JP2021068768A - Jig for chip-shaped electronic component - Google Patents

Abstract

To make it possible to immediately visually distinguish between different specifications in a jig for a chip-shaped electronic component, which is composed of a plurality of X-direction linear members and a plurality of Y-direction linear members and includes a plurality of chip storage sections.SOLUTION: Coloring is applied to a Y-direction linear member Y6 appearing on a second main surface 32, which is a lower side of a jig 11 for a chip-shaped electronic component. This coloring causes a part of the appearance of the jig 11 for the chip-shaped electronic component to have a peculiar feature that differs from the rest of the appearance. Therefore, by making this unique feature different, jigs for chip-shaped electronic components with different specifications can be immediately distinguished from each other by visual inspection.SELECTED DRAWING: Figure 3

Description

The present invention relates to a jig for chip-shaped electronic components having a plurality of chip accommodating portions for accommodating and holding chip-shaped electronic components one by one, and particularly to an improvement in the form of a jig for chip-shaped electronic components. ..

A jig for chip-shaped electronic components that is of interest to the present invention is described in, for example, Japanese Patent Application Laid-Open No. 2008-177188 (Patent Document 1). The jig for chip-shaped electronic components described in Patent Document 1 is a jig used for processing chip-shaped electronic components, and includes a support member and a receiving member. The support member is made of a metal material. The support member is flat as a whole and has a large number of penetrating tip insertion holes in the plane. The receiving member is a net-like body in which metal meridians and metal parallels are woven. The receiving member is joined to one surface of the support member, and at least one intersection is present in the opening surface of the chip insertion hole.

When a plurality of chip-shaped electronic components are treated with a reaction gas using the above-mentioned jig for chip-shaped electronic components, the chip-shaped electronic components are formed in each of the plurality of chip insertion holes formed in the jig for chip-shaped electronic components. Inserted one by one. Since the receiving member of the jig for chip-shaped electronic parts is made of a net-like body, it has breathability. Therefore, in the processing step, the reaction gas can flow around the chip-shaped electronic component.

Japanese Unexamined Patent Publication No. 2008-177188

In factories that process chip-shaped electronic components using jigs for chip-shaped electronic components, a large number of jigs for chip-shaped electronic components are often handled. Moreover, even if a large number of jigs for chip-shaped electronic components are used, not all of them have the same specifications. For example, it is necessary to properly use jigs for chip-shaped electronic components having different specifications depending on the type of chip-shaped electronic component to be processed, particularly the dimensions.

However, jigs for chip-shaped electronic components having different specifications have a feature that, for example, the dimensions of the chip storage portion are different, but it is difficult to immediately visually distinguish the difference in the dimensions of the chip storage portion. There is also. Therefore, it is easy to encounter management problems such as inadvertently mixing jigs for chip-shaped electronic components having different specifications.

Therefore, an object of the present invention is to provide a jig for chip-shaped electronic components that can solve the above-mentioned problems.

The jig for chip-shaped electronic components according to the present invention is a first main unit facing each other in the Z direction when the X and Y directions intersect each other and the Z direction is orthogonal to the X and Y directions. A plurality of X-direction linear members each having a flat plate shape having a surface and a second main surface and a side surface extending in the Z direction connecting the first main surface and the second main surface, each extending in the X direction. Each of the members is provided with a plurality of Y-direction linear members extending in the Y direction, and the plurality of X-direction linear members and the plurality of Y-direction linear members are used to store one chip-shaped electronic component. A plurality of chip accommodating portions arranged in two directions, the X direction and the Y direction, are configured.

Each chip storage portion has a bottom wall portion that receives chip-shaped electronic components and a side wall portion that rises from the bottom wall portion in the Z direction, and the side wall portion is on the opposite side of the bottom wall portion and is the first main unit. On the surface side, an opening is formed to receive the chip-shaped electronic component in the chip storage portion.

The opening has a quadrangular shape defined by a plurality of X-direction linear members adjacent to each other in the Y direction and a plurality of Y-direction linear members adjacent to each other in the X direction.

The side wall portion is formed by a plurality of X-direction linear members arranged in the Z direction and a plurality of Y-direction linear members arranged in the Z direction.

