JPH08115916A - Method of forming solder bump - Google Patents

Abstract

PURPOSE: To form an inexpensive solder bump without a chip by sucking a solder ball by vacuum from the rear of a mask when making the mask adsorb the solder ball, and also, adding force in the direction orthogonal to the direction the vacuum suction to the solder ball in the vicinity of an installation hole so as to agitating it. CONSTITUTION: Solder balls 16 are placed in holes 3 of an a line-up jig 1. Vacuum suction 20 is performed while giving agitation force 21 to the solder balls 16b within a cover 8 by air flow, and the solder balls 16 are put in order in the holes 3. Vacuum suction 18 is connected, and a line-up jig 1 is inverted, and solder balls 18 are retained downward and carried to a liquid storage container 40, and the tip of the solder ball 16 is soaked in fixing liquid 43. The solder balls 16 wetted with the fixing liquid 43 are positioned to terminals 51. The vacuum suction 18 of a hose 7 is changed over to air blow 52. The transcription onto a terminal electrode 51 of solder balls 16 is terminated. A solder bump 53 is made by fusing the solder ball 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder bump forming method for forming a solder bump on a terminal electrode of an electronic circuit device.

[0002]

2. Description of the Related Art In recent years, in an electronic circuit device such as an LSI having many input / output terminals, a plurality of terminal electrodes arranged in a grid pattern or a zigzag pattern are provided on the lower surface of the electronic circuit device and the corresponding circuit electrodes on a circuit board. A structure is adopted in which these are connected by protruding contacts (solder bumps). After mounting an LSI having solder bumps formed on a circuit board, the solder bumps are melted and bonded. As one method for forming solder bumps on an LSI, there is a method in which spherical solder (solder balls) is supplied to the terminal electrodes of the LSI and then melted to form the solder bumps.

In Japanese Patent Laid-Open No. 58-118131, after a solder ball is adsorbed on a solder ball adsorbing mask, a solder ball is placed on the head of a pin coated with flux and heated and melted. It is a thing. A method is disclosed in which, when a solder ball is attracted to a mask, a container containing a large number of solder balls is vibrated, and the solder ball bounced by the vibration is suctioned by vacuum suction from the back surface of the mask. Further, there is disclosed a method in which the solder balls are easily separated by applying vibration when transferring and transferring the solder balls from the mask.

In Japanese Patent Laid-Open No. 5-129374, a solder ball is adsorbed by a mask for adsorbing the solder ball, and then the solder ball is placed on a terminal electrode of a circuit device coated with flux and heated and melted. Is. When a solder ball is attracted to a mask, a method is disclosed in which a container containing a large number of solder balls is covered with the mask, and the solder ball is sucked up by vacuum suction from the back surface of the mask while being turned over. Further, there is disclosed a method in which an impact force is applied when the solder balls are transferred and transferred from the mask to facilitate the separation of the solder balls. Further, there is disclosed a method in which, when applying flux to a terminal electrode, an applying jig having a plurality of protrusions is provided, the flux is once attached to the protrusion of the applying jig, and the flux is transferred to the terminal electrode and applied. There is.

[0005]

However, the above-mentioned conventional methods have the following problems.

When the solder balls are attracted to the mask by vacuum suction from the back surface of the mask, the solder balls 16 form a bridge as shown in FIG. 15, and the solder balls 16 may not enter the mounting holes 3 of the mask 2. To do.
In the method described in JP-A-58-118131, since a ball bounced by vibration is vacuum-sucked, the chance of generating a bridge is small, but a plurality of air-flows 20 accompanied by the vacuum suction 18 can be used. A bridge may occur when the solder balls 16 are present at the same time, or when the solder balls 300, which have already been aggregated into a plurality of units in the solder ball container, are flying.

When the solder balls are transferred and transferred from the mask, the solder balls may not drop due to an electrostatic effect, adhesion due to moisture or the like, or biting. It is not possible to guarantee that the solder balls are reliably separated from the mask by the method of applying vibration and the method of applying impact force.

When applying the flux to the terminal electrodes,
In JP-A-5-129374, a coating jig having a plurality of protrusions is used. However, when the coating jig is repeatedly used, the residue of flux is accumulated on the tip of the protrusion, so that the coating amount changes. To prevent this, maintenance is necessary to keep the tip of the protrusion clean. Even when the flux is applied by screen printing, the maintenance for preventing the adhesion and accumulation of the flux on the screen is also required, which leads to an increase in the cost of the electronic circuit device.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an inexpensive method for forming solder bumps, in which solder bumps are not missing.

[0010]

Therefore, in the present invention, the following technical means are used.

When the solder balls are attracted to the mask, vacuum suction is performed from the back surface of the mask, and force is applied to the solder balls in the vicinity of the mounting hole in a direction orthogonal to the vacuum suction direction to stir.

