JP5062844B2 - Manufacturing method of ceramic laminate - Google Patents

Description

  The present invention relates to a method for manufacturing a ceramic laminate in which a ceramic laminate is manufactured by laminating a plurality of ceramic green sheets and then firing.

  FIG. 16 is an exploded perspective view of a ceramic laminate 100 manufactured by a conventionally known method for manufacturing a ceramic laminate. According to the conventional method for manufacturing a ceramic laminate, the ceramic layer 101 shown at the top in FIG. 16 becomes the lowest layer when forming a laminate (temporary laminate) before firing. Therefore, the ceramic layer 101 is referred to as the lowermost layer 101. The lowermost layer 101 is made of a ceramic thin plate body 101a. No conductor film is formed on the upper surface of the lowermost layer 101. The intermediate layer 102 to the intermediate layer 109 include the ceramic thin plate bodies 102a to 109a and the conductor films 102b to 109b formed on the upper surfaces of the ceramic thin plate bodies 102a to 109a, respectively. The intermediate layer 109 is also referred to as the uppermost layer 109. The ceramic laminate 100 is a component in which these ceramic layers 101 to 109 are integrated by firing.

  In the conventional manufacturing method for manufacturing such a component, as shown in FIG. 17A, for example, a ceramic green sheet forming film made of PET (polyethylene terephthalate) (hereinafter also simply referred to as “forming film”). .) A lamination sheet 203 in which a ceramic green sheet 202 is formed on 201 is prepared.

  Next, as shown in FIG. 17B, in order to obtain a laminating sheet 205 (hereinafter also referred to as a “lowermost layer laminating sheet”) 205 that becomes the lowermost layer 101 of the ceramic laminate, a plurality of through holes are obtained. The holes 204 are formed in the lamination sheet 203 by punching with a mold. The through hole 204 is a hole through which a reference pin erected on the plate is inserted when a plurality of lamination sheets including the lowermost layer lamination sheet 205 are laminated.

  Similarly, as illustrated in FIG. 17C, a lamination sheet (hereinafter, also referred to as “intermediate layer lamination sheet” or “upper lamination sheet”) 206 to be the intermediate layers 101 to 109 is obtained. For this purpose, a plurality of through holes 204 and, if necessary, via holes 207 are formed in the lamination sheet 203 by punching with a mold. Further, as shown in FIG. 17D, a conductor film 208 having a predetermined pattern is formed on the intermediate layer lamination sheet 206. The conductor film 208 is formed on at least one of the plurality of intermediate layer laminating sheets 206 to be laminated.

  After these laminating sheets are prepared, the lowermost layer laminating sheet 205 is disposed on the plate 210 as shown in FIG. The plate 210 includes a plurality of reference pins 211 erected on the upper surface of the plate 210 and a plurality of suction through holes 212 penetrating the plate 210. When the lowermost layer laminating sheet 205 is disposed on the plate 210, the reference pin 211 is passed through the through hole 204 of the lowermost layer laminating sheet 205. The bottom layer laminating sheet 205 is formed so that the surface (exposed surface) of the ceramic green sheet 202 is in contact with the upper surface of the plate 210 (that is, the forming film 201 is positioned above the ceramic green sheet 202). 210 is arranged.

  Next, the lowermost layer stacking sheet 205 is sucked (fixed) to the plate 210 by being sucked toward the plate 210 through the suction through-hole 212. Thereafter, as shown in FIG. 18B, the forming film 201 of the lowermost layer laminating sheet 205 is peeled from the ceramic green sheet 202 of the lowermost layer laminating sheet 205. Next, as shown in FIG. 18C, the surface of the intermediate layer lamination sheet 206 on which the conductor film 208 is formed (the exposed surface of the ceramic green sheet 202), the upper surface of the lowermost layer lamination sheet 205, The intermediate layer laminating sheet 206 is disposed on the lowermost layer laminating sheet 205 so as to be in contact with each other. In this state, the intermediate layer laminating sheet 206 is heated and pressure bonded to the lowermost layer laminating sheet 205.

Thereafter, as shown in FIG. 19A, the forming film 201 of the intermediate layer laminating sheet 206 is peeled from the ceramic green sheet 202 of the intermediate layer laminating sheet 206. Thereafter, similarly, a desired number of intermediate layer lamination sheets 206 are laminated (see FIGS. 19B and 19C). After the lamination is completed, the laminated body is pulled out from the reference pin 211 and separated from the plate 210, and then the laminated body is baked (for example, see Patent Document 1).
Japanese Patent Laid-Open No. 9-104015

  Incidentally, in recent years, there has been a demand for forming a conductive film (and a via hole if necessary) having a highly accurate pattern on the surface of the lowermost layer 101 (the lowermost layer lamination sheet 205 after firing). Therefore, the inventor separated the laminated body laminated by the above-described conventional method from the plate 210, formed a conductor film on the surface of the lowermost layer, and then fired the laminated body. However, as shown by the “x” plot in FIG. 12, it was found that the conductor film is greatly displaced in the direction along the layer surface with respect to the conductor film of the other layer (in the example of FIG. 80 μm). When the laminate is separated from the reference pin 211, this misalignment is caused by the fact that the flatness of the surface of the lowermost layer deteriorates because the respective laminating sheets expand and contract and / or deform, and the flatness of the lowermost layer is not good. This is thought to be caused by printing a conductor film on the substrate.

  On the other hand, the inventor previously formed a conductor film on the lowermost layer laminating sheet 205, and then manufactured a laminate using the conventional method. However, even with this method, as shown by the “triangle” plot in FIG. 12, it was found that the lowermost conductor film is greatly displaced in the direction along the layer surface with respect to the other conductor films ( In the example of FIG. 12, about 40 μm).

This misalignment is considered to be due to the following reason.
(1) When the lowermost layer stacking sheet 205 is adsorbed to the plate 210, a part of the lowermost layer stacking sheet 205 is sucked into the suction through-hole 212. As a result, the lowermost layer lamination sheet 205 is deformed.
(2) The lowermost layer stacking sheet 205 is fixed to the plate 210 by suction. Therefore, the lowermost layer stacking sheet 205 is not completely adhered to the plate 210. Therefore, when the forming film 201 is peeled from the ceramic green sheet 202 of the lowermost layer laminating sheet 205, deformation such as wrinkles occurs in the ceramic green sheet 202 of the lowermost layer laminating sheet 205.

  Accordingly, an object of the present invention is to provide a method for manufacturing a ceramic laminate that can reduce the amount of positional deviation between a conductor film (and / or via hole) formed in the lowermost layer and a conductor film of another layer. There is to do.

The method for producing a ceramic laminate according to the present invention includes:
A method for manufacturing a ceramic laminate, in which a ceramic laminate is produced by laminating a plurality of ceramic green sheets and then firing, a plate preparation step for preparing a plate with a plurality of reference pins standing up, and a lowermost layer lamination Sheet preparation step, upper lamination sheet preparation step, and lower dummy sheet preparation step.

  The lowermost layer lamination sheet preparation step includes a ceramic green sheet molding film, a ceramic green sheet molded on the upper surface of the molding film, and a conductor film having a predetermined pattern formed on the upper surface of the ceramic green sheet. And it is the process of preparing the sheet | seat for lowermost layer lamination | stacking in which the multiple through-hole for allowing the said reference | standard pin to pass was formed.

  The upper laminate sheet preparation step includes a ceramic green sheet forming film and a ceramic green sheet formed on the upper surface of the forming film, and an upper portion formed with a plurality of through holes for allowing the reference pin to pass therethrough. In this step, a plurality of lamination sheets are prepared, and a conductor film having a predetermined pattern is formed on the exposed surface of the ceramic green sheet of at least one of the plurality of upper lamination sheets.

  The lower dummy sheet preparation step is a step of preparing a ceramic green sheet as a lower dummy sheet in which a plurality of through holes for allowing the reference pins to pass therethrough are formed.

  The plate is a base for laminating ceramic green sheets. The surface of the plate is flat. The reference pin is, for example, a cylinder having a central axis along a direction orthogonal to the surface of the plate. Since the ceramic green sheet of the lowermost layer lamination sheet and the ceramic green sheet of the upper lamination sheet are very thin, handling is not easy. Therefore, in the lowermost layer laminating sheet preparing step and the upper layer laminating sheet preparing step, the ceramic green sheet is formed on a ceramic green sheet forming film.

  A conductor film having a predetermined pattern is formed on the exposed surface (the surface not in contact with the forming film) of the ceramic green sheet of the lowermost layer lamination sheet. Furthermore, a via hole may be formed in the lowermost layer lamination sheet as necessary. A conductor film having a predetermined pattern is formed on the exposed surface of the ceramic green sheet of the upper lamination sheet as necessary. Furthermore, via holes may be formed in the upper lamination sheet as necessary. In other words, the conductor film is formed on at least one of the plurality of upper lamination sheets to be laminated. The conductor film can be formed by printing, for example. The via hole can be formed at the same time as the through hole, for example, by punching with a mold when forming the plurality of through holes.

  The thickness of the ceramic green sheet constituting the lower dummy sheet can be increased compared to the ceramic green sheets of the lamination sheets (the lowermost layer lamination sheet and the upper lamination sheet). Therefore, the lower dummy sheet does not need to be formed on the forming film.

  Furthermore, the manufacturing method of this ceramic laminated body includes a lower dummy sheet arrangement step, a lowermost layer lamination sheet arrangement step, a first thermocompression bonding step, and a first film peeling step.

  The lower dummy sheet placing step arranges the lower dummy sheet on the same plate so that the reference pin of the plate passes through the through hole of the lower dummy sheet, and the lower dummy sheet is placed on the same plate. And fixing. In this case, the lower dummy sheet can be fixed on the plate by suction and / or by adhesion. When the lower dummy sheet is fixed on the plate by suction, a suction through hole formed in the plate can be used for the suction.

  The lowermost layer stacking sheet disposing step is such that the reference pin of the plate is inserted through the through hole of the lowermost layer stacking sheet, and “the exposed surface of the ceramic green sheet of the lowermost layer stacking sheet” Is a step of arranging the lowermost layer stacking sheet on the lower dummy sheet so that “is in contact with the upper surface of the lower dummy sheet”.

  The first thermocompression bonding step is performed by applying a pressure in a direction from the upper part of the lowermost layer laminating sheet to the plate while heating the arranged lowermost layer laminating sheet. This is a step of pressure-bonding (heat-bonding) the lowermost layer lamination sheet to the lower dummy sheet.

