JP6136207B2 - Transfer jig and method of manufacturing electronic component using the same - Google Patents

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer jig and a method of manufacturing an electronic component using the same, and in particular, for example, a conductive type for an external electrode on an end face of a chip-type electronic component body for forming an electronic component such as a ceramic capacitor. The present invention relates to a transfer jig used when applying a paste, and an electronic component manufacturing method using the same.

  Chip-type electronic parts typified by ceramic capacitors are used in electronic devices such as mobile phones and portable music players. Such an electronic component generally includes a rectangular parallelepiped ceramic body having internal electrodes and external electrodes connected to internal electrodes drawn out at both end faces in the longitudinal direction of the ceramic body.

  For example, an alignment pallet is used to form external electrodes at the longitudinal ends of the ceramic body. The alignment pallet 1 includes a flat hard plate 2 as shown in FIG. A plurality of alignment holes 3 are regularly formed on one main surface of the hard plate 2. The alignment hole 3 has such a size that the chip-like electronic component element body 4 can be inserted vertically, and a mortar-shaped taper 5 is formed at the upper end of the alignment hole 3. A vent hole 6 smaller than the area of the end face of the electronic component element body 4 is formed at the center of the bottom surface of the alignment hole 3. The depth of the alignment hole 3 is formed shallower than the length of the electronic component element body 4.

  When the electronic component element body 4 is transferred to the alignment pallet 1, the electronic component element body 4 is fitted into the alignment hole 3 in the vertical direction and sucked through the vent hole 6. It is held upright in the alignment hole 3. At this time, one end side of the electronic component element body 1 in the longitudinal direction protrudes from the upper surface of the hard plate 2.

  Next, a holding plate having an adhesive surface is prepared, and the adhesive surface of the holding plate is pressed against the end surface of the electronic component element body 4 protruding from the hard plate 2. Thereby, the end surfaces of the plurality of electronic component bodies 4 are adhesively held by the holding plate, and all the electronic component bodies 4 can be removed from the alignment plate 1 at the same time. At this time, the plurality of electronic component bodies 4 are held by the holding plate in the same direction, and the end face in the longitudinal direction of the electronic component body 4 is exposed toward the outside of the holding plate. Therefore, by immersing the exposed end surface of the electronic component element body 4 in an electrode paste tank for forming an external electrode, the electrode paste can be applied simultaneously to the end surfaces of the plurality of electronic component element bodies 4 (Patent Literature). 1).

JP 2005-333000 A

  When the electronic component element body enters the alignment pallet, as shown in FIG. 12, the electronic component element body may enter obliquely with respect to the alignment hole. At this time, if the corners of the electronic component element body are fitted into the ventilation holes, the electronic component element element body may be bitten into the alignment hole and held (diagonal lock). In such a case, in a later process, the electronic component element body may not be transferred to the holding plate, or the electronic component element body may be transferred to the holding plate in an inclined state. If the transfer of the electronic component element is not successful, the electronic component element remains in the alignment pallet, and it is necessary to blow off the electronic component element from the alignment pallet with an air gun or the like. Further, when the electronic component element body is held on the holding plate in an oblique state, the electrode paste cannot be applied cleanly to the end face of the electronic component element body. Therefore, the external electrode cannot be formed on the end face of the electronic component element body as designed.

Therefore, a main object of the present invention is to provide a transfer jig capable of holding all electronic component bodies in the same direction without causing diagonal lock.
Another object of the present invention is to provide an electronic component manufacturing method capable of forming external electrodes as designed on the end surfaces of all electronic component bodies using the transfer jig of the present invention. It is.

