JP3024113B1 - Metal ball arrangement method and arrangement device - Google Patents

Abstract

Abstract: PROBLEM TO BE SOLVED: To stably apply a flux or the like even to a fine metal sphere having a diameter of less than 150 μm, to prevent the flux or the like from being deteriorated and not to contaminate the periphery of a flux coating device. A ball arrangement method and an arrangement apparatus are provided. SOLUTION: A metal ball 3 is sucked into a metal ball suction hole 6 of a metal ball arraying jig 1, a flux 8 or the like is applied to the sucked metal ball 3, and the metal balls 3 are collectively mounted on an array target 2. In the method for arranging metal spheres, a flux supply hole 7 is arranged on the flux supply plate 5 at a position corresponding to the metal sphere suction hole 6 of the metal sphere arrangement jig 1, and the flux or the like 8 is supplied from the back surface 15 of the flux supply plate 5. Filling the flux supply hole 7 with a flux by supplying the flux, and then applying the flux 8 or the like to the surface of the metal sphere 3 by bringing the metal sphere 3 adsorbed in the metal sphere adsorption hole 6 into contact with the flux supply hole 7. A metal ball arranging method and an arraying device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for arranging metal spheres on a metal ball arrangement object, and more particularly to an electrode on a semiconductor chip, an electrode on a semiconductor mounting substrate or a semiconductor element electrode as a ball bump. Method and apparatus for arranging solder balls.

[0002]

2. Description of the Related Art Fine metal spheres (bumps) are used as a bonding medium between an electrode on a substrate of a semiconductor chip and an external circuit. Further, as a bump of a ball grid array (BGA), a technique of forming a bump by transferring a fine metal sphere to a semiconductor substrate, a semiconductor chip, or the like has become important.
Here, a semiconductor chip or a semiconductor substrate onto which a metal sphere is transferred is generically referred to as a metal sphere arrangement target. Solder balls and gold balls are used as bumps. When a solder ball is used as a bump, the solder ball is arranged on the surface of the metal ball arrangement target where the bump is to be formed, and the solder ball is heated and welded to the metal ball arrangement target. In order to perform welding, it is necessary to apply a flux or cream solder (hereinafter referred to as “flux or the like”) between the metal ball arrangement target and the solder ball.

In order to transfer a large number of metal spheres at once to a metal ball arrangement object, a technique of adsorbing metal balls to a metal ball arrangement jig and then transferring the metal balls from the metal ball arrangement jig to the metal ball arrangement object has been developed. Are known. The metal ball arrangement jig is provided with metal ball suction holes for sucking a large number of metal balls. The position of the metal ball suction hole corresponds to the position where the metal ball on the metal ball array target is to be transferred. The metal spheres are previously sucked into all the metal sphere suction holes, and the metal sphere array jig that has sucked the metal spheres is transported to the transfer table. A metal ball arrangement target to which a metal ball is to be transferred is placed on the transfer table in advance. By pressing the metal spheres adsorbed on the metal sphere arrangement jig against the surface of the metal sphere arrangement target on the transfer table, the metal spheres can be transferred.

When a solder ball is used as a metal ball, it is necessary to apply a flux or the like between the metal ball and the metal ball arrangement target. As a method of application, there is a method of applying a flux or the like to a position where the metal sphere is to be transferred on the surface of the metal sphere arrangement target before the metal sphere transfer, and a method of applying a flux to the surface of the metal sphere adsorbed by the metal sphere arrangement jig. There is a method of applying a flux or the like.

[0005] As a first method of applying a flux or the like to the surface of a metal ball arrangement target, a printing method using a mask is known. A metal mask or a mesh mask is used, and the mask is provided with an opening at a position where a flux or the like on the surface of the metal ball array is to be applied. When the metal ball arrangement target is covered with the mask, a flux or the like is applied from above the mask, and the mask is removed, the flux or the like is transferred to a predetermined portion of the metal ball arrangement target surface.

The method using the mask is a method which has been widely practiced in the past, and is a method excellent in quantitativeness of the amount of applied flux. However, air bubbles enter into the flux or the like supplied to the opening of the mask, and excess flux enters into the back surface of the mask (the side in contact with the metal ball arrangement target), thereby soiling the back surface of the mask. Has the disadvantage of contaminating it. In such a case, it is also difficult to clean only the back surface of the mask. Further, in the method using a mask, there is no problem if the surface of the metal ball array target is flat, but if the surface of the metal ball array target is not flat, the mask cannot be in close contact with the surface and transfer of flux or the like is not possible. Does not work properly.

[0007] As a second method of applying flux or the like to the surface of a metal ball array target, a number of pins corresponding to the number of metal balls to be transferred are arranged like a sword, and flux or the like is attached to the tip of the pin. Then, a method is known in which the tip of the pin is brought into contact with a metal ball arrangement target, and flux or the like is transferred from the pin tip to the metal ball arrangement target and applied.

