CN114502325A - Clip for chip electronic component - Google Patents
Clip for chip electronic component Download PDFInfo
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- CN114502325A CN114502325A CN202080070177.2A CN202080070177A CN114502325A CN 114502325 A CN114502325 A CN 114502325A CN 202080070177 A CN202080070177 A CN 202080070177A CN 114502325 A CN114502325 A CN 114502325A
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- linear members
- direction linear
- chip
- adjacent
- electronic component
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- 238000009423 ventilation Methods 0.000 claims abstract description 22
- 239000000919 ceramic Substances 0.000 claims description 5
- 230000000630 rising effect Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 230000035699 permeability Effects 0.000 abstract description 14
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910003465 moissanite Inorganic materials 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a clamp for a chip electronic component, which has good air permeability and can ensure the air permeability even if stacked into a plurality of layers. The X-direction linear member and the Y-direction linear member constitute a plurality of sheet storage sections (13). The sheet accommodating portion (13) has a 1 st opening (16) for accommodating the sheet-like electronic component (12). Between adjacent ones of the sheet housing portions (13), a vent well (17) having a 2 nd opening (18) that is unlikely to house the sheet-like electronic component (12) is provided. The ventilation trap (17) has ventilation properties with respect to the sheet accommodating section (13).
Description
Technical Field
The present invention relates to a clip for a chip electronic component having a plurality of chip housing portions each housing and holding one chip electronic component, and more particularly, to an improvement in the form of the clip for a chip electronic component.
Background
A clip for a chip-shaped electronic component that is of interest for the present invention is described in, for example, japanese patent application laid-open No. 2008-177188 (patent document 1). The jig for a chip electronic component described in patent document 1 is a jig used for processing a chip electronic component, and includes a support member and a carrier member. The support member comprises a metallic material. The support member is planar as a whole, and has a large number of through-hole insertion holes in its surface. The bearing component is a reticular body woven by metal warp and metal weft. The bearing member is joined to one surface of the support member so that at least one intersection portion exists in the opening surface of the sheet insertion hole.
When the above-described jig for chip electronic components is used to process a plurality of chip electronic components with a reaction gas, one chip electronic component is inserted into each of a plurality of chip insertion holes formed in the jig for chip electronic components. The carrier member of the clip for a chip-shaped electronic component is made of a mesh-like body, and therefore has air permeability. Therefore, in the processing step, the reaction gas can flow into the periphery of the chip electronic component.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open No. 2008-177188
Disclosure of Invention
Problems to be solved by the invention
However, in the processing step, a plurality of chip electronic components may be stacked in multiple layers and used. In this case, air permeability with respect to the chip insertion hole in which the chip electronic component is housed is deteriorated. Therefore, improvement for further improving the air permeability is desired.
Accordingly, an object of the present invention is to provide a jig for a chip-shaped electronic component, which can further improve air permeability.
Means for solving the problems
In the chip-type electronic component jig according to the present invention, when the X direction and the Y direction are set to intersect each other, and the Z direction is set to a direction orthogonal to the X direction and the Y direction, the chip-type electronic component jig includes a plurality of X-direction linear members each extending in the X direction and a plurality of Y-direction linear members each extending in the Y direction. The plurality of X-direction linear members and the plurality of Y-direction linear members constitute a plurality of chip accommodating portions each of which accommodates one chip-shaped electronic component and is arranged in both the X-direction and the Y-direction.
Each of the sheet accommodating portions has a bottom wall portion for carrying the sheet-like electronic component and a side wall portion rising from the bottom wall portion in the Z direction, and the side wall portion has a 1 st opening formed on the opposite side of the bottom wall portion for accommodating the sheet-like electronic component in the sheet accommodating portion.
The 1 st opening has a quadrangular shape defined by X-direction linear members adjacent in the Y-direction among the plurality of X-direction linear members and Y-direction linear members adjacent in the X-direction among the plurality of Y-direction linear members.
