CN113539921A - Chip end-sealing positioning device and positioning method - Google Patents
Chip end-sealing positioning device and positioning method Download PDFInfo
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- CN113539921A CN113539921A CN202110872978.7A CN202110872978A CN113539921A CN 113539921 A CN113539921 A CN 113539921A CN 202110872978 A CN202110872978 A CN 202110872978A CN 113539921 A CN113539921 A CN 113539921A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68309—Auxiliary support including alignment aids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
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Abstract
The invention discloses a chip end-capping positioning device, which comprises an implantation plate and a conveying plate, wherein the implantation plate is divided into a plurality of implantation units by a first cross beam and a first vertical beam which are vertically arranged, each implantation unit is provided with a plurality of implantation areas which are arranged at intervals, each implantation area is provided with a plurality of implantation holes in a penetrating way, the conveying plate is divided into a plurality of conveying units by a second cross beam and a second vertical beam which are vertically arranged, each conveying unit is provided with a conveying area and a conveying area which are in one-to-one correspondence with the implantation areas, and each conveying area is provided with a conveying hole in a penetrating way. The invention enhances the strength of each implantation unit and each conveying unit through the clearance design among the implantation areas and among the conveying areas, thereby improving the overall strength of the implantation plate and the conveying plate, prolonging the service life of the implantation plate and the conveying plate, and reducing the processing precision and the processing cost of the implantation plate and the conveying plate. The invention also discloses a chip end-capping positioning method.
Description
Technical Field
The invention relates to the technical field of laminated ceramic capacitors, in particular to a chip end-capping positioning device and a chip end-capping positioning method for a laminated ceramic capacitor.
Background
The end-sealing production of copper electrodes of multilayer Ceramic Capacitors (MLCC) is to dip copper on two ends of a sintered and chamfered MLCC chip to form end electrodes on two ends of the capacitor so as to weld the capacitor on a substrate. Because the copper thickness and the copper end width of the terminal electrode of the MLCC have certain technical requirements, in order to enable the thickness and the width of copper to be controllable during the end sealing, different end sealing tools can be used for the end sealing production of the MLCCs with different sizes, and the domestic existing end sealing technology can correspond to the end sealing processing of the MLCCs with the sizes of 01005 and above.
For the MLCC of 01005/0201 size, the currently used sealing technique is hole-to-hole technique of the implantation plate 100 'and the delivery plate 200', wherein the implantation plate 100 'is uniformly distributed with fine implantation holes 110' and the delivery plate 200 'is locally provided with fine delivery holes 210'. Referring specifically to fig. 1a-1c, before implantation, the implantation plate 100 'is stacked on the delivery plate 200', the implantation holes 110 'on the implantation plate 100' correspond to the delivery holes 210 'on the delivery plate 200' one by one, and then the chips 2 'are implanted into the delivery holes 210' from the implantation holes 110 'of the implantation plate 100', and one chip 2 'is implanted into one delivery hole 210', as shown in fig. 1 a; then the implanting plate 100 'is removed, and the chips 2' are rolled back by the leveling roller 300 'to vertically stand up and cling to the adhesive tape 400', as shown in fig. 1b, so as to ensure controllable copper thickness and width during subsequent copper dipping; then, the chip 2 'stuck by the tape 400' and the conveying plate 200 'are turned over by 180 ° to stick the copper paste to the end of the chip 2', as shown in fig. 1 c. However, the existing end capping method has the following problems:
firstly, the implantation hole 110 'and the delivery hole 210' have small aperture and large density, so that the requirement on the alignment precision of the implantation hole and the delivery hole is high; moreover, the processing precision requirement of the inner wall of the conveying hole 210 'is high, and there can be no abnormality such as step burrs, otherwise the chip 2' is easily clamped when entering the conveying hole 210 ', so that the chip 2' is obliquely inserted into the conveying hole 210 ', as shown in fig. 2a, the chip 2' is damaged due to the pressure of the roller 300 'when leveling, and the chip 2' is obliquely stuck when being stained with copper;
secondly, the conveying holes 210 ' of the conveying plate 200 ' easily scrape a copper layer formed after the chips 2 ' are dipped with copper during discharging, so that the quality of the capacitor is influenced;
thirdly, the conveying plate 200 ' is easy to generate local deformation, as shown in fig. 2b, the chip 2 ' is inclined due to the local deformation position, and the service life of the conveying plate 200 ' is low;
fourthly, in the case of the MLCC of an ultra-small size such as 008004, since the diameter of the conveyance holes 210 'is required to be smaller and the conveyance board 200' is required to be thinner, the conveyance holes 210 'densely opened in the extremely thin conveyance board 200' may cause insufficient strength of the conveyance board 200 ', and the life of the conveyance board 200' may be reduced.