Further, after performing the suction operation of the solder balls to the mask, it is detected whether or not the solder balls are mounted in all the mounting holes, and the suction operation is performed until the solder balls are mounted in all the mounting holes. I decided to repeat it.

When transferring and transferring the solder balls from the mask, a force for pushing the solder balls out of the mask is applied.

When applying the flux, the flux is adhered to the tip of the solder ball mounted on the mask without using the means such as the application jig or the printing mask, and the solder ball to which the flux is adhered is transferred to the terminal electrode, I decided to transfer it.

[0015]

The bridge between the solder balls can be broken by applying a force to the solder balls in the vicinity of the mounting hole in the direction orthogonal to the vacuum suction direction and stirring.
Alternatively, the solder balls aggregated in a plurality of units can be excluded from the vicinity of the mounting hole. Therefore, it is possible to reduce the loss of the solder balls when the solder balls are attracted to the mask.

Further, the mounting state is detected after the suction operation to the mask, and the suction operation is repeated until the solder balls are mounted in all the mounting holes, so that the solder balls can be securely mounted to the mask. it can.

By extruding the solder balls from the mask and transferring and transferring the solder balls, the solder balls can be reliably removed from the mask, and it is possible to eliminate the lack of the solder balls during transfer.

By attaching flux to the solder balls themselves and placing them on the terminal electrodes, a coating jig or a printing mask is not required, and the deposition of flux residue impairs the stability of coating. Therefore, an inexpensive solder bump forming method can be provided.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below with reference to FIGS.

A first embodiment of the present invention will be described with reference to FIGS. 1 to 6.

FIG. 1 is a process flow chart showing a solder bump forming method according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing the structure of an alignment jig according to the first embodiment of the present invention.

FIG. 3 is a sectional view showing the structure of a cover for mounting solder balls according to the first embodiment of the present invention.

FIG. 4 is a process flow diagram showing in detail the steps from FIG. 1 (1) to FIG. 1 (2).

FIG. 5 is a process flow chart showing in detail the processes from FIG. 1 (2) to FIG. 1 (3).

FIG. 6 is a process flow chart showing in detail the processes from FIG. 1 (4) to FIG. 1 (6).

First, the structure of the alignment jig will be described with reference to FIG. The alignment jig 1 has a mask 2 attached to a base 5. Mounting holes 3 are provided in the mask 2 at positions corresponding to the terminal electrodes 51 of the electronic circuit device 50, and the diameter of the mounting holes 3 is slightly larger than the diameter of the solder balls 16.
A suction hole 4 having a diameter smaller than that of the solder ball 16 is formed in the bottom portion of the mounting hole 3 and penetrates to the base 5 side. A hose 7 is connected to the hole 6 formed in the base 5. The other end of the hose 7 is connected via a switch so as to be connected to either a vacuum suction device or an air blower. (A vacuum suction device, an air blower, and a switching device are not shown.) The alignment jig 1 is fixed to a transfer positioning device (not shown), and the orientation of the top and bottom is reversed, and the cover 8 and
It is transported to the liquid reservoir 40 and the electronic circuit device 50 and positioned.

Next, the structure of the cover 8 for mounting the solder balls will be described with reference to FIG. The cover 8 has a cup shape for covering the mask 2, and has a hole 9,
The holes 10 and 11 are formed. A pipe 12 in the hole 9,
A pipe 13 is connected to the hole 10, and a hose 14 is connected to the hole 11. Diameter of holes 9 and 10 and tube 12
The inner diameter of the tube 13 is larger than the diameter of the solder ball 16. The other end of the tube 12 is connected to a solder ball reservoir for retaining the solder balls 16. (The solder ball reservoir is not shown.) The other end of the tube 13 is connected to a vacuum suction device. (The vacuum suction device is not shown.) The other end of the hose 14 is connected to an air blower. (The air blower is not shown.) Next, referring to FIG. 1, the overall flow of the method for forming solder bumps will be described.

First, the mounting hole 3 of the mask 2 of the alignment jig 1
Then, the solder balls 16 are mounted (FIG. 1 (1)). By applying a suction force 21 to the solder balls 16 in the cover 8 by the air blow 19 and performing vacuum suction 20 by the vacuum suction 18, the solder balls 16 are sequentially inserted into the mounting holes 3.
Can be installed.

When the mounting is completed, the alignment jig 1 is reversed while the vacuum suction 18 is continued, and the solder balls 16 are held downward (FIG. 1 (2)).

The alignment jig 1 is conveyed to the liquid reservoir 40 and the tip of the solder ball 16 is dipped in the fixing liquid 43 (FIG. 1 (3)).

The alignment jig 1 is conveyed to the electronic circuit device 50, and the positions of the terminal electrodes 51 and the solder balls 16 are aligned (FIG. 1 (4)). At this time, the fixing liquid 43 is attached to the tips of the solder balls 16.