The side wall portion is formed of a plurality of X-direction linear members arranged in the Z-direction and a plurality of Y-direction linear members arranged in the Z-direction.
The bottom wall portion is formed of at least one of an X-direction linear member and a Y-direction linear member that cross a space in the side wall portion.
In order to solve the above-described technical problem, the jig for a chip electronic component having such a configuration is characterized in that a vent well (pocket) having a 2 nd opening which is unlikely to accommodate the chip electronic component is provided between adjacent ones of the chip accommodating portions.
The chip electronic component handled by the jig for chip electronic components according to the present invention is not limited to a completed chip electronic component, and includes, for example, a chip electronic component that is a semi-finished product during production such as an unfired chip electronic component that is a target of firing.
Effects of the invention
According to the present invention, since the chip electronic component holder is provided with the vent well in addition to the chip accommodating portion, a space through which gas can pass is larger. Therefore, even when a plurality of chip electronic component jigs are stacked in multiple stages and used in the processing step, good air permeability can be ensured over the entire plurality of chip electronic component jigs. As a result, a large number of chip electronic parts can be handled uniformly at a time.
Further, the 2 nd opening in the vent well cannot accommodate the chip electronic component, and therefore, it is possible to prevent the chip electronic component from being erroneously fitted into the vent well.
Drawings
Fig. 1 is a plan view schematically showing a clip 11 for a chip electronic component according to embodiment 1 of the present invention.
Fig. 2 is an enlarged front view of a part of the chip electronic component holder 11 shown in fig. 1, and also shows the chip electronic component 12 accommodated therein.
Fig. 3 is a plan view showing a part of the chip-type electronic component holder 11 shown in fig. 1 in an enlarged manner, and shows the chip-type electronic component 12 accommodated therein by dotted lines.
Fig. 4 corresponds to fig. 2 and shows a chip-shaped electronic component jig 11H as a comparative example of the chip-shaped electronic component jig 11 shown in fig. 2.
Fig. 5 is a front view schematically showing a state in which the chip-type electronic component clips 11 shown in fig. 1 to 3 are stacked in multiple layers.
Fig. 6 is a view corresponding to fig. 2 showing a chip-type electronic component jig 11a according to embodiment 2 of the present invention.
Fig. 7 is a view corresponding to fig. 2 showing a clip 11b for a chip-type electronic component according to embodiment 3 of the present invention.
Fig. 8 is a view corresponding to fig. 1 showing a chip-type electronic component jig 11c according to embodiment 4 of the present invention.
Detailed Description
Referring to fig. 1 to 3, a basic structure of the chip-shaped electronic component jig 11 will be described. In the description, the X direction, the Y direction, and the Z direction are defined as illustrated in fig. 1 to 3. The X direction and the Y direction intersect with each other, and the Z direction is orthogonal to the X direction and the Y direction. Further, the X direction and the Y direction are preferably orthogonal to each other.
The chip-shaped electronic component jig 11 includes a plurality of X-direction linear members X1, and the plurality of X-direction linear members X1 are arranged to form layers parallel to the X-direction and the Y-direction, are spaced apart from each other, and each extend in the X-direction. The clip 11 for a sheet-like electronic component includes a plurality of X-direction linear members X2, a plurality of X-direction linear members X3, a plurality of X-direction linear members X4, and a plurality of X-direction linear members X5, which are arranged in the same manner as in the case of the X-direction linear member X1.
Further, the clip 11 for a chip-shaped electronic component includes a plurality of Y-direction linear members Y1, and the plurality of Y-direction linear members Y1 are arranged to constitute a layer parallel to the X-direction and the Y-direction, are spaced apart from each other, and each extend in the Y-direction. The clip 11 for a chip-shaped electronic component includes a plurality of Y-direction linear members Y2, a plurality of Y-direction linear members Y3, a plurality of Y-direction linear members Y4, a plurality of Y-direction linear members Y5, and a plurality of Y-direction linear members Y6, which are arranged in the same manner as in the case of the Y-direction linear member Y1.
