CN115763099A - End capping process of MLCC - Google Patents
End capping process of MLCC Download PDFInfo
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- CN115763099A CN115763099A CN202211292501.2A CN202211292501A CN115763099A CN 115763099 A CN115763099 A CN 115763099A CN 202211292501 A CN202211292501 A CN 202211292501A CN 115763099 A CN115763099 A CN 115763099A
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims description 46
- 230000001070 adhesive effect Effects 0.000 claims description 46
- 239000002002 slurry Substances 0.000 claims description 17
- 238000007598 dipping method Methods 0.000 claims description 13
- 238000001035 drying Methods 0.000 claims description 13
- 238000005096 rolling process Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000000903 blocking effect Effects 0.000 abstract description 5
- 239000013256 coordination polymer Substances 0.000 abstract 3
- 238000007789 sealing Methods 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
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- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
The invention relates to a blocking process of MLCC. According to the end-capping process of the MLCC, after the CP board is used for loading the MLCC and one side of the MLCC is capped, the MLCC is directly and continuously glued and fixed on the side of the capped MLCC, then the first-time gluing is removed, the other end face of the MLCC is exposed, the end-capping process is completed, the secondary CP board does not need to be used for replacing the face, and the input cost of the secondary CP board is reduced. The end-capping process of the MLCC has the advantages of stable product production quality, low loss and low production cost.
Description
Technical Field
The invention relates to the technical field of capacitor manufacturing, in particular to a blocking process of an MLCC (multilayer ceramic capacitor).
Background
Nowadays, ceramic devices such as MLCCs (Multi-layer Ceramic Chip Capacitors) play an important role in the fields of networks, 5G communications, home appliances, automotive electronics, consumer electronics, and the like.
In the production process of ceramic elements such as the conventional MLCC (chip multilayer ceramic capacitor) and the like, the end faces of two sides, which are exposed out of an inner electrode, need to be subjected to slurry dipping and end sealing, a double-plate mode is generally used for performing slurry dipping and end sealing, the MLCC is mounted on one surface of a CP (package for bearing the MLCC) after being pasted with glue, so that the MLCC is fixed on the CP, and then one end of the MLCC is subjected to slurry dipping. And transferring and inserting one end of the MLCC subjected to slurry dipping onto a secondary CP (printed circuit board) pasted with an adhesive tape, and carrying out slurry dipping on the other end of the MLCC. When the MLCC is inserted into the secondary CP plate in the process, the two CP plates are required to be aligned very accurately, otherwise, the product can be scratched, the product is easy to fall off in the process of transferring to the secondary CP plate, the secondary CP plate is easy to deform, the consumption of the secondary CP plate is large, and the process has the defects of unstable product production quality, high loss and high production cost.
Disclosure of Invention
Based on the above, the invention aims to provide a blocking process of the MLCC, which is characterized in that after the blocking and drying of the first side of the MLCC are carried out, the second rubberizing is directly carried out on the blocked surface, and then the first rubberizing is torn off and the surface is changed, so that the secondary CP plate is not needed to be used for butt joint and change of the surface, the input cost of the secondary CP plate is reduced, and the blocking process has the advantages of stable product production quality, low loss and low production cost.
The invention is realized by the following scheme:
a capping process of an MLCC, comprising the following steps:
s1) providing a CP (concrete panel), wherein the CP comprises an A surface and a B surface, and a plurality of bearing holes penetrating through the A surface and the B surface are formed in the CP; gluing the surface A of the CP board, and rolling the gluing of the surface A;
s2) the B surface of the CP board is upward, a plurality of MLCCs are placed on the B surface of the CP board, and the MLCCs are guided into the bearing holes through a vibrating screen of the CP board, wherein the depth of each bearing hole is smaller than the length of the MLCC, so that one end face of the MLCC guided into the CP board is exposed out of the bearing hole of the B surface, and the other end face of the MLCC is fixedly adhered to an adhesive of the A surface;
s3) after the feeding is finished, recovering redundant MLCCs;
s4) leveling the CP board, then enabling the B surface of the CP board to face downwards, and carrying out slurry dipping operation on the end surface of the MLCC with the B surface exposed;
s5) drying the MLCC after being stained with the slurry;
s6) rubberizing the surface B of the dried CP board, and rolling and pressing the rubberizing of the surface B;
s7) removing the adhesive on the surface A, and exposing the end face of the MLCC which is not stained with the paste to the outside of the bearing hole on the surface A;
s8) leveling the CP board, enabling the B surface of the CP board to face downwards, and dipping the end surface of the MLCC with the A surface exposed;
s9) drying the MLCC after being stained with the slurry;
and S10) removing the adhesive on the surface B, and separating the MLCC from the bearing hole of the CP plate.