The present invention provides a transfer jig for holding one end side in the longitudinal direction of a transferred electronic component element body so that the other end side in the longitudinal direction of the electronic component element body is exposed, and a plurality of substrates A flat base, a recess formed on one main surface of the base and housing the other end in the longitudinal direction of the electronic component body, and a bottom surface of the recess. A position formed in the base, where the opening at the bottom of the recess includes only one through-hole that is smaller than the area of the longitudinal end surface of the electronic component body, and the opening of the through-hole is off the center of the bottom of the recess It is a transfer jig characterized by being formed.
The other end side in the longitudinal direction of the electronic component element body is housed in the recess, and the one end side in the longitudinal direction of the electronic component element body is exposed from the recess by sucking through the through-hole opened in the bottom surface of the recess. The element body for electronic parts is held by the transfer jig. At this time, since the opening of the through hole is formed at a position deviated from the center of the bottom surface of the recess, the corner of the electronic component element is not inclined even when the electronic component element is inclined in the recess. It can prevent fitting in the opening part of a through-hole. Therefore, even if the electronic component element body is inclined in the recess, the posture of the electronic component element body can be corrected to be in an upright state in the recess by suction through the through hole. . Therefore, all the electronic component bodies can be held on the transfer jig in the same posture.

Further, the present invention is a method for manufacturing an electronic component using the above-described transfer jig, wherein the end surface on the other end side in the longitudinal direction of the electronic component body transferred to the recess is sucked from the through hole. The step of holding the other end side in the longitudinal direction of the electronic component body, the step of preparing a holder having an adhesive surface, and the end surface of one end side in the longitudinal direction of the electronic component element body on the adhesive surface of the holder The step of sticking and holding, the step of removing the electronic component element body held by the holder from the transfer jig, and the end surface on the other end side in the longitudinal direction of the electronic component element body are immersed in a conductive paste tank to conduct electricity Applying an adhesive paste. A method for manufacturing an electronic component.
By holding the electronic component element body using the above-described transfer jig, it is possible to hold all the electronic component element bodies in the same posture. Therefore, by holding the end face on one end side in the longitudinal direction of the electronic component body exposed from the transfer jig with the adhesive surface of the holder, all the electronic component bodies are held on the holder in the same posture. can do. In this state, the conductive paste is applied to the end surfaces of all the electronic component bodies as designed by immersing the exposed end surfaces of the electronic component bodies in the conductive paste tank. can do.

In such an electronic component manufacturing method, a step of preparing another holder having an adhesive surface having a higher adhesiveness than the adhesive surface of the holder, and a longitudinal direction of the electronic component body to which the conductive paste is applied are provided. A step of adhering and holding the end surface on the other end side with an adhesive surface of another holder, a step of removing an end surface on one end side in the longitudinal direction of the electronic component element body from the holder, and a longitudinal direction of the electronic component element body A step of immersing an end face on one end side in a conductive paste tank and applying the conductive paste.
Since all the electronic component bodies are held on the adhesive surface of the holder in the same posture, the end surface of the electronic component body to which the conductive paste is applied adheres to another holder that has a strong adhesive force. By holding on the surface, all the electronic component bodies can be transferred to another holder in the same posture. At this time, the electronic component element body held by another holding tool is held such that the end face to which the conductive paste is not applied is exposed. Therefore, by immersing the end face of the electronic component element body that is held and exposed by another holder in the conductive paste, the conductive paste as designed on the end faces of both ends in the longitudinal direction of the electronic component element body Can be applied.

  According to this invention, in the recess of the transfer jig, the electronic component element body is in an upright state without being held obliquely, and all the electronic component element bodies are exposed in one end side in the longitudinal direction. The other end side can be held. Therefore, the electronic component element body can be transferred to the holder in a state in which all the electronic component element bodies are aligned, and can be transferred from the holder to another holder. Therefore, the conductive paste is applied to the end face of the electronic component element body while the electronic component element body is held by the holder, and the electronic component element body is held by another holder. By applying the conductive paste to another end face of the component element body, the conductive paste can be applied to the end faces of all the electronic component element bodies as designed. Therefore, the external electrodes can be accurately formed on the end faces of all the electronic component bodies. In addition, since the electronic component element body does not bite into the transfer jig, it is not necessary to take measures such as blowing the electronic component element element with an air gun or the like, and the electronic component element can be manufactured stably. .