The bottom wall portion is formed by at least one of an X-direction linear member and a Y-direction linear member that crosses the space in the side wall portion.

In order to solve the above-mentioned technical problems, the jig for a chip-shaped electronic component having such a configuration is characterized in that a part of the appearance has a peculiar feature different from the rest.

The chip-shaped electronic component handled by the jig for chip-shaped electronic component according to the present invention is not limited to the completed chip-shaped electronic component, and is in the process of being manufactured, for example, an unfired chip-shaped electronic component to be fired. Also includes chip-shaped electronic components as semi-finished products.

According to the present invention, in a jig for a chip-shaped electronic component, a part of the appearance thereof has a peculiar feature different from that of the rest. The jigs for electronic components can be visually and immediately distinguished from each other. Therefore, it is possible to solve the management problem that jigs for chip-shaped electronic components having different specifications are inadvertently mixed.

It is a figure which shows the 2nd main surface 32 side which is the lower surface side of the jig 11 for a chip electronic component by 1st Embodiment of this invention. It is a figure which shows the 1st main surface 31 side which is the upper surface while enlarging the part A of the jig 11 for a chip-shaped electronic component shown in FIG. It is a front view which shows the one chip accommodating part 13 shown in FIG. 2 in an enlarged manner. This is for explaining the second embodiment of the present invention, and is an enlarged view showing a part of the second main surface 32 side which is the lower surface of the jig 11a for chip-shaped electronic components. It is a figure which shows the 2nd main surface 32 side which is the lower surface side of the jig 11b for a chip-shaped electronic component by 3rd Embodiment of this invention.

The basic configuration of the jig 11 for chip-shaped electronic components will be described with reference to FIGS. 1 to 3. In the description, the X direction, the Y direction, and the Z direction are defined as shown in FIGS. 1 to 3. The X and Y directions intersect each other, and the Z direction is orthogonal to the X and Y directions. It is preferable that the X direction and the Y direction are orthogonal to each other.

The jig 11 for chip-shaped electronic components includes a first main surface 31 and a second main surface 32 facing each other in the Z direction, and a side surface 33 extending in the Z direction connecting the first main surface 31 and the second main surface 32. It is a flat plate with,
(1) A plurality of X-direction linear members X1, a plurality of X-direction linear members X2, a plurality of X-direction linear members X3, a plurality of X-direction linear members X4, and a plurality of Xs, each extending in the X direction. Directional linear member X5 and
(2) A plurality of Y-direction linear members Y1, a plurality of Y-direction linear members Y2, a plurality of Y-direction linear members Y3, a plurality of Y-direction linear members Y4, and a plurality of Y directions, each extending in the Y direction. A linear member Y5 and a plurality of Y-direction linear members Y6,
To be equipped.

As shown in FIG. 3, the plurality of X-direction linear members X1 to X5 are arranged so as to form different layers from each other. Further, as shown in FIG. 3, the plurality of Y-direction linear members Y1 to Y6 are arranged so as to form different layers from each other. The plurality of X-direction linear members X1 to X5 and the plurality of Y-direction linear members Y1 to Y6 are alternately arranged in the Z direction.

In order to store the chip-shaped electronic components 12 shown in FIGS. 2 and 3 one by one, the plurality of chip accommodating portions 13 include the plurality of X-direction linear members X1 to X5 and the plurality of Y-direction linear members Y1 described above. It is composed of ~ Y6. As shown in FIG. 2, the plurality of chip accommodating portions 13 are arranged in two directions, the X direction and the Y direction.

In this embodiment, the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 have the form of a bar having a circular cross section. From this, the contact area between the chip-shaped electronic component 12 in the chip accommodating portion 13 and the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 can be reduced, and the chip-shaped electronic component 12 can be reduced. Gas can be smoothly circulated around.

Each of the chip accommodating portions 13 has a bottom wall portion 14 that receives the chip-shaped electronic component 12 and a side wall portion 15 that rises from the bottom wall portion 14 in the Z direction, and the side wall portion 15 is opposite to the bottom wall portion 14. On the side, on the first main surface 31 side, an opening 16 for receiving the chip-shaped electronic component 12 into the chip accommodating portion 13 is formed.