According to the end-capping process of the MLCC, after the MLCC is loaded on the CP board and one side of the MLCC is capped, the MLCC is directly and continuously glued and fixed on the side of the capped MLCC, the first-time gluing is removed, the other end face of the MLCC is exposed, the end-capping process is completed, and the secondary CP board does not need to be used, so that the MLCC end-capping process has the advantages of stable product production quality, low loss and low production cost.
Further, the diameter of the bearing hole on the CP plate is smaller than the length of the MLCC and larger than the outer electrode of the MLCC.
Furthermore, the viscosity of the surface B coating is greater than that of the surface A coating.
Further, in step S3, by tilting and vibrating the plane of the CP plate, the redundant MLCCs are slid off the CP plate and recovered.
Further, in step S4 and step S8, the CP board is leveled, specifically, the CP board loaded with the MLCC is flatly pressed by using an elastic rubber pad and a rubber roller.
Furthermore, in step S4 and step S8, the end face of the MLCC is pasted, specifically, the CP plate on the side where the MLCC end face is exposed faces downward, and is vertically inserted into the paste.
Further, in step S5 and step S9, drying the MLCC, specifically, sending the MLCC after being stained with the slurry into a high temperature furnace for baking.
Further, in step S6, the adhesive on the surface a is removed, specifically, one end of the adhesive on the surface a is torn off from the horizontal direction until the whole adhesive is separated from the CP board.
Further, in step S10, removing the rubberizing of the B surface, specifically tearing off one end of the rubberizing of the B surface from the horizontal direction until the whole rubberizing is separated from the CP board; or the adhesive on the surface B is subjected to high-temperature treatment, and then the adhesive which loses viscosity after the high-temperature treatment is removed.
Further, in step S10, a bearing hole detaching operation, specifically, detaching a part of the MLCCs from the bearing holes of the CP plate by means of dropping due to their own weights after the rubberizing is removed, and completely detaching the remaining MLCCs from the bearing holes of the CP plate by means of shaking the CP plate for multiple times.
According to the end-sealing process of the MLCC, after the A surface of the CP board is glued and rolled, a plurality of MLCCs are placed on the B surface of the CP board, the MLCCs are guided into the bearing holes of the CP board through vibration, the diameters of the bearing holes are limited to ensure that the end surfaces of the MLCCs are inserted into the bearing holes, and then the CP board is inclined and vibrated to recover the redundant MLCCs. And then, leveling the CP board, dipping and drying the end surfaces of the MLCCs exposed on the B surface to form external electrodes, then, rubberizing and rolling the B surface of the CP board, wherein the tackiness of the rubberizing used on the B surface is larger than that of the rubberizing of the A surface, so that the MLCCs can be prevented from being stuck and carried when the rubberizing of the A surface is removed in the next step, and the end surfaces of the MLCCs exposed on the A surface are dipped and dried after the rubberizing of the A surface is removed, so that the end surfaces of two sides form the external electrodes, and the end sealing process is completed. The B-side tape is then removed and the MLCC is completely separated from the CP plate by multiple shakes.
For a better understanding and practice, the invention is described in detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a flow chart of a capping process for an MLCC according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an A-side rubberizing process of a sealing process of an MLCC according to an embodiment of the present invention;
FIG. 3 is a top view of an A-side rubberizing of a capping process of an MLCC according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view of an A-side rubberizing of a sealing process of an MLCC according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of the A side and B side of a MLCC termination process in accordance with embodiments of the present invention during taping;
FIG. 6 is a schematic diagram of an MLCC of a capping process of the MLCC according to an embodiment of the invention.
Reference numerals are as follows: CP board 100, A surface 110, B surface 120, bearing hole 130, MLCC200, rubberized tape 300, inner electrode 210, outer electrode 220, end face 230.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Aiming at the technical problems in the background art, the invention provides a capping process of an MLCC, which comprises the following steps:
s1) providing a CP (concrete panel), wherein the CP comprises an A surface and a B surface, and a plurality of bearing holes penetrating through the A surface and the B surface are formed in the CP; gluing the surface A of the CP board, and rolling the gluing of the surface A;
s2) the B surface of the CP board is upward, a plurality of MLCCs are placed on the B surface of the CP board, and the MLCCs are guided into the bearing holes through a vibrating screen of the CP board, wherein the depth of each bearing hole is smaller than the length of the MLCC, so that one end face of the MLCC guided into the CP board is exposed out of the bearing hole of the B surface, and the other end face of the MLCC is fixedly adhered to an adhesive of the A surface;
s3) after the feeding is finished, recovering redundant MLCCs;
s4) leveling the CP board, then enabling the B surface of the CP board to face downwards, and carrying out slurry dipping operation on the end surface of the MLCC with the B surface exposed;
s5) drying the MLCC after being stained with the slurry;
s6) rubberizing the surface B of the dried CP board, and rolling and pressing the rubberizing of the surface B;
s7) removing the adhesive on the surface A, and exposing the end face of the MLCC which is not stained with the paste to the outside of the bearing hole on the surface A;
s8) leveling the CP board, enabling the B surface of the CP board to face downwards, and dipping the end surface of the MLCC with the A surface exposed;
s9) drying the MLCC after being stained with the slurry;
and S10) removing the adhesive on the surface B, and separating the MLCC from the bearing hole of the CP plate.