  The above-described object, other objects, features, and advantages of the present invention will become more apparent from the following description of embodiments for carrying out the invention with reference to the drawings.

It is a perspective view which shows an example of the transfer jig | tool of this invention. It is an illustration figure which shows the cross-section of the transfer jig | tool shown in FIG. It is an illustration figure which shows the principal part of the cross-section of the transfer jig | tool shown in FIG. It is a perspective view which shows the multilayer ceramic capacitor as an example of the electronic component manufactured using the transfer jig | tool shown in FIG. FIG. 5 is a plan view of the multilayer ceramic capacitor shown in FIG. 4. FIG. 6 is an illustrative view showing an internal structure of the multilayer ceramic capacitor shown in FIGS. 4 and 5. FIG. 5 is an illustrative view showing a state in which the ceramic body of the multilayer ceramic capacitor shown in FIG. 4 is held on the transfer jig shown in FIG. 1. It is an illustration figure which shows the attitude | position of the ceramic element | base_body in the recessed part of the transfer jig | tool shown in FIG. It is an illustration figure which shows the process of apply | coating the electroconductive paste for external electrodes to the ceramic body hold | maintained at the transfer jig | tool shown in FIG. It is an illustration figure which shows the principal part of the cross-section of the transfer jig used in an Example. It is an illustration figure which shows the conventional alignment pallet for hold | maintaining the several element | base_body for electronic components. FIG. 12 is an illustrative view showing a state in which an electronic component element body is inclined in an alignment hole of the conventional alignment pallet shown in FIG. 11.

  FIG. 1 is a perspective view showing an example of a transfer jig according to the present invention. The transfer jig 10 includes a flat base 12. As shown in FIG. 2, the base 12 is formed by laminating a plurality of substrates 12a, 12b,. The substrates 12a, 12b,... Are made of stainless steel such as SUS430.

  A plurality of recesses 14 are formed on one main surface of the base 12 so as to be regularly arranged. The recess 14 is formed in a circular shape in plan view. These recesses 14 are used to hold an electronic component element body on which no external electrode is formed. Here, the electronic component element body held by the recess 14 has a shape having a longitudinal direction such as a rectangular parallelepiped. The electronic component element body is fitted into the recess 14 at the other end in the longitudinal direction so that one end in the longitudinal direction is exposed. Therefore, the diameter of the opening of the recess 14 is formed so as to be smaller than the length of the electronic component element body and larger than the end surface in the longitudinal direction of the electronic component element body. Specifically, the diameter of the opening of the recess 14 is preferably selected from the range of 0.2 mm to 1.0 mm in accordance with the size of the electronic component body to be held.

  The concave portion 14 may have a uniform diameter inside thereof, or may have a diameter that varies depending on the position. The recess 14 is formed by stacking the substrates 12a, 12b, 12c and the substrate 12d in which circular holes are formed. Here, for example, the diameter can be changed in the recess 14 by changing the diameters of the holes formed in the stacked substrates 12a, 12b, and 12c.

  When the diameter of the recess 14 is changed, for example, as shown in FIG. 3, since the hole formed in the first substrate 12a becomes the opening of the recess 14, the diameter is within the above-described range. Is set. Next, the diameter of the hole formed in the second substrate 12b is set so as to be smaller than the diameter of the hole of the first substrate 12a and larger than the end face in the longitudinal direction of the electronic component body to be fitted into the recess 14. Is done. Further, the diameter of the hole formed in the third substrate 12c is set larger than the diameter of the hole in the second substrate 12b. A recess 14 is formed by the holes formed in the first to third substrates 12a to 12c and the fourth substrate 12d serving as the bottom surface.