Therefore, it is necessary to provide a chip end-sealing positioning device and a positioning method that can improve the service life of the conveying plate and reduce the processing precision of the conveying plate, so as to solve the above problems.
Disclosure of Invention
The invention aims to provide a chip end-sealing positioning device which can prolong the service life of a conveying plate and reduce the processing precision of the conveying plate.
Another object of the present invention is to provide a chip positioning method capable of improving the service life of the conveying plate and reducing the processing precision of the conveying plate.
In order to achieve the purpose, the technical scheme of the invention is as follows: the chip end-capping positioning device is suitable for end-capping positioning of a chip of a laminated ceramic capacitor and comprises an implantation plate and a conveying plate; the implantation plate comprises at least one first cross beam and at least one first vertical beam, the first cross beam and the first vertical beam are arranged vertically, an implantation unit is formed in the area between the first cross beam and the first vertical beam, each implantation unit is provided with a plurality of implantation areas arranged at intervals, and each implantation area is provided with a plurality of implantation holes in a penetrating mode; the conveying plate comprises at least one second cross beam and at least one second vertical beam, the second cross beam and the second vertical beam are arranged perpendicularly, conveying units are formed in the area between the second cross beam and the second vertical beam, each conveying unit is provided with a plurality of conveying areas arranged at intervals, the conveying areas correspond to the implantation areas one to one, and each conveying area is provided with a conveying hole in a penetrating mode.
Preferably, each of the implantation units includes a plurality of first transverse supporting portions arranged in parallel and a plurality of first vertical supporting portions arranged in parallel, the first transverse supporting portions and the first vertical supporting portions are arranged vertically, and the implantation area is formed in an area between the first transverse supporting portions and the first vertical supporting portions; each conveying unit comprises a second transverse supporting part corresponding to the first transverse supporting part and a second vertical supporting part corresponding to the first vertical supporting part, and the conveying area is formed by the area between the second transverse supporting part and the second vertical supporting part; when the implantation plate and the delivery plate are superposed, all the implantation holes on the implantation area are communicated with the delivery holes corresponding to the implantation holes.
Preferably, a boss is further disposed on one side surface of the implantation area, the outer diameter of the boss is smaller than the inner diameter of the conveying hole, the height of the boss is smaller than or equal to the thickness of the conveying plate, each implantation hole penetrates through the boss, and when the implantation plate is stacked on the conveying plate, the boss is accommodated in the conveying hole.
Preferably, the widths of the first and second lateral supports are the same and smaller than the widths of the first and second beams; the widths of the first vertical supporting part and the second vertical supporting part are the same and smaller than the widths of the first vertical beam and the second vertical beam.
Preferably, the widths of the first transverse supporting portion, the first vertical supporting portion, the second transverse supporting portion and the second vertical supporting portion are all 2-8 mm.
Preferably, the implantation plate has a plurality of first beams arranged in parallel and a plurality of first vertical beams arranged in parallel, and the delivery plate has a second beam corresponding to the first beam and a second vertical beam corresponding to the first vertical beam.
Preferably, the widths of the first cross beam and the second cross beam are the same, and the widths of the first vertical beam and the second vertical beam are the same.
Preferably, the implantation area and the delivery area are both square structures, and the delivery holes are square structures with the side length of 50-150 mm.
Preferably, chip end-capping positioner still includes leveling mechanism, leveling mechanism is including parallel arrangement's flattening platform and flattening sky board, the flattening platform the equal more than or equal to of flattening sky board size the conveyer plate size.
Correspondingly, the invention also provides a chip end-capping positioning method, which uses the chip end-capping positioning device and is suitable for end-capping positioning of a chip of a multilayer ceramic capacitor, and the method comprises the following steps:
(1) adhering an adhesive tape to one surface of the conveying plate;
(2) the implantation plate is superposed on the other surface of the conveying plate, so that each implantation area corresponds to each conveying area one by one, and all implantation holes on each implantation area are communicated with the conveying holes on the corresponding conveying areas;
(3) placing a plurality of chips on the implantation plate, implanting each chip into one implantation hole of the implantation area correspondingly, implanting the plurality of chips into one corresponding conveying hole simultaneously through the implantation area, and bonding one end of each chip to the adhesive tape;
(4) and the implantation plate is moved away from the conveying plate, and then the chip is leveled by a leveling mechanism so as to be attached to the adhesive tape.