With respect to each of the linear members X1 to X5 and each of the linear members Y1 to Y6, the interval between adjacent linear members, for example, the interval between adjacent X-direction linear members X1 in the X-direction linear member X1 is selected in the range of, for example, 0.1mm to 5.0 mm.
As shown in fig. 2, the plurality of X-direction linear members X1, the plurality of X-direction linear members X2, the plurality of X-direction linear members X3, the plurality of X-direction linear members X4, and the plurality of X-direction linear members X5 are arranged to constitute mutually different layers. As shown in fig. 2, the plurality of Y-direction linear members Y1, the plurality of Y-direction linear members Y2, the plurality of Y-direction linear members Y3, the plurality of Y-direction linear members Y4, the plurality of Y-direction linear members Y5, and the plurality of Y-direction linear members Y6 are arranged to constitute mutually different layers. The plurality of X-direction linear members X1 to X5 and the plurality of Y-direction linear members Y1 to Y6 are alternately arranged in the Z direction.
In order to accommodate one chip-shaped electronic component 12 shown in fig. 2, each of the plurality of chip accommodating portions 13 is configured by the plurality of X-direction linear members X1 to X5 and the plurality of Y-direction linear members Y1 to Y6. As shown in fig. 1, the plurality of sheet housing portions 13 are aligned in both the X direction and the Y direction.
In this embodiment, as shown in fig. 2 for the Y-direction linear members Y1 to Y6, the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 have a rod shape with a circular cross section. Accordingly, the contact area between the chip-shaped electronic component 12 in the chip housing 13 and the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y5 can be reduced, and gas can be smoothly circulated around the chip-shaped electronic component 12.
The linear members X1 to X5 and Y1 to Y6 are illustrated as rods having a circular cross section, but are not limited to a circular cross section, and may have a cross section of a rectangle, an ellipse, a long circle, a semicircle, or a polygon other than a rectangle. The plurality of linear members X1 to X5 and Y1 to Y6 may be identical to or different from each other.
The sheet accommodating portions 13 each have a bottom wall portion 14 for carrying the sheet-like electronic component 12 and a side wall portion 15 rising from the bottom wall portion 14 in the Z direction, and the side wall portion 15 has a 1 st opening 16 formed on the opposite side of the bottom wall portion 14 for accommodating the sheet-like electronic component 12 in the sheet accommodating portion 13.
As shown in fig. 3, the 1 st opening 16 has a quadrangular shape defined by the X-direction linear member X1 adjacent in the Y direction among the plurality of X-direction linear members X1 and the Y-direction linear member Y1 adjacent in the X direction among the plurality of Y-direction linear members Y1. In this embodiment, the 1 st opening 16 has a square shape.
The size of the 1 st openings 16 is selected to accommodate one chip electronic component 12 each. More specifically, the 1 st opening 16 is sized to receive a specific end face of the chip electronic component 12 but not the end faces other than the end face, and is sized to receive no end faces of two chip electronic components 12.
As shown in fig. 2, the side wall portion 15 is formed of a plurality of X-direction linear members X1 to X4 aligned in the Z direction and a plurality of Y-direction linear members Y1 to Y5 aligned in the Z direction.
As seen through the 1 st opening 16 in fig. 3, the bottom wall portion 14 is formed of an X-direction linear member X5 of the lowermost X-direction linear member X5 that crosses the space inside the side wall portion 15, and a Y-direction linear member Y6 of the lowermost Y-direction linear member Y6 that crosses the space inside the side wall portion 15. Either the X-direction linear member X5 crossing the space in the side wall portion 15 or the Y-direction linear member Y6 crossing the space in the side wall portion 15 may be omitted. Thus, the through-hole provided in the bottom wall portion 14 has at least one of a size, a shape, and a configuration that prohibits passage of the chip electronic component 12 accommodated in the chip accommodating portion 13.
