability is required for the jig for a sheet-like electronic component, the terms "air permeability" and "air permeable well" used in the present specification are replaced with "liquid permeability" and "liquid permeable well", respectively.
The embodiments described in the present specification are illustrative, and partial replacement or combination of structures can be performed between different embodiments.
Description of the reference numerals
X1 to X5: an X-direction linear member;
Y1 to Y6: a Y-direction linear member;
S1, S2: spacing;
p1, P2: configuring a space;
11. 11a, 11b, 11c: a clamp for a sheet-like electronic component;
12: a sheet-like electronic component;
13: a sheet accommodating section;
14: a bottom wall portion;
15: a side wall portion;
16: a1 st opening;
17. 17a, 17b, 17c, 17d, 17e: an air-passing trap;
18. 18a, 18b: and an opening 2.
Claims (15)
1. A clamp for a chip electronic component, wherein when an X direction and a Y direction are set as directions intersecting each other and a Z direction is set as a direction orthogonal to the X direction and the Y direction,
The clamp for the sheet-shaped electronic component comprises:
a plurality of X-direction linear members extending in the X-direction; and
A plurality of Y-direction linear members extending in the Y direction,
A plurality of sheet accommodating portions each accommodating one sheet-like electronic component, each of which is arranged in both the X-direction and the Y-direction, are constituted by the plurality of X-direction linear members and the plurality of Y-direction linear members,
Each of the sheet accommodating portions has a bottom wall portion for carrying a sheet-like electronic component and a side wall portion rising from the bottom wall portion in the Z-direction,
The side wall portion is formed with a1 st opening on the opposite side of the bottom wall portion for accommodating a chip electronic component in the chip accommodating portion,
The 1 st opening has a quadrangular shape defined by the X-direction linear members adjacent in the Y-direction among the plurality of X-direction linear members and the Y-direction linear members adjacent in the X-direction among the plurality of Y-direction linear members,
The side wall portion is formed of a plurality of the X-direction linear members arranged in the Z direction and a plurality of the Y-direction linear members arranged in the Z direction,
The bottom wall portion is formed of at least one of the X-direction linear member and the Y-direction linear member which traverse the space in the side wall portion,
Wherein,
Between adjacent ones of the sheet accommodating portions, a vent well having a2 nd opening that is not likely to accommodate a sheet-like electronic component is provided.
2. The clip for a chip electronic component according to claim 1, wherein,
The X direction and the Y direction are orthogonal to each other.
3. The clip for a chip electronic component according to claim 1 or 2, wherein,
The 2 nd opening has a quadrangular shape defined by the X-direction linear members adjacent in the Y-direction among the plurality of X-direction linear members and the Y-direction linear members adjacent in the X-direction among the plurality of Y-direction linear members, and a size that inhibits passage of the sheet-like electronic component is selected to define an interval between the X-direction linear members adjacent in the Y-direction among the X-direction linear members or an interval between the Y-direction linear members adjacent in the X-direction among the Y-direction linear members of the 2 nd opening.
4. The clip for a chip electronic component according to claim 3, wherein,
The arrangement pitch of the X-direction linear members adjacent in the Y-direction among the X-direction linear members or the arrangement pitch of the Y-direction linear members adjacent in the X-direction among the Y-direction linear members is set to be shorter than the arrangement pitch of the X-direction linear members adjacent in the Y-direction among the X-direction linear members or the arrangement pitch of the Y-direction linear members adjacent in the X-direction among the X-direction linear members of the 1 st opening.
5. The clip for a chip electronic component according to claim 3, wherein,
At least one of the X-direction linear members adjacent in the Y-direction or at least one of the Y-direction linear members adjacent in the X-direction among the X-direction linear members defining the 2 nd opening is thicker than the other X-direction linear members or the other Y-direction linear members.
6. The clip for a chip electronic component according to claim 1 or 2, wherein,
The 1 st opening has a square shape, and the 2 nd opening has a rectangular shape.
7. The clip for a chip electronic component according to claim 1 or 2, wherein,
The 2 nd opening has a form in which a quadrangular shape defined by the two X-direction linear members and the two Y-direction linear members is divided into a plurality of portions by the other X-direction linear members or the other Y-direction linear members so as to be a size that inhibits passage of the sheet-like electronic component.
8. The clip for a chip electronic component according to claim 1 or 2, wherein,
The ventilation trap is provided between adjacent ones of the sheet accommodating portions in the X direction.
9. The clip for a chip electronic component according to claim 8, wherein,
The ventilation trap is provided between the sheet accommodating portions adjacent in the X direction among all the sheet accommodating portions.
10. The clip for a chip electronic component according to claim 1 or 2, wherein,
The ventilation trap is provided between the sheet accommodating parts adjacent in the Y direction among the sheet accommodating parts.
11. The clip for a chip electronic component according to claim 10, wherein,
The ventilation trap is provided between the sheet accommodating portions adjacent in the Y direction among all the sheet accommodating portions.
12. The clip for a chip electronic component according to claim 1 or 2, wherein,
The venting trap comprises:
A 1 st ventilation trap provided between the adjacent sheet accommodating sections in the X direction among all the sheet accommodating sections; and
And a 2 nd ventilation trap provided between the sheet accommodating portions adjacent in the Y direction among all the sheet accommodating portions.
13. The clip for a chip electronic component according to claim 12, wherein,
The venting trap further comprises: and 3 rd ventilation wells arranged between the 1 st ventilation wells adjacent in the Y direction in the 1 st ventilation wells and between the 2 nd ventilation wells adjacent in the X direction in the 2 nd ventilation wells.