Compared with the prior art, the chip end-sealing positioning device has the advantages that the implantation plate is divided into a plurality of implantation units through the first cross beam and the first vertical beam, a plurality of implantation areas are arranged on each implantation unit at intervals, each implantation area is provided with a plurality of implantation holes in a penetrating mode, the conveying plate is divided into a plurality of conveying units through the second cross beam and the second vertical beam, each conveying unit is provided with a plurality of conveying areas at intervals, the conveying holes correspond to the implantation areas one to one, and each conveying area is provided with one conveying hole in a penetrating mode. Therefore, the space-avoiding design among the implant areas and the space-avoiding design among the delivery areas firstly enhance the strength of each implant unit and each delivery unit, so that each implant unit and each delivery unit are not easy to deform; in addition, the arrangement of the cross beam and the vertical beam greatly improves the strength of the implantation plate and the conveying plate, so that the implantation plate and the conveying plate are not easy to deform integrally, the service lives of the implantation plate and the conveying plate are prolonged, the processing precision of the implantation plate and the conveying plate is reduced, and the processing cost of the implantation plate and the conveying plate is reduced; in addition, a plurality of chips can be implanted in a conveying hole corresponding to the arrangement of a plurality of implantation holes in the same conveying hole, the chips are not easily clamped by the inner wall of the conveying hole during discharging, and then the copper layer is prevented from being scratched by the hole, so that the quality of copper attached to the chips can be improved, and the cost is saved.
Correspondingly, the chip end-sealing positioning method using the chip end-sealing positioning device of the invention also has the above effects.
Drawings
FIGS. 1a-1c are schematic diagrams of a prior art chip termination positioning process.
Fig. 2a-2b are schematic views of a partial state of a conventional transfer plate.
Fig. 3 is a top view of an implant plate in the chip termination positioning device of the present invention.
Figure 4 is an enlarged schematic view of one of the implant units of figure 3.
Fig. 5 is a top view of a transfer plate in the die-termination positioning device of the present invention.
Fig. 6 is an enlarged schematic view of one of the conveyor units of fig. 5.
Figure 7 is a cross-sectional view of an implantation area and a delivery area after the implantation plate and the delivery plate are stacked in accordance with an embodiment of the present invention.
Fig. 8 is a schematic view of the chip of fig. 7 in a state of being implanted.
Fig. 9 is a schematic view of the chip of fig. 8 after implantation.
Fig. 10 is a schematic view of the flattened state of the chip of fig. 9.
FIG. 11 is a schematic view showing the chip of FIG. 10 being stained with copper.
FIG. 12 is a cross-sectional view of an implantation area and a delivery area after an implantation plate and a delivery plate have been superimposed in accordance with another embodiment of the invention.
Detailed Description
Embodiments of the present invention will now be described with reference to the drawings, wherein like element numerals represent like elements. The chip end-capping positioning device 1 provided by the present invention is particularly suitable for end-capping 01005/008004-sized multilayer ceramic capacitors, but the principles and modes thereof can be applied to other sizes of multilayer ceramic capacitors.
Referring first to fig. 3-6, the chip-end-cap positioning device 1 of the present invention includes an implantation plate 100 and a delivery plate 200. The implant plate 100 includes at least one first beam 110 and at least one first vertical beam 120, the first beam 110 and the first vertical beam 120 have a certain width and are vertically disposed, and an implant unit 130 is formed by a region partitioned by the first beam 110 and the first vertical beam 120, as shown in fig. 3; furthermore, each implant unit 130 further has a plurality of implant regions 133 disposed at intervals, and each implant region 133 has a plurality of implant holes 1331 formed therethrough, as shown in fig. 4. Correspondingly, the conveying plate 200 includes at least one second cross beam 210 and at least one second vertical beam 220, the second cross beam 210 and the second vertical beam 220 both have a certain width and are vertically disposed, and a conveying unit 230 is formed by a region partitioned by the second cross beam 210 and the second vertical beam 220, as shown in fig. 5; moreover, each of the conveying units 230 is divided into a plurality of spaced conveying regions 233, the conveying regions 233 of each of the conveying units 230 correspond to the implant regions 133 of each of the implant units 130 one by one, and as shown in fig. 6, each of the conveying regions 233 is perforated with a conveying hole 2331.
As shown in fig. 10, the chip end-capping positioning apparatus 1 of the present invention further includes a leveling mechanism 300, wherein the leveling mechanism 300 includes a leveling platform 310 and a leveling top board 320, which are disposed in parallel, and the size of each of the leveling platform 310 and the leveling top board 320 is greater than or equal to that of the conveying board 200, and the chip 2 positioned by the conveying board 200 is leveled by the cooperation of the two (described in detail later), wherein a distance D1 between the top surface of the leveling platform 310 and the top surface of the leveling top board 320 is equal to the thickness of the adhesive tape 400 + the size of the chip 2 + an allowable error, and the allowable error is preferably 0-50 um, but not limited thereto.