The bottom wall portion 14 may be formed of a freely shaped member in place of the X-direction linear member X5 and the Y-direction linear member Y6 within a range not to hinder air permeability. For example, the bottom wall portion 14 may be formed of a plurality of parallel linear members that are arranged along a plane parallel to the X direction and the Y direction, extend in a direction different from both the X direction and the Y direction, and are spaced apart from each other. Alternatively, the bottom wall portion 14 may be formed of a plate-like member having a plurality of through holes. However, among them, the through-hole provided in the bottom wall portion 14 also needs to have at least one of a size, a shape, and a configuration that prohibits passage of the chip electronic component 12 accommodated in the chip accommodating portion 13.
The X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 may be made of, for example, ceramics such as SiC, zirconia, yttria-stabilized zirconia, alumina, or mullite, metals such as nickel, aluminum, Inconel (registered trademark), or stainless steel, resin materials such as polytetrafluoroethylene, polypropylene, acrylic resin, ABS (Acrylonitrile butadiene styrene) resin, or other heat-resistant resins, carbon, or composite materials made of metals and ceramics.
The respective linear diameters of the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 are, for example, 0.1mm to 2.0 mm. In this embodiment, the linear members X1 to X5 and Y1 to Y6 have the same line diameter, but may be different from each other.
In this embodiment, the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 include ceramics. Therefore, the joining of the linear members that are joined to each other of the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 is preferably performed by sintering.
The surfaces of the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 may be further coated with SiC, zirconia, yttria-stabilized zirconia, ceramics such as alumina and mullite, or metals such as nickel.
The chip-shaped electronic component jig 11 having the basic configuration described above has the following characteristic configuration.
Between adjacent ones of the sheet containing portions 13, at least one ventilation well 17 is provided. The vent well 17 is provided with a 2 nd opening 18, and the 2 nd opening 18 has at least one of a size and a shape that cannot accommodate the chip electronic component 12.
In this embodiment, the vent wells 17 are provided between the sheet containing portions 13 adjacent in the X direction among the sheet containing portions 13. Preferably, as shown in fig. 1, the vent trap 17 is provided between the sheet accommodating portions 13 adjacent in the X direction among all the sheet accommodating portions 13.
According to the above configuration, the sheet housing portion 13 and the vent well 17 are divided by the Y-direction linear members Y1 to Y6, and any X-direction linear member of the X-direction linear members X1 to X5 is interposed between adjacent Y-direction linear members of these Y-direction linear members Y1 to Y6, thereby forming a space. Therefore, the vent trap 17 has air permeability with respect to the sheet accommodating portion 13.
As shown in fig. 3, the 2 nd opening 18 has a quadrangular shape defined by the X-direction linear member X1 adjacent in the Y direction among the plurality of X-direction linear members X1 and the Y-direction linear member Y1 adjacent in the X direction among the plurality of Y-direction linear members Y1. In this embodiment, the space S1 (see fig. 2 and 3) between the Y-direction linear members Y1 adjacent in the X direction among the Y-direction linear members Y1 defining the 2 nd opening 18 is selected to be a size that inhibits passage of the chip-shaped electronic component 12. More specifically, in this embodiment, the arrangement pitch P2 of the Y-direction linear member Y1 adjacent in the X direction among the Y-direction linear members Y1 defining the 2 nd opening 18 is set to be shorter than the arrangement pitch P1 of the Y-direction linear member Y1 adjacent in the X direction among the Y-direction linear members Y1 defining the 1 st opening 16. Thus, the 2 nd opening 18 has a configuration having at least one of a size and a shape that cannot accommodate any end face of the chip electronic component 12.
Therefore, in this embodiment, there is also a feature that the 1 st opening 16 in the sheet housing portion 13 has a square shape, but the 2 nd opening 18 in the ventilation trap 17 has a rectangular (not including a square) shape.