  Thus, since the lowermost layer lamination sheet is heat-pressed against the lower dummy sheet, the lowermost layer lamination sheet is not deformed such as wrinkles. In addition, even if the lower dummy sheet is fixed to the plate by suction and the lower surface of the lower dummy sheet (contact surface with the plate) is uneven, for example, the thickness of the lower dummy sheet is set to be relatively large As a result, the upper surface of the lower dummy sheet is kept flat. As a result, since the deformation of the lowermost layer lamination sheet is difficult to occur, it is difficult for the conductor film formed on the lowermost layer lamination sheet to be misaligned.

  A said 1st film peeling process is a process of peeling the said film for shaping | molding of the said sheet | seat for lowermost layer lamination | stacked by the pressure bonding from the said ceramic green sheet of the sheet | seat for lowermost layer lamination | stacking. The lowermost layer laminating sheet is bonded to the lower dummy sheet with thermocompression bonding with uniform and appropriate strength. Accordingly, when the forming film is peeled from the ceramic green sheet of the lowermost layer lamination sheet, the ceramic green sheet is unlikely to be deformed such as wrinkles. As a result, since the deformation of the lowermost layer lamination sheet is difficult to occur, it is difficult for the conductor film formed on the lowermost layer lamination sheet to be misaligned.

  In addition, the method for manufacturing the ceramic laminate includes an upper lamination sheet arranging step, a second thermocompression bonding step, and a second film peeling step.

  The upper laminating sheet arranging step includes the step of inserting the reference pin of the plate through the through-hole of one of the plurality of upper laminating sheets, and “the same sheet of the ceramic green sheets. This is a step of arranging the same upper lamination sheet on the lowermost layer lamination sheet such that the “exposed surface” is in contact with the “surface of the lowermost layer lamination sheet from which the molding film has been peeled off”. “The surface from which the forming film of the lowermost layer lamination sheet is peeled” is “the exposed surface (upper surface) of the ceramic green sheet of the lowermost layer lamination sheet”.

  The second thermocompression bonding step is for applying the upper lamination by applying a pressure in the direction from the upper part of the upper lamination sheet toward the plate while heating at least the arranged upper lamination sheet. In this step, the sheet is pressure-bonded to the lowermost layer lamination sheet. Thus, since the upper lamination sheet is heat-pressed with respect to the lowermost lamination sheet, deformation such as wrinkles does not occur in the upper lamination sheet. As a result, when this upper lamination sheet is provided with a conductor film, the conductor film is less likely to be displaced.

  The second film peeling step is a step of peeling the molding film of the pressure-bonded upper lamination sheet from the ceramic green sheet of the upper lamination sheet. The upper lamination sheet is bonded to the lowermost lamination sheet by thermocompression bonding with uniform and appropriate strength. Accordingly, even when the forming film is peeled from the ceramic green sheet of the upper lamination sheet, the ceramic green sheet is unlikely to be deformed such as wrinkles.

  As described above, according to the method for manufacturing a ceramic laminate according to the present invention, deformation such as wrinkles does not occur not only in the ceramic green sheet of the upper lamination sheet but also in the ceramic green sheet of the lowermost lamination sheet. The positional deviation amount of the conductor film formed on the ceramic green sheet of the lamination sheet can be reduced.

  The method for producing a ceramic laminate further includes an upper sheet laminating step including an Nth upper laminating sheet arranging step, an Nth thermocompression bonding step, and an Nth film peeling step, which is repeatedly performed a plurality of times. It is preferable that

  In the N-th upper lamination sheet arranging step, the reference pin of the plate is inserted through the through hole of the N-th upper lamination sheet which is another one of the plurality of upper lamination sheets. In addition, “the exposed surface of the ceramic green sheet of the N-th upper laminated sheet” is “the molded film of the laminated ceramic green sheet that has already been pressure-bonded to the lower ceramic green sheet”. In this step, the N-th upper lamination sheet is placed on the laminated ceramic green sheet so as to be in contact with the “surface (upper surface)”.

  In the Nth thermocompression bonding step, a pressure in a direction from the top of the Nth upper lamination sheet toward the plate is applied to the Nth upper lamination sheet while heating at least the arranged Nth upper lamination sheet. This is a step of pressure-bonding the N-th upper lamination sheet to the laminated ceramic green sheet. In this manner, the Nth upper lamination sheet is heat-pressed against the laminated ceramic green sheet of the upper lamination sheet, so that the Nth upper lamination sheet is not deformed such as wrinkles.

  The Nth film peeling step is a step of peeling the pressure-bonding forming film of the Nth upper lamination sheet from the ceramic green sheet of the Nth upper lamination sheet. The N-th upper lamination sheet is bonded to the laminated ceramic green sheet with uniform and appropriate strength by thermocompression bonding. Therefore, even when the forming film is peeled from the ceramic green sheet of the Nth upper lamination sheet, the ceramic green sheet is unlikely to be deformed such as wrinkles.

  According to this, deformation such as wrinkles hardly occurs in any of the ceramic green sheets that are laminated and then fired to form a ceramic laminate. Therefore, “the amount of positional deviation between the conductor film formed on the lowermost layer stack sheet and the conductor film formed on at least one of the Nth upper layer stack sheets” is small and has the desired number of layers. A laminated body can be manufactured easily.

A method for producing a ceramic laminate including repeating the upper sheet lamination step a plurality of times,
A separation step of separating the laminated body laminated on the plate after repeatedly performing the upper sheet lamination step a required number of times;
A firing step of firing the laminate after the separation step;
A lower dummy sheet removing step of removing the lower dummy sheet after completion of the firing step;
Is preferably included.

  According to this, the laminated body is baked in a state where the lower dummy sheet is fixed to the laminated body composed of the lamination sheets (the lowermost layer lamination sheet and the upper lamination sheet). Therefore, by setting the composition of the lower dummy sheet to a composition that is less likely to expand and contract during firing than the ceramic green sheet of the lamination sheet, the amount of deformation during lamination of the laminate made of the lamination sheet (for lamination) The amount of change in the direction along the main surface of the sheet can be reduced. That is, the lower dummy sheet can also be used as a constraining layer in the constraining firing method. Furthermore, the lower dummy sheet can be easily removed from the sintered laminate by forming the lower dummy sheet from a composition that becomes brittle when the laminate comprising the lamination sheet is sintered.

On the other hand, the method for producing a ceramic laminate including repeating the upper sheet lamination step a plurality of times,
Separating the laminate laminated on the plate after repeatedly performing the upper sheet lamination step a required number of times and removing the lower dummy sheet from the laminate; and
A firing step of firing the laminate after the separation step;
May be included.

  In this case, by adjusting the amount of the binder contained in the lower dummy sheet, the bonding force between the lower dummy sheet and the lowermost layer lamination sheet generated by thermocompression bonding (in other words, the lower dummy sheet is the lowermost layer lamination sheet). The force necessary for peeling from the ceramic green sheet can be easily adjusted. Moreover, by adjusting the amount of the binder contained in the lower dummy sheet, the bonding force between the lower dummy sheet and the lowermost layer lamination sheet can be adjusted using the molding film for the lowermost layer lamination sheet. When peeling from the ceramic green sheet of the sheet, it can be easily adjusted to a strength that does not cause deformation of the ceramic green sheet of the lowermost layer lamination sheet.

  Further, the method for manufacturing a ceramic laminate including repeating the upper sheet lamination step a plurality of times not only arranges the lower dummy sheet on the lower surface of the laminate comprising the lamination sheets, but also arranges the upper dummy sheet of the laminate. By laminating on the upper surface and firing the laminated body together with the lower dummy sheet and the upper dummy sheet, the restraint firing described above can be more reliably realized.

  More specifically, the method for manufacturing the ceramic laminate includes an upper dummy sheet preparation step, an upper dummy sheet placement step, an upper dummy sheet thermocompression bonding step, a separation step, a firing step, and a dummy sheet removal step. It is preferable to include.

  The upper dummy sheet preparation step is a step of preparing a ceramic green sheet as an upper dummy sheet in which a plurality of through holes for allowing the reference pin to pass therethrough are formed. Similar to the lower dummy sheet, the upper dummy sheet can be made thicker than the ceramic green sheets of the lamination sheets (the lowermost layer lamination sheet and the upper lamination sheet). Therefore, the upper dummy sheet does not need to be formed on the forming film.

  In the upper dummy sheet arranging step, after the upper sheet stacking step is repeatedly performed a required number of times, the reference pin of the plate is inserted through the through hole of the upper dummy sheet and “one surface of the upper dummy sheet” "The upper dummy sheet of the laminated ceramic green sheet is contacted with the surface of the laminated ceramic green sheet that has already been pressure-bonded to the lower ceramic green sheet (the exposed surface)". It is a process of arranging on top.

In the upper dummy sheet thermocompression bonding step, the upper dummy sheet is applied by applying pressure in the direction from the upper part of the upper dummy sheet to the plate while heating the arranged upper dummy sheet. It is a step of pressure-bonding to the laminated ceramic green sheets.
The separation step is a step of separating the laminated body laminated on the plate after the upper dummy sheet thermocompression bonding step from the same plate.
The firing step is a step of firing the laminate after the separation step.
The removing step is a step of removing the lower dummy sheet and the upper dummy sheet after completion of the firing step.

  According to this, the laminated body which consists of a sheet | seat for lamination | stacking is fired in the state pinched | interposed into the lower dummy sheet and the upper dummy sheet. Therefore, the lower dummy sheet and the upper dummy sheet can be used as a constraining layer in the constraining firing method. Furthermore, not only the lower dummy sheet but also the upper dummy sheet is composed of a composition that becomes brittle at the time of completion of the sintering of the laminated body made of the laminating sheets, so that the lower dummy sheet and the upper dummy sheet are sintered. Can be easily removed.

  Another method for producing a ceramic laminate according to the present invention (hereinafter also referred to as “second production method” for convenience) includes the plate preparation step, the lowermost layer lamination sheet preparation step, the upper lamination sheet preparation step, And the said lower dummy sheet preparation process is included. Furthermore, the second manufacturing method is a sheet having a sticky expression surface that is sticky when heated by heating, and a plurality of through holes for allowing the reference pin to pass therethrough are formed. A step of preparing an adhesive expression sheet (adhesive expression sheet preparation step) is included.

  In addition, the second manufacturing method includes an adhesive expression sheet arranging step and a lower dummy sheet arranging step.