As shown in FIG. 2, the opening 16 has a quadrangular shape defined by a plurality of X-direction linear members X1 adjacent to each other in the Y direction and a plurality of Y-direction linear members Y1 adjacent to each other in the X direction. Has. In this embodiment, the opening 16 has a square shape.

As shown in FIG. 3, the side wall portion 15 is formed by a plurality of X-direction linear members X1 to X4 arranged in the Z direction and a plurality of Y-direction linear members Y1 to Y5 arranged in the Z direction. To.

The bottom wall portion 14 is formed by an X-direction linear member X5 and a Y-direction linear member Y6 that cross the space in the side wall portion 15, as can be seen from the chip storage portion 13 shown at the lower right end in FIG. .. The bottom wall portion 14 may be formed by only one of the X-direction linear member X5 and the Y-direction linear member Y6 that crosses the space in the side wall portion 15.

As shown in FIG. 1, the jig 11 for a chip-shaped electronic component has an outer peripheral edge 17 extending in a direction parallel to the diagonal line of a quadrangle formed by the opening 16. In this embodiment, the opening 16 has a square shape. Therefore, the outer peripheral edge 17 intersects each of the X-direction linear members X1 to X5 and each of the Y-direction linear members Y1 to Y6 at an angle of 45 degrees. It should be noted that such a configuration is not an essential feature, and the outer peripheral edge 17 intersects each of the X-direction linear members X1 to X5 and each of the Y-direction linear members Y1 to Y6 at an angle of 90 degrees. You may be.

The X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 are, for example, ceramics such as SiC, zirconia, ittria-stabilized zirconia, alumina or mulite, nickel, aluminum, inconel (registered trademark) or stainless steel. It may be composed of a resin material such as metal, polytetrafluoroethylene, polypropylene, acrylic resin, ABS (Acrylonitrile butadiene styrene) -like resin or other heat-resistant resin, carbon, or a composite material composed of metal and ceramic.

In this embodiment, the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 are made of ceramic. Therefore, joining of the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 that are in contact with each other is preferably achieved by sintering.

Further, the surfaces of the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6 are made of a ceramic such as SiC, zirconia, yttria, yttria-stabilized zirconia, alumina or mullite, or a metal such as nickel. It may be further coated.

The jig 11 for a chip-shaped electronic component having the above-mentioned basic configuration has the following characteristic configurations.

As shown in FIGS. 2 and 3, the shaded Y-direction linear member Y6 constitutes the lowermost layer. The Y-direction linear member Y6 gives the appearance of the second main surface 32 and does not come into contact with the chip-shaped electronic component 12. Such a plurality of Y-direction linear members Y6 are imparted with unique features, for example, colors different from those of the X-direction linear members X1 to X5 and the other Y-direction linear members Y1 to Y5.

For example, heat-resistant ink or color zirconia is added to the material of the Y-direction linear member Y6 in order to impart a unique color. As described above, since the Y-direction linear member Y6 does not come into contact with the chip-shaped electronic component 12, it is possible to prevent coloring with heat-resistant ink or color zirconia from adversely affecting the chip-shaped electronic component 12.

Further, even if any of the Y-direction linear members Y1 to Y5 other than the Y-direction linear member Y6 is selected as having a peculiar feature, any of the X-direction linear members X1 to X5 is selected. May be good. That is, as having a peculiar feature, not only the member appearing on the second main surface 32 of the jig 11 for chip-shaped electronic components but also the member appearing on the first main surface 31 may be selected. If the condition of not being in contact with the chip-shaped electronic component 12 is emphasized, it is preferable to avoid the member appearing on the first main surface 31.

Further, a member constituting the side surface 33 of the jig 11 for a chip-shaped electronic component may be selected as having a peculiar feature. As described above, the outer peripheral edge 17 of the jig 11 for chip-shaped electronic components intersects each of the X-direction linear members X1 to X5 and each of the Y-direction linear members Y1 to Y6 at an angle of 90 degrees. In the case of the configuration, it is sufficient to give a peculiar feature to either the X-direction linear member or the Y-direction linear member along the outer peripheral edge 17. When it is desired to avoid contact with the chip-shaped electronic component 12, a structure may be adopted so that the chip-shaped electronic component 12 is not transferred to the chip accommodating portion 13 along the outer peripheral edge 17.