In addition, as a modification of the above embodiment, the vent wells 17 may be provided between the sheet containing portions 13 adjacent in the Y direction among the sheet containing portions 13. In this case, the interval between X-direction linear members X1 adjacent in the Y direction among the X-direction linear members X1 defining the 2 nd opening 18 is selected to be a size that prohibits passage of the chip-shaped electronic component 12.
Fig. 4 corresponds to fig. 2, and shows a comparative example of the chip-shaped electronic component jig 11. In fig. 4, elements corresponding to those shown in fig. 2 are denoted by the same reference numerals, and redundant description thereof is omitted.
The chip-like electronic component holder 11H shown in fig. 4 does not have a ventilation well. That is, the adjacent sheet housing portions 13 among the plurality of sheet housing portions 13 are sandwiched only by the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 which are aligned in the Z direction. Therefore, the chip-shaped electronic component jig 11H shown in fig. 4 has inferior air permeability in that it does not have an air-permeable trap, as compared with the chip-shaped electronic component jig 11 shown in fig. 2.
In fig. 5, a state in which the chip electronic component-use jig 11 explained with reference to fig. 1 to 3 is stacked in multiple layers is schematically shown. As is apparent from fig. 5, the ventilation trap 17 can ensure good ventilation over the entire plurality of chip electronic component clips 11 stacked in multiple layers. Therefore, many chip electronic parts 12 can be handled uniformly at one time.
Fig. 6 is a view corresponding to fig. 2 showing a chip-type electronic component jig 11a according to embodiment 2 of the present invention. In fig. 6, elements corresponding to those shown in fig. 2 are denoted by the same reference numerals, and redundant description thereof is omitted.
In the chip electronic component jig 11a shown in fig. 6, as in the case of the chip electronic component jig 11 described above, the vent wells 17a are provided between the chip housing portions 13 adjacent in the X direction in the chip housing portions 13, but the vent wells 17a have the same volume as the chip housing portions 13. In the vent well 17a, the 2 nd opening 18a has a shape in which a rectangular shape defined by the two X-direction linear members X1 and the two Y-direction linear members Y1 is divided into a plurality of portions, for example, two portions, by the other Y-direction linear member Ya so as to have a size that prohibits passage of the chip-shaped electronic component 12.
In the vent well 17a, in order to divide the square shape of the 2 nd opening 18a into a plurality of portions so as to have a size that prohibits passage of the chip electronic component 12, another Y-direction linear member Ya is disposed in the above-described embodiment. On the other hand, in the case where the vent wells are provided between the sheet housing portions adjacent in the Y direction among the sheet housing portions, other X-direction linear members are arranged in order to divide the 2 nd opening.
In addition, the 2 nd opening 18a may be divided by any member. For example, the 2 nd opening 18a may be divided by a plurality of linear members which are arranged along a plane parallel to the X direction and the Y direction, extend in a direction different from both the X direction and the Y direction, and extend in parallel with a space therebetween. Alternatively, the 2 nd opening 18a may be divided by disposing a linear member independently of the 2 nd opening 18 a.
In addition, in the embodiment shown in fig. 6, the vent well 17a has the same volume as the sheet accommodating portion 13. However, this structure is not fundamental, and the vent well 17a may have a different volume from the sheet accommodating portion 13.
Fig. 7 is a view corresponding to fig. 2 showing a chip-shaped electronic component jig 11b according to embodiment 3 of the present invention. In fig. 7, elements corresponding to those shown in fig. 2 are denoted by the same reference numerals, and redundant description thereof is omitted.
In the chip electronic component jig 11b shown in fig. 7, as in the case of the chip electronic component jig 11a shown in fig. 6, the vent wells 17b are provided between the chip housing portions 13 adjacent in the X direction among the chip housing portions 13, and have the same volume as the chip housing portions 13. In the chip-shaped electronic component jig 11b shown in fig. 7, the 2 nd opening 18b in the vent well 17b has a quadrangular shape defined by the X-direction linear member X1 adjacent in the Y direction among the plurality of X-direction linear members X1 and the Y-direction linear member Y1 adjacent in the X direction among the plurality of Y-direction linear members Y1, as in the case of the chip-shaped electronic component jig 11 shown in fig. 2.