  In the adhesive expression sheet arranging step, the reference pin of the plate is inserted through the through-hole of the adhesive expression sheet, and the surface opposite to the adhesive expression surface is in contact with the upper surface of the plate. As described above, the adhesive expression sheet is disposed on the plate, and the adhesive expression sheet is fixed to the plate. In this case, the tacky expression sheet can be fixed on the plate by suction and / or by adhesion.

  In the lower dummy sheet arrangement step, in the state where the temperature is raised by heating the pressure-sensitive adhesive sheet (that is, in the state where the pressure-sensitive adhesive surface is made adhesive), the reference pin of the plate is the lower part The lower dummy sheet is disposed on the adhesive expression surface of the adhesive expression sheet so as to be inserted through the through-hole of the dummy sheet. Thereby, a lower dummy sheet | seat is joined to an adhesive expression sheet | seat by the adhesiveness which appeared on the adhesive expression surface. The thickness of the lower dummy sheet can be increased as compared with the ceramic green sheet of the lamination sheet. Therefore, even if the lower dummy sheet is disposed on the adhesive development sheet, even if wrinkles are generated on the lower surface of the lower dummy sheet due to the adhesiveness appearing on the adhesive development surface, the effect of the wrinkles is the lower dummy sheet. It is hard to appear on the top surface of.

  Furthermore, the second manufacturing method includes the lowermost layer lamination sheet arranging step, the first thermocompression bonding step, the first film peeling step, the upper lamination sheet arranging step, and the second thermocompression bonding step. And the second film peeling step.

  As described above, according to the second manufacturing method, the lowermost layer lamination sheet and the upper lamination sheet are laminated in a state where the adhesive expression sheet and the lower dummy sheet are present under the lowermost layer lamination sheet. . Therefore, even if the pressure-sensitive adhesive sheet is fixed to the plate by suction and the bottom surface of the pressure-sensitive adhesive sheet (the contact surface with the plate) has unevenness, the unevenness is caused by the pressure-sensitive adhesive sheet and the lower dummy sheet. Therefore, the upper surface of the lower dummy sheet maintains flatness. Furthermore, as described above, even when the lower dummy sheet is disposed on the adhesive development sheet, even if wrinkles occur on the lower surface of the lower dummy sheet due to the adhesiveness appearing on the adhesive expression surface, the effect of the wrinkles Is unlikely to appear on the upper surface of the lower dummy sheet. As a result, deformation such as wrinkles is less likely to occur in the ceramic green sheet of the lowermost layer lamination sheet. Therefore, it is possible to reduce the amount of displacement of the conductor film formed on the ceramic green sheet of the lowermost layer lamination sheet.

  Furthermore, the lowermost layer lamination sheet is bonded to the lower dummy sheet by thermocompression bonding with uniform and appropriate strength. Accordingly, when the forming film is peeled from the ceramic green sheet of the lowermost layer lamination sheet, the ceramic green sheet is unlikely to be deformed such as wrinkles. As a result, since the deformation of the lowermost layer stacking sheet hardly occurs, the amount of displacement of the conductor film of the lowermost layer stacking sheet can be further reduced.

  Also in the second manufacturing method, the upper sheet laminating step including the N-th upper laminating sheet arranging step, the N-th thermocompression bonding step, and the N-th film peeling step can be repeatedly performed a plurality of times.

  According to this, deformation such as wrinkles hardly occurs in any of the ceramic green sheets that are laminated and then fired to form a ceramic laminate. Therefore, “the amount of positional deviation between the conductor film formed on the lowermost layer stack sheet and the conductor film formed on at least one of the Nth upper layer stack sheets” is small and has the desired number of layers. A laminated body can be manufactured easily.

Furthermore, the second manufacturing method including repeating the upper sheet laminating step a plurality of times,
The upper sheet has been laminated body stacked in the plate lamination step after repeatedly executed by a required number of times away minutes from the plate, then, before SL adhesive expression sheets same laminate the adhesive expression sheet after cooling A separation step of separating from,
A firing step of firing the laminate after the separation step;
A lower dummy sheet removing step of removing the lower dummy sheet after completion of the firing step;
It is preferable to contain.

  When the pressure-sensitive adhesive sheet is cooled and the temperature is lowered, the pressure-sensitive adhesive sheet loses its adhesiveness (the adhesiveness of the pressure-sensitive adhesive surface disappears). Therefore, the adhesive expression sheet can be easily separated from the lower dummy sheet by the separation step. And in the said 2nd manufacturing method, since a lower dummy sheet is removed after baking the laminated body from which the adhesive expression sheet was isolate | separated, a lower dummy sheet can be used as a restraint layer in a restraint firing method. Even in this case, the lower dummy sheet can be easily removed from the sintered laminate by configuring the lower dummy sheet with a composition that becomes brittle when the laminate comprising the lamination sheets is sintered. .

On the other hand, the second manufacturing method including repeating the upper sheet lamination step a plurality of times,
The upper sheet has been laminated body stacked in the plate lamination step after repeatedly executed by a required number of times away minutes from the plate, then, before SL adhesive expression sheets same laminate the adhesive expression sheet after cooling And a separation step of removing the lower dummy sheet from the laminate,
A firing step of firing the laminate after the separation step;
May be included.

  Even in this case, as described above, by adjusting the amount of the binder contained in the lower dummy sheet, the bonding force between the lower dummy sheet and the lowermost layer lamination sheet generated by thermocompression bonding (in other words, the lower dummy sheet). The force required to peel the sheet from the ceramic green sheet of the lowermost layer lamination sheet) can be easily adjusted. Moreover, by adjusting the amount of the binder contained in the lower dummy sheet, the bonding force between the lower dummy sheet and the lowermost layer lamination sheet can be adjusted using the molding film for the lowermost layer lamination sheet. When peeling from the ceramic green sheet of the sheet, it can be easily adjusted to a strength that does not cause deformation of the ceramic green sheet of the lowermost layer lamination sheet.

  Further, in the second manufacturing method including repeating the upper sheet laminating step a plurality of times, not only the lower dummy sheet is disposed on the lower surface of the laminated body made of the laminating sheets, but also the upper dummy sheet is disposed on the upper surface of the laminated body. The above-described restraint firing can be more reliably realized by laminating the laminate and firing the laminate together with the lower dummy sheet and the upper dummy sheet.

More specifically, the second manufacturing method is:
An upper dummy sheet preparation step of preparing a ceramic green sheet as an upper dummy sheet in which a plurality of through-holes for passing the reference pin are formed;
After the upper sheet stacking step is repeatedly performed as many times as necessary, the reference pin of the plate is inserted into the through hole of the upper dummy sheet, and one surface of the upper dummy sheet is already crimped to the lower ceramic green sheet. An upper dummy sheet placement step of placing the upper dummy sheet on the laminated ceramic green sheet so that the molded film of the laminated ceramic green sheet is in contact with the peeled surface;
An upper part that presses the upper dummy sheet against the laminated ceramic green sheet by applying pressure in the direction from the upper part of the upper dummy sheet toward the plate while heating the arranged upper dummy sheet. Dummy sheet thermocompression bonding process;
including.

Furthermore, the second manufacturing method is:
After the upper dummy sheet heat pressing step is completed, the laminate which is stacked on the plate away minutes from the plate, then separated the adhesive expression sheet from the laminate prior SL adhesive expression sheet after cooling A separation process;
A firing step of firing the laminate after the separation step;
A dummy sheet removing step for removing the lower dummy sheet and the upper dummy sheet after the firing step;
Is preferably included.

  According to this, the laminated body which consists of a sheet | seat for lamination | stacking is fired in the state pinched | interposed into the lower dummy sheet and the upper dummy sheet. Therefore, the lower dummy sheet and the upper dummy sheet can be used as a constraining layer in the constraining firing method. Furthermore, not only the lower dummy sheet but also the upper dummy sheet is composed of a composition that becomes brittle at the time of completion of the sintering of the laminated body made of the laminating sheets, so that the lower dummy sheet and the upper dummy sheet are sintered. Can be easily removed.

Hereinafter, the manufacturing method of the ceramic laminated body which concerns on each embodiment of this invention is demonstrated, referring drawings. This ceramic laminate is, for example, an LTCC substrate (Low-Temperature).
Co-fired Ceramics) can be configured. The LTCC substrate is a ceramic multilayer substrate used for electronic devices such as a dielectric multilayer filter, a multilayer wiring substrate, a dielectric antenna, a dielectric coupler, and a dielectric composite module.

<Structure of ceramic laminate>
First, a ceramic laminate manufactured by the method for manufacturing a ceramic laminate according to each embodiment of the present invention will be described with reference to FIG. FIG. 1 is an exploded perspective view of the ceramic laminate 10.

According to the method for manufacturing a ceramic laminate according to each embodiment, the ceramic layer 11 shown in the uppermost part in FIG. 1 becomes the lowermost layer when the laminate before firing is formed. Therefore, the ceramic layer 11 is referred to as the lowermost layer 11 (or the first layer 11).
The lowermost layer 11 has a ceramic thin plate 11a and a conductor film 11b.
The ceramic thin plate 11a is a flat plate having a thickness of about 10 μm to 100 μm. The shape of the ceramic thin plate member 11a in a plan view is a rectangle (or a square).
The conductor film 11b is formed on one surface (the upper surface in FIG. 1) of the ceramic thin plate member 11a. The conductor film 11b has a predetermined pattern.

Similar to the lowermost layer 11, the upper layers (upper ceramic layers) 12 to 19 have ceramic thin plate bodies 12a to 19a and conductor films 12b to 19b, respectively.
Each of the ceramic thin plate bodies 12a to 19a has the same shape as the ceramic thin plate body 11a.
Each of the conductor films 12b to 19b has a predetermined pattern (a pattern unique to each layer), like the conductor film 11b.
The upper layer 19 is also referred to as the uppermost layer 19. Further, in the lowermost layer 11 and the upper layers 12 to 19, via holes (through holes filled with a conductive material for realizing electrical connection between the upper and lower layers) are formed as necessary.

  The laminated body 10 is a multilayer dielectric component manufactured by sequentially laminating ceramic green sheets constituting these ceramic layers 11 to 19 and firing and integrating the laminated body (temporary laminated body) ( Multilayer dielectric device). In addition, although the laminated body 10 consists of nine layers, the number of layers should just be two or more. Further, an IC chip (for example, a flip chip IC or a bare chip IC) may be disposed on the exposed surface of the fired and integrated laminate 10. Such a ceramic laminate 10 can constitute a so-called “LTCC module”.