In order to store the chip-shaped electronic component 12 in the chip accommodating portion 13, a plurality of chip-shaped electronic components 12 are scattered on the jig 11 for the chip-shaped electronic component with the opening 16 in the chip accommodating portion 13 facing upward. After that, the jig 11 for chip-shaped electronic components is shaken. At this time, as shown in FIGS. 2 and 3, the chip-shaped electronic component 12 is transferred to each of the plurality of chip accommodating portions 13 through the opening 16, and the chip-shaped electronic component 12 is accommodating in the chip accommodating portion 13. Is obtained. The chip-shaped electronic component 12 that is not transferred to the chip accommodating portion 13 and remains on the chip-shaped electronic component jig 11 is sifted off by tilting the chip-shaped electronic component jig 11.

Next, the plurality of chip-shaped electronic components 12 held by the jigs 11 for chip-shaped electronic components are subjected to a predetermined processing step such as firing. In the processing step, since the jig main body 30 is basically composed of the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6, the air permeability of the reaction gas or the like to the chip-shaped electronic component 12 is good. Can be.

The processing step may be carried out in a state where a plurality of jigs 11 for chip-shaped electronic components are stacked in a plurality of stages.

When the processing step is completed, the stacked state of the plurality of jigs 11 for chip-shaped electronic components is released as necessary, and the chip-shaped electronic components 12 are taken out from the chip accommodating portions 13 of the jigs 11 for chip-shaped electronic components. ..

FIG. 4 is for explaining a second embodiment of the present invention, and is an enlarged view showing a part of the second main surface 32 side, which is the lower surface of the jig a for chip-shaped electronic components.

In this embodiment, not all of the Y-direction linear members Y6, but only a part of the Y-direction linear members Y6a are given a unique feature, for example, a unique color.

When a unique feature is given to the Y-direction linear member or the X-direction linear member as in the first and second embodiments described above, each of the plurality of X-direction linear members X1 to X5 and a plurality of Y directions Since each of the linear members Y1 to Y6 can be handled in separate linear member units at the manufacturing stage of the jig 11 for chip-shaped electronic components, it is possible to impart unique characteristics only to a specific linear member. It's easy.

FIG. 5 is a diagram showing the second main surface 32 side, which is the lower surface side of the jig 11b for chip-shaped electronic components according to the third embodiment of the present invention. FIG. 5 is a diagram corresponding to FIG. In FIG. 5, the elements corresponding to the elements shown in FIG. 1 are designated by the same reference numerals, and duplicate description will be omitted.

In the jig 11b for chip-shaped electronic components shown in FIG. 5, a mark 18 is added at an appropriate position on the second main surface 32 thereof. The mark 18 is responsible for a part of the appearance of the jig 11b for chip-shaped electronic components, and the portion to which the mark 18 is added has a peculiar feature different from the remaining portion, that is, different from the remaining portion. It has a structure. The mark 18 makes it possible to distinguish between jigs for chip-shaped electronic components having different specifications.

In FIG. 5, the mark 18 is shown by one circle, but one circle is only an example and can be replaced with various other forms such as two or more circles. Further, the mark 18 may be added to the first main surface 31 or the side surface 33 of the jig 11b for chip-shaped electronic components.

The mark 18 is preferably composed of linear members like the X-direction linear members X1 to X5 and the Y-direction linear members Y1 to Y6. According to the mark 18 composed of the linear member, good air permeability can be ensured in the jig 11b for chip-shaped electronic components.

Although the present invention has been described above in relation to the illustrated embodiment, various modifications are possible within the scope of the present invention.

As a peculiar feature, the Y-direction linear member or the X-direction linear member may be given a peculiar form. Although not shown, the Y-direction linear member or the X-direction linear member may be extended in a zigzag shape or a wavy shape instead of extending linearly. In particular, if it is a Y-direction linear member or an X-direction linear member located in the lowermost layer that does not come into contact with the chip-shaped electronic component 12, such as the Y-direction linear member Y6, its form is relatively free. Can be changed.