As shown in fig. 2 to 5, the CP board 100 is a tool for loading the MLCC200 to perform a sealing process, and includes an opposite a surface 110 and a B surface 120. The CP board 100 is provided with a plurality of receiving holes 130 penetrating the A-side 110 and the B-side 120, and the MLCCC200 is loaded in the receiving holes 130. Further, as shown in fig. 6, the MLCC200 is a rectangular parallelepiped having a length a, a width b, and a height h, wherein end surfaces 230 of both sides formed by the width b and the height h expose the internal electrodes 210; the diameter of the loading hole 130 on the CP board 100 is smaller than the length a of the MLCC200 and larger than the external electrode 220 of the terminated MLCC200, in order to ensure that the end face 230 to be terminated is inserted into the loading hole 130, then the end face 230 on one side of the internal electrode 210 is slurry terminated, and the terminated MLCC200 can be detached from the loading hole 130.
In this embodiment, as shown in fig. 2 to 4, the adhesive is applied to the a-surface 110 of the CP board 100, and the adhesive 300 of the a-surface 110 is rolled to ensure that the adhesive 300 of the a-surface 110 is closely attached to the a-surface 110. Further, the B-side 120 of the CP board 100 is faced upward, a plurality of MLCCs 200 are placed on the B-side 120 of the CP board 100, and the MLCCs 200 are introduced into the receiving holes 130 by vibrating the CP board 100, wherein one end surface 230 of the MLCC200 is exposed from the receiving hole 130 of the B-side 120, and the other end surface 230 is fixedly attached to the adhesive 300 of the a-side 110. Further, after the feeding is completed, the redundant MLCCs are recycled. Further, the CP board 100 is flattened so that the end face 230 of the MLCC200, from which the B-face 120 is exposed, is at the same level, and the MLCC200 is further closely attached to the adhesive 300. The CP plate 100 is then moved to allow the end face 230 of the MLCC200, where the B-face 120 is exposed, to be pasted. Further, the MLCC200 after being dipped is dried, and the dried paste forms the external electrode 220 of the MLCC200. Further, as shown in fig. 5, the B surface 120 of the dried CP board 100 is pasted with glue, and the paste 300 of the B surface 120 is pressed by rolling, so that the external electrode 220 terminated by the MLCC200 is fixedly pasted on the paste 300 of the B surface 120. Further, the adhesive 300 on the a-side 110 is removed, and the non-pasted end face 230 of the MLCC200 is exposed out of the bearing hole 130 of the a-side 110, thereby completing the surface replacement operation. Further, the CP board 100 is flattened so that the end face 230 of the MLCC200 exposed to the a-face 110 is at the same level, and the MLCC200 is further closely attached to the adhesive 300. The CP plate 100 is then moved to allow the end face 230 of the MLCC200, where the a-face 110 is exposed, to be pasted. Further, the pasted MLCC200 is dried, and the dried paste forms the external electrode 220 of the MLCC200, so that the end surfaces 230 on both sides of the MLCC200 are all finished with the end capping process. Further, the adhesive 300 on the B-side 120 is removed, and the MLCC200 is separated from the carrying hole 130 of the CP board 100, thereby obtaining the MLCC200 with the end-sealing process completed.
In a preferred embodiment, in step S3, the redundant MLCCs are slid off the CP board 100 and recovered by tilting and vibrating the plane of the CP board 100. By recovering the redundant MLCCs, MLCCs that are not properly loaded into the loading holes 130 are prevented from crushing the CP board 100 and other MLCCs in the subsequent flattening step.
In a preferred embodiment, in steps S4 and S8, the CP board 100 is flattened, specifically, the CP board 100 loaded with the MLCC200 is pressed flat by using an elastic cushion and a rubber roller. The elastic rubber pad and rubber roller can provide a buffering force for the MLCC200 to prevent crushing or scratching the MLCC200, and the end surface 230 of the MLCC200 exposed out of the a surface 110 or the B surface 120 is in the same horizontal plane to make the MLCC200 tightly attached to the adhesive tape 300.