<First embodiment (first manufacturing method)>
Next, the manufacturing method (first manufacturing method) of the ceramic laminate according to the first embodiment of the present invention will be described. This method for manufacturing a ceramic laminate includes the steps described below.

  Step 1: As shown in FIG. 2A, a ceramic green sheet forming film 21 (forming film) is prepared, and a ceramic green sheet 22 is formed on the upper surface of the forming film 21. Although the film 21 for shaping | molding is not specifically limited, In this example, it consists of PET (polyethylene terephthalate). The thickness of the forming film is about 10 μm to 100 μm. The thickness of the ceramic green sheet 22 is about 10 μm to 100 μm.

The ceramic green sheet 22 has, for example, a BaO—TiO ₂ —Nd ₂ O ₃ —Bi ₂ O ₃ -based composition of ZnO—SiO ₂ —B ₂ O ₃ as a composition that provides a high dielectric constant (relative dielectric constant of about 85). It can create from the material which mix | blended 2-5 mass% of system glass. In addition, the ceramic green sheet 22 has, for example, a BaO—Al ₂ O ₃ —SiO ₂ —Bi ₂ O ₃ -based composition of ZnO—SiO ₂ —B ₂ as a composition that provides a low dielectric constant (relative dielectric constant of about 7). It can also be made from a material containing 2 to 5% by mass of O ₃ glass.

Step 2: As shown in FIG. 2B, the forming film 21 and the ceramic green sheet 22 are cut along the cutting line CL. As a result, as shown in FIG. 2C, a rectangular cut piece 23 is obtained in plan view.
Step 3: The cut piece 23 is punched and formed into a predetermined shape by a mold to obtain a plurality of lamination sheets 24 shown in FIG. 2D and FIG. At the time of punching with this mold, a plurality (four in this example) of through-holes 24a and a plurality (four in this example) or a single via hole 24b are simultaneously formed as necessary. That is, the through holes 24 a are formed in all the lamination sheets 24. On the other hand, the via hole 24b is formed only in the lamination sheet 24 that constitutes the ceramic layer that requires the via hole 24b. The shape of the through hole 24a in a plan view is a circle.

  FIG. 4A is a perspective view of the plate 30 used when laminating the laminating sheets 24. FIG. 4B is a longitudinal sectional view of the plate 30. The plate 30 includes a base portion 31 and a plurality (four in this example) of reference pins 32 erected on the base portion 31. The base part 31 is a metal plate. The upper surface of the base part 31 is flat. The reference pin 32 is a metal cylinder having a central axis along a direction orthogonal to the upper surface of the base portion 31. The reference pin 32 is integrated with the base part 31. A plurality of through holes 31 a for suction penetrating in the thickness direction of the base portion 31 are formed in the base portion 31. The suction through holes 31a are linearly arranged between two reference pins 32 and 32 adjacent to each other with a shortest distance in a plan view. The plate 30 is prepared separately in the plate preparation process.

  The diameter of the through hole 24 a formed in step 3 is substantially the same as the diameter of the reference pin 32. Further, in a plan view, the relative positions between the plurality of through holes 24 a coincide with the relative positions between the plurality of reference pins 32. Accordingly, the positions of the plurality of through holes 24 a in one lamination sheet 24 coincide with the positions of the plurality of through holes 24 a in the other lamination sheet 24. On the other hand, the via holes 24b are formed in a predetermined position and a predetermined number according to which layer of the lowermost layer 11 and the upper layers 12 to 19 the stacking sheet 24 in which the via holes 24b are formed later becomes.

  Step 4: As shown in FIG. 3, the conductor film 24c is formed on the surface of the ceramic green sheet 22 of the laminating sheet 24 (the exposed surface of the ceramic green sheet 22, the surface opposite to the surface in contact with the forming film 21). Is formed by printing. The conductor film 24c is formed so as to have a predetermined pattern according to which layer of the lowermost layer 11 and the upper layers 12 to 19 the lamination sheet 24 on which the conductor film 24c is formed later becomes. As described above, it is not necessary to form the conductor film 24 c on all the lamination sheets 24. However, a conductor film 24 c is formed on the lamination sheet 24 that is to constitute the lowermost layer 11. The conductor film 24c is made of silver (Ag). The conductor film 24c may be formed of, for example, another conductive metal such as copper (Cu) and conductive cermet.

  Steps 1 to 4 include a ceramic green sheet forming film 21, a ceramic green sheet 22 formed on the upper surface of the forming film 21, and a conductor film 24 c having a predetermined pattern formed on the upper surface of the ceramic green sheet 22. , And a lowermost layer stacking sheet preparation step for preparing a lowermost layer stacking sheet 24 in which a plurality of through holes 24a for allowing the reference pin 32 to pass therethrough is prepared.

  Further, Step 1 to Step 4 include a ceramic green sheet forming film 21 and a ceramic green sheet 22 formed on the upper surface of the forming film 21, and a penetration for allowing the reference pin 32 to pass therethrough. A plurality of upper lamination sheets 24 having a plurality of holes 24a are prepared, and a conductor film 24c having a predetermined pattern is formed on the exposed surface of the ceramic green sheet 22 of at least one of the plurality of upper lamination sheets 24. It also constitutes an upper lamination sheet preparation step.

  Step 5: Prepare at least two lower dummy sheets 40 shown in FIG. The lower dummy sheet 40 is made of alumina. The material of the lower dummy sheet 40 is selected so as not to sinter and become extremely brittle when the ceramic green sheet 22 of the laminating sheet 24 is sintered in the firing step described later. That is, the lower dummy sheet 40 is a hardly sinterable ceramic green sheet. Furthermore, the material of the lower dummy sheet 40 is adjusted so that it is less likely to deform (elongate and / or shrink) than the ceramic green sheet 22 when the ceramic green sheet 22 is fired. The thickness of the lower dummy sheet 40 is about several times the thickness of the ceramic green sheet 22 (for example, about 100 μm). The lower dummy sheet 40 may be formed of, for example, magnesia, zirconia, spinel or the like in addition to alumina.

  The lower dummy sheet 40 can be made thicker than the ceramic green sheet 22 of the laminating sheet 24. Therefore, the lower dummy sheet 40 has such a strength that it can be handled without being molded on the molding film 21. The lower dummy sheet 40 is formed by punching out sheet-like alumina to be the lower dummy sheet 40 with a mold. At this time, the lower dummy sheet 40 is formed to have substantially the same outer diameter shape as the lamination sheet 24 and to have a plurality of through holes 40a. The shape of the through hole 40a is the same as the shape of the through hole 24a. The plurality of through holes 40 a are formed such that the relative positions between the plurality of through holes 40 a coincide with the relative positions between the plurality of reference pins 32.

  This step 5 corresponds to a lower dummy sheet preparation step of preparing a ceramic green sheet as the lower dummy sheet 40 in which a plurality of through holes 40a for allowing the reference pin 32 to pass therethrough are formed. Further, one of the lower dummy sheets 40 prepared in step 5 is also used as an upper dummy sheet 50 described later. Therefore, Step 5 corresponds to an upper dummy sheet preparation process.

Step 6: As shown in FIGS. 6A and 6B, the lower dummy sheet 40 is disposed on the base 31 of the plate 30. At this time, the lower dummy sheet 40 is arranged such that the reference pin 32 is inserted through the through hole 40 a of the lower dummy sheet 40.
Step 7: As indicated by the arrow in FIG. 6B, the lower dummy sheet 40 is sucked downward (in the direction from the lower dummy sheet 40 toward the base portion 31 of the plate 30) through the suction through hole 31a. Thereby, the lower dummy sheet 40 is attracted (fixed) to the base portion 31 of the plate 30.

  As described above, in step 6 and step 7, the lower dummy sheet 40 is arranged on the plate 30 (base portion 31) so that the reference pin 32 of the plate 30 passes through the through hole 40 a of the lower dummy sheet 40. This corresponds to the lower dummy sheet placement step of fixing the lower dummy sheet 40 to the plate 30 (base portion 31).

  Step 8: As shown in FIGS. 7A and 7B, a lamination sheet (lowermost layer lamination sheet, first layer) to be the lowermost layer 11 among the lamination sheets 24 created in Step 1 to Step 4. (Lamination sheet) 41 is disposed on the lower dummy sheet 40. At this time, the lowermost layer laminating sheet 41 has the exposed surface of the ceramic green sheet 22 of the lowermost layer laminating sheet 41 such that the reference pin 32 of the plate 30 passes through the through hole 24a of the lowermost layer laminating sheet 41. (One surface of the lowermost layer lamination sheet 41 on which the conductor film 24c is formed) of the lower dummy sheet 40 so as to be in contact with the upper surface of the lower dummy sheet 40 (the exposed surface opposite to the base portion 31). Placed on top. Step 8 corresponds to the lowermost layer stacking sheet arranging step.

  Step 9: In this state, the lowermost layer lamination sheet 41, the lower dummy sheet 40 and the plate 30 are heated while the pressure in the direction from the upper part of the lowermost layer lamination sheet 41 toward the base portion 31 of the plate 30 is laminated. By adding to the sheet 41 for use, the lowermost layer lamination sheet 41 is pressure-bonded (heat-bonded) to the lower dummy sheet 40. This step 9 is also referred to as a first thermocompression bonding process.

  Thus, since the lowermost layer lamination sheet 41 is heat-pressed to the lower dummy sheet 40, the lowermost layer lamination sheet 41 is not deformed such as wrinkles. In addition, when the lower dummy sheet 40 is fixed to the base portion 31 of the plate 30 by suction, unevenness may occur on the lower surface of the lower dummy sheet 40 (the contact surface with the base portion 31). However, even in this case, since the thickness of the lower dummy sheet 40 can be set relatively large, the upper surface of the lower dummy sheet 40 maintains flatness. As a result, since the deformation of the lowermost layer laminating sheet 41 hardly occurs, the displacement of the conductor film 24c of the lowermost layer laminating sheet 41 hardly occurs.

  Step 10: As shown in FIGS. 8A and 8B, the forming film 21 of the lowermost layer laminating sheet 41 is peeled from the ceramic green sheet 22 of the lowermost layer laminating sheet 41. This step 10 is also referred to as a first film peeling step.

  The lowermost layer laminating sheet 41 is bonded to the lower dummy sheet 40 with uniform and appropriate strength by thermocompression bonding. Therefore, when the molding film 21 is peeled from the ceramic green sheet 22 of the lowermost layer lamination sheet 41, the ceramic green sheet 22 is unlikely to be deformed such as wrinkles. As a result, since the deformation of the lowermost layer laminating sheet 41 (ceramic green sheet 22) hardly occurs, the displacement of the conductor film 24c of the lowermost layer laminating sheet 41 hardly occurs.