  The depth of the recess 14 is set to be smaller than the length of the electronic component element body. Thereby, the other end side of the electronic component element body in the longitudinal direction can be fitted into the recess 14 such that one end side of the electronic component element body in the longitudinal direction is exposed. Specifically, the depth of the recess 14 is selected from the range of 0.05 mm to 0.15 mm corresponding to the size of the electronic component body. The depth of the recess 14 can be adjusted by changing the number of substrates for forming the recess 14 or changing the thickness of the substrate.

  Further, the base 12 is formed with a through-hole 16 that penetrates from the fourth substrate 12 d serving as the bottom surface of the recess 14 to the other main surface of the base 12. The through-hole 16 is formed in the fourth substrate 12d serving as the bottom surface of the recess 14 and the plurality of substrates 12e, 12f,. The through hole 16 is opened on the bottom surface of the concave portion 14 by a circular opening hole 16a formed in the fourth substrate 12d. The opening hole 16a of the fourth substrate 12d is formed to be smaller than the end surface in the longitudinal direction of the electronic component element body held in the recess 14. Specifically, the diameter of the opening hole 16a of the fourth substrate 12d is selected from the range of 0.05 mm to 0.15 mm corresponding to the size of the electronic component element body.

  The opening hole 16a formed in the fourth substrate 12d is formed at a position off the center of the bottom surface of the recess 14. Specifically, within the range of the bottom surface of the concave portion 14, the center portion of the bottom surface of the concave portion 14 and the central portion of the opening hole 16 a of the fourth substrate 12 d are the width of the electronic component element body held by the concave portion 14. An opening hole 16a is formed in the fourth substrate 12d so as to be separated by a length of ½ or more of the dimension in the direction. The depth of the opening hole 16a of the fourth substrate 12d, that is, the thickness of the fourth substrate 12d is preferably in the range of 0.05 mm to 0.15 mm.

  A portion of the through hole 16 that communicates with the opening hole 16 a is used as a suction hole 16 b for sucking the electronic component element body in the recess 14. The suction holes 16b are configured by holes formed in a plurality of substrates 12e, 12f,... Stacked on the fourth substrate 12d. The diameter of the suction hole 16b may be the same as the diameter of the opening hole 16a, or may have a different size depending on the position. When the suction hole 16b having a different diameter depending on the position is formed, it is preferable that the diameter gradually increases as the distance from the opening hole 16a increases, as shown in FIGS.

  That is, in the transfer jig 10 shown in FIGS. 2 and 3, a hole having a diameter larger than the opening hole 16a is formed in the fifth substrate 12e, and the fifth substrate 12e is formed in the sixth and seventh substrates 12f and 12g. Are formed in the substrates 12h, 12i,... Laminated thereon, and holes having a diameter larger than those of the sixth and seventh substrates 12f, 12g are formed.

  As described above, by gradually increasing the diameter of the suction hole 16b as the distance from the opening hole 16a increases, it is possible to improve the suction efficiency of the electronic component body in the recess 14. Further, when the diameter of the hole formed in the substrate is small, it is necessary to reduce the thickness of the substrate due to the problem of processing accuracy. However, when a hole having a large diameter is formed as the suction hole 16b, the thickness of the substrate can be increased. Therefore, the base 12 can be formed with a small number of substrates, and the processing cost can be reduced. The diameter of the suction hole 16b is preferably in the range of 0.15 mm to 0.5 mm. The depth of the suction hole 16b, that is, the total thickness of the substrate on which the suction hole 16b is formed is preferably 4 mm to 7 mm.

  The transfer jig 10 is used when manufacturing a chip-type electronic component. Here, a method of manufacturing a multilayer ceramic capacitor will be described as an example of a chip-type electronic component. As shown in FIGS. 4 and 5, the multilayer ceramic capacitor 30 includes a rectangular parallelepiped ceramic body 32. The ceramic body 32 corresponds to an electronic component body that is transferred to the transfer jig 10 described above.