Referring to fig. 3 and 5, in an embodiment of the present invention, the implant plate 100 includes a first horizontal beam 110 and a first vertical beam 120, which are vertically disposed, and the first horizontal beam 110 and the first vertical beam 120 are vertically disposed at a middle portion of the implant plate 100, so that the first horizontal beam 110 and the first vertical beam 120 divide four implant units 130 on the implant plate 100, and the overall strength of the implant plate 100 can be enhanced by disposing the first horizontal beam 110 and the first vertical beam 120 with a certain width. Correspondingly, the conveying plate 200 also comprises a second cross beam 210 and a second vertical beam 220 which are vertically arranged, the second cross beam 210 and the second vertical beam 220 are vertically arranged in the middle of the conveying plate 200, so that the conveying plate 200 is also divided into four conveying units 230, and the arrangement of the second cross beam 210 and the second vertical beam 220 on the conveying plate 200 also plays a role in enhancing the overall strength of the conveying plate.
Understandably, the number of the implant units 130 on the implant plate 100 and the number of the delivery units 230 on the delivery plate 200 are not limited to four. For example, in other embodiments, a plurality of first transverse beams 110 and a plurality of first vertical beams 120 arranged in parallel may be disposed on the implantation plate 100, and the first transverse beams 110 and the first vertical beams 120 are vertically disposed, thereby dividing a plurality of implantation units 130 on the implantation plate 100. The number of the second cross beams 210 and the second vertical beams 220 on the conveying plate 200 may be set to correspond to the number of the first cross beams 110 and the first vertical beams 120.
As shown in fig. 3 and 5, in the present invention, the widths of the first cross member 110 and the second cross member 210 are preferably the same, and the widths of the first vertical member 120 and the second vertical member 220 are preferably the same. Due to the structural arrangement, when the implant plate 100 is superposed with the delivery plate 200, the upper plate and the lower plate can be quickly aligned and the alignment precision is improved by aligning the first cross beam 110 with the second cross beam 210 and the first vertical beam 120 with the second vertical beam 220.
Referring to fig. 3, in a more preferred embodiment of the present invention, the first transverse beam 110 and the first vertical beam 120 of the implant plate 100 have the same width, and both have a width of L1. Accordingly, the widths of the second cross beams 210 and the second vertical beams 220 of the conveying panel 200 are also the same, and are also preferably L1, as shown in fig. 5. That is, the width of all the transverse beams and the vertical beams of the implant plate 100, the delivery plate 200 are the same. This arrangement can further improve the alignment accuracy.
Referring again to fig. 3-6, in a more preferred embodiment of the present invention, the implant plate 100 and the delivery plate 200 are both square in configuration and have the same dimensions. Moreover, the first transverse beam 110 and the first vertical beam 120 on the implant plate 100 are arranged at the center of each side edge, and the widths of the first transverse beam 110 and the first vertical beam 120 are the same and are both L1, so that four implant units 130 with the same size are separated on the implant plate 100. Correspondingly, the widths of the second transverse beam 210 and the second vertical beam 220 on the delivery board 200 are also L1, and the second transverse beam 210 and the second vertical beam 220 are also arranged at the central position of each side edge of the delivery board 200, so that four delivery units 230 with the same size are also separated from the delivery board 200, and the size of each delivery unit 230 is the same as that of each implantation unit 130, and the structural arrangement can enable the implantation board 100 and the delivery board 200 to be aligned quickly, and has high alignment precision.
It is apparent that in other embodiments, the implantation plate 100 and the delivery plate 200 are not limited to the square structure, the sizes of the implantation units 130 formed on the implantation plate 100 are not necessarily all the same, and the delivery unit 230 on the delivery plate 200 may be provided corresponding to the implantation unit 130.
The specific structure of the implant unit 130 and the delivery unit 230 according to the present invention will be described in detail with reference to fig. 3 to 7.
As shown in fig. 4 and 7, each implant unit 130 includes a plurality of first horizontal support portions 131 and a plurality of first vertical support portions 132, which are arranged in parallel, and the first horizontal support portions 131 and the first vertical support portions 132 are arranged vertically, each implant region 133 is formed by the areas formed by the first horizontal support portions 131 and the first vertical support portions 132, and a plurality of implant holes 1331 are uniformly formed in each implant region 133, as shown in fig. 4. In an embodiment of the present invention, each implant unit 130 includes two first transverse support portions 131 and two first vertical support portions 132, the two first transverse support portions 131 are uniformly arranged along the longitudinal direction of the implant unit 130, and likewise, the two first vertical support portions 132 are uniformly arranged along the transverse direction of the implant unit 130, so that nine implant regions 133 having the same size are partitioned on each implant unit 130, and each implant region 133 has a square structure, as shown in fig. 4.