The distance S2 between the Y-direction linear members Y1 adjacent in the X direction among the Y-direction linear members Y1 defining the 2 nd opening 18b is selected to be a size that prohibits passage of the chip-shaped electronic component 12, which is similar to the case of the chip-shaped electronic component jig 11 shown in fig. 2. However, the structure for realizing this is different from the case of the chip-shaped electronic component jig 11 shown in fig. 2.
In the chip-shaped electronic component jig 11b shown in fig. 7, at least one of the Y-direction linear members Y1 adjacent in the X direction among the Y-direction linear members Y1 defining the 2 nd opening 18b in the ventilation well 17b is provided so as to protrude thicker than the other Y-direction linear members Y2 to Y6, and is provided so as to narrow the 2 nd opening 18 b. In the illustrated embodiment, of the Y-direction linear members Y1 defining the 2 nd opening 18b, both of the Y-direction linear members Y1 adjacent in the X direction are thicker than the other Y-direction linear members Y2 to Y6.
In addition, as a modification of the above embodiment, in the case where the vent wells 17 are provided between the sheet housing sections 13 adjacent in the Y direction among the sheet housing sections 13, at least one of the X-direction linear members X1 adjacent in the Y direction among the X-direction linear members X1 defining the 2 nd opening 18 is made thicker than the other X-direction linear members X2 to X5.
The cross-sectional shape of the linear member defining the 2 nd opening 18b may be the same as or different from that of the other linear members. The linear member defining the 2 nd opening 18b may have a cross section of a rectangle, an ellipse, a prolate circle, a semicircle, or a polygon other than a rectangle, for example. In the clip 11b for a chip-shaped electronic component shown in fig. 7, the thickness is also set to be larger than the other Y-direction linear members Y2 to Y6 in accordance with the width of the Y-direction linear member Y1, but the thickness of the Y-direction linear member Y1 may be made equal to the thickness of the other Y-direction linear members Y2 to Y6 or may be made smaller than the thickness of the other Y-direction linear members Y2 to Y6 by making the cross-sectional shape of the Y-direction linear member Y1 different from the cross-sectional shapes of the other Y-direction linear members Y2 to Y6.
Fig. 8 is a view corresponding to fig. 1 showing a chip-type electronic component jig 11c according to embodiment 4 of the present invention. In fig. 8, elements corresponding to those shown in fig. 1 are denoted by the same reference numerals, and redundant description thereof is omitted.
In the jig 11c for chip electronic components shown in fig. 8, the 1 st vent well 17c is provided between the chip housing parts 13 adjacent in the X direction in the chip housing parts 13, and the 2 nd vent well 17d is provided between the chip housing parts 13 adjacent in the Y direction in the chip housing parts 13. Further, it is preferable that the 1 st vent well 17c is provided between the sheet containing portions 13 adjacent in the X direction among all the sheet containing portions 13, and the 2 nd vent well 17d is provided between the sheet containing portions 13 adjacent in the Y direction among all the sheet containing portions 13. The provision of the 2 nd vent trap 17d in addition to the 1 st vent trap 17c contributes to further improvement in air permeability.
Further, in the chip-type electronic component jig 11c shown in fig. 8, the 3 rd ventilation wells 17e are provided between the 1 st ventilation wells 17c adjacent in the Y direction among the 1 st ventilation wells 17c and between the 2 nd ventilation wells 17d adjacent in the X direction among the 2 nd ventilation wells 17 d. The addition of the 3 rd ventilation trap 17e contributes to further improvement in ventilation.
The openings of the 1 st vent well 17c, the 2 nd vent well 17d, and the 3 rd vent well 17e have the configurations adopted in at least one of the 2 nd openings 18, 18a, and 18b in embodiments 1 to 3 of the present invention. The opening of the 3 rd ventilation well 17e may be square as long as it has a size and/or a shape that cannot accommodate any end face of the chip electronic component 12.