  The ceramic body 32 is formed with a first main surface and a second main surface facing each other along the longitudinal direction, and a first side surface and a second side surface facing each other, and at both ends in the longitudinal direction, A first end surface and a second end surface facing each other are formed. The corners and ridges of the ceramic body 32 are preferably rounded.

As the ceramic material constituting the ceramic body 32, for example, a dielectric ceramic material mainly composed of BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , CaZrO ₃ or the like can be used. Moreover, you may use what added subcomponents, such as a Mn compound, Fe compound, Cr compound, Co compound, Ni compound, to these main components.

  In addition, piezoelectric ceramics such as PZT ceramics, semiconductor ceramics such as spinel ceramics, and magnetic ceramics such as ferrite can be used depending on the type of electronic component.

  A plurality of internal electrodes 34 are formed in the ceramic body 32 as shown in FIG. These internal electrodes 34 have a main surface that faces the first main surface and the second main surface of the ceramic body 32, and the main surfaces of the adjacent internal electrodes 34 face each other in the ceramic body 32. To be arranged. The internal electrodes 34 are alternately drawn out to the first end surface and the second end surface of the ceramic body 32.

  As a material of the internal electrode 34, for example, Cu, Ni, Ag, Pd, an Ag—Pd alloy, Au, or the like can be used. The thickness of the internal electrode 34 is preferably 0.3 μm to 2.0 μm. Moreover, it is preferable that the space | interval between adjacent internal electrodes 34 is 0.5 micrometer-10 micrometers.

  External electrodes 36 are formed on the first end surface and the second end surface of the ceramic body 32 so as to be connected to the extracted internal electrode 34. The external electrode 36 is formed to wrap around the two main surfaces and the two side surfaces from the first end surface and the second end surface of the ceramic body 32. The external electrode 36 is preferably composed of a base layer and a plating layer. For example, Cu, Ni, Ag, Pd, an Ag—Pd alloy, Au, or the like can be used as the material for the underlayer. The base layer is formed by applying a conductive paste on the end face of the ceramic body 32 before firing and firing it, thereby forming a ceramic base body 32 having the internal electrodes 34 and simultaneously forming a base layer for the external electrodes 36. Can be formed. Further, the base layer of the external electrode 36 can also be formed by a postfire that applies and pastes a conductive paste onto the end face of the fired ceramic body 32. The thickness of the underlayer is preferably 10 μm to 50 μm at the thickest part.

  A plating layer is formed on the base layer. As a material for the plating layer, for example, Cu, Ni, Ag, Pd, an Ag—Pd alloy, Au, or the like can be used. The plating layer may be formed of a plurality of layers, and preferably has a two-layer structure of a Ni plating layer and a Sn plating layer. The thickness per one plating film is preferably 1 μm to 10 μm. Furthermore, a conductive resin layer for stress relaxation may be formed between the base layer and the plating layer. In this way, the external electrodes 36 are connected to the alternately drawn internal electrodes 34, whereby a capacitance is formed between the external electrodes 36.

  In order to manufacture such a multilayer ceramic capacitor 30, a ceramic green sheet, an internal electrode conductive paste, and an external electrode conductive paste are prepared. The ceramic green sheet and various conductive pastes include a binder and a solvent, and a known organic binder or organic solvent can be used.

  Next, an internal electrode pattern is formed on the ceramic green sheet by printing a conductive paste in a predetermined pattern by screen printing or the like. Then, a predetermined number of ceramic green sheets for outer layers on which no internal electrode pattern is printed are stacked, ceramic green sheets on which internal electrode patterns are printed are sequentially stacked thereon, and a predetermined number of ceramic green sheets for outer layers are stacked thereon. By laminating, a mother laminate is produced.

  The obtained mother laminate is pressed in the laminating direction by a method such as isostatic pressing. The pressed mother laminate is cut to a predetermined size to form a raw ceramic laminate. At this time, you may form roundness in the corner part and ridgeline part of a raw ceramic laminated body by barrel grinding | polishing. Next, the raw ceramic laminate is fired to form the ceramic body 32 having the internal electrodes 34. The firing temperature of the raw ceramic laminate is preferably 900 ° C. to 1300 ° C., although it depends on the material of the ceramic green sheet and the material of the conductive paste for internal electrodes.