In the above-mentioned method using the pins, the amount of flux or the like adhering to the tip of the pin in the next transfer due to the flux or the like adhering to the tip of the pin is not constant, which hinders the stability of the amount of adhered flux. There is a problem of doing. Further, there is a problem that the pin jig becomes complicated and expensive when the number of solder balls mounted on the metal ball arrangement target increases.

As a method of applying a flux or the like to the surface of the metal spheres adsorbed on the metal sphere arrangement jig, a flux or the like is applied on a flat plate and spread to a predetermined thickness with a squeegee or the like.
After that, a method is known in which a metal ball on a metal ball array jig is brought into contact with a flux coating film on the flat plate to attach a flux or the like to the surface of the metal ball. After this, if the metal ball is transferred from the metal ball array jig to the metal ball array object,
A flux or the like is applied between the metal ball and the metal ball arrangement target, and the metal ball is mounted.

[0010]

In the method of applying a flux or the like to the surface of the metal spheres adsorbed by the metal sphere array jig, the flux is used for spreading when spreading the flux or the like on a flat plate. If the flux or the like adheres to the squeegee or the like, the thickness of the applied flux or the like becomes uneven.
If the diameter of the metal sphere is large, slight unevenness of the thickness of the flux etc. on the flat plate does not matter, but if the diameter of the metal sphere is small, due to the unevenness of the thickness of the flux, etc.,
There is a problem that flux or the like adheres to the surface of the metal ball arrangement jig as well as the surface of the metal ball. If the flux or the like adheres to the surface of the metal ball array jig, the surplus metal ball adheres to the portion of the metal ball adsorption jig where the flux or the like adheres during the next metal ball suction operation, and the metal ball in the tray is contaminated. Will also occur simultaneously. Therefore, if the diameter is 1
For a metal sphere of less than 50 μm, flux or the like could not be applied by this method.

Further, since flux or the like is repeatedly spread on a flat plate and then repeatedly adhered to the metal sphere, the flux or the like on the flat plate is exposed to the atmosphere for a long time, causing a change in viscosity due to drying. was there.

Further, when a flux or the like is spread on a flat plate with a squeegee or the like, the flux or the like protruding from the squeegee is piled up on four rounds of the flat plate. Therefore, the size of the flat plate needs to be excessively large so that the metal ball array jig is not contaminated by the accumulated flux or the like.
Therefore, when cleaning the machine periodically, the cleaning time around the flux coating device centered on the flat plate becomes long, which causes a reduction in the operation time of the device.

[0013] The present invention solves the above problems and provides a method for applying a flux or the like to the surface of a metal sphere adsorbed on a metal sphere array jig. It is an object of the present invention to provide a method and an apparatus for arranging metal spheres, which can apply a metal sphere, do not deteriorate the flux or the like, and do not contaminate the periphery of the flux applying apparatus.

[0014]

