JPWO2021075357A1 - - Google Patents

Info

Publication number
JPWO2021075357A1
JPWO2021075357A1 JP2021552362A JP2021552362A JPWO2021075357A1 JP WO2021075357 A1 JPWO2021075357 A1 JP WO2021075357A1 JP 2021552362 A JP2021552362 A JP 2021552362A JP 2021552362 A JP2021552362 A JP 2021552362A JP WO2021075357 A1 JPWO2021075357 A1 JP WO2021075357A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021552362A
Other languages
Japanese (ja)
Other versions
JP7226579B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021075357A1 publication Critical patent/JPWO2021075357A1/ja
Application granted granted Critical
Publication of JP7226579B2 publication Critical patent/JP7226579B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2021552362A 2019-10-19 2020-10-09 Jig for chip electronic parts Active JP7226579B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019191597 2019-10-19
JP2019191597 2019-10-19
PCT/JP2020/038224 WO2021075357A1 (en) 2019-10-19 2020-10-09 Chip-shaped electronic component jig

Publications (2)

Publication Number Publication Date
JPWO2021075357A1 true JPWO2021075357A1 (en) 2021-04-22
JP7226579B2 JP7226579B2 (en) 2023-02-21

Family

ID=75537450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021552362A Active JP7226579B2 (en) 2019-10-19 2020-10-09 Jig for chip electronic parts

Country Status (4)

Country Link
JP (1) JP7226579B2 (en)
KR (1) KR102637721B1 (en)
CN (1) CN114502325A (en)
WO (1) WO2021075357A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077776A (en) * 2001-06-21 2003-03-14 Tdk Corp Method and device for baking terminal electrode of ceramic electronic component
JP2006310763A (en) * 2005-03-28 2006-11-09 Tdk Corp Tool for chip electronic component
JP2008177188A (en) * 2007-01-16 2008-07-31 Tdk Corp Tool for chip electronic component
JP2012144433A (en) * 2012-04-20 2012-08-02 Tdk Corp Degreasing tool
JP2018193287A (en) * 2017-12-11 2018-12-06 三井金属鉱業株式会社 Ceramic lattice body
JP2021089920A (en) * 2019-12-03 2021-06-10 株式会社村田製作所 Chip-shaped electronic component jig

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3073770A (en) * 1961-04-24 1963-01-15 Bell Telephone Labor Inc Mullite synthesis
US6036023A (en) * 1997-07-10 2000-03-14 Teradyne, Inc. Heat-transfer enhancing features for semiconductor carriers and devices
CN2358983Y (en) * 1998-12-01 2000-01-19 唐甦 Net-type ceramics carrier
US6264037B1 (en) * 2000-04-27 2001-07-24 R. H. Murphy Co., Inc. Tray for ball grid array integrated circuit
JP2001326135A (en) * 2000-05-16 2001-11-22 Taiyo Yuden Co Ltd Method and device for manufacturing laminated electronic component
JP4595199B2 (en) * 2000-12-19 2010-12-08 株式会社村田製作所 Manufacturing method of multilayer ceramic substrate
US6868970B2 (en) * 2003-04-16 2005-03-22 Illinois Tool Works Inc. Stackable tray for integrated circuits with corner support elements and lateral support elements forming matrix tray capture system
US20050072715A1 (en) * 2003-10-06 2005-04-07 Pylant James D. Self aligning tray and carrier apparatus
US20070256958A1 (en) * 2007-04-30 2007-11-08 Peak Plastic And Metal Products (Int'l) Ltd. Reinforced tray for delicate devices
KR100878859B1 (en) * 2007-11-27 2009-01-15 주식회사 아크로이엔지 Ceramic goods fire ceramic coating nickel mesh crosspiece and making method
JP2011052909A (en) * 2009-09-02 2011-03-17 Ngk Insulators Ltd Kiln tool plate for ceramic firing
US9206086B2 (en) * 2012-04-18 2015-12-08 Nitto Denko Corporation Method and apparatus for sintering flat ceramics
CN203830731U (en) * 2014-04-03 2014-09-17 浙江科扬新材料科技有限公司 Preparing equipment for nanometer metal and ceramic composite powder
CN205747995U (en) * 2016-05-16 2016-11-30 青岛冠鼎贸易有限公司 Ceramic material electronic devices and components sintering load bearing board
CN107344865A (en) * 2017-06-15 2017-11-14 上海极率科技有限公司 The preparation method of heat transfer anisotropic ceramics material
CN107382284A (en) * 2017-06-28 2017-11-24 中国电子科技集团公司第五十五研究所 A kind of sintering method of high temperature co-firing aluminium oxide ceramics
CN207407698U (en) * 2017-08-30 2018-05-25 青岛冠鼎贸易有限公司 For the load bearing board of sintered ceramic material electronic component

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077776A (en) * 2001-06-21 2003-03-14 Tdk Corp Method and device for baking terminal electrode of ceramic electronic component
JP2006310763A (en) * 2005-03-28 2006-11-09 Tdk Corp Tool for chip electronic component
JP2008177188A (en) * 2007-01-16 2008-07-31 Tdk Corp Tool for chip electronic component
JP2012144433A (en) * 2012-04-20 2012-08-02 Tdk Corp Degreasing tool
JP2018193287A (en) * 2017-12-11 2018-12-06 三井金属鉱業株式会社 Ceramic lattice body
JP2021089920A (en) * 2019-12-03 2021-06-10 株式会社村田製作所 Chip-shaped electronic component jig

Also Published As

Publication number Publication date
KR20220047840A (en) 2022-04-19
WO2021075357A1 (en) 2021-04-22
JP7226579B2 (en) 2023-02-21
CN114502325A (en) 2022-05-13
KR102637721B1 (en) 2024-02-19

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