  As shown in FIG. 7, the obtained ceramic body 32 is transferred into the recess 14 of the transfer jig 10 such that the end face in the longitudinal direction faces the bottom surface of the recess 14. At this time, one end face (first end face) in the longitudinal direction of the ceramic body 32 is exposed from the recess 14, and the other end face (second end face) is accommodated in the recess 14. Here, by changing the diameter in the recess 14 as shown in FIG. 3, the filling rate of the ceramic body 32 into the recess 14 can be increased. In other words, by increasing the diameter of the hole of the first substrate 12 a constituting the base 12, the ceramic body 32 can easily enter the recess 14. In addition, by setting the diameter of the hole of the second substrate 12b to be smaller than the diameter of the hole of the first substrate 12a, the ceramic body 32 entering the recess 14 is less likely to stand obliquely.

  In addition, even when the ceramic body 32 stands obliquely in the recess 14, as shown in FIG. 8, the opening 16 a of the through hole 16 is formed at a position away from the center of the bottom surface of the recess 14. Therefore, the corners of the ceramic body 32 do not enter the opening hole 16a. Therefore, in the recess 14, it is possible to suppress the occurrence of so-called diagonal lock, in which the ceramic body 32 is caught in the recess 14 of the base 12 and stops moving. Therefore, the posture of the ceramic body 32 can be easily changed in the recess 14, and the ceramic body 32 is in an upright posture by being sucked from the opening hole 16 a through the suction hole 16 b. It is possible to suck and hold the second end face.

  As described above, since the plurality of ceramic bodies 32 can be held in the recessed portion 14 in an upright state, the ceramic body 32 is removed from each recessed portion 14 of the transfer jig 10 as shown in FIG. The first end face is exposed and its height is substantially uniform. As shown in FIG. 9B, the first holder 40 is pressed against the first end surface of the ceramic body 32. The first holder 40 includes, for example, an adhesive plate 40a that is formed in a flat plate shape with an elastic body such as silicone rubber, and has a main surface that is an adhesive surface. One main surface of the adhesive plate 40a is supported by the support plate 40b to form the first holder 40. Therefore, the other main surface of the adhesive plate 40 a is exposed as the adhesive surface of the first holder 40. Then, the adhesive surface of the first holder 40 is pressed against the first end surface of the ceramic body 32. Thereby, the plurality of ceramic bodies 32 are held upright on the adhesive surface of the first holder 40.

  The ceramic body 32 held by the first holder 40 is pulled up from the recess 14 of the transfer jig 10, and as shown in FIG. 9C, the second end surface of the ceramic body 32 is connected to the external electrode. It is immersed in the conductive paste tank 42 for forming 36. In this way, after the conductive paste is applied to the second end face of the ceramic body 36, the conductive paste applied to the second end face is dried as shown in FIG. 9D.

  Next, as shown in FIG. 9E, the second holder 44 is pressed onto the conductive paste dried on the second end face of the ceramic body 36. Similar to the first holder 40, the second holder 44 includes an adhesive plate 44a and a support plate 44b. The adhesive force of the main surface of the adhesive plate 44a is the same as that of the first holder 40. It is larger than the adhesive strength of the main surface of the adhesive plate 40a. By pressing the adhesive surface of the second holder 44, the conductive paste applied to the second end surface of the ceramic body 32 is strongly held by the second holder 44. Therefore, by pulling the first holder 40 and the second holder 44 apart, all the ceramic body 32 is transferred to the second holder 44.