  Step 11: As shown in FIGS. 9A and 9B, the lowermost layer laminating sheet 41 from which the molding film 21 is peeled off the laminating sheet (upper laminating sheet, second laminating sheet) 42. It arrange | positions on (ceramic green sheet 22). The laminating sheet 42 is a sheet that becomes the upper layer 12 shown in FIG. 1 among the laminating sheets 24 created in steps 1 to 4. At this time, the upper lamination sheet 42 is arranged so that the reference pin 32 of the plate 30 passes through the through hole 24 a of the upper lamination sheet 42. Further, the upper laminating sheet 42 has the exposed surface of the ceramic green sheet 22 of the upper laminating sheet 42 (the surface on which the conductor film 24c is formed when the conductor film 24c is formed) as the lowermost layer laminating sheet. It arrange | positions so that the surface (the exposed surface of the ceramic green sheet 22 of the lowermost layer lamination | stacking sheet | seat 41) from which the film 21 for shaping | molding 41 was peeled may be touched. This step 11 is one of the upper lamination sheet arranging steps.

  Step 12: In this state, the upper lamination sheet 42, the lowermost lamination sheet 41, the lower dummy sheet 40, and the plate 30 are heated in the direction from the upper part of the upper lamination sheet 42 toward the base portion 31 of the plate 30. Pressure is applied to the upper laminate sheet 42. As a result, the upper lamination sheet 42 is thermocompression bonded to the ceramic green sheet 22 of the lowermost lamination sheet 41. This step 12 is also referred to as a second thermocompression bonding process. As described above, the upper lamination sheet 42 is heat-pressed against the lowermost lamination sheet 41, and thus the upper lamination sheet 42 is not deformed such as wrinkles. As a result, when the upper lamination sheet 42 includes the conductor film 24c, the conductor film 24c of the upper lamination sheet 42 is unlikely to be displaced.

  Step 13: As shown in FIGS. 10A and 10B, the molding film 21 of the upper lamination sheet 42 is peeled from the ceramic green sheet 22 of the upper lamination sheet 42. This step 13 is also referred to as a second film peeling step.

  The upper laminating sheet 42 is bonded to the lowermost laminating sheet 41 with uniform and appropriate strength by thermocompression bonding. Therefore, even when the molding film 21 is peeled from the ceramic green sheet 22 of the upper lamination sheet 42, the ceramic green sheet 22 is unlikely to be deformed such as wrinkles. As a result, when the upper lamination sheet 42 includes the conductor film 24c, the conductor film 24c of the upper lamination sheet 42 is unlikely to be displaced.

  Step 14: The upper sheet laminating process including the same steps as Step 11 to Step 13 is repeatedly executed a plurality of times. As a result, the upper lamination sheet 49 corresponding to the uppermost layer 19 shown in FIG. 1 is laminated on the laminated ceramic green sheet, and the molding film 21 is peeled off. That is, the upper sheet lamination step includes an Nth upper lamination sheet arranging step, an Nth thermocompression bonding step, and an Nth film peeling step, which will be described below.

  The N-th upper lamination sheet arrangement step is one of a plurality of lamination sheets 24 (upper lamination sheet) and is an N-th upper lamination sheet (for example, a lamination sheet 24 that has not yet been laminated) This is a step of disposing a laminated sheet scheduled to constitute the upper layer 15 on a laminated ceramic green sheet (in this case, a laminated sheet scheduled to constitute the upper layer 14). At this time, the Nth upper lamination sheet has the reference pin 32 inserted through the through hole 24a of the Nth upper lamination sheet and the “exposed surface of the ceramic green sheet 22 of the Nth upper lamination sheet”. “A laminated ceramic green sheet (in this case, the upper layer 14 is scheduled to be formed) that has already been pressure-bonded to the lower ceramic green sheet (in this case, the ceramic green sheet of the upper laminated sheet that is to form the upper layer 13) 22. The ceramic green sheet of the upper laminated sheet) 22 is disposed on the laminated ceramic green sheet so as to be in contact with the surface from which the forming film 21 is peeled off.

  In the Nth thermocompression bonding step, while the plate 30, the lower dummy sheet 40, the laminated ceramic green sheet, and the Nth upper lamination sheet are heated, the base portion 31 of the plate 30 is formed from the upper part of the Nth upper lamination sheet. In this step, the N-th upper lamination sheet is pressure-bonded to the laminated ceramic green sheets by applying a pressure in the direction toward the N-th upper lamination sheet.

  The Nth film peeling step is a step of peeling the molding film 21 of the Nth upper lamination sheet from the ceramic green sheet 22 of the Nth upper lamination sheet.

  In this way, the Nth upper lamination sheet is thermocompression bonded to the laminated ceramic green sheet (the upper lamination sheet from which the forming film has been peeled), so that the Nth upper lamination sheet is arranged and molded. No deformation such as wrinkles occurs in the ceramic green sheet 22 of the Nth upper lamination sheet when the film 21 is peeled off. As a result, when the conductor film 24c is formed on the Nth upper lamination sheet, the conductor film 24c is unlikely to be misaligned.

  Step 15: As shown in FIG. 11, the upper dummy sheet 50 is placed on the upper lamination sheet 49 from which the molding film 21 has been peeled off. That is, in step 15, after the upper sheet laminating process is repeatedly performed a required number of times, the reference pin 32 is inserted through the through hole 40a of the upper dummy sheet 50, and the “one surface of the upper dummy sheet 50” is “ The surface from which the molding film 21 of the laminated ceramic green sheet (the ceramic green sheet 22 of the upper lamination sheet 49) which has already been pressure-bonded to the lower ceramic green sheet (the ceramic green sheet 22 of the upper lamination sheet 48) has been peeled off " This corresponds to the upper dummy sheet placement step of placing the upper dummy sheet 50 on the laminated ceramic green sheet so as to be in contact therewith.

  Step 16: While heating the plate 30, the lower dummy sheet 40, the laminating sheets 41 to 49 and the upper dummy sheet 50, the pressure in the direction from the upper part of the upper dummy sheet 50 toward the base part 31 of the plate 30 is changed to the upper dummy sheet. Add to 50. As a result, the upper dummy sheet 50 is pressure-bonded to the laminated ceramic green sheet (the ceramic green sheet 22 of the upper lamination sheet 49). This step 16 corresponds to the upper dummy sheet thermocompression bonding step. The stacking process is completed by the steps described above.

Step 17: Separate the laminate (pre-firing laminate) laminated on the base 31 of the plate 30 from the plate 30. That is, the suction using the suction through hole 31 a is stopped, and the laminate is pulled out from the reference pin 32. This step 17 is also referred to as a separation process.
Step 18: The laminated body separated from the plate 30 is fired. Step 18 corresponds to a firing process. Firing conditions (firing temperature and firing time) are set so that the laminate of the laminating sheets 41 to 49 is sintered and the lower dummy sheet 40 and the upper dummy sheet 50 are not sintered.
Step 19: After firing, the lower dummy sheet 40 and the upper dummy sheet 50 are removed from the fired laminate (sintered body). The lower dummy sheet 40 and the upper dummy sheet 50 are removed by a method such as wet blasting, sand blasting, water jet, or ultrasonic cleaning. This step 19 corresponds to a removal process.

  According to this, the laminated body which consists of the sheet | seats 41-49 for lamination | stacking is fired in the state pinched | interposed into the lower dummy sheet 40 and the upper dummy sheet 50. FIG. Therefore, the lower dummy sheet 40 and the upper dummy sheet 50 can be used as a constraining layer in the constraining firing method. Furthermore, the lower dummy sheet 40 and the upper dummy sheet 50 are made of a composition that becomes brittle when the lamination of the laminated sheets 41 to 49 is completed, thereby firing the lower dummy sheet 40 and the upper dummy sheet 50. It can be easily removed from the bonded laminate (ceramic laminate 10).

  Thus, the ceramic laminate 10 is manufactured. FIG. 12 shows the measurement results when the shape of the ceramic laminate 10 manufactured in this way is a square shape having a side of 220 mm and the thicknesses of the lower dummy sheet 40 and the upper dummy sheet 50 are 100 μm. Show. In this ceramic laminate 10, as shown by the plot of “open circle” in FIG. 12, the positional deviation in the direction along the layer surface with respect to the conductor films 12 b to 19 b of the other layers of the conductor film 11 b of the lowermost layer 11. The amount (in this case, about 15 μm) was much smaller than the amount of displacement in the case of the conventional manufacturing method indicated by the “x” or “triangle” plot.

  In the above experiment, when the thicknesses of the lower dummy sheet 40 and the upper dummy sheet 50 are 100 μm, respectively, the positional displacement amount in the plane of the lowermost layer 11 (the positional displacement amount of the conductor film 11b of the lowermost layer 11) is 15 μm. It was. On the other hand, the same ceramic laminate 10 is manufactured by changing the thickness of the lower dummy sheet 40 and the upper dummy sheet 50 (hereinafter simply referred to as “dummy sheet thickness”). Was measured. As a result, it has been found that the “in-plane positional deviation amount of the lowermost layer 11” varies greatly depending on the dummy sheet thickness. That is, when the dummy sheet thickness is 50 μm, the positional deviation amount is 18 μm, when the dummy sheet thickness is 200 μm, the positional deviation amount is 10 μm, and when the dummy sheet thickness is 400 μm, the positional deviation amount is 8 μm.

  Furthermore, when the dummy sheet thickness is 50 μm or less, there arises a problem that it becomes difficult to handle the dummy sheets (the lower dummy sheet 40 and the upper dummy sheet 50). Specifically, if the dummy sheet thickness is 50 μm or less, the dummy sheet cannot be handled without the PET film (the same film as the molding film described above), and if the dummy sheet is forcibly handled without providing the PET film, The sheet is torn and wrinkled. On the other hand, the thicker the dummy sheet, the more difficult it is to control the thickness with accuracy. That is, when the thickness of the dummy sheet is larger than 400 μm, the difference between the thickness at one end of the dummy sheet and the thickness at the other end becomes excessive, and the flatness of the dummy sheet is impaired. As a result, the upper layer is laminated. It is difficult to apply a constant pressure when doing so. From the above, it is desirable that at least the lower dummy sheet 40 has a thickness of 50 μm or more and 400 μm or less. Further, the thickness of the upper dummy sheet 50 is more preferably 50 μm or more and 400 μm or less.