The alignment jig 1 is lowered to lower the solder balls 16
Vacuum contact of the hose 7 after contacting the terminal electrode 51 with
8 is switched to the air blow 52, and while the air blow 52 is being performed, the alignment jig 1 is slightly raised (FIG. 1 (5)).

The air blow 52 is cut to retract the alignment jig 1, and the transfer of the solder balls 16 onto the terminal electrodes 51 is completed (FIG. 1 (6)).

Next, heating 55 is applied to the electronic circuit device 50,
The solder balls 16 are melted to form the solder bumps 53 (FIG. 1 (7)).

Next, the process of mounting the solder balls 16 on the alignment jig 1 will be described in detail with reference to FIG.

The alignment jig 1 is conveyed to the cover 8 with the mounting hole 3 facing upward (FIG. 4 (1)), and the cover 8 is placed over the alignment jig 1 (see FIG. 4 (2)).

Next, the solder balls 16 are pressure-fed or dropped from the solder ball reservoir in the direction of the arrow 17 through the tube 12 and supplied into the inside 15 of the cover 8 (FIG. 4 (3)).
The number of solder balls 16 supplied is larger than the number of mounting holes 3 of the mask 2.

Next, an air blow 19 is applied from the hose 14 to the inside 15 of the cover 8 to give a stirring force 21, while vacuum suction 18 is applied to the mounting hole 3 of the mask 2 by the vacuum suction 18 from the hose 7 to thereby solder the solder. The balls 16 are sequentially mounted in the mounting holes 3 (FIG. 4 (4) and FIG. 1 (1)).

When the mounting is completed, vacuum suction 22 is applied to the tube 13 to remove the solder ball 1 mounted in the mounting hole 3.
All the solder balls other than 6 are collected through the tube 13 (FIG. 4 (5)).

After that, the alignment jig 1 is moved from the cover 8, the alignment jig 1 is inverted while the vacuum suction 18 is continued, and the solder balls 16 are held downward (FIG. 4).
(6) and FIG. 1 (2)).

Next, referring to FIG. 5, the step of attaching the fixing liquid 43 to the solder balls 16 will be described in detail.

Liquid reservoir container 40 placed on container 41
Then, the fixer 43 is discharged by the dispenser 42 (FIG. 5 (1)).

A squeegee 4 is provided along the upper surface of the liquid reservoir 40.
4 is moved to flatten the fixative 43 (see FIG. 5).
(2)). At this time, the excess fixing liquid 45 is received and stored in the container 41.

The vacuum suction 18 is reversed while continuing, and the solder balls 16 are conveyed downward to the alignment jig 1 liquid reservoir 40 holding the solder balls 16 (FIG. 5 (3)).

The alignment jig 1 is lowered and the solder balls 16
The tip portion of the is immersed in the fixative 43 (FIG. 5 (4) and FIG. 1 (3)).

When the alignment jig 1 is raised, the solder balls 1
Fixing liquid 43 is attached to the tip of 6 (see FIG. 5).
(5)).

Next, the process of transferring the solder balls 16 onto the electronic circuit device 50 will be described in detail with reference to FIG.

By vacuum suction 18, the alignment jig 1 holding the solder balls 16 downward is positioned so that the terminal electrodes 51 of the electronic circuit device 50 and the solder balls 16 are aligned (FIG. 6 (1) and FIG. 1). (4)). At this time, the fixing liquid 43 has already been attached to the tips of the solder balls 16.

The alignment jig 1 is lowered and the solder balls 16
And the terminal electrode 51 are brought into contact with each other (FIG. 6 (2)). Fixative 43
Spreads over the terminal electrode 51.

The vacuum suction 18 of the hose 7 is stopped, the air blow 52 is switched to, and the aligning jig 1 is raised while giving a force to push the solder ball 16 out of the mounting hole 3 of the mask 2 (FIG. 6 (3) and FIG. 1 (5)). The amount of rise at this time is such that the solder balls 16 do not completely come out of the mounting holes 3.

After that, the air blow 52 is stopped and the alignment jig 1 is further raised (FIG. 6 (4) and FIG. 1 (6)). The solder ball 16 is fixed on the terminal electrode 51 by the fixing liquid 43, and the transfer is completed.

As described in the above embodiment, according to the present invention, the solder ball 16 in the vicinity of the mounting hole 3 is stirred by applying the stirring force 21 by the air blow in the direction orthogonal to the direction of the vacuum suction 20. It is possible to break the bridge between the solder balls 16 and reduce the loss of the solder balls when mounting the solder balls 16 on the mask 2.

By attaching the fixing liquid 43 to the ball 16 itself and placing it on the terminal electrode 51, a coating jig or a printing mask is not required, and the coating liquid is stabilized by depositing the fixing liquid residue. Therefore, it is possible to provide an inexpensive solder bump forming method without the problem of impairing the property.