In a preferred embodiment, in step S4, one side end face 230 of the MLCC200 is pasted, specifically, the CP board 100 on the side where the end face 230 of the MLCC is exposed faces downward, and is vertically inserted into the paste, so that the end face 230 of the MLCC200 is pasted with the paste; in step S8, the other end face 230 of the MLCC200 is pasted, specifically, the CP plate 100 exposing the other end face 230 of the MLCC200 is inserted into the paste vertically with the CP plate facing downward, the exposed end face 230 of the MLCC200 is pasted with the paste, and both end faces 230 of the MLCC200 are pasted with the blocked paste through step S4 and step S8.
In a preferred embodiment, in step S5 and step S9, the MLCC200 is dried, specifically, the MLCC200 with the end face 230 dipped with paste is sent to a high temperature furnace to be baked, so that the paste is solidified to form the external electrode 220.
In a preferred embodiment, in step S6, the adhesive 300 of the a-side 110 is removed, specifically, one end of the adhesive 300 of the a-side 110 is torn off from the horizontal direction until the entire adhesive 300 is separated from the CP board 100. Tearing in a horizontal direction may prevent the sticker 300 from being carried away with the MLCC200 adhered to the sticker 300 during the tearing process.
In a preferred embodiment, in step S10, for a large-size MLCC product, such as 0603 and above, the operation of removing the adhesive 300 of the B-side 120, specifically, tearing one end of the adhesive 300 of the B-side 120 from the horizontal direction, is performed until the whole adhesive 300 is separated from the CP board 100. Tearing in the horizontal direction may prevent the adhesive 300 from being carried away with the MLCC200 adhered to the adhesive 300 during the tearing process. The operation of removing the adhesive 300 on the B-side 120 is performed on a small-sized MLCC product, such as an MLCC product of 0402 or below, specifically, the adhesive 300 on the B-side 120 is subjected to a high temperature treatment to make the adhesive 300 on the B-side 120 lose adhesiveness, and then the adhesive 300 that loses adhesiveness is removed. Specifically, the way to remove the adhesive 300 includes, but is not limited to, separating the adhesive 300 from the MLCC200 after adsorbing the adhesive 300.
In a preferred embodiment, in step S10, a part of the MLCCs are separated from the bearing holes of the CP plate by falling under their own weight after the rubberizing is removed, and then the remaining MLCCs are completely separated from the bearing holes of the CP plate by shaking the CP plate for many times. By shaking for many times, the MLCC200 can be prevented from remaining on the CP board 100, and the production loss of the product is reduced.
According to the end-capping process of the MLCC, after the A surface 110 of the CP board 100 is pasted with the adhesive 300 and rolled, a plurality of MLCCs 200 are placed on the B surface 120 of the CP board 100, the MLCCs 200 are guided into the bearing holes 130 of the CP board 100 through vibration, the diameters of the bearing holes 130 are limited to ensure that the end surfaces 230 of the MLCCs 200 are inserted into the bearing holes 130, and then the CP board 100 is inclined and vibrated to recover the redundant MLCCs 200. And then, after the CP board 100 is flattened, pasting and drying the end face 230 of the MLCC200 exposed on the B surface 120 to form an external electrode 220, then, pasting 300 rolling the B surface 120 of the CP board 100, wherein the viscosity of the pasting 300 used by the B surface 120 is larger than that of the pasting 300 of the A surface 110, so that the MLCC200 is prevented from being pasted and carried when the pasting 300 of the A surface 110 is removed in the next step, and after the pasting 300 of the A surface 110 is removed, pasting and drying the end face 230 of the MLCC200 exposed on the A surface 110, so that the end faces 230 on two sides form the external electrode 220, and the end-sealing process is completed. The adhesive 300 on the B-side 120 is then removed and the MLCC200 is completely separated from the CP board 100 by multiple dithering.
According to the end sealing process of the MLCC, after primary drying, secondary rubberizing is directly carried out on one surface with the end sealed, the primary rubberizing is torn off to change the surface, a secondary CP plate is not needed to be used for butt joint of the changed surface, the input cost of the secondary CP plate is reduced, and the MLCC has the advantages of being stable in product production quality, low in loss and low in production cost.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, to those skilled in the art, changes and modifications may be made without departing from the spirit of the present invention, and it is intended that the present invention encompass such changes and modifications.