  As described above, according to the method for manufacturing a ceramic laminate according to the first embodiment, since the lower dummy sheet 40 is employed, not only the ceramic green sheets of the upper lamination sheets 42 to 49 but also the lowermost layer lamination. No deformation such as wrinkles occurs in the ceramic green sheet of the sheet 41 for use. Accordingly, between the conductor film 24c (11b) formed on the ceramic green sheet of the lowermost layer lamination sheet 41 and the conductor film 24c (12b-19b) formed on the ceramic green sheet of the upper lamination sheets 42 to 49. A ceramic laminate with a small amount of displacement is easily manufactured.

<First Modification of First Embodiment>
In the manufacturing method according to the first embodiment, the lower dummy sheet 40 and the upper dummy sheet 50 are used as a constraining layer in the constraining firing method. On the other hand, even if the laminated body in which the upper dummy sheet 50 is omitted is fired by omitting the lamination process of the upper dummy sheet 50 (upper dummy sheet preparation process, upper dummy sheet arrangement process, and upper dummy sheet thermocompression bonding process). Good. That is, only the lower dummy sheet 40 can be used as a constraining layer in the constraining firing method. Also in this case, by forming the lower dummy sheet 40 from a composition that becomes brittle when the lamination of the lamination sheets 41 to 49 is completed, a laminated body (ceramic laminate) obtained by sintering the lower dummy sheet 40 is obtained. It can be easily removed from the body 10).

<Second Modification of First Embodiment>
In the manufacturing method according to the first embodiment, the lower dummy sheet 40 and the upper dummy sheet 50 are used as a constraining layer in the constraining firing method. On the other hand, the lower dummy sheet 40 and the upper dummy sheet 50 are removed from the laminated body after being separated from the plate 30 and before firing, and the lower dummy sheet 40 (and the upper dummy sheet 50) are removed. The laminated ceramic body 10 may be manufactured by firing the laminated body.

  In this case, by adjusting the amount of the binder contained in the lower dummy sheet 40 and the upper dummy sheet 50, the bonding force by the thermocompression bonding between the lower dummy sheet 40 and the lowermost layer lamination sheet 41 and the upper dummy sheet 50 It is possible to easily adjust the bonding force by thermocompression bonding with the uppermost layer stacking sheet 49. According to this, the lower dummy sheet 40 and the upper dummy sheet 50 can be easily removed from the laminate before firing. Further, the bonding force between the lower dummy sheet 40 and the lowermost layer laminating sheet 41 is deformed to the ceramic green sheet 22 of the lowermost layer laminating sheet 41 when the molding film 21 of the lowermost layer laminating sheet 41 is peeled off. It is possible to easily adjust the strength to such a level that does not occur. The upper dummy sheet stacking step (upper dummy sheet preparing step, upper dummy sheet arranging step, and upper dummy sheet thermocompression bonding step) is omitted to create a stacked body in which the upper dummy sheet 50 is omitted, and the stacked body is plate-shaped. After separating from 30, the ceramic laminate 10 may be manufactured by removing the lower dummy sheet 40 from the laminate in a stage before firing and firing the laminate from which the lower dummy sheet 40 has been removed.

<Second Embodiment (Second Manufacturing Method)>
Next, the manufacturing method (2nd manufacturing method) of the ceramic laminated body which concerns on 2nd Embodiment of this invention is demonstrated. The second production method is the above-mentioned only in that the adhesive expression sheet is disposed between the base portion of the plate and the lower dummy sheet, and the adhesive expression sheet is removed before firing the laminate. This is different from the manufacturing method according to the embodiment (first manufacturing method). Therefore, the following description will focus on such differences.

  Also in the second manufacturing method, the step of preparing the plate 30, the stacking sheet preparation step (step 1 to step 4) (the lowermost layer stacking sheet preparation step, the upper stacking sheet preparation step), and the lower part of step 5 above A dummy sheet preparation step is performed. The second production method further includes a step of preparing the adhesive expression sheet (adhesive expression sheet during heating) 60 shown in FIG.

  The adhesive expression sheet 60 is a sheet provided with an adhesive expression surface 61 that becomes adhesive when heated by heating. A plurality of through holes 60 a for allowing the plurality of reference pins 32 to pass through are formed in the adhesive expression sheet 60. The shape of the through hole 60a is the same as the shape of the through hole 24a. The plurality of through holes 60 a are formed such that the relative positions between the plurality of through holes 60 a coincide with the relative positions between the plurality of reference pins 32. The shape of the adhesive expression sheet 60 in plan view is the same as that of the lamination sheet 24.

The second manufacturing method includes the following steps 21 to 23 in place of the lower dummy sheet arranging step (step 6 and step 7) of the first manufacturing method.
Step 21: As shown in FIG. 14, the adhesive expression sheet 60 is disposed on the base portion 31 of the plate 30, and the adhesive expression sheet 60 is lowered (adhesive expression sheet) through the suction through-hole 31a. (In a direction from 60 toward the base 31). Thereby, the adhesive expression sheet 60 is adsorbed (fixed) to the base portion 31 of the plate 30. At this time, the adhesive expression sheet 60 is such that the reference pin 32 of the plate 30 passes through the through hole 60a of the adhesive expression sheet 60, and the surface opposite to the adhesive expression surface 61 is the base of the plate 30. It arrange | positions so that the upper surface of the part 31 may be contact | connected. Step 21 is referred to as an adhesive expression sheet arranging step.

Step 22: The temperature is raised by heating the pressure-sensitive adhesive sheet 60 so that the upper surface (the pressure-sensitive adhesive surface 61) of the pressure-sensitive adhesive sheet is expressed.
Step 23: In this state, the lower dummy sheet 40 is placed on the adhesive expression sheet 60 (that is, on the adhesive expression surface 61). At this time, the lower dummy sheet 40 is disposed such that the reference pin 32 of the plate 30 passes through the through hole 40a of the lower dummy sheet 40. The lower dummy sheet 40 is joined to the adhesive expression sheet 60 by the adhesiveness appearing on the adhesive expression surface 61. This step 23 corresponds to a lower dummy sheet arrangement process.

  The lower dummy sheet 40 can be made thicker than the ceramic green sheet 22 of the laminating sheet 24. Therefore, even if the lower dummy sheet 40 is disposed on the adhesive expression sheet 60, even if wrinkles are generated on the lower surface of the lower dummy sheet 40 due to the adhesiveness appearing on the adhesive expression surface 61, the influence of the wrinkles. Is unlikely to appear on the upper surface of the lower dummy sheet 40.

  Thereafter, in the second manufacturing method, the same stacking as in the first manufacturing method is performed. That is, as shown in FIG. 15, the lowermost layer laminating sheet 41 is disposed on the upper surface of the lower dummy sheet 40 in the lowermost layer laminating sheet arranging step, and the lowermost layer laminating sheet 41 is disposed in the lower dummy in the first thermocompression bonding step. The sheet 40 is thermocompression bonded. In the first film peeling step, the ceramic green sheet forming film 21 of the lowermost layer laminating sheet 41 is peeled from the ceramic green sheet 22 of the lowermost layer laminating sheet 41.

  Thus, in the second manufacturing method, the lowermost layer laminating sheet 41 is laminated on the adhesive expression sheet 60 and the lower dummy sheet 40. Therefore, even if the pressure-sensitive adhesive expression sheet 60 is fixed to the base portion 31 of the plate 30 by suction, unevenness is generated on the lower surface (contact surface with the base portion 31) of the pressure-sensitive adhesive sheet 60. Since the unevenness is absorbed by the adhesive expression sheet 60 and the lower dummy sheet 40, the upper surface of the lower dummy sheet 40 maintains flatness. As a result, the ceramic green sheet 22 of the lowermost layer laminating sheet 41 is less likely to be deformed such as wrinkles. Therefore, between the conductor film 24c (11b) formed on the ceramic green sheet 22 of the lowermost layer lamination sheet 41 and the conductor film 24c (12b-19b) formed on the ceramic green sheet of the upper lamination sheets 42 to 49. Can be made even more difficult to occur.

  Thereafter, as shown in FIG. 15, the above-described Nth upper sheet stacking step is repeatedly performed a required number of times. Thereby, the upper lamination sheets 42 to 49 are laminated. Next, the upper dummy sheet 50 is further laminated and thermocompression bonded to the upper part of the upper lamination sheet 49.

Furthermore, the second manufacturing method includes steps 24 and 25 in place of step 17 of the first manufacturing method.
Step 24: The laminated body laminated on the plate 30 is separated from the plate 30. That is, the suction using the suction through hole 31 a is stopped, and the laminate is pulled out from the reference pin 32.
Step 25: The adhesive expression sheet 60 is cooled, and the adhesive expression sheet 60 is separated from the laminate. The adhesive expression sheet 60 loses its adhesiveness when it is cooled and the temperature is lowered. Therefore, in this step 25, the adhesive expression sheet 60 can be easily separated from the laminate. Steps 24 and 25 are also called separation processes.

  Thereafter, the laminate is fired, and the lower dummy sheet 40 and the upper dummy sheet 50 are removed after the firing is finished. As described above, also in the second manufacturing method, since the lower dummy sheet 40 and the upper dummy sheet 50 are removed after the laminate is fired, the lower dummy sheet 40 and the upper dummy sheet 50 are used as constraining layers in the restraint firing method. be able to. Also in this case, the lower dummy sheet 40 and the upper dummy sheet 50 are made of a composition that becomes brittle when the lamination of the lamination sheets 41 to 49 is completed. 50 can be easily removed from the sintered laminate (ceramic laminate 10).

  Thus, the ceramic laminate 10 is manufactured. In this ceramic laminate 10, as shown by the “square” plot in FIG. 12, the amount of displacement in the direction along the layer surface relative to the conductor films 12b to 19b of the other layers of the conductor film 11b of the lowermost layer 11 (this In the case of several μm) was much smaller than the amount of displacement in the case of the conventional manufacturing method indicated by the plot of “x” or “triangle”.

  As described above, according to the second manufacturing method, due to the presence of the adhesive expression sheet 60 and the lower dummy sheet 40, the ceramic green sheet of the lowermost layer stacking sheet 41 is more unlikely to be deformed. Therefore, between the conductor film 24c (11b) formed on the ceramic green sheet of the lowermost layer lamination sheet 41 and the conductor film 24c (12b-19b) formed on the ceramic green sheet 22 of the upper lamination sheets 42 to 49. Can be made even more difficult to occur.

