JP3062441U - Transfer jig - Google Patents

Abstract

(57) [Problem] To provide a transfer jig capable of arranging minute three-dimensional structures having a complicated shape, capable of being manufactured at low cost, and having good processing accuracy. SOLUTION: A large number of spaces 12 for accommodating microstructures 13 are provided on the surface, and a large number of microstructures 1 mounted on the surface are provided.
In the transfer jig 11 in which the openings 3 are arranged in the space 12 by transfer, thin metal plates 11a, 11b, 11c, 11d, 11e, 11f having openings 12 formed by etching.
By superimposing a plurality of sheets and thermocompression bonding, a large number of spaces 12 in which three-dimensional microstructures 13 can be arranged were formed.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a transfer jig, and more particularly to a structure of a jig suitable for regularly arranging three-dimensional microstructures such as semi-finished products of chip-type electronic components.

[0002]

[Prior art]

 Conventionally, a transfer jig has been used to regularly arrange a large number of minute and complicated structures such as chip components. The transfer jig has a space for storing and arranging three-dimensional microstructures on a surface of a thick metal plate of, for example, several cm square. Then, a number of microstructures such as semi-finished products of chip-type electronic components were placed on the surface of the metal plate, and vibration was applied to the metal plate, so that the microstructure was provided on the surface of the metal plate. It is used to transfer into space and align regularly.

Various methods for forming a space for accommodating a large number of such microstructures can be considered as follows. For example, a method of punching a metal plate is conceivable. However, only a thin plate can be processed, and there is a problem in processing accuracy. When the plate is thick, processing is difficult. When drilling or milling is used, the processing accuracy is good, but it takes too much work and is costly. In addition, in one-way etching, since the etching depth is large, an etching inclination angle is formed in the depth direction, and there is a problem in processing accuracy.

[0004]

[Problems to be solved by the invention]

 The present invention has been made in view of the above-described circumstances, and provides a transfer jig capable of arranging minute three-dimensional structures having a complicated shape, capable of being manufactured at low cost, and having good processing accuracy. With the goal.

[0005]

[Means for Solving the Problems]

 The transfer jig of the present invention is provided with a large number of spaces for accommodating microstructures on its surface, and a transfer jig for arranging a large number of microstructures mounted on the surface in the space by transfer. A plurality of thin metal plates are stacked and thermocompression bonded to form a large number of spaces in which the three-dimensional microstructures can be arranged.

According to the present invention described above, an opening can be easily formed in a thin metal plate at low cost and with high precision by etching. By laminating the thin metal plates by thermocompression bonding, it is possible to easily manufacture a transfer jig having a space with good processing accuracy and capable of transferring a microstructure having a complicated shape. This makes it possible to easily and precisely perform transfer alignment of a microstructure having a complicated shape such as a chip component by using vibration and inclination.

[0007]

[Embodiment of the invention]

 Hereinafter, embodiments of the present invention will be described. FIG. 1 shows an outline of the transfer jig of the present invention. For example, a thick plate-shaped jig 11 is formed by thermocompression-bonding a plurality of thin stainless steel plates having a thickness of about 0.2 mm and having a large number of openings formed in a matrix by etching. . Since the opening of each thin metal plate is as thin as about 0.2 mm, it can be formed with high precision by ordinary etching. Openings are formed in the thin metal plates at equal pitches in a matrix. These are aligned and thermocompression-bonded to provide space for storing and aligning the micro three-dimensional structures. (Space) 12 is formed. According to such a configuration, the transfer can be restricted by using a different opening pattern from the other opening patterns for the thin metal plate. For example, by reducing the size of the opening in the lowermost metal plate, the structure can be supported on its upper surface, and can be fixed by vacuum suction. Therefore, thousands of structures are placed on the transfer jig shown in FIG. 1, and the jig is surrounded by a wall to vibrate and tilt the jig. Then, the structures are sucked into the thousands of spaces provided in the jig and aligned.

FIGS. 2A and 2B are enlarged cross-sectional views of a space in which a microstructure is stored. Since the openings of the thin metal plates 11a, 11b, 11c,... Are formed by etching, the upper side is slightly wider than the lower side, though slightly. Therefore, the three-dimensional microstructure can be easily transferred into each opening. In FIG. 2A, the openings of the thin metal plates 11a, 11b, 11c... Have the same diameter. For this reason, the opening 12 formed by thermocompression bonding of these thin metal plates has a straight circular shape as shown in the figure. On the other hand, in the case shown in FIG. 2B, each of the thin metal plates 11a, 11b, 11c... As the size increases, the size is adjusted to the diameter of the microstructure to be transferred. For this reason, by thermocompression-bonding each thin metal plate, the upper surface side is widened and narrowed toward the lower surface side, and the opening of the thin metal plate 11f on the lower end side is smaller than the diameter of the microstructure 13. A gap 12 can be formed. Therefore, since the opening on the upper surface side is wide as described above, it is easy to transfer the microstructure, and the lower end portion of the microstructure can be supported by the opening side walls of the thin metal plates 11d and 11e on the lower end side. The opening of the thin metal plate 11f smaller than the diameter of the microstructure 13 enables vacuum suction or the like to be performed, whereby the upper end portion of the microstructure 13 is accurately positioned, and is aligned upright. be able to .

Since the side end surfaces of the aligned structures are exposed in this manner, a thick film paste may be printed on this portion by screen printing. Alternatively, a film may be deposited by sputtering or the like with a mask applied. In the case of FIG. 2B, the lower end of the structure 13 may be sucked and supported by the opening, and the opening of another metal plate may be fitted to the upper end.

FIG. 3A shows an example of a structure to be transferred, which is, for example, a ceramic element used for a chip-type inductor element and has a size of 1.0 mm × 0.5 mm × 0. It is about 5 mm. (B) shows the shape of the opening viewed from the upper surface of the transfer jig, (c) shows a cross section along the line CC, (d) shows a cross section along the line DD, ( e) shows a cross section along the line EE. By forming a transfer jig by thermocompression bonding of such a thin metal plate, a microstructure having a complicated shape shown in (a) can be placed in a space precisely formed in this structure. It can be aligned with accurate alignment.

[0011]

[Effect of the invention]

 ADVANTAGE OF THE INVENTION According to this invention, many small and complicated-shaped structures, such as a chip component, can be accurately aligned and aligned. This makes it possible to perform batch processing for batch processing of a large number of semi-finished products in the manufacturing process of a microstructure such as a chip component, thereby significantly improving the productivity.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a transfer jig according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view of a space for accommodating the microstructure of FIG.

3A is a perspective view showing an example of a microstructure to be transferred, FIG. 3B is an enlarged top view of one opening of a transfer jig, and FIG. 3C is a view C of FIG. It is sectional drawing along the -C line, (d) is sectional drawing along the DD line of (b), (e) is sectional drawing along the EE line of (b). .

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 Transfer jig 12 Space (opening) 11a, 11b, 11c, 11d, 11e, 11f Thin metal plate 13 Microstructure

Claims (1)

[Utility model registration claims] 1. A transfer jig for providing a large number of spaces for accommodating microstructures on a surface thereof and arranging a large number of microstructures mounted on the surface in the space by transfer, wherein openings are formed by etching. A transfer jig wherein a plurality of thin metal plates are stacked and thermocompressed to form a large number of spaces in which the three-dimensional microstructures can be arranged.