The solder balls 16 can be reliably removed from the mask 2 by pushing out the ball 16 from the mounting hole 3 of the mask 2 by air blow and transferring and transferring it. It can be lost.

The second embodiment of the present invention will be described with reference to FIG.

FIG. 7 is a process flow chart showing a solder ball mounting process according to the second embodiment of the present invention.

The aligning jig 1 and the cover 3 are shown in FIG. 7 (2).
The structure of 0 will be described.

FIG. 7B shows a state in which the cover 30 covers the aligning jig 1. The structure of the alignment jig 1 is the same as that shown in FIG. The cover 30 has a cup shape for covering the mask 2 and has a hole 3 on its wall.
1. A hole 32 is formed. The pipe 12 is connected to the hole 31, and the pipe 13 is connected to the hole 32. The diameters of the holes 31 and 32 and the inner diameters of the tubes 12 and 13 are larger than the diameter of the solder balls 16. The other end of the tube 12
It is connected to a solder ball reservoir for storing the solder balls 16. (The solder ball reservoir is not shown.) Tube 13
The other end of is connected to a vacuum suction device. (Vacuum suction device is not shown.) Next, referring to FIG. 7, a process of mounting the solder balls 16 on the alignment jig 1 will be described.

The aligning jig 1 is conveyed to the cover 30 with the mounting hole 3 facing upward (FIG. 7 (1)), and the cover 30 is placed over the aligning jig 1 (see FIG. 7). 7 (2)).

Next, from the solder ball reservoir, the solder balls 16 are pressure-fed or dropped in the direction of the arrow 17 through the tube 12 and supplied into the inside 33 of the cover 30 (FIG. 7).
(3)). The number of solder balls 16 supplied is larger than the number of mounting holes 3 of the mask 2.

Next, while vibrating the alignment jig 1 in the direction of the arrow 34 (the vibrating device is not shown), the vacuum suction 18 from the hose 7 vacuum-sucks the mounting hole 3 of the mask 2. Thus, the solder balls 16 are sequentially mounted in the mounting holes 3 (FIG. 7 (4)).

When the mounting is completed, a vacuum suction 22 is applied to the tube 13 so that the solder ball 1 mounted in the mounting hole 3 is attached.
All the solder balls other than 6 are collected through the tube 13 (FIG. 7 (5)).

After that, the alignment jig 1 is moved from the cover 30, and the alignment jig 1 is inverted while the vacuum suction 18 is continued, and the solder balls 16 are held downward (FIG. 7).
(6)).

According to the above-described embodiment, the solder ball 16 in the vicinity of the mounting hole 3 is vibrated and stirred in a direction orthogonal to the direction of the vacuum suction 20, so that the solder ball 1
It is possible to break the bridge between the six, and it is possible to reduce the loss of the solder balls when the solder balls 16 are attached to the mask 2.

A third embodiment of the present invention will be described with reference to FIG.

FIG. 8 is a process flow chart showing a solder ball mounting process according to the third embodiment of the present invention.

The process shown in FIG. 8 is basically the same as the process shown in FIG. 4, and FIGS. 8 (1) to 8 (5) are respectively shown in FIGS.
Corresponding to (5), they are the same.

The alignment jig 1 is conveyed at the cover 8 with the mounting hole 3 facing upward (FIG. 8 (1)), and the cover 8 is placed over the alignment jig 1 (see FIG. 8 (2)).

Next, from the solder ball reservoir, the solder balls 16 are pressure-fed or dropped in the direction of the arrow 17 through the tube 12 and supplied into the inside 15 of the cover 8 (FIG. 8 (3)).
The number of solder balls 16 supplied is larger than the number of mounting holes 3 of the mask 2.

Next, an air blow 19 is applied from the hose 14 to the inside 15 of the cover 8 to give a stirring force 21, while vacuum suction 18 is applied to the mounting hole 3 of the mask 2 by the vacuum suction 18 from the hose 7. The balls 16 are sequentially mounted in the mounting holes 3 (FIG. 8 (4)).

When the mounting operation is completed, a vacuum suction 2 is applied to the tube 13.
By performing step 2, all solder balls except the solder balls 16 mounted in the mounting holes 3 are collected through the tube 13 (FIG. 8 (5)).

The alignment jig 1 is conveyed downward to the camera 56, and it is detected whether or not the solder balls 16 are mounted in all the mounting holes 3 (FIG. 8 (6)). If all the mounting holes 3 are not mounted, the aligning jig 1 is again transported to the cover 8 and covered, and the steps (3) to (5) of FIG. 8 are performed.

The above is repeated until the mounting is completed in all the mounting holes 3, and when the mounting is completed, the alignment jig 1 is inverted (FIG. 8 (7)), and the process proceeds to the next step.