Claims (10)
1. A termination process of an MLCC is characterized by comprising the following steps:
s1) providing a CP (concrete panel), wherein the CP comprises a surface A and a surface B, and a plurality of bearing holes penetrating through the surface A and the surface B are formed in the CP; gluing the surface A of the CP board, and rolling the gluing of the surface A;
s2) the B surface of the CP board is upward, a plurality of MLCCs are placed on the B surface of the CP board, and the MLCCs are guided into the bearing holes through a vibrating screen of the CP board, wherein the depth of each bearing hole is smaller than the length of the MLCC, so that one end face of the MLCC guided into the CP board is exposed out of the bearing hole of the B surface, and the other end face of the MLCC is fixedly adhered to an adhesive of the A surface;
s3) after the feeding is finished, recovering redundant MLCCs;
s4) leveling the CP board, then enabling the B surface of the CP board to face downwards, and carrying out slurry dipping operation on the end surface of the MLCC with the B surface exposed;
s5) drying the MLCC after being stained with the slurry;
s6) rubberizing the surface B of the dried CP board, and rolling and pressing the rubberizing of the surface B;
s7) removing the adhesive on the surface A, and exposing the end face of the MLCC which is not stained with the paste to the outside of the bearing hole of the surface A;
s8) leveling the CP board, enabling the B surface of the CP board to face downwards, and dipping the end surface of the MLCC with the A surface exposed;
s9) drying the MLCC after slurry dipping;
and S10) removing the adhesive on the surface B, and separating the MLCC from the bearing hole of the CP plate.
2. The capping process of MLCC according to claim 1, wherein:
the diameter of the bearing hole on the CP plate is smaller than the length of the MLCC and larger than the outer electrode of the MLCC.
3. The capping process of MLCC according to claim 1, wherein:
the viscosity of the surface B adhesive is greater than that of the surface A adhesive.
4. The capping process of MLCC according to claim 1, wherein:
in step S3, the redundant MLCCs are slid off the CP plate and recovered by tilting and vibrating the plane of the CP plate.
5. The capping process of MLCC according to claim 1, wherein:
in step S4 and step S8, the CP board is leveled, specifically, the CP board loaded with the MLCC is flatly pressed by using an elastic rubber pad and a rubber roller.
6. The capping process of an MLCC according to claim 4, wherein:
in step S4 and step S8, the MLCC end face is dipped, specifically, the CP plate exposed on the MLCC end face side is downward and vertically inserted into the slurry.
7. The capping process of MLCC according to claim 1, wherein:
and in the step S5 and the step S9, drying the MLCC, specifically, sending the stained MLCC into a high-temperature furnace for baking.
8. The capping process of MLCC according to claim 1, wherein:
in step S6, the adhesive on the surface a is removed, specifically, one end of the adhesive on the surface a is torn off from the horizontal direction until the whole adhesive is separated from the CP board.
9. The capping process of MLCC according to claim 1, wherein:
in the step S10, removing the rubberizing of the surface B, specifically tearing one end of the rubberizing of the surface B from the horizontal direction until the whole rubberizing is separated from the CP plate; or the adhesive on the surface B is subjected to high-temperature treatment, and then the adhesive which loses viscosity after the high-temperature treatment is removed.
10. The capping process of MLCC according to claim 1, wherein:
in step S10, a bearing hole is disengaged, specifically, a part of the MLCCs are disengaged from the bearing holes of the CP plate by means of self-weight dropping after the rubberizing is removed, and then the remaining MLCCs are completely disengaged from the bearing holes of the CP plate by means of shaking the CP plate for multiple times.
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| CN202211292501.2A CN115763099A (en) | 2022-10-21 | 2022-10-21 | End capping process of MLCC |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117736665A (en) * | 2023-12-29 | 2024-03-22 | 惠州市欣洋电子材料有限公司 | Automatic end-capped thermal foaming adhesive tape for small-size MLCC (multi-layer ceramic) and application method |
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| CN209929153U (en) * | 2019-07-16 | 2020-01-10 | 杭州灵通电子有限公司 | A high-efficient mounting device for piece formula porcelain dielectric capacitor |
| KR102273829B1 (en) * | 2020-12-09 | 2021-07-07 | (주)삼정오토메이션 | Variant ejecting apparatus for electronic component and variant ejecting process thereof |
| CN215433361U (en) * | 2021-07-29 | 2022-01-07 | 四川华瓷科技有限公司 | Chip component external electrode end-sealing auxiliary guiding and positioning device |
| CN215846462U (en) * | 2021-12-30 | 2022-02-18 | 广东微容电子科技有限公司 | Clamp for welding performance test of chip multilayer ceramic dielectric capacitor |
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