In the present embodiment, the first lateral support portion 131 and the first vertical support portion 132 both have a certain width, and the width of the two may be the same or different, and in the present embodiment, the width of the two is preferably the same and both L2, as shown in fig. 4. The first horizontal supporting portion 131 and the first vertical supporting portion 132 having a certain width are used to connect the implant region 133 for forming the implant hole 1331, that is, the space-saving design is performed on the region where the implant hole 1331 is formed in each implant unit 130, so that the strength of the implant unit 130 can be enhanced, and compared with the manner that the implant holes are densely formed in all regions of the implant unit 130, the implant unit 130 of the present invention is not easily deformed, so that the strength and the service life of the entire implant plate 100 are improved.
As shown in fig. 6 to 7, in the present embodiment, each of the conveying units 230 includes a second transverse supporting portion 231 corresponding to the first transverse supporting portion 131 and a second vertical supporting portion 232 corresponding to the first vertical supporting portion 132, that is, each of the conveying units 230 includes two second transverse supporting portions 231 and two second vertical supporting portions 232 which are vertically disposed, the width of the second transverse supporting portion 231 is the same as that of the first transverse supporting portion 131 and is L2, the two second transverse supporting portions 231 and the two second vertical supporting portions 232 divide nine conveying regions 233 having the same size on each of the conveying units 230, and each of the conveying regions 233 has a square structure, so that each of the conveying regions 233 can correspond to one of the implantation regions 133, and one conveying hole 2331 is opened in each of the conveying regions 233, thereby forming a plurality of implantation regions 100, When the delivery plates 200 are stacked, a plurality of implant holes 1331 of one implant region 133 correspond to one delivery hole 2331.
In the present invention, the size of the delivery hole 2331 is set to correspond to the area of the implant region 133 where the implant hole 1331 is opened, as long as when the implant plate 100 and the delivery plate 200 are stacked, it is ensured that the plurality of implant holes 1331 of the implant region 133 are all communicated with the corresponding delivery holes 2331, that is, the size of the delivery hole 2331 needs to be slightly larger than the area of the implant region 133 where the implant hole 1331 is opened, specifically, as shown in fig. 7, only four implant holes 1331 are schematically drawn in fig. 7, but the number of implant holes 1331 opened in the implant region 133 is not limited to that in fig. 7. In a preferred embodiment of the present invention, the delivery hole 2331 has a square structure, and the length of the side of the delivery hole 2331 is preferably 50-150mm, but not limited thereto.
In the present invention, each of the conveying units 230 is provided with the second horizontal supporting portion 231 and the second vertical supporting portion 232 having a certain width, and the perforated conveying area 233 is connected by the second horizontal supporting portion 231 and the second vertical supporting portion 232, that is, the perforated area on each of the conveying units 230 is designed to be void-free, so that the strength of the conveying unit 230 can be enhanced, compared to a method of densely forming the conveying holes 2331 in all the areas of the conveying unit 230, in the present invention, due to the void-free arrangement of the second horizontal supporting portion 231 and the second vertical supporting portion 232, the conveying units 230 are not easily deformed, so that the whole conveying plate 200 is not easily deformed, the service life of the whole conveying plate 200 is prolonged, the processing precision of the conveying plate 200 is reduced, and the processing cost of the conveying plate 200 is reduced. In addition, through the arrangement mode that one delivery hole 2331 corresponds to a plurality of implantation holes 1331, as shown in fig. 7, only four implantation holes 1331 are schematically drawn in fig. 7, so that a plurality of chips are implanted into one delivery hole 2331 at one time, compared with the mode that one delivery hole 2331 corresponds to one chip, the delivery hole 2331 in the invention can effectively avoid the problem of chip clamping stagnation, and the delivery hole 2331 is not easy to scratch a copper layer on the chip during discharging, thereby improving the end-capping quality.
As shown in fig. 3 to 6, in the preferred embodiment of the present invention, the widths of the first lateral support part 131, the first vertical support part 132, the second lateral support part 231 and the second vertical support part 232 are all L2, and the width L2 is preferably smaller than the width L1 of the transverse beam and the vertical beam, so that different support strengths are formed for different sized regions in the implantation plate 100 and the delivery plate 200, and the strengths of the two can be further enhanced. Of course, the width L2 is not limited to be smaller than the width L1, and both widths can be flexibly set according to the needs.