According to the above embodiment, the mounting state is detected after the mounting operation on the mask 2, and the mounting operation is repeated until the solder balls 16 are mounted in all the mounting holes 3, whereby the solder balls on the mask 2 are The 16 can be mounted securely.

Fourth Embodiment of the Present Invention FIGS. 9 and 10
Will be explained.

FIG. 9 is a sectional view showing the structure of an alignment jig according to the fourth embodiment of the present invention.

FIG. 10 is a process flow chart showing a solder ball transfer process according to the fourth embodiment of the present invention.

The structure of the alignment jig 60 will be described with reference to FIG. A mounting hole 62 is provided in the mask 61 attached to the base 63 at a position corresponding to the terminal electrode 51 of the electronic circuit device 50, and the diameter of the mounting hole 62 is slightly larger than the diameter of the solder ball 16. It penetrates to the 63 side. The hose 107 is provided in the hole 64 formed in the base 63.
Are connected. The other end of the hose 107 is connected to a vacuum suction device. (A vacuum suction device is not shown.) A bearing 65 is fixed to the base 63, and a drive shaft 69 of an air cylinder 68 is slidably engaged with the bearing 65. The air cylinder 68 is fixed to the base 63. A pin base 67 is attached to the tip of the drive shaft 69, and the pin 66 is fixed to the pin base 67. The same number of pins 66 are provided at the same positions as the mounting holes 62, and they are slidably engaged. The gap between the pin 66 and the mounting hole 62 is smaller than the diameter of the solder ball 16, and when the air cylinder 68 is at the retracted end,
The space formed by the pin 66 and the mounting hole 62 is large enough to accommodate only one solder ball 16.

The transfer process will be described with reference to FIG.
When the air cylinder 68 is at the retracted end, the alignment jig 60 is externally equivalent to the alignment jig 1 in FIG. 2, and therefore the soldering process is performed by the same process as the process shown in FIG. 4 or 7 or 8. The ball 16 can be mounted in the mounting hole 62. (The mounting process is not shown.) After the mounting is completed, the vacuum jig 118 is performed and the alignment jig 60 is inverted to hold the solder balls 16 downward, and the solder balls 16 and the terminal electrodes 51 After the positions are aligned, the alignment jig 60 is lowered to bring the solder balls 16 and the terminal electrodes 51 into contact with each other (FIG. 10 (1)).

After the vacuum suction 118 of the hose 107 is stopped, the drive shaft 69 of the air cylinder 68 is advanced, that is, the pin 66 is lowered, and the solder ball 16 is attached to the mounting hole 6.
While pushing out from 2, the alignment jig 60 is raised by the same amount as the amount of lowering of the pin 66 (FIG. 10 (2)).

The aligning jig 60 is further raised to complete the transfer process (FIG. 10 (3)).

According to the above-described embodiment, the solder balls 16 are pushed out from the mounting holes 62 of the mask 61 by the pins 66, transferred, and transferred, whereby the solder balls 16 can be reliably separated from the mask 61, and the transfer In this case, it is possible to eliminate the lack of solder balls.

The fifth embodiment of the present invention is shown in FIG. 11 and FIG.
2 is used for the explanation.

FIG. 11 is a sectional view showing the structure of an alignment jig according to the fifth embodiment of the present invention.

FIG. 12 is a process flow chart showing a fixing liquid attaching process and a solder ball transferring process according to the fifth embodiment of the present invention.

The structure of the alignment jig 70 will be described with reference to FIG. The mask 71 attached to the base 73 has a mounting hole 72 at a position corresponding to the terminal electrode 51 of the electronic circuit device 50. The diameter of the mounting hole 72 is slightly larger than the diameter of the solder ball 16. It penetrates to the 73 side. A window 74 is formed in the base 73, and a hose 207 can be vertically moved in the window 74. A hole 75 is formed in the base 73, and a drive shaft 77 of an air cylinder 76 is slidably engaged with the drive shaft 77. The air cylinder 76 is fixed to the base 73.
A frame 78 is fixed to the drive shaft 77, and a base 79 is fixed to the frame 78. A hose 207 is connected to the hole 81 formed in the base 79.
The other end of the hose 207 is connected to a vacuum suction device.
(The vacuum suction device is not shown.) Also, the bearing 8 is provided on the base 79.
2 is fixed, and a drive shaft 84 of an air cylinder 83 is slidably engaged with the bearing 82. The air cylinder 83 is fixed to the base 79. A pin base 85 is attached to the tip of the drive shaft 84, and a pin 86 is fixed to the pin base 85. Also base 79
A pipe 80 is fixed to the. Pipe 80 and pin 8
6 are provided at the same position and in the same number, and are slidably engaged. When the air cylinder 83 is at the retracted end, that is, when the drive shaft 84 is rising, the tip of the pin 86 is inside (upper) than the tip of the pipe 80. The same number of pipes 80 are provided at the same positions as the mounting holes 72, and they are slidably engaged. Pipe 80
The gap between the mounting hole 72 and the mounting hole 72 is smaller than the diameter of the solder ball 16, and when the air cylinder 76 is at the retracted end and the air cylinder 83 is at the retracted end, the space formed by the pipe 80 and the mounting hole 72 is The size is such that only one solder ball 16 can be inserted.

