JP2021068770A - Jig for chip-shaped electronic component - Google Patents

Abstract

To provide a jig for a chip-shaped electronic component that includes a plurality of X-direction linear members and a plurality of Y-direction linear members, and facilitates both transfer operation of a chip-shaped electronic component to a chip storage portion and removal operation from the chip storage portion.SOLUTION: A side wall portion 15 that defines a chip storage portion 13 of a jig 11 for a chip-shaped electronic component can be separated into two parts of a first side wall portion 18 having a first opening 16, and a second side wall portion 19 having a bottom wall portion 14 and a second opening 20 through a boundary portion 17 at an intermediate position in the Z direction. A head 21 of the chip-shaped electronic component 12 received in the chip storage portion 13 does not protrude from the first opening 16, but protrudes from the second opening 20 defined by the second side wall portion 19 when the first side wall portion 18 is removed. When the chip-shaped electronic component 12 is taken out from the chip storage portion 13, the first side wall portion 18 is removed.SELECTED DRAWING: Figure 3

Description

The present invention relates to a jig for chip-shaped electronic components having a plurality of chip accommodating portions for accommodating and holding chip-shaped electronic components one by one, and particularly to an improvement in the form of a jig for chip-shaped electronic components. ..

A jig for chip-shaped electronic components that is of interest to the present invention is described in, for example, Japanese Patent Application Laid-Open No. 2008-177188 (Patent Document 1). The jig for chip-shaped electronic components described in Patent Document 1 is a jig used for processing chip-shaped electronic components, and includes a support member and a receiving member. The support member is made of a metal material. The support member is flat as a whole, and has a large number of penetrating chip insertion holes, that is, chip accommodating portions in the plane. The receiving member is a net-like body in which metal meridians and metal parallels are woven. The receiving member is joined to one surface of the support member, and at least one intersection is present in the opening surface of the chip accommodating portion.

When a plurality of chip-shaped electronic components are treated with a reaction gas using the above-mentioned jig for chip-shaped electronic components, the chip-shaped electronic components are formed in each of the plurality of chip accommodating portions formed in the jig for chip-shaped electronic components. Inserted one by one. Since the receiving member of the jig for chip-shaped electronic parts is made of a net-like body, it has breathability. Therefore, in the processing step, the reaction gas can flow around the chip-shaped electronic component.

Japanese Unexamined Patent Publication No. 2008-177188

When it is desirable that the head of the chip-shaped electronic component inserted into the chip storage portion of the jig for chip-shaped electronic components does not protrude from the opening of the chip storage portion, the head protrudes from the opening of the chip storage portion. There are some situations where it is better to do it.

More specifically, when the chip-shaped electronic component is transferred to the chip storage portion, it is desirable that the head of the chip-shaped electronic component does not protrude from the opening of the chip storage portion. That is, in order to transfer the chip-shaped electronic component to the chip storage portion, a plurality of chip-shaped electronic components are scattered on the jig for the chip-shaped electronic component with the opening of the chip-shaped electronic component facing upward, and then the chip-shaped electronic component is transferred. Shake the jig for parts. At this time, the chip-shaped electronic components are transferred to each of the plurality of chip storage units, and a state in which the chip-shaped electronic components are stored in the chip storage units can be obtained. The chip-shaped electronic component that is not transferred to the chip storage portion and remains on the jig for the chip-shaped electronic component is sifted off by tilting the jig for the chip-shaped electronic component.

If the head of the chip-shaped electronic component that was previously transferred protrudes from the opening of the chip storage portion during such a transfer operation to the chip storage portion, the head of the chip-shaped electronic component that protrudes However, in many cases, the movement of the chip-shaped electronic component to be transferred later on the jig for the chip-shaped electronic component is restricted, and as a result, the transfer operation of the chip-shaped electronic component may be hindered. In addition, if the jig for chip-shaped electronic components is tilted after the transfer operation to remove the excess chip-shaped electronic components on the jig for chip-shaped electronic components, even the chip-shaped electronic components for which the transfer has been completed will be chipped. It may pop out of the storage section.