In an embodiment of the present invention, the width L2 of the first transverse supporting portion 131, the first vertical supporting portion 132, the second transverse supporting portion 231, and the second vertical supporting portion 232 is preferably 2-8mm, but not limited thereto, and the specific width thereof can be flexibly adjusted according to the needs and the thickness of the implantation plate 100 and the delivery plate 200.
Referring to fig. 12, in another embodiment of the positioning device 1 for chip termination of the present invention, a boss 1332 is disposed on one side of the implantation region 133, the outer diameter of the boss 1332 is slightly smaller than the inner diameter of the delivery hole 2331, the height of the boss 1332 is smaller than or equal to the thickness of the delivery plate 200, a plurality of implantation holes 1331 are opened at the position of the implantation region 133 having the boss 1332, only four implantation holes 1331 are schematically illustrated in fig. 12, and the number in fig. 12 is not limited. The thickness of implant region 133 is made greater than the thickness of other portions of implant plate 100 by the provision of bosses 1332. Thus, when the implant board 100 is stacked on one surface of the delivery board 200, the boss 1332 protrudes into the delivery hole 2331, and the end surface of the boss 1332 is at a certain distance from or in the same plane as the other surface of the delivery board 200 (or from the adhesive tape 400), the height of the implant hole 1331 is increased by the thickening of the implant region 133, when a chip 2 with a smaller size (for example, a chip of 008004-sized laminated ceramic capacitor) is implanted, the chip 2 can be prevented from being implanted obliquely and lying horizontally, and the chip 2 can be ensured to be implanted vertically.
In a preferred embodiment of the present invention, the difference between the height of the boss 1332 and the thickness of the conveying plate 200 is preferably 20 to 40um, so that when the boss 1332 protrudes into the conveying hole 2331, the distance D2 between the end surface of the boss 1332 and the adhesive tape 400 is about 20 to 40um, as shown in fig. 12, so as not to be adhered to the adhesive tape 400.
Next, referring to fig. 8 to 12, a description will be given of a method for positioning chip termination by using the apparatus 1 for positioning chip termination according to the present invention, taking a 01005 size multilayer ceramic capacitor as an example, wherein the length and width of the 01005 size multilayer ceramic capacitor are generally 0.4 × 0.2 mm. The chip end-sealing positioning method specifically comprises the following steps:
(1) a high temperature adhesive tape is attached to one surface of the transfer plate 200.
(2) The implant plate 100 is stacked on the other surface of the delivery plate 200 such that the implant regions 133 correspond to the delivery regions 233 one by one, and all the implant holes 1331 of each implant region 133 are communicated with the delivery holes 2331 therebelow.
Referring to fig. 3-6 and 8, the implantation plate 100 is stacked on the surface of the delivery plate 200 away from the adhesive tape 400, and the first transverse beam 110 and the first vertical beam 120 of the implantation plate 100 correspond to the second transverse beam 210 and the second vertical beam 220 of the delivery plate 200, respectively, so that the four implantation units 130 correspond to the four delivery units 230. Meanwhile, the respective implantation regions 133 of each implantation unit 130 correspond to the respective delivery regions 233 of each delivery unit 230 one by one, and all the implantation holes 1331 on each implantation region 133 are communicated with the delivery holes 233 therebelow, as shown in fig. 8, only four implantation holes 1331 are schematically drawn in fig. 8, and four implantation holes 1331 are communicated with one delivery hole 233 therebelow, of course, the number of implantation holes 1331 is not limited to that in fig. 8.
(3) A plurality of chips 2 are placed on the implant plate 100 such that one end of each chip 2 is implanted into one of the implant holes 1331 of the implant region 133, a plurality of chips 2 are simultaneously implanted into one of the delivery holes 2331 through one of the implant holes 1331 of the implant region 133 at one time with one end of each chip 2 being bonded to the adhesive tape 400, and then the implant plate 100 is removed from the delivery plate 200.
As shown in fig. 3-6 and 8-9, when implanting chips 2, a plurality of chips 2 are placed on the implant board 100, and a large number of chips are implanted at a time through the plurality of implant regions 133 of the four implant units 130. Taking an implantation region 133 as an example, the implantation region 133 has a plurality of chips 2 thereon, and then one end of each chip 2 corresponds to one implantation hole 1331, at this time, the chips 2 can be introduced into the delivery holes 2331 through the implantation holes 1331, that is, the chips 2 are simultaneously implanted into one delivery hole 2331 through the implantation holes 1331 of the implantation region 133, and only four implantation holes 1331 are schematically shown in fig. 8.