  Since all the ceramic element bodies 32 are held upright on the first holder 40, all the ceramic element bodies 32 remain in an upright posture even when transferred to the second holder 44. It is held by the holding tool 44. At this time, the second end face of the ceramic body 32 to which the conductive paste is not applied is exposed. As shown in FIG. 9F, the second end face of the ceramic body 32 is immersed in the conductive paste tank 42, and the conductive paste is applied to the second end face.

  Next, as shown in FIG. 9G, the conductive paste applied to the second end face of the ceramic body 32 is dried. Thereafter, as shown in FIG. 9 (H), the ceramic body 32 is scraped off from the second holder 44 by using the scraping blade 46, and the both ends are electrically conductive as shown in FIG. 9 (I). The ceramic body 32 to which the adhesive paste is applied can be obtained.

  By baking the conductive paste applied to the ceramic body 32, the base layer of the external electrode 36 is formed. The baking temperature is preferably 700 to 900 ° C. On the underlayer, Ni plating or Sn plating is performed as necessary, and external electrodes 34 are formed on both end faces of the ceramic body 32. The multilayer ceramic capacitor 10 is manufactured through the above steps.

  In the transfer jig 10 used here, since the opening hole 16a constituting the through hole 16 is formed at a position deviated from the center of the bottom surface of the recess 14, the ceramic body 32 is formed in the recess 14 of the transfer jig 10. Even if it is slanted inside, it does not fit into the opening 16a. Therefore, the ceramic body 32 is not fixed in an inclined posture in the recess 14, and all the ceramic bodies 32 can be upright in the recess 14. Therefore, even if the ceramic body 32 held by the transfer jig 10 is transferred to the first holder 40 and further transferred to the second holder 40, all the ceramic bodies 32 are held in an upright state. be able to. Therefore, the conductive paste can be accurately applied to the end face of the ceramic body 32 by using the first holder 40 and the second holder 44. Further, the ceramic body 32 is not fitted into the opening 16 a and does not move in the recess 14, and the ceramic body 32 does not remain in the recess 14 of the transfer jig 10. Therefore, it is not necessary to remove the ceramic body 32 remaining in the recess 14 using an air gun or the like, and the multilayer ceramic capacitor 30 can be manufactured stably.

  Using the transfer jig 10 of the present invention, an electronic component was produced by the method described above. In the process, the presence or absence of occurrence of diagonal lock of the ceramic body 32 in the transfer jig was confirmed. The electronic component produced in this example is of 0402 size (T × W × L = 0.2 × 0.2 × 0.4 mm), and is a ceramic using a Ba—Ti—Nd ceramic material. The element body 32 is used, and an Ni plating layer having a thickness of 5 μm and an Sn plating layer having a thickness of 3.7 μm are formed on a base layer having an end face thickness of 30.5 μm using Ag / Pd as the external electrode 36.

  Further, the transfer jig 10 used in this example was formed by stacking the substrates 12a, 12b,... Formed using SUS430, and the recesses 14 and the through holes 16 were formed as shown in FIG. A base 12 is provided. The base 12 has substantially the same configuration as the base 10 shown in FIG. 3, but the opening holes 16a formed in the substrate 12d shown in FIG. 3 have two substrates 12d (1), 12d laminated. It differs in that it is formed in (2). The thickness of each board | substrate 12a, 12b, ... which comprises the transfer jig | tool 10, and the diameter of the hole formed in board | substrates 12a, 12b, ..., transfer treatment which has a numerical value as shown in Table 1. Tool 10 was used. Here, the transfer jig 10 in which the central portion of the concave portion 14 and the central portion of the opening hole 16a are shifted by 0.1 mm was used.

  In addition, as the adhesive plates 40a and 44a used for the first holder 40 and the second holder 44, those having a thickness of 1.5 mm were used. Here, the pressure-sensitive adhesive plate 44 a used for the second holder 44 has a larger adhesive force than the pressure-sensitive adhesive plate 40 a used for the first holder 40.