On the other hand, when the processing of the chip-shaped electronic component is completed and the chip-shaped electronic component is to be taken out from the chip storage portion, it is desirable that the head of the chip-shaped electronic component protrudes from the opening of the chip storage portion. This is because it is easier to take out the chip-shaped electronic component from the chip storage portion when the head of the chip-shaped electronic component protrudes from the opening of the chip storage portion. Further, if the chip-shaped electronic component is completely housed in the chip storage portion, when the chip-shaped electronic component is tilted, for example, the corner of the head of the chip-shaped electronic component is somewhere on the wall surface defining the chip storage portion. However, if the head of the chip-shaped electronic component protrudes from the opening of the chip storage portion, such a situation does not occur.

Therefore, an object of the present invention is to provide a jig for a chip-shaped electronic component that can smoothly perform both a transfer operation to the chip storage portion and an operation of taking out the chip-shaped electronic component from the chip storage portion. is there.

The jig for chip-shaped electronic parts according to the present invention has a plurality of Xs each extending in the X direction when the X and Y directions intersect each other and the Z direction is orthogonal to the X and Y directions. It includes a directional linear member and a plurality of Y-direction linear members, each of which extends in the Y direction. The plurality of X-direction linear members and the plurality of Y-direction linear members are used to store one chip-shaped electronic component, and a plurality of chips arranged in two directions, the X direction and the Y direction. A storage unit is configured.

Each chip storage portion has a bottom wall portion that receives chip-shaped electronic components and a side wall portion that rises in the Z direction from the peripheral edge portion of the bottom wall portion, and the side wall portion has a chip shape on the side opposite to the bottom wall portion. It forms a first opening for receiving electronic components in the chip housing.

The bottom wall portion is formed by at least one of an X-direction linear member and a Y-direction linear member that crosses the space in the side wall portion, and the side wall portion is formed by a plurality of X-direction linear members arranged in the Z direction and in the Z direction. It is formed by a plurality of arranged Y-direction linear members.

In the jig for chip-shaped electronic components having such a configuration, in order to solve the above-mentioned technical problems, the side wall portion has a first side wall having a first opening through a boundary portion at an intermediate position in the Z direction. It is separable into at least two parts, a portion and a second side wall portion with a bottom wall portion, and the second side wall portion forms a second opening on the side opposite to the bottom wall portion. , The first opening and the second opening have the same shape and dimensions as each other, and are adjacent to a plurality of X-direction linear members in the Y direction and a plurality of Y-direction linear members adjacent to each other in the X direction. It is characterized by having a defined quadrangular shape.

The chip-shaped electronic component handled by the jig for chip-shaped electronic component according to the present invention is not limited to the completed chip-shaped electronic component, and is in the process of being manufactured, for example, an unfired chip-shaped electronic component to be fired. Also includes chip-shaped electronic components as semi-finished products.

According to the present invention, the side wall portion is formed by at least two of a first side wall portion having a first opening and a second side wall portion having a bottom wall portion via a boundary portion at an intermediate position in the Z direction. Since it is separable into two parts, if necessary, the head of the chip-shaped electronic component received in the chip storage part does not protrude from the first opening, but when the first side wall part is removed, It is possible to enable two usage modes such as protruding from the second opening.

Therefore, in the jig for chip-shaped electronic components according to the present invention, it is desirable that the head of the chip-shaped electronic component inserted into the chip storage portion does not protrude from the opening of the chip storage portion, and the head thereof is It is possible to deal with both situations where it is desirable to protrude from the opening of the chip storage portion.