After the chips 2 are vertically introduced into the transfer holes 2331 through the implanting holes 1331 and one end of each chip 2 is adhered to the adhesive tape 400, the implanting plate 100 is then removed from the transfer plate 200, and a plurality of chips 2 are vertically adhered in each transfer hole 2331, as shown in fig. 9, in which only four chips 2 are schematically shown in fig. 9.
(4) The chip 2 is flattened by the flattening mechanism 300 so that one end thereof abuts on the adhesive tape 400.
Referring specifically to fig. 3-6 and 10, the conveying plate 200, the adhesive tape 400 and the chips 2 bonded thereon are integrally moved to the leveling platform 310 of the leveling mechanism 300, and the leveling top plate 320 is pressed against the upper ends of the chips 2 to level the chips 2, so that each chip 2 is tightly attached to the adhesive tape 400, and only four chips 2 are schematically illustrated in fig. 10.
Furthermore, the chip end-capping positioning method of the invention may further include the steps of:
(5) the conveying plate 200, the adhesive tape 400 and the chip 2 bonded thereon are turned over by 180 ° as a whole, so that the end of the chip 2 is stained with copper paste, and the copper staining operation is completed, as shown in fig. 11.
It should be noted that the chip end-capping and positioning device 1 of the present invention is not limited to the use for end-capping and positioning a 01005-sized multilayer ceramic capacitor, but any other multilayer ceramic capacitor, for example, a 0201-sized multilayer ceramic capacitor (length, width, 0.6, 0.3mm) may be applied to the chip end-capping and positioning device 1 of the present invention, and the hole diameter of the implantation hole 1331 may be adjusted according to the size of the multilayer ceramic capacitor.
Furthermore, for the 008004-sized laminated ceramic capacitor, because the size is too small, the implant board 100 of the other embodiment of the chip-end-capping positioning device 1 of the present invention, i.e. the implant board 100 with the boss 1332 on one side of the implant region 133, is adopted, and as shown in fig. 12 in particular, when the implant board 100 of this structure is stacked on the delivery board 200, the boss 1332 protrudes into the delivery hole 2331, and the boss 1332 is disposed so that the height of the implant hole 1331 is increased, therefore, when the chip 2 of the 008004-sized laminated ceramic capacitor is implanted through the implant hole 1331, the implant skew and the lying can be avoided, and the chip 2 can be implanted vertically.
In summary, in the chip-capping positioning apparatus 1 of the present invention, firstly, the implantation plate 100 is divided into a plurality of implantation units 130 by the first beam 110 and the first vertical beam 120, and a plurality of implantation regions 133 are disposed at intervals on each implantation unit 130, and each implantation region 133 is penetrated by a plurality of implantation holes 1331, secondly, the delivery plate 200 is divided into a plurality of delivery units 230 by the second beam 210 and the second vertical beam 220, and a plurality of delivery regions 233 are disposed at intervals on each delivery unit 230, wherein the delivery holes 2331 correspond to the implantation regions 133 one by one, and each delivery region 233 is penetrated by a delivery hole 2331. In the present invention, the design of the gaps between the implant regions 133 and the design of the gaps between the delivery regions 233 first enhances the strength of each implant unit 130 and each delivery unit 230, so that each implant unit 130 and each delivery unit 230 are not easily deformed; in addition, the arrangement of the transverse beams and the vertical beams greatly improves the strength of the implantation plate 100 and the conveying plate 200, so that the implantation plate 100 and the conveying plate 200 are not easy to deform integrally, the service lives of the implantation plate 100 and the conveying plate 200 are prolonged, the processing precision of the implantation plate 100 and the conveying plate 200 is reduced, and the processing cost of the implantation plate 100 and the conveying plate 200 is reduced; in addition, the same delivery hole 2331 corresponds to the arrangement of the plurality of implantation holes 1331, a plurality of chips 2 can be implanted into one delivery hole 2331, the chips 2 are not easily clamped by the inner wall of the delivery hole 2331 during unloading, and further the copper layer is prevented from being scratched by a hole of the plate, so that the copper-stained quality of the chips 2 can be improved, and the cost is saved.
Accordingly, the chip end-sealing positioning method using the chip end-sealing positioning device 1 of the present invention also has the above-mentioned effects.