The fixing liquid attaching step and the transferring step will be described with reference to FIG. When the air cylinder 76 and the air cylinder 83 are at the retracted end, the alignment jig 70 is externally equivalent to the alignment jig 1 in FIG. 2, and therefore the same steps as those shown in FIG. 4 or FIG. 7 or FIG. Depending on the process, the solder balls 16 can be mounted in the mounting holes 72.
(The mounting process is not shown.) After the mounting is completed, the vacuum jig 218 is performed and the alignment jig 70 is inverted to hold the solder balls 16 downward (FIG. 12 (1)). At this time, solder ball 1
6 is vacuum-adsorbed on the pipe 80.

With the drive shaft 77 of the air cylinder 76 moved forward to lower the frame 78 and the pipe 80 protruding downward from the mask 71, the alignment jig 70 is conveyed to the liquid reservoir 40. The tip portion of the solder ball 16 is immersed in the fixing liquid 43 (FIG. 12 (2)).

The alignment jig 70 is conveyed to the electronic circuit device 50, the terminal electrodes 51 and the solder balls 16 are aligned with each other, and then the alignment jig 70 is lowered to bring the solder balls 16 into contact with the terminal electrodes 51. (Fig. 12 (3)).

After the vacuum suction 218 of the hose 207 is stopped, the drive shaft 84 of the air cylinder 83 is moved forward, that is, the pin 86 is lowered, and the solder ball 16 is moved to the pipe 8.
While pushing out from 0, the alignment jig 70 is raised by the same amount as the amount of lowering of the pin 86 (FIG. 12 (4)).

The aligning jig 70 is further raised to complete the transfer process (FIG. 12 (5)).

According to the above-described embodiment, the solder ball 16 is pushed out from the mounting hole 72 of the mask 71 by the pipe 80, and further pushed out from the pipe 80 by the pin 86 for transfer and transfer, so that the solder ball 16 is surely transferred. It is possible to separate from the mask 71, and it is possible to eliminate the lack of solder balls during transfer.

In a state where the hollow ball 16 is vacuum-adsorbed on the pipe 80 and protrudes below the mask 71,
Since the fixing liquid 43 is immersed in the fixing liquid 43, a large amount of the fixing liquid 43 can be attached to the solder balls 16.
The displacement of the solder balls 16 after transferring and transferring 6 to the terminal electrodes 51 is small, and when the fixing liquid 43 is solder flux, stable melting is achieved when the solder balls 16 are heated and melted. can get.

A sixth embodiment of the present invention is shown in FIGS. 13 and 14.
Will be explained.

FIG. 13 is a sectional view showing the structure of a transfer jig according to the sixth embodiment of the present invention.

FIG. 14 is a process flow chart showing a solder ball mounting process, a fixing liquid deposition process, and a solder ball transfer process according to the sixth embodiment of the present invention.

In this embodiment, two kinds of jigs are used as jigs: an alignment jig and a transfer jig.

The alignment jig is the same as the alignment jig 1 shown in FIG.

The structure of the transfer jig 90 will be described with reference to FIG. The transfer jig 90 is obtained by taking out only the portion of the alignment jig 70 shown in FIG. 11 that is attached to the base 79. That is, the hose 207 is connected to the hole 81 formed in the base 79. The other end of the hose 207 is connected to a vacuum suction device. (A vacuum suction device is not shown.) A bearing 82 is fixed to the base 79.
A drive shaft 84 of an air cylinder 83 is slidably engaged with the shaft 2. The air cylinder 83 is fixed to the base 79. A pin base 85 is attached to the tip of the drive shaft 84, and a pin 86 is fixed to the pin base 85. A pipe 80 is fixed to the base 79. The same number of pipes 80 and pins 86 are provided at the same position, and they are slidably engaged. When the air cylinder 83 is at the retracted end, that is, when the drive shaft 84 is rising, the tip of the pin 86 is inside (upper) than the tip of the pipe 80. The pipe 80 is provided at the same position as the mounting hole 3 of the alignment jig 1.

The steps of mounting the solder balls, adhering the fixing liquid and transferring the solder balls will be described with reference to FIG.

First, the mounting hole 3 of the mask 2 of the alignment jig 1
Then, the solder balls 16 are mounted (FIG. 14 (1)). While agitating force 21 is applied to the solder balls 16 in the cover 8 by the air blow 19, vacuum suction 20 is performed by the vacuum suction 18.
The solder balls 16 can be sequentially mounted in the mounting holes 3 by performing.