Further, when a plurality of jigs for chip-shaped electronic components are stacked and used in a plurality of stages, the head of the chip-shaped electronic components received in the chip storage portion of the jig for chip-shaped electronic components in the lower stage protrudes from the first opening. If so, the protruding head may come into contact with the bottom wall portion of the upper chip-shaped electronic component jig, and the aligned stacked state may be hindered. However, according to the present invention, since the head of the chip-shaped electronic component received in the chip storage portion can be prevented from protruding from the first opening, a plurality of jigs for the chip-shaped electronic component can be used without any problem. It can be used by stacking it in stages.

It is a top view which shows typically the jig 11 for a chip-shaped electronic component by one Embodiment of this invention. FIG. 5 is an enlarged plan view showing a portion A of the jig 11 for chip-shaped electronic components shown in FIG. 1. It is a front view which shows the part B of the jig 11 for a chip-shaped electronic component shown in FIG. 2 in an enlarged manner. FIG. 3 is a front view showing a state in which the first side wall portion 18 is removed from the jig 11 for chip-shaped electronic components shown in FIG.

The configuration of the jig 11 for chip-shaped electronic components will be described with reference to FIGS. 1 to 4. In the description, the X direction, the Y direction, and the Z direction are defined as shown in FIGS. 1 to 4. The X and Y directions intersect each other, and the Z direction is orthogonal to the X and Y directions. It is preferable that the X direction and the Y direction are orthogonal to each other.

The jig 11 for chip-shaped electronic components is
(1) A plurality of X-direction linear members X1, a plurality of X-direction linear members X2, a plurality of X-direction linear members X3, a plurality of X-direction linear members X4, and a plurality of X-directions, each of which extends in the X direction. Linear member X5, and a plurality of X-direction linear members X6,
(2) A plurality of Y-direction linear members Y1, a plurality of Y-direction linear members Y2, a plurality of Y-direction linear members Y3, a plurality of Y-direction linear members Y4, and a plurality of Y directions, each extending in the Y direction. A linear member Y5, a plurality of Y-direction linear members Y6, and a plurality of Y-direction linear members Y7,
To be equipped.

As shown in FIG. 3, the plurality of X-direction linear members X1 to X6 are arranged so as to form different layers from each other. Further, as shown in FIG. 3, the plurality of Y-direction linear members Y1 to Y7 are arranged so as to form different layers from each other. The plurality of X-direction linear members X1 to X6 and the plurality of Y-direction linear members Y1 to Y7 are alternately arranged in the Z direction.

In order to store the chip-shaped electronic components 12 shown in FIGS. 2 to 4 one by one, the plurality of chip storage units 13 include the plurality of X-direction linear members X1 to X6 and the plurality of Y-direction linear members Y1 described above. It is composed of ~ Y7. As shown in FIG. 1, the plurality of chip accommodating portions 13 are arranged in two directions, the X direction and the Y direction.

In this embodiment, the X-direction linear members X1 to X6 and the Y-direction linear members Y1 to Y7 have the form of a bar having a circular cross section. From this, the contact area between the chip-shaped electronic component 12 in the chip accommodating portion 13 and the X-direction linear members X1 to X6 and the Y-direction linear members Y1 to Y7 can be reduced, and the chip-shaped electronic component 12 can be reduced. Gas can be smoothly circulated around.

Each of the chip accommodating portions 13 has a bottom wall portion 14 that receives the chip-shaped electronic component 12, and a side wall portion 15 that rises from the bottom wall portion 14 in the Z direction.

The bottom wall portion 14 is formed by an X-direction linear member X6 and a Y-direction linear member Y7 that cross the space in the side wall portion 15, as can be seen from the chip storage portion 13 shown at the lower right end in FIG. .. The bottom wall portion 14 may be formed by only one of the X-direction linear member X6 and the Y-direction linear member Y7 that crosses the space in the side wall portion 15.

The side wall portion 15 is formed by a plurality of X-direction linear members X1 to X5 arranged in the Z direction and a plurality of Y-direction linear members Y1 to Y6 arranged in the Z direction. The side wall portion 15 forms a first opening 16 that receives the chip-shaped electronic component 12 into the chip accommodating portion 13 on the side opposite to the bottom wall portion 14.