The structure of the multilayer ceramic capacitor according to the present invention and other steps of the end-capping method thereof are conventional and well known to those skilled in the art, and will not be described in detail herein.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. A chip end-capping positioning device is suitable for end-capping positioning of a chip of a multilayer ceramic capacitor, and is characterized by comprising:
the implant plate comprises at least one first cross beam and at least one first vertical beam, the first cross beam and the first vertical beam are arranged vertically, an implant unit is formed in the area between the first cross beam and the first vertical beam, each implant unit is provided with a plurality of implant areas arranged at intervals, and each implant area is provided with a plurality of implant holes in a penetrating mode;
the conveying plate comprises at least one second cross beam and at least one second vertical beam, the second cross beam and the second vertical beam are arranged perpendicularly, conveying units are formed in the area between the second cross beam and the second vertical beam, each conveying unit is provided with a plurality of conveying areas arranged at intervals, the conveying areas correspond to the implantation areas one to one, and each conveying area is provided with a conveying hole in a penetrating mode.
2. The positioning apparatus for die termination according to claim 1, wherein each of the implant units comprises a plurality of first lateral support portions and a plurality of first vertical support portions, the first lateral support portions and the first vertical support portions are arranged in parallel, the first lateral support portions and the first vertical support portions are arranged vertically, and the implant area is formed by the area between the first lateral support portions and the first vertical support portions;
each conveying unit comprises a second transverse supporting part corresponding to the first transverse supporting part and a second vertical supporting part corresponding to the first vertical supporting part, and the conveying area is formed by the area between the second transverse supporting part and the second vertical supporting part;
when the implantation plate and the delivery plate are superposed, all the implantation holes on the implantation area are communicated with the delivery holes corresponding to the implantation holes.
3. The positioning apparatus for chip end-caps according to claim 1, wherein a side of the implantation area is further provided with a boss, an outer diameter of the boss is smaller than an inner diameter of the transportation hole, a height of the boss is smaller than or equal to a thickness of the transportation plate, each of the implantation holes penetrates through the boss, and the boss is received in the transportation hole when the implantation plate is stacked on the transportation plate.
4. The die termination positioning device of claim 2, wherein the widths of the first and second lateral supports are the same and less than the widths of the first and second beams; the widths of the first vertical supporting part and the second vertical supporting part are the same and smaller than the widths of the first vertical beam and the second vertical beam.
5. The die termination positioning device of claim 2, wherein the widths of the first lateral support portion, the first vertical support portion, the second lateral support portion, and the second vertical support portion are all 2-8 mm.
6. The die attach positioning apparatus of claim 1, wherein said implant plate has a plurality of first beams disposed in parallel and a plurality of first vertical beams disposed in parallel, and said delivery plate has a second beam corresponding to said first beam and a second vertical beam corresponding to said first vertical beam.
7. The die termination positioning device of claim 6, wherein the first beam and the second beam have the same width, and the first vertical beam and the second vertical beam have the same width.
8. The device as claimed in claim 1, wherein the implantation region and the delivery region are both square, and the delivery hole is square and has a side length of 50-150 mm.
9. The positioning apparatus for chip end-capping according to claim 1, further comprising a leveling mechanism, wherein the leveling mechanism comprises a leveling platform and a leveling top plate disposed in parallel, and the size of the leveling platform and the size of the leveling top plate are both greater than or equal to the size of the conveying plate.
10. A chip end-capping positioning method using the chip end-capping positioning device as claimed in any one of claims 1 to 9, which is suitable for end-capping positioning of a chip of a multilayer ceramic capacitor, and comprises the following steps:
(1) adhering an adhesive tape to one surface of the conveying plate;
(2) the implantation plate is superposed on the other surface of the conveying plate, so that each implantation area corresponds to each conveying area one by one, and all implantation holes on each implantation area are communicated with the conveying holes on the corresponding conveying areas;
(3) placing a plurality of chips on the implantation plate, implanting each chip into one implantation hole of the implantation area correspondingly, implanting the plurality of chips into one corresponding conveying hole simultaneously through the implantation area, and bonding one end of each chip to the adhesive tape;
(4) and the implantation plate is moved away from the conveying plate, and then the chip is leveled by a leveling mechanism so as to be attached to the adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110872978.7A CN113539921A (en) | 2021-07-30 | 2021-07-30 | Chip end-sealing positioning device and positioning method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110872978.7A CN113539921A (en) | 2021-07-30 | 2021-07-30 | Chip end-sealing positioning device and positioning method |
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| CN113539921A true CN113539921A (en) | 2021-10-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116153664A (en) * | 2023-02-24 | 2023-05-23 | 深圳市宇阳科技发展有限公司 | Ceramic capacitor mounting device and ceramic capacitor reflow soldering mounting method |
-
2021
- 2021-07-30 CN CN202110872978.7A patent/CN113539921A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116153664A (en) * | 2023-02-24 | 2023-05-23 | 深圳市宇阳科技发展有限公司 | Ceramic capacitor mounting device and ceramic capacitor reflow soldering mounting method |
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