  In addition, the inventor arranges the adhesive expression sheet 60 on the upper surface of the base portion 31 of the plate 30, and adheres the lowermost layer laminating sheet 41 with the adhesive expression sheet 60 heated and heated. A method of directly arranging on the expression sheet 60 was also examined. However, according to this method, as shown by the plot of “black circle” in FIG. 12, the positional deviation in the direction along the layer surface with respect to the conductor films 12 b to 19 b of the other layers of the conductor film 11 b of the lowermost layer 11. The amount became relatively large. This is because when the lowermost layer laminating sheet 41 is disposed on the adhesive expression sheet 60, the lowermost layer laminating sheet 41 is bonded to the adhesive expression sheet 60 due to the adhesiveness of the adhesive expression sheet 60. This is presumed to be due to this.

<First Modification of Second Embodiment>
In the manufacturing method according to the second embodiment, the lower dummy sheet 40 and the upper dummy sheet 50 are used as a constraining layer in the constraining firing method. On the other hand, even if the laminated body in which the upper dummy sheet 50 is omitted is fired by omitting the lamination process of the upper dummy sheet 50 (upper dummy sheet preparation process, upper dummy sheet arrangement process, and upper dummy sheet thermocompression bonding process). Good. That is, only the lower dummy sheet 40 can be used as a constraining layer in the constraining firing method. In this case as well, the lower dummy sheet 40 is made of a composition that becomes brittle when the lamination of the laminates 41 to 49 is completed, so that the lower dummy sheet 40 is sintered (ceramic laminate). 10) can be easily removed.

<Second Modification of Second Embodiment>
In the manufacturing method according to the second embodiment and the first modification of the second embodiment, the lower dummy sheet 40 and the upper dummy sheet 50 are used as constraining layers in the constraining firing method. On the other hand, the lower dummy sheet 40 and the upper dummy sheet 50 are removed from the laminated body after being separated from the plate 30 and before firing, and the lower dummy sheet 40 and the upper dummy sheet 50 are removed. The ceramic laminate 10 may be manufactured by firing the laminate.

  In this case, by adjusting the amount of the binder contained in the lower dummy sheet 40 and the upper dummy sheet 50, the bonding force by the thermocompression bonding between the lower dummy sheet 40 and the lowermost layer lamination sheet 41 and the upper dummy sheet 50 The joining force by thermocompression bonding with the uppermost layer stacking sheet 49 can be easily adjusted. According to this, the lower dummy sheet 40 and the upper dummy sheet 50 can be easily removed from the laminate before firing. Further, by adjusting the amount of the binder contained in the lower dummy sheet 40, the bonding force between the lower dummy sheet 40 and the lowermost layer laminating sheet 41 is peeled off from the molding film 21 of the lowermost layer laminating sheet 41. In this case, the strength of the ceramic green sheet 22 of the lowermost layer stacking sheet 41 can be easily adjusted to such a degree that no deformation occurs. Also in the second manufacturing method, a laminated body in which the upper dummy sheet 50 is omitted is created by omitting the upper dummy sheet stacking step (upper dummy sheet preparation step, upper dummy sheet placement step, and upper dummy sheet thermocompression bonding step). Then, after separating the laminated body from the plate 30, the adhesive development sheet 60 is further separated from the laminated body, and the lower dummy sheet 40 is removed from the laminated body, and the laminated body from which the lower dummy sheet 40 is removed is removed. The ceramic laminate 10 may be manufactured by firing.

  As described above, according to the manufacturing method according to each embodiment of the present invention, the conductor film (and / or via hole) formed in the lowermost layer of the multilayer body and the conductor film (and / or via hole) of another layer are used. ) Can be effectively reduced. In addition, this invention is not limited to said each embodiment, A various modification can be employ | adopted within the scope of the present invention. For example, the thickness of the plurality of lamination sheets may be different from each other. Furthermore, as described above, it is not necessary that a conductor film is formed on all of the ceramic layers constituting the ceramic laminate 10, and the lowermost layer and a plurality of upper layers positioned above the lowermost layer are not required. It suffices if a conductive film is disposed on at least one layer. In addition, the shape of the lamination sheet in plan view may be a shape other than a rectangle such as a circle and an oval. Further, the diameters of the plurality of reference pins 32 of the plate 30 may be different from each other. In that case, the diameter of the through-hole for inserting the reference hole formed in each lamination sheet is also different. In addition, the cross-sectional shape of the reference pin 32 and the shape of the through hole 24a, the through hole 40a, and the through hole 60a in a plan view may be other than a circle. Furthermore, the lower dummy sheet 40 in the first manufacturing method and the adhesive expression sheet 60 in the second manufacturing method may be bonded and fixed to the base portion 31 by adhesion.

It is a disassembled perspective view of the ceramic laminated body manufactured by the manufacturing method of the ceramic laminated body which concerns on each embodiment of this invention. It is a figure for demonstrating the process of the manufacturing method of the ceramic laminated body which concerns on 1st Embodiment of this invention. It is a top view of the sheet | seat for lamination | stacking produced in the middle step of the manufacturing method of the ceramic laminated body which concerns on 1st Embodiment of this invention. (A) is a perspective view of the plate used when laminating | stacking the sheet | seat for lamination | stacking in the manufacturing method of the ceramic laminated body which concerns on 1st Embodiment of this invention, (B) is a longitudinal cross-sectional view of the same plate. It is a perspective view of the lower dummy sheet created in the middle of the manufacturing method of the ceramic layered product concerning a 1st embodiment of the present invention. It is a figure for demonstrating one process of the manufacturing method of the ceramic laminated body which concerns on 1st Embodiment of this invention, (A) is a perspective view of a plate and a lower dummy sheet, (B) is a plate and a lower dummy sheet FIG. It is a figure for demonstrating other one process of the manufacturing method of the ceramic laminated body which concerns on 1st Embodiment of this invention, (A) is a perspective view of a plate, a lower dummy sheet, etc., (B) is a plate and It is a longitudinal cross-sectional view of a lower dummy sheet or the like. It is a figure for demonstrating another process of the manufacturing method of the ceramic laminated body which concerns on 1st Embodiment of this invention, (A) is a perspective view of a plate, a lower dummy sheet, etc., (B) is a plate and a lower part. It is a longitudinal cross-sectional view of a dummy sheet or the like. It is a figure for demonstrating another process of the manufacturing method of the ceramic laminated body which concerns on 1st Embodiment of this invention, (A) is a perspective view of a plate, a lower dummy sheet, etc., (B) is a plate and a lower part. It is a longitudinal cross-sectional view of a dummy sheet or the like. It is a figure for demonstrating another process of the manufacturing method of the ceramic laminated body which concerns on 1st Embodiment of this invention, (A) is a perspective view of a plate, a lower dummy sheet, etc., (B) is a plate and a lower part. It is a longitudinal cross-sectional view of a dummy sheet or the like. It is a longitudinal cross-sectional view of the plate, the lower dummy sheet, the sheet | seat for lamination | stacking, and an upper dummy sheet for demonstrating another process of the manufacturing method of the ceramic laminated body which concerns on 1st Embodiment of this invention. The method for manufacturing the ceramic laminate according to the first and second embodiments of the present invention and the other layers of the lowermost conductor film in each case of manufacturing the ceramic laminate by the conventional method for manufacturing a ceramic laminate It is the graph which showed the amount of position shift to a conductor film. It is a perspective view of the adhesive expression sheet created in the middle of the manufacturing method of the ceramic layered product concerning a 2nd embodiment of the present invention. It is a longitudinal cross-sectional view of the plate and adhesive expression sheet | seat in one process of the manufacturing method of the ceramic laminated body which concerns on 2nd Embodiment of this invention. It is a longitudinal cross-sectional view of the plate for describing the other process of the manufacturing method of the ceramic laminated body which concerns on 2nd Embodiment of this invention, an adhesive expression sheet, a lower dummy sheet, a sheet for lamination, and an upper dummy sheet. It is a disassembled perspective view of the ceramic laminated body manufactured by the manufacturing method of the conventional ceramic laminated body. It is a figure for demonstrating the process of the manufacturing method of the conventional ceramic laminated body. It is a figure for demonstrating the process of the manufacturing method of the conventional ceramic laminated body. It is a figure for demonstrating the process of the manufacturing method of the conventional ceramic laminated body.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Ceramic laminated body, 11-19 ... Ceramics layer (11 ... Lowermost layer, 12-19 ... Intermediate layer, 19 ... Uppermost layer), 11a-19a ... Ceramic thin plate, 11b-19b ... Conductor film, 21 ... Ceramic green Sheet forming film, 22 ... ceramic green sheet, 23 ... cut piece, 24 ... laminate sheet, 24a ... through hole, 24b ... via hole, 24c ... conductor film, 30 ... plate, 31 ... base, 31a ... for suction Through hole, 32 ... reference pin, 40 ... lower dummy sheet, 40a ... through hole, 41 ... sheet for lowermost layer lamination, 42-49 ... sheet for intermediate layer lamination, 50 ... upper dummy sheet, 60 ... adhesive expression sheet, 60a ... through hole, 61 ... adhesive surface.