With reference to FIGS. 3 and 4, the side wall portion 15 has a first side wall portion 18 having the first opening 16 and a bottom wall portion 14 via a boundary portion 17 at an intermediate position in the Z direction. It is said that it can be separated into at least two portions of the second side wall portion 19 accompanied by the above.

As is well shown in FIG. 4, the second side wall portion 19 forms the second opening 20 on the side opposite to the bottom wall portion 14.

The first opening 16 and the second opening 20 have the same shape and dimensions as each other. The first opening 16 has a quadrangular shape defined by a plurality of X-direction linear members X1 adjacent to each other in the Y direction and a plurality of Y-direction linear members Y1 adjacent to each other in the X direction. .. The second opening 20 has a quadrangular shape defined by a plurality of X-direction linear members X3 adjacent to each other in the Y direction and a plurality of Y-direction linear members Y3 adjacent to each other in the X direction. .. In this embodiment, the first opening 16 and the second opening 20 have a square shape.

The X-direction linear members X1 to X6 and the Y-direction linear members Y1 to Y7 are, for example, ceramics such as SiC, zirconia, ittria-stabilized zirconia, alumina or mulite, nickel, aluminum, inconel (registered trademark) or stainless steel. It may be composed of a resin material such as metal, polytetrafluoroethylene, polypropylene, acrylic resin, ABS (Acrylonitrile butadiene styrene) -like resin or other heat-resistant resin, carbon, or a composite material composed of metal and ceramic.

In this embodiment, the X-direction linear members X1 to X6 and the Y-direction linear members Y1 to Y7 are made of ceramic. Therefore, joining of the X-direction linear members X1 to X6 and the Y-direction linear members Y1 to Y7, which are in contact with each other, is preferably achieved by sintering.

Further, the surfaces of the X-direction linear members X1 to X6 and the Y-direction linear members Y1 to Y7 are made of a ceramic such as SiC, zirconia, yttria, yttria-stabilized zirconia, alumina or mullite, or a metal such as nickel. It may be further coated.

In order to store the chip-shaped electronic component 12 in the chip storage portion 13, as shown in FIG. 3, the first side wall portion 18 is placed on the second side wall portion 19. In order to maintain this state, an engaging tool or a connecting tool (not shown) may be used. In this embodiment, the first side wall portion 18 and the second side wall portion 19 are in direct contact with each other, and at the boundary portion 17, the X-direction linear member X2 is located on the first side wall portion 18, and the second side wall portion A linear member Y3 in the Y direction is located at 19. According to this configuration, it is possible to make it difficult for the first side wall portion 18 to be misaligned when the first side wall portion 18 is stacked on the second side wall portion 19. On the contrary, when the X-direction linear members or the Y-direction linear members come into contact with each other, the X-direction linear member and the Y-direction linear member are relatively thin members, so that the positional deviation is likely to occur.

The same effect as the above-mentioned effect can be obtained at the boundary portion, and conversely, when the Y-direction linear member is located on the first side wall portion and the X-direction linear member is located on the second side wall portion. Played.

Next, with the first opening 16 in the chip accommodating portion 13 facing upward, a plurality of chip-shaped electronic components 12 are scattered on the jig 11 for chip-shaped electronic components, and then the jig 11 for chip-shaped electronic components is shaken. At this time, as shown in FIGS. 2 and 3, the chip-shaped electronic component 12 is transferred to each of the plurality of chip accommodating portions 13 through the first opening 16, and the chip-shaped electronic component 12 is accommodated in the chip accommodating portion 13. You can get the state. The chip-shaped electronic component 12 that is not transferred to the chip accommodating portion 13 and remains on the chip-shaped electronic component jig 11 is sifted off by tilting the chip-shaped electronic component jig 11.