  Electronic components were produced using these transfer jig 10 and holders 40 and 44, and it was confirmed whether or not diagonal lock of the ceramic body 32 in the transfer jig 10 occurred. In this example, the ceramic body 32 was transferred to a single transfer jig 10 a plurality of times, and the number of diagonal locks was confirmed for 1 million ceramic bodies 32. As a specific confirmation method, the ceramic body 32 was transferred to the transfer jig 10 a plurality of times, and the presence or absence of diagonal lock was confirmed in the transfer jig 10 when the ceramic body 32 was finally transferred.

  Here, if there is no diagonal lock in the transfer jig 10 after the last transfer, it is determined that the diagonal lock has not occurred in the transfer before that. The reason is that when the diagonal lock occurs, the ceramic body 32 is engaged with the transfer jig 10 at a level that cannot be removed unless it is blown away using an air gun or the like. 32 does not move from the transfer jig 10, and if there is no diagonal lock in the transfer jig 10 after the last transfer, the diagonal lock is performed in the transfer jig 10 even in the multiple transfers up to that time. It can be said that it has not occurred.

  Further, as a comparative example, except that the opening hole 16a is formed at the center of the bottom surface of the concave portion 14, a transfer jig having the structure shown in FIG. confirmed.

  As a result of the above experiment, when the transfer jig in which the opening hole 16a is formed at the center of the bottom surface of the recess 14 is used, 30 diagonal locks are generated for transfer of 1 million ceramic bodies. . On the other hand, when the transfer jig 10 of the present invention was used, the occurrence of diagonal lock was zero for one million ceramic body transfers.

From the above results, it can be seen that the diagonal lock of the ceramic body 32 in the recess 14 can be prevented by using the transfer jig 10 of the present invention. Thereby, the ceramic body 32 to the subsequent first holder 40 is thereby obtained.
It is possible to prevent a transfer error from occurring in the transfer. As a result, in the manufacturing process of the electronic component, it is possible to reduce processes such as removal of the ceramic body 32 in which the diagonal lock has occurred, and it is possible to manufacture the electronic component stably.

DESCRIPTION OF SYMBOLS 10 Transfer jig 12 Base 14 Recess 16 Through-hole 16a Opening hole 16b Suction hole 30 Multilayer ceramic capacitor 32 Ceramic body 40 First holder 44 Second holder

Claims (3)

A transfer jig for holding the other end side in the longitudinal direction of the electronic component element body such that one end side in the longitudinal direction of the transferred electronic component element body is exposed,
A flat base formed by laminating a plurality of substrates;
A recess formed on one main surface of the base and accommodating the other end side in the longitudinal direction of the electronic component element body; and an opening formed on the base so as to communicate with the bottom surface of the recess. The part includes only one through hole smaller than the area of the end face in the longitudinal direction of the electronic component element body,
The transfer jig, wherein the opening of the through hole is formed at a position deviating from the center of the bottom surface of the recess. An electronic component manufacturing method using the transfer jig according to claim 1,
Holding the other end side of the electronic component element body in the longitudinal direction by sucking the end surface on the other end side in the longitudinal direction of the electronic component element body that has been transferred into the recess, from the through hole;
Providing a holder having an adhesive surface;
A step of sticking and holding an end face on one end side in the longitudinal direction of the electronic component element body with an adhesive face of the holder;
Removing the electronic component element body held by the holder from the transfer jig; and immersing an end surface on the other end side in the longitudinal direction of the electronic component element body in an electrically conductive paste tank. A method for manufacturing an electronic component, comprising a step of applying a paste. Preparing another holder having an adhesive surface that is more sticky than the adhesive surface of the holder;
A step of sticking and holding the end face on the other end side in the longitudinal direction of the electronic component element body to which the conductive paste has been applied with the sticking face of the another holding tool;
Removing the end face on one end side in the longitudinal direction of the element body for electronic parts from the holder; and immersing the end face on one end side in the longitudinal direction of the element body for electronic parts in a conductive paste tank. The manufacturing method of the electronic component of Claim 2 including the step of apply | coating.

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