Claims (11)

A method for producing a ceramic laminate, wherein a ceramic laminate is produced by firing after laminating a plurality of ceramic green sheets,
A plate preparation step of preparing a plate with a plurality of reference pins standing upright;
A ceramic green sheet forming film, a ceramic green sheet formed on the upper surface of the forming film, and a conductor film having a predetermined pattern formed on the upper surface of the ceramic green sheet, and for passing the reference pin A bottom layer stacking sheet preparation step of preparing a bottom layer stacking sheet in which a plurality of through holes are formed;
Preparing a plurality of upper lamination sheets each having a ceramic green sheet forming film and a ceramic green sheet formed on the upper surface of the forming film and having a plurality of through holes for allowing the reference pin to pass therethrough; An upper lamination sheet preparation step of forming a conductor film of a predetermined pattern on the exposed surface of the ceramic green sheet of at least one of the plurality of upper lamination sheets;
A lower dummy sheet preparation step of preparing a ceramic green sheet as a lower dummy sheet in which a plurality of through-holes for passing the reference pin are formed;
A lower dummy sheet placement step for placing the lower dummy sheet on the same plate and fixing the lower dummy sheet to the same plate so that the reference pin of the plate passes through the through hole of the lower dummy sheet. When,
The reference pin of the plate is inserted through the through hole of the lowermost layer lamination sheet, and the exposed surface of the ceramic green sheet of the lowermost layer lamination sheet is in contact with the upper surface of the lower dummy sheet. A lowermost layer lamination sheet arrangement step of arranging the lower layer lamination sheet on the lower dummy sheet;
The lowermost layer laminating sheet is applied to the lowermost layer laminating sheet by applying a pressure in the direction from the upper part of the lowermost layer laminating sheet to the plate while heating the arranged lowermost layer laminating sheet. A first thermocompression bonding step for crimping the dummy sheet;
A first film peeling step of peeling off the molding film of the pressure-bonded lowermost layer lamination sheet from the ceramic green sheet of the lowermost layer lamination sheet;
The reference pin of the plate is inserted through the through hole of one of the plurality of upper lamination sheets, and the exposed surface of the ceramic green sheet of the same sheet is the one of the lowermost lamination sheet. An upper laminating sheet arranging step of arranging the same upper laminating sheet on the lowermost laminating sheet so as to contact the surface from which the forming film is peeled off,
Applying a pressure in a direction from the upper part of the upper laminating sheet to the plate while heating the arranged upper laminating sheet, the upper laminating sheet is made to be the lowermost laminating sheet. A second thermocompression bonding step for crimping to
A second film peeling step of peeling the pressure-bonding film of the upper laminated sheet from the ceramic green sheet of the upper laminated sheet;
The manufacturing method of the ceramic laminated body containing this. In the manufacturing method of the ceramic laminated body of Claim 1,
The lower dummy sheet has a thickness of 50 μm or more and 400 μm or less. A method for producing a ceramic laminate according to claim 1,
The ceramic green of the Nth upper lamination sheet so that the reference pin of the plate is inserted through the through hole of the Nth upper lamination sheet which is another one of the plurality of upper lamination sheets. The Nth upper laminating sheet is placed on the laminated ceramic green sheet so that the exposed surface of the sheet is in contact with the surface of the laminated ceramic green sheet that has already been pressure-bonded to the lower ceramic green sheet. Nth upper lamination sheet arrangement step to be arranged in,
Applying pressure in the direction from the top of the Nth upper lamination sheet to the plate while heating at least the Nth upper lamination sheet, the Nth upper lamination sheet An Nth thermocompression bonding step of crimping the sheet to the laminated ceramic green sheet;
An N-th film peeling step of peeling the pressure-bonding film of the N-th upper lamination sheet from the ceramic green sheet of the N-th upper lamination sheet;
The manufacturing method of the ceramic laminated body which repeatedly performs the upper sheet | seat lamination process which consists of these several times. A method for producing a ceramic laminate according to claim 3,
A separation step of separating the laminated body laminated on the plate after repeatedly performing the upper sheet lamination step a required number of times;
A firing step of firing the laminate after the separation step;
A lower dummy sheet removing step of removing the lower dummy sheet after completion of the firing step;
The manufacturing method of the ceramic laminated body containing this. A method for producing a ceramic laminate according to claim 3,
Separating the laminate laminated on the plate after repeatedly performing the upper sheet lamination step a required number of times and removing the lower dummy sheet from the laminate; and
A firing step of firing the laminate after the separation step;
The manufacturing method of the ceramic laminated body containing this. A method for producing a ceramic laminate according to claim 3,
An upper dummy sheet preparation step of preparing a ceramic green sheet as an upper dummy sheet in which a plurality of through-holes for passing the reference pin are formed;
After the upper sheet stacking step is repeatedly performed as many times as necessary, the reference pin of the plate is inserted into the through hole of the upper dummy sheet, and one surface of the upper dummy sheet is already crimped to the lower ceramic green sheet. An upper dummy sheet placement step of placing the upper dummy sheet on the laminated ceramic green sheet so that the molded film of the laminated ceramic green sheet is in contact with the peeled surface;
An upper part that presses the upper dummy sheet against the laminated ceramic green sheet by applying pressure in the direction from the upper part of the upper dummy sheet toward the plate while heating the arranged upper dummy sheet. Dummy sheet thermocompression bonding process;
A separation step of separating the laminated body laminated on the plate after the upper dummy sheet thermocompression bonding step;
A firing step of firing the laminate after the separation step;
A dummy sheet removing step for removing the lower dummy sheet and the upper dummy sheet after the firing step;
The manufacturing method of the ceramic laminated body containing this. A method for producing a ceramic laminate, wherein a ceramic laminate is produced by firing after laminating a plurality of ceramic green sheets,
A plate preparation step of preparing a plate with a plurality of reference pins standing upright;
Preparing a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive surface that is tacky when heated by heating on one surface and having a plurality of through-holes for passing the reference pin; ,
A ceramic green sheet forming film, a ceramic green sheet formed on the upper surface of the forming film, and a conductor film having a predetermined pattern formed on the upper surface of the ceramic green sheet, and for passing the reference pin A bottom layer stacking sheet preparation step of preparing a bottom layer stacking sheet in which a plurality of through holes are formed;
Preparing a plurality of upper lamination sheets each having a ceramic green sheet forming film and a ceramic green sheet formed on the upper surface of the forming film and having a plurality of through holes for allowing the reference pin to pass therethrough; An upper lamination sheet preparation step of forming a conductor film of a predetermined pattern on the exposed surface of the ceramic green sheet of at least one of the plurality of upper lamination sheets;
A lower dummy sheet preparation step of preparing a ceramic green sheet as a lower dummy sheet in which a plurality of through-holes for passing the reference pin are formed;
The adhesive expression sheet is attached to the plate so that the reference pin of the plate passes through the through-hole of the adhesive expression sheet and the surface opposite to the adhesive expression surface is in contact with the upper surface of the plate. Adhesive expression sheet placement step for fixing the adhesive expression sheet to the same plate while being arranged on the top,
In a state where the temperature is raised by heating the pressure-sensitive adhesive sheet, the lower dummy sheet is attached to the pressure-sensitive adhesive sheet so that the reference pin of the plate passes through the through hole of the lower dummy sheet. A lower dummy sheet placement step to be placed on the expression surface;
The reference pin of the plate is inserted through the through hole of the lowermost layer lamination sheet, and the exposed surface of the ceramic green sheet of the lowermost layer lamination sheet is in contact with the upper surface of the lower dummy sheet. A lowermost layer lamination sheet arrangement step of arranging the lower layer lamination sheet on the lower dummy sheet;
The lowermost layer laminating sheet is applied to the lowermost layer laminating sheet by applying a pressure in the direction from the upper part of the lowermost layer laminating sheet to the plate while heating the arranged lowermost layer laminating sheet. A first thermocompression bonding step for crimping the dummy sheet;
A first film peeling step of peeling off the molding film of the pressure-bonded lowermost layer lamination sheet from the ceramic green sheet of the lowermost layer lamination sheet;
The reference pin of the plate is inserted through the through hole of one of the plurality of upper lamination sheets, and the exposed surface of the ceramic green sheet of the same sheet is the one of the lowermost lamination sheet. An upper laminating sheet arranging step of arranging the same upper laminating sheet on the lowermost laminating sheet so as to contact the surface from which the forming film is peeled off,
Applying a pressure in a direction from the upper part of the upper laminating sheet to the plate while heating the arranged upper laminating sheet, the upper laminating sheet is made to be the lowermost laminating sheet. A second thermocompression bonding step for crimping to
A second film peeling step of peeling the pressure-bonding film of the upper laminated sheet from the ceramic green sheet of the upper laminated sheet;
The manufacturing method of the ceramic laminated body containing this. A method for producing a ceramic laminate according to claim 7,
The ceramic green of the Nth upper lamination sheet so that the reference pin of the plate is inserted through the through hole of the Nth upper lamination sheet which is another one of the plurality of upper lamination sheets. The Nth upper laminating sheet is placed on the laminated ceramic green sheet so that the exposed surface of the sheet is in contact with the surface of the laminated ceramic green sheet that has already been pressure-bonded to the lower ceramic green sheet. Nth upper lamination sheet arrangement step to be arranged in,
Applying pressure in the direction from the top of the Nth upper lamination sheet to the plate while heating at least the Nth upper lamination sheet, the Nth upper lamination sheet An Nth thermocompression bonding step of crimping the sheet to the laminated ceramic green sheet;
An N-th film peeling step of peeling the pressure-bonding film of the N-th upper lamination sheet from the ceramic green sheet of the N-th upper lamination sheet;
The manufacturing method of the ceramic laminated body which repeatedly performs the upper sheet | seat lamination process which consists of these several times. A method for producing a ceramic laminate according to claim 8,
The upper sheet has been laminated body stacked in the plate lamination step after repeatedly executed by a required number of times away minutes from the plate, then, before SL adhesive expression sheets same laminate the adhesive expression sheet after cooling A separation step of separating from,
A firing step of firing the laminate after the separation step;
A lower dummy sheet removing step of removing the lower dummy sheet after completion of the firing step;
The manufacturing method of the ceramic laminated body containing this. A method for producing a ceramic laminate according to claim 8,
The upper sheet has been laminated body stacked in the plate lamination step after repeatedly executed by a required number of times away minutes from the plate, then, before SL adhesive expression sheets same laminate the adhesive expression sheet after cooling And a separation step of removing the lower dummy sheet from the laminate,
A firing step of firing the laminate after the separation step;
The manufacturing method of the ceramic laminated body containing this. A method for producing a ceramic laminate according to claim 8,
An upper dummy sheet preparation step of preparing a ceramic green sheet as an upper dummy sheet in which a plurality of through-holes for passing the reference pin are formed;
After the upper sheet stacking step is repeatedly performed as many times as necessary, the reference pin of the plate is inserted into the through hole of the upper dummy sheet, and one surface of the upper dummy sheet is already crimped to the lower ceramic green sheet. An upper dummy sheet placement step of placing the upper dummy sheet on the laminated ceramic green sheet so that the molded film of the laminated ceramic green sheet is in contact with the peeled surface;
An upper part that presses the upper dummy sheet against the laminated ceramic green sheet by applying pressure in the direction from the upper part of the upper dummy sheet toward the plate while heating the arranged upper dummy sheet. Dummy sheet thermocompression bonding process;
After the upper dummy sheet heat pressing step is completed, the laminate which is stacked on the plate away minutes from the plate, then separated the adhesive expression sheet from the laminate prior SL adhesive expression sheet after cooling A separation process;
A firing step of firing the laminate after the separation step;
A dummy sheet removing step for removing the lower dummy sheet and the upper dummy sheet after the firing step;
The manufacturing method of the ceramic laminated body containing this.

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