As a result of the above-mentioned transfer operation, the head portion 21 of the chip-shaped electronic component 12 housed in the chip storage unit 13 does not protrude from the first opening 16, as shown in FIG. If the head 21 of the chip-shaped electronic component 12 that has been transferred earlier protrudes from the first opening 16 of the chip storage portion 13, the head 21 of the chip-shaped electronic component 12 that protrudes is often transferred later. The movement of the chip-shaped electronic component 12 on the jig 11 for the chip-shaped electronic component is restricted, and as a result, the transfer operation of the chip-shaped electronic component 12 may be hindered. Further, when the chip-shaped electronic component 12 that is left over on the chip-shaped electronic component jig 11 is to be screened off by tilting the chip-shaped electronic component jig 11 after the transfer operation, the chip-shaped electronic component 12 for which the transfer is completed is completed. Even may pop out from the chip storage unit 13.

Next, the plurality of chip-shaped electronic components 12 held by the jigs 11 for chip-shaped electronic components are subjected to a predetermined processing step such as firing. In the processing step, since the jig 11 for the chip-shaped electronic component is basically composed of the X-direction linear members X1 to X6 and the Y-direction linear member Y1 to Y7, the reaction gas or the like is ventilated to the chip-shaped electronic component 12. The sex can be made good. The processing step may be carried out in a state where a plurality of jigs 11 for chip-shaped electronic components are stacked in a plurality of stages. In this way, even when a plurality of jigs 11 for chip-shaped electronic components are stacked in a plurality of stages, the head portion 21 of the chip-shaped electronic components 12 does not protrude from the first opening 16. It is preferable to have.

When the above processing step is completed, the chip-shaped electronic component 12 is taken out from the chip storage unit 13. At this time, it is preferable that the head portion 21 of the chip-shaped electronic component 12 protrudes from the opening of the chip accommodating portion 13. The protrusion of the chip-shaped electronic component 12 facilitates removal of the chip-shaped electronic component 12 from the chip accommodating portion 13. Further, it is possible to prevent the chip-shaped electronic component 12 from being tilted in the chip accommodating portion 13 and the corner portion of the head 21 of the chip-shaped electronic component 12 being caught somewhere on the wall surface defining the chip accommodating portion 13. ..

As shown in FIG. 4, the first side wall portion 18 is removed from the jig 11 for the chip-shaped electronic component so that the head 21 of the chip-shaped electronic component 12 protrudes from the opening of the chip accommodating portion 13. As a result, the head 21 of the chip-shaped electronic component 12 is in a state of protruding from the second opening 20. In this way, the chip-shaped electronic component 12 is taken out from the chip accommodating portion 13 after the head 21 of the chip-shaped electronic component 12 protrudes from the second opening 20.

When the jig 11 for a chip-shaped electronic component is used in the firing step of the chip-shaped electronic component 12, the chip-shaped electronic component 12 shrinks due to firing, but even after the chip-shaped electronic component 12 has shrunk, the first side wall portion In the state of FIG. 4 in which 18 is removed, it is preferable that the head portion 21 of the chip-shaped electronic component 12 has a dimensional design that protrudes from the second opening 20.

In this embodiment, the Z-direction dimension of the first side wall portion 18 is shorter than the Z-direction dimension of the second side wall portion 19, but these dimensions can be arbitrarily changed, for example, the Z-direction dimension of the first side wall portion 18. However, even if it is longer than the Z-direction dimension of the second side wall portion 19, the Z-direction dimension of the first side wall portion 18 may be equal to the Z-direction dimension of the second side wall portion 19.

Although the present invention has been described above in relation to the illustrated embodiment, various modifications are possible within the scope of the present invention.

For example, the number of arrangements of the X-direction linear member and the Y-direction linear member in the Y-direction and the X-direction can be arbitrarily changed according to the required number of chip accommodating portions. Further, the number of arrangements of the X-direction linear member and the Y-direction linear member in the Z direction can be arbitrarily changed according to the required depth of the chip accommodating portion.