The number of arrangements of the X-direction linear member and the Y-direction linear member in the Y-direction and the X-direction can be arbitrarily changed according to the required number of chip accommodating portions. Further, the number of arrangements of the X-direction linear member and the Y-direction linear member in the Z direction can be arbitrarily changed according to the required depth of the chip accommodating portion.

The cross-sectional shape of each of the illustrated X-direction linear member and Y-direction linear member is circular, but may be semicircular, triangular, quadrangular, or other polygonal.

The jig for chip-shaped electronic components according to the present invention can be used not only in a firing process for manufacturing chip-shaped electronic components, but also in a plating process and the like.

It should be noted that each embodiment described herein is exemplary and allows partial replacement or combination of configurations between different embodiments.

X1 to X5 X-direction linear member Y1 to Y6, Y6a Y-direction linear member 11, 11a, 11b Jig for chip-shaped electronic parts 12 Chip-shaped electronic parts 13 Chip storage part 14 Bottom wall part 15 Side wall part 16 Opening 17 Outer peripheral edge 18 Mark 31 1st main surface 32 2nd main surface 33 Side surface

Claims (10)

When the X and Y directions intersect each other and the Z direction is orthogonal to the X and Y directions.
It is a flat plate having a first main surface and a second main surface facing each other in the Z direction, and a side surface extending in the Z direction connecting the first main surface and the second main surface.
A plurality of X-direction linear members each extending in the X direction and a plurality of Y-direction linear members each extending in the Y direction are provided.
The plurality of X-direction linear members and the plurality of Y-direction linear members are used to store one chip-shaped electronic component, and are arranged in two directions of the X direction and the Y direction. Chip storage is configured,
Each of the chip accommodating portions has a bottom wall portion that receives chip-shaped electronic components and a side wall portion that rises from the bottom wall portion in the Z direction.
The side wall portion is on the side opposite to the bottom wall portion, and on the first main surface side, an opening for receiving the chip-shaped electronic component in the chip accommodating portion is formed.
The opening has a quadrangular shape defined by those adjacent to each other in the Y direction of the plurality of X-direction linear members and those adjacent to each other in the X direction of the plurality of Y-direction linear members.
The side wall portion is formed of a plurality of the X-direction linear members arranged in the Z direction and a plurality of the Y-direction linear members arranged in the Z direction.
The bottom wall portion is formed by at least one of the X-direction linear member and the Y-direction linear member that crosses the space in the side wall portion.
Part of the appearance has unique characteristics that are different from the rest,
Jig for chip-shaped electronic components. The jig for chip-shaped electronic components according to claim 1, wherein the X and Y directions are orthogonal to each other. The jig for chip-shaped electronic components according to claim 1 or 2, wherein the unique feature is a color different from the rest. The jig for chip-shaped electronic components according to claim 1 or 2, wherein the unique feature is a structure different from that of the remaining portion. The peculiar feature is at least a part of the X-direction linear members selected from the plurality of X-direction linear members, and at least a part of the Y-direction linear members selected from the plurality of Y-direction linear members. The jig for a chip-shaped electronic component according to any one of claims 1 to 4, which is provided to at least one of the above. The chip shape according to claim 5, wherein the peculiar feature is imparted to at least one of the X direction linear member and the Y direction linear member that do not come into contact with the chip-shaped electronic component housed in the chip storage portion. Jig for electronic components. The jig for a chip-shaped electronic component according to any one of claims 1 to 6, wherein the unique feature is imparted to the appearance of at least one of the second main surface and the side surface. The jig for chip-shaped electronic components according to any one of claims 1 to 7, wherein the opening has a square shape. The jig for a chip-shaped electronic component according to any one of claims 1 to 8, wherein the X-direction linear member and the Y-direction linear member are made of ceramic. The jig for a chip-shaped electronic component according to any one of claims 1 to 9, wherein the X-direction linear member and the Y-direction linear member have a circular cross section.

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