The present invention has been described above in connection with the illustrated embodiments, but various modifications can be made within the scope of the present invention.
In the illustrated embodiment, the vent wells are provided between the sheet housing portions adjacent in the X direction or the Y direction among all the sheet housing portions, but may be provided only between the sheet housing portions adjacent in the X direction or the Y direction among some of the sheet housing portions.
The number of the X-direction linear members and the Y-direction linear members arranged in the Y direction and the X direction can be arbitrarily changed depending on the required number of the sheet housing portions. The number of rows of the X-direction linear members and the Y-direction linear members in the Z direction can be arbitrarily changed according to the required depth of the sheet accommodating portion.
The jig for a chip electronic component according to the present invention can be used not only in a firing step for manufacturing a chip electronic component but also in a plating step and the like.
In the case of use in the wet plating process, liquid permeability is required for the chip-shaped electronic component jig, and therefore the terms "air permeability" and "air permeable well" used in the present specification are replaced with "liquid permeability" and "liquid permeable well", respectively.
The embodiments described in the present specification are exemplary, and partial replacement or combination of the structures may be performed between different embodiments.
Description of the reference numerals
X1-X5: an X-direction linear member;
Y1-Y6: a Y-direction linear member;
s1, S2: spacing;
p1, P2: configuring a spacing;
11. 11a, 11b, 11 c: a jig for a chip electronic component;
12: a chip-shaped electronic component;
13: a sheet accommodating portion;
14: a bottom wall portion;
15: a sidewall portion;
16: 1 st opening;
17. 17a, 17b, 17c, 17d, 17 e: a ventilation trap;
18. 18a, 18 b: the 2 nd opening.
Claims (15)
1. A jig for a chip-shaped electronic component, wherein when an X direction and a Y direction are set to cross each other and a Z direction is set to a direction orthogonal to the X direction and the Y direction,
the chip-shaped electronic component jig includes:
a plurality of X-direction linear members extending in the X-direction; and
a plurality of Y-direction linear members extending in the Y-direction,
a plurality of chip accommodating portions each configured to accommodate one chip electronic component and arranged in both the X direction and the Y direction are formed by the plurality of X-direction linear members and the plurality of Y-direction linear members,
each of the sheet accommodating portions has a bottom wall portion for carrying a sheet-like electronic component and a side wall portion rising from the bottom wall portion in the Z direction,
the side wall portion has a 1 st opening formed on the opposite side of the bottom wall portion for accommodating a chip electronic component in the chip accommodating portion,
the 1 st opening has a quadrangular shape defined by the X-direction linear members adjacent in the Y-direction among the plurality of X-direction linear members and the Y-direction linear members adjacent in the X-direction among the plurality of Y-direction linear members,
the side wall portion is formed of a plurality of the X-direction linear members arranged in the Z direction and a plurality of the Y-direction linear members arranged in the Z direction,
the bottom wall portion is formed of at least one of the X-direction linear member and the Y-direction linear member that cross a space inside the side wall portion,
wherein the content of the first and second substances,
between adjacent ones of the sheet accommodating portions, a vent well having a 2 nd opening that is unlikely to accommodate a sheet-like electronic component is provided.
2. The jig for chip electronic components according to claim 1, wherein,
the X direction and the Y direction are orthogonal to each other.
3. The jig for chip electronic components according to claim 1 or 2, wherein,
the 2 nd opening has a quadrangular shape defined by the X-direction linear members adjacent in the Y direction among the plurality of X-direction linear members and the Y-direction linear members adjacent in the X direction among the plurality of Y-direction linear members, and a size of a gap between the X-direction linear members adjacent in the Y direction among the X-direction linear members or a gap between the Y-direction linear members adjacent in the X direction among the Y-direction linear members defining the 2 nd opening is selected to inhibit passage of the chip-shaped electronic component.