In the illustrated embodiment, the side wall portion 15 is separable into two portions, a first side wall portion 18 and a second side wall portion 19, but may be separable into three or more portions.

The cross-sectional shape of each of the illustrated X-direction linear member and Y-direction linear member is circular, but may be semicircular, triangular, quadrangular, or other polygonal.

The jig for chip-shaped electronic components according to the present invention can be used not only in a firing process for manufacturing chip-shaped electronic components, but also in a plating process and the like.

X1 to X6 X-direction linear member Y1 to Y7 Y-direction linear member 11 Jig for chip-shaped electronic parts 12 Chip-shaped electronic parts 13 Chip storage part 14 Bottom wall part 15 Side wall part 16 First opening 17 Boundary part 18 First side wall Part 19 Second side wall part 20 Second opening 21 Head

Claims (10)

When the X and Y directions intersect each other and the Z direction is orthogonal to the X and Y directions.
A plurality of X-direction linear members each extending in the X direction and a plurality of Y-direction linear members each extending in the Y direction are provided.
The plurality of X-direction linear members and the plurality of Y-direction linear members are used to store one chip-shaped electronic component, and are arranged in two directions of the X direction and the Y direction. Chip storage is configured,
Each of the chip accommodating portions has a bottom wall portion that receives chip-shaped electronic components and a side wall portion that rises in the Z direction from the peripheral edge portion of the bottom wall portion.
The side wall portion forms a first opening for receiving the chip-shaped electronic component in the chip storage portion on the side opposite to the bottom wall portion.
The bottom wall portion is formed by at least one of the X-direction linear member and the Y-direction linear member that crosses the space in the side wall portion.
The side wall portion is formed of a plurality of the X-direction linear members arranged in the Z direction and a plurality of the Y-direction linear members arranged in the Z direction.
The side wall portion is formed into at least two portions, a first side wall portion having the first opening and a second side wall portion including the bottom wall portion, via a boundary portion at an intermediate position in the Z direction. It is said to be separable
The second side wall portion forms a second opening on the side opposite to the bottom wall portion.
The first opening and the second opening have the same shape and dimensions as each other, and are adjacent to each other in the Y direction of the plurality of X-direction linear members and adjacent to each other in the X direction of the plurality of Y-direction linear members. Has a rectangular shape defined by the thing,
Jig for chip-shaped electronic components. The jig for chip-shaped electronic components according to claim 1, wherein the X and Y directions are orthogonal to each other. The head of the chip-shaped electronic component received in the chip accommodating portion does not protrude from the first opening, but when the first side wall portion is removed, the head of the chip-shaped electronic component protrudes from the second opening, according to claim 1 or 2. Jig for chip-shaped electronic components described. The jig for chip-shaped electronic components according to any one of claims 1 to 3, wherein the Z-direction dimension of the first side wall portion is shorter than the Z-direction dimension of the second side wall portion. The jig for chip-shaped electronic components according to any one of claims 1 to 3, wherein the Z-direction dimension of the first side wall portion is longer than the Z-direction dimension of the second side wall portion. The jig for chip-shaped electronic components according to any one of claims 1 to 3, wherein the Z-direction dimension of the first side wall portion is equal to the Z-direction dimension of the second side wall portion. The first side wall portion and the second side wall portion are in direct contact with each other, and at the boundary portion, the X-direction linear member is located on one of the first side wall portion and the second side wall portion, and the X-direction linear member is located. The jig for a chip-shaped electronic component according to any one of claims 1 to 6, wherein the Y-direction linear member is located on the other side of the first side wall portion and the second side wall portion. The jig for a chip-shaped electronic component according to any one of claims 1 to 7, wherein the first opening and the second opening have a square shape. The jig for a chip-shaped electronic component according to any one of claims 1 to 8, wherein the X-direction linear member and the Y-direction linear member are made of ceramic. The jig for a chip-shaped electronic component according to any one of claims 1 to 9, wherein the X-direction linear member and the Y-direction linear member have a circular cross section.

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