When the mounting is completed, the alignment jig 1 is transferred to the transfer jig 9
Then, the pipe 80 is brought into contact with the solder ball 16 (FIG. 14 (2)). At this time, the air cylinder 83 of the transfer jig 90 is at the retracted end, that is, the pin 86 is pulled inside the pipe 80. When the vacuum suction 18 of the hose 7 is stopped in this state and the vacuum suction 218 of the hose 207 is operated, the solder balls 16 are vacuum-sucked to the tip of the pipe 80 and the solder balls 16 are sucked to the transfer jig 90. Become.

While continuing the vacuum suction 218, the transfer jig 90 is conveyed to the liquid reservoir 40, and the solder balls 16
The tip portion of the is immersed in the fixative 43 (FIG. 14 (3)).

After transferring the transfer jig 90 to the electronic circuit device 50 and aligning the positions of the terminal electrode 51 and the solder ball 16, the transfer jig 90 is lowered to bring the solder ball 16 into contact with the terminal electrode 51. (Fig. 14 (4)).

After the vacuum suction 218 of the hose 207 is stopped, the drive shaft 84 of the air cylinder 83 is moved forward, that is, the pin 86 is lowered, and the solder ball 16 is moved to the pipe 8.
While extruding from 0, the transfer jig 90 is raised by the same amount as the descending amount of the pin 86 (FIG. 14 (5)).

The transfer jig 90 is further raised to complete the transfer process (FIG. 14 (6)).

According to the above-described embodiment, the solder balls 16 are taken out from the mounting holes 3 of the mask 2 by the pipe 80, pushed out from the pipe 80 by the pins 86, transferred, and transferred, so that the solder balls 16 are reliably transferred. Therefore, it is possible to eliminate the lack of solder balls during transfer.

Since the solder balls 16 are immersed in the fixing liquid 43 while being vacuum-adsorbed on the pipe 80, the fixing liquid 43 can be adhered to the solder balls 16 in a large amount. The positional deviation of the solder balls 16 after the transfer and transfer to and from is reduced, and when the fixing liquid 43 is solder flux, stable melting can be obtained when the solder balls 16 are heated and melted.

Of the above-mentioned embodiments, the solder ball mounting step shown in FIG. 4, the solder ball transferring step shown in FIG. 6, the solder ball mounting step shown in FIG. 7, or the solder ball mounting step shown in FIG. Solder ball transfer step shown in FIG. 9 or solder ball transfer step shown in FIGS. 12 (3) to (5) or FIG. 14 (4) to (6)
In the method of forming solder bumps that includes the solder ball transfer step shown in FIG. 1 as a partial step, when a fixing liquid is used, as shown in FIG. 1 (3) and FIG. 12 (2) or FIG. 14 (3). As described above, the fixing liquid may be attached to the tip of the solder ball and then transferred, or the fixing liquid may be attached to the terminal electrodes in advance before the transfer step.

In the solder ball transfer process shown in FIG. 1 (5) or FIG. 6 (3), if the adhesive force due to the viscosity of the fixing liquid is sufficient, the solder ball is installed in the mounting hole during transfer. The air blower 52 for applying a force in the pushing direction does not have to be applied.

[0112]

According to the present invention, there is provided a method of forming a solder bump on a terminal electrode of an electronic circuit device by using a solder ball, in which there is no missing of the solder bump and which is inexpensive. You can

[Brief description of drawings]

FIG. 1 is a process flow chart showing a method for forming solder bumps according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the structure of an alignment jig according to the first embodiment of the present invention.

FIG. 3 is a sectional view showing the structure of a cover for mounting solder balls according to the first embodiment of the present invention.

FIG. 4 is a process flow chart showing in detail the process from FIG. 1 (1) to FIG. 1 (2).

FIG. 5 is a process flow chart showing in detail the processes from FIG. 1 (2) to FIG. 1 (3).

FIG. 6 is a process flow chart showing in detail the processes from FIG. 1 (4) to FIG. 1 (6).

FIG. 7 is a process flow chart showing a solder ball mounting process according to a second embodiment of the present invention.

FIG. 8 is a process flow chart showing a solder ball mounting process according to a third embodiment of the present invention.

FIG. 9 is a sectional view showing the structure of an alignment jig according to a fourth embodiment of the present invention.

FIG. 10 is a process flow chart showing a solder ball transfer process according to the fourth embodiment of the present invention.

FIG. 11 is a sectional view showing the structure of an alignment jig according to a fifth embodiment of the present invention.

FIG. 12 is a process flow chart showing a fixing liquid attaching process and a solder ball transferring process according to a fifth embodiment of the present invention.

FIG. 13 is a sectional view showing the structure of an upper alignment jig according to a sixth embodiment of the present invention.

FIG. 14 is a process flow diagram showing a solder ball mounting process, a fixing liquid deposition process, and a solder ball transfer process according to a sixth embodiment of the present invention.