4. The jig for chip electronic components according to claim 3, wherein,
the arrangement pitch of the X-direction linear members adjacent in the Y direction among the X-direction linear members defining the 2 nd opening or the arrangement pitch of the Y-direction linear members adjacent in the X direction among the Y-direction linear members defining the 1 st opening is shorter than the arrangement pitch of the X-direction linear members adjacent in the Y direction among the X-direction linear members or the arrangement pitch of the Y-direction linear members adjacent in the X direction among the Y-direction linear members defining the 1 st opening.
5. The jig for chip electronic components according to claim 3, wherein,
at least one of the X-direction linear members adjacent in the Y direction among the X-direction linear members defining the 2 nd opening or at least one of the Y-direction linear members adjacent in the X direction among the Y-direction linear members is made thicker than the other X-direction linear members or the other Y-direction linear members.
6. The jig for chip electronic components according to any one of claims 1 to 5, wherein,
the 1 st opening has a square shape and the 2 nd opening has a rectangular shape.
7. The jig for chip electronic components according to claim 1 or 2, wherein,
the 2 nd opening has a shape in which a quadrangular shape defined by the two X-direction linear members and the two Y-direction linear members is divided into a plurality of portions by the other X-direction linear members or the other Y-direction linear members so as to have a size that prohibits the passage of the chip-shaped electronic component.
8. The jig for chip electronic components according to any one of claims 1 to 7, wherein,
the vent wells are provided between the sheet accommodating portions adjacent in the X direction among the sheet accommodating portions.
9. The jig for chip electronic components according to claim 8, wherein,
the vent well is provided between the sheet accommodating portions adjacent in the X direction among all the sheet accommodating portions.
10. The jig for chip electronic components according to any one of claims 1 to 9, wherein,
the vent well is provided between the sheet accommodating portions adjacent in the Y direction among the sheet accommodating portions.
11. The jig for chip electronic components according to claim 10, wherein,
the vent well is provided between the sheet accommodating portions adjacent in the Y direction among all the sheet accommodating portions.
12. The jig for chip electronic components according to any one of claims 1 to 7, wherein,
the vent trap includes:
a 1 st vent well provided between the sheet accommodating portions adjacent in the X direction among all the sheet accommodating portions; and
and a 2 nd vent well provided between the sheet accommodating portions adjacent in the Y direction among all the sheet accommodating portions.
13. The jig for chip electronic components according to claim 12, wherein,
the vent trap further comprises: and a 3 rd ventilation trap which is arranged between the 1 st ventilation traps adjacent to each other in the Y direction in the 1 st ventilation traps and between the 2 nd ventilation traps adjacent to each other in the X direction in the 2 nd ventilation traps.
14. The jig for chip electronic components according to any one of claims 1 to 13, wherein,
the X-direction linear member and the Y-direction linear member include ceramics.
15. The jig for chip electronic components according to any one of claims 1 to 14, wherein,
the cross-section of the X-direction linear member and the Y-direction linear member is circular.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-191597 | 2019-10-19 | ||
| JP2019191597 | 2019-10-19 | ||
| PCT/JP2020/038224 WO2021075357A1 (en) | 2019-10-19 | 2020-10-09 | Chip-shaped electronic component jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114502325A true CN114502325A (en) | 2022-05-13 |
Family
ID=75537450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080070177.2A Pending CN114502325A (en) | 2019-10-19 | 2020-10-09 | Clip for chip electronic component |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7226579B2 (en) |
| KR (1) | KR102637721B1 (en) |
| CN (1) | CN114502325A (en) |
| WO (1) | WO2021075357A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2021075357A1 (en) | 2021-04-22 |
| JP7226579B2 (en) | 2023-02-21 |
| KR20220047840A (en) | 2022-04-19 |
| KR102637721B1 (en) | 2024-02-19 |
| JPWO2021075357A1 (en) | 2021-04-22 |
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