14. The clip for a chip electronic component according to claim 1 or 2, wherein,
The X-direction linear member and the Y-direction linear member include ceramic.
15. The clip for a chip electronic component according to claim 1 or 2, wherein,
The X-direction linear member and the Y-direction linear member are circular in cross section.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-191597 | 2019-10-19 | ||
| JP2019191597 | 2019-10-19 | ||
| PCT/JP2020/038224 WO2021075357A1 (en) | 2019-10-19 | 2020-10-09 | Chip-shaped electronic component jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114502325A CN114502325A (en) | 2022-05-13 |
| CN114502325B true CN114502325B (en) | 2024-09-10 |
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ID=75537450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080070177.2A Active CN114502325B (en) | 2019-10-19 | 2020-10-09 | Clamp for sheet-like electronic component |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7226579B2 (en) |
| KR (1) | KR102637721B1 (en) |
| CN (1) | CN114502325B (en) |
| WO (1) | WO2021075357A1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107344865A (en) * | 2017-06-15 | 2017-11-14 | 上海极率科技有限公司 | The preparation method of heat transfer anisotropic ceramics material |
| CN107382284A (en) * | 2017-06-28 | 2017-11-24 | 中国电子科技集团公司第五十五研究所 | A kind of sintering method of high temperature co-firing aluminium oxide ceramics |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3073770A (en) * | 1961-04-24 | 1963-01-15 | Bell Telephone Labor Inc | Mullite synthesis |
| US6036023A (en) * | 1997-07-10 | 2000-03-14 | Teradyne, Inc. | Heat-transfer enhancing features for semiconductor carriers and devices |
| CN2358983Y (en) * | 1998-12-01 | 2000-01-19 | 唐甦 | Net-type ceramics carrier |
| US6264037B1 (en) * | 2000-04-27 | 2001-07-24 | R. H. Murphy Co., Inc. | Tray for ball grid array integrated circuit |
| JP2001326135A (en) * | 2000-05-16 | 2001-11-22 | Taiyo Yuden Co Ltd | Method and device for manufacturing laminated electronic component |
| JP4595199B2 (en) * | 2000-12-19 | 2010-12-08 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic substrate |
| JP3629007B2 (en) * | 2001-06-21 | 2005-03-16 | Ｔｄｋ株式会社 | Method and apparatus for baking terminal electrodes of ceramic electronic components |
| US6868970B2 (en) * | 2003-04-16 | 2005-03-22 | Illinois Tool Works Inc. | Stackable tray for integrated circuits with corner support elements and lateral support elements forming matrix tray capture system |
| US20050072715A1 (en) * | 2003-10-06 | 2005-04-07 | Pylant James D. | Self aligning tray and carrier apparatus |
| JP4692755B2 (en) * | 2005-03-28 | 2011-06-01 | Ｔｄｋ株式会社 | Chip-shaped electronic component jig |
| JP4737440B2 (en) | 2007-01-16 | 2011-08-03 | Ｔｄｋ株式会社 | Chip electronic component jig |
| US20070256958A1 (en) * | 2007-04-30 | 2007-11-08 | Peak Plastic And Metal Products (Int'l) Ltd. | Reinforced tray for delicate devices |
| KR100878859B1 (en) * | 2007-11-27 | 2009-01-15 | 주식회사 아크로이엔지 | Ceramic goods fire ceramic coating nickel mesh crosspiece and making method |
| JP2011052909A (en) * | 2009-09-02 | 2011-03-17 | Ngk Insulators Ltd | Kiln tool plate for ceramic firing |
| TW201345869A (en) * | 2012-04-18 | 2013-11-16 | Nitto Denko Corp | Method and apparatus for sintering flat ceramics |
| JP2012144433A (en) * | 2012-04-20 | 2012-08-02 | Tdk Corp | Degreasing tool |
| CN203830731U (en) * | 2014-04-03 | 2014-09-17 | 浙江科扬新材料科技有限公司 | Preparing equipment for nanometer metal and ceramic composite powder |
| CN205747995U (en) * | 2016-05-16 | 2016-11-30 | 青岛冠鼎贸易有限公司 | Ceramic material electronic devices and components sintering load bearing board |
| CN207407698U (en) * | 2017-08-30 | 2018-05-25 | 青岛冠鼎贸易有限公司 | For the load bearing board of sintered ceramic material electronic component |
| JP6462102B2 (en) * | 2017-12-11 | 2019-01-30 | 三井金属鉱業株式会社 | Ceramic lattice |
| JP2021089920A (en) * | 2019-12-03 | 2021-06-10 | 株式会社村田製作所 | Chip-shaped electronic component jig |
-
2020
- 2020-10-09 KR KR1020227008874A patent/KR102637721B1/en active IP Right Grant
- 2020-10-09 WO PCT/JP2020/038224 patent/WO2021075357A1/en active Application Filing
- 2020-10-09 JP JP2021552362A patent/JP7226579B2/en active Active
- 2020-10-09 CN CN202080070177.2A patent/CN114502325B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107344865A (en) * | 2017-06-15 | 2017-11-14 | 上海极率科技有限公司 | The preparation method of heat transfer anisotropic ceramics material |
| CN107382284A (en) * | 2017-06-28 | 2017-11-24 | 中国电子科技集团公司第五十五研究所 | A kind of sintering method of high temperature co-firing aluminium oxide ceramics |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220047840A (en) | 2022-04-19 |
| WO2021075357A1 (en) | 2021-04-22 |
| KR102637721B1 (en) | 2024-02-19 |
| CN114502325A (en) | 2022-05-13 |
| JPWO2021075357A1 (en) | 2021-04-22 |
| JP7226579B2 (en) | 2023-02-21 |
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