FIG. 15 is a side view showing a bridge between solder balls in a solder ball mounting step.

[Explanation of symbols]

1, 60, 70 ... Alignment jig, 2, 61, 71
... Mask 3, 62, 72 ... Mounting hole, 4 ... Suction hole 5, 63, 73, 79 ... Base, 6, 64, 81
... Hole 7,107,207 ... Hose, 8,30 ... Cover 9,10,11,31,32 ... Hole, 12,13 ...
Tube 14 ... Hose, 16 ... Solder ball 40 ... Liquid storage container, 41 ... Container 42 ... Dispenser, 43 ... Fixing liquid 44 ... Squeegee, 50 ... Electronic circuit device 51 ... Terminal electrode, 56 ... Camera 65, 82 ... Bearing, 66 , 86…
Pins 67, 85 ... Pin base, 68, 76, 8
3 ... Air cylinder 69, 77, 84 ... Drive shaft, 74 ... Window 75 ... Hole, 78 ... Frame 80 ... Pipe, 90 ... Transfer jig

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsuhisa Tanaka, 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Stock Production Research Institute, Hitachi, Ltd. (72) Tomohiko Murase, 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Hitachi, Ltd.Production Technology Research Institute (72) Inventor Kosuke Inoue 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Stock Production Institute, Hitachi Ltd. (72) Inventor Hiroshi Honma 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Production Engineering Laboratory, Hitachi, Ltd. (72) Inventor Michiharu Honda, 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Stock Production Laboratory, Hitachi, Ltd.

Claims (6)

[Claims] 1. A method of forming solder bumps for forming solder bumps on a plurality of terminal electrodes of an electronic circuit device, comprising: soldering on an alignment jig having a through hole at the bottom of a mounting hole of a solder ball. A ball is supplied, the solder ball around the opening of the mounting hole is stirred in a direction orthogonal to the vacuum suction direction, the through hole side is vacuum sucked to mount the solder ball, and the alignment jig and the electronic circuit device are mounted. A method for forming solder bumps, which comprises aligning positions, transferring and transferring from a mounting hole of the alignment jig to a terminal electrode of an electronic circuit device, melting a solder ball, and forming a solder bump. 2. A method of forming solder bumps for forming solder bumps on a plurality of terminal electrodes of an electronic circuit device, comprising: soldering on an alignment jig having a through hole at the bottom of a mounting hole of a solder ball. Supply the ball, vacuum suction the through hole side to mount the solder ball, transfer the solder ball to the transfer jig from the mounting hole of the alignment jig, and align the position of the transfer jig and the electronic circuit device. A method of forming a solder bump, comprising: transferring and transferring to a terminal electrode of the electronic circuit device, melting a solder ball, and forming a solder bump. 3. A solder bump forming method for forming a solder bump on a plurality of terminal electrodes of an electronic circuit device, wherein a solder ball is provided on an alignment jig having a through hole at the bottom of a mounting hole of a solder ball. Supply, and vacuum suction the through-hole side to mount the solder balls, detect whether or not the solder balls are mounted in the mounting holes, and when all the mounting holes are mounted, the alignment jig and the electronic A method of forming a solder bump, comprising: aligning a position of a circuit device, transferring and transferring the same from a mounting hole of the alignment jig to a terminal electrode of an electronic circuit device, melting a solder ball, and forming a solder bump. 4. A solder bump forming method for forming solder bumps on a plurality of terminal electrodes of an electronic circuit device, wherein a solder ball is provided on an alignment jig having a through hole at the bottom of a mounting hole of a solder ball. When vacuuming the through hole side to mount a solder ball, aligning the alignment jig and the electronic circuit device, and transferring from the mounting hole of the alignment jig to the terminal electrode of the electronic circuit device. , The solder ball is pushed out from the through hole side of the mounting hole in the direction of the opening side of the mounting hole, transferred from the mounting hole of the alignment jig to the terminal electrode of the electronic circuit device, transferred, and melted the solder ball. A method for forming solder bumps, which comprises forming solder bumps. 5. A solder bump forming method for forming a solder bump on a plurality of terminal electrodes of an electronic circuit device, wherein a solder ball is provided on an alignment jig having a through hole at the bottom of a mounting hole of a solder ball. The solder ball is supplied by vacuum suction of the through hole side to mount the solder ball, and the temporary fixer is transported to the place of the liquid reservoir that holds a predetermined amount with the liquid surface exposed above, The tip of the is immersed in the temporary fixer, the alignment jig and the electronic circuit device are aligned, transferred from the mounting hole of the alignment jig to the terminal electrode of the electronic circuit device, transferred, and the solder ball is melted. A method for forming solder bumps, which comprises forming solder bumps. 6. A method of forming a solder bump, wherein the temporary fixing solution according to claim 5 is a solder flux or a solder paste.