That is, the gist of the present invention is as follows. (1) The metal spheres 3 are sucked into the metal sphere suction holes 6 of the metal sphere arrangement jig 1 in which the metal sphere suction holes 6 are arranged. And then apply flux or cream solder to the adsorbed metal spheres 3;
Further, in the metal sphere arrangement method in which the attracted metal spheres 3 are transferred onto the arrangement target 2 by transferring the metal spheres 3 to the arrangement target 2, the metal sphere arrangement jig 1 of the metal sphere arrangement jig 1 is attached to the flux supply plate 5. flux supply hole 7 is disposed at a position corresponding to the hole 6, filled with flux or cream solder to the flux supply hole 7 by supplying the soldering flux or cream from the back 15 of the flux supply plate 5, after which the Flux from flux supply hole 7
Flux or cream protruding from the surface of the feed plate 5
The solder is wiped off, and then the metal spheres 3 adsorbed in the metal sphere adsorption holes 6 of the metal sphere arrangement jig 1 are brought into contact with the flux or the flux supply holes 7 filled with the cream solder, so that the surface of the metal spheres 3 has a flux. Alternatively, a method of arranging metal spheres, characterized by applying cream solder. ( 2 ) The metal spheres 3 are sucked into the metal sphere suction holes 6 of the metal sphere arrangement jig 1 in which the metal sphere suction holes 6 are arranged, and then the flux or cream solder is applied to the sucked metal spheres 3. In the metal ball arranging method in which the attracted metal spheres 3 are transferred to the arrangement target 2 by transferring the metal spheres 3 to the arrangement target 2, the flux supply plate 5 includes the metal sphere adsorption holes 6 of the metal sphere arrangement jig 1. The flux supply hole 7 is arranged at a position corresponding to the metal ball suction jig 1 of the metal ball arrangement jig 1.
The flux or cream solder is filled in the flux supply hole 7 by contacting the metal sphere 3 adsorbed on the flux supply hole 7 with the flux supply hole 7 and then supplying flux or cream solder from the back surface 15 of the flux supply plate 5. A method for arranging metal spheres, comprising applying a flux or cream solder to the surface of the metal spheres 3. ( 3 ) A flux or cream solder is applied to the surface of the metal ball 3, and after the metal ball 3 is separated from the flux supply plate 5, the flux protruding from the flux supply hole 7 to the surface 14 of the flux supply plate 5. Alternatively, the method for arranging metal balls according to the above ( 2 ), wherein the cream solder is wiped off. ( 4 ) The metal according to any of (1) to ( 3 ) above, wherein the flux supply hole 7 is filled with flux or cream solder by a flux pressurizing device arranged on the back side of the flux supply plate 5. Ball array method. ( 5 ) The method for arranging metal spheres according to ( 1 ) or ( 3 ), wherein the squeegee 11 wipes off the flux or cream solder that has overflowed to the surface 14 of the flux supply plate 5. ( 6 ) The metal ball arranging method according to the above ( 1 ) or ( 3 ), wherein the flux or cream solder protruding from the surface 14 of the flux supply plate 5 is wiped off with the tape 12. ( 7 ) The diameter of the flux supply hole 7 is 1 of the diameter of the metal ball 3.
The metal ball arrangement method according to any one of the above (1) to ( 7 ), wherein the ratio is from / 3 to 9/10. ( 8 ) a metal ball array jig 1 in which metal ball suction holes 6 are arranged;
A transfer table for transferring the metal balls 3 adsorbed to the metal ball suction holes 6 of the metal ball arrangement jig 1 to the arrangement target 2, and at a position corresponding to the metal ball suction holes 6 of the metal ball arrangement jig 1. a flux supply plate 5 arranged flux supply holes 7, and the flux supply device for filling the flux or cream solder to the flux supply hole 7 by supplying the soldering flux or cream from the back 15 of the flux supply plate 5, the full
From the flux supply hole 7 to the surface of the flux supply plate 5
Wipe off the soldering flux or cream solder
And a device, the metal ball adsorbing the metal ball aligning jig 1 hole 6
Adsorbs the metal ball 3 on the back surface of the flux supply plate 5
Before supplying flux or cream solder from
Flux or cream solder into the flux supply hole 7
After filling, the flux supply hole 7
Flux or cream protruding from the surface of the feed plate 5
The solder is wiped off, and then the adsorbed metal ball 3 is brought into contact with the flux supply hole 7 to apply a flux or cream solder to the surface of the metal ball 3, and the flux is applied to the arrangement target 2 placed on the transfer table. Alternatively, a metal ball arrangement device for transferring a metal ball 3 coated with cream solder. (9) a metal ball array jig 1 in which metal ball suction holes 6 are arranged;
A transfer table for transferring the metal balls 3 adsorbed to the metal ball suction holes 6 of the metal ball arrangement jig 1 to the arrangement target 2, and at a position corresponding to the metal ball suction holes 6 of the metal ball arrangement jig 1. It has a flux supply plate 5 in which the flux supply holes 7 are arranged, and a flux supply device that supplies flux or cream solder from the back surface 15 of the flux supply plate 5 and fills the flux supply holes 7 with flux or cream solder. ,
The metal spheres 3 are sucked into the metal sphere suction holes 6 of the metal sphere arrangement jig 1 and the sucked metal spheres 3 are inserted into the flux supply holes 7.
Contact, and then from the back side of the flux supply plate 5
Lux or cream solder
Fill flux supply hole 7 with flux or cream solder
Metal ball which the flux or cream solder on the surface of the metal balls 3 is applied, characterized by transferring the metal balls 3 in sequence target 2 is placed and applying solder the flux or cream to the transfer table by Array device. (10) The flux supply device is a flux supply plate 5
The metal ball arrangement device according to the above (8) or (9), which is a flux pressurizing device disposed on the back side of the metal ball. (11) The metal ball arrangement device according to (9) or (10), further including a wiping device for wiping off the flux or cream solder that has protruded from the flux supply hole 7 to the surface 14 of the flux supply plate 5. (12) above, wherein the flux wiping device is a device wipe according squeegee 11 (8) The
Is a metal ball arrangement device according to (11). (13) The metal ball arrangement device according to (8) or (11), wherein the flux wiping device is a wiping device using a tape 12. (14) The diameter of the flux supply hole 7 is 1 of the diameter of the metal sphere.
The metal ball arrangement device according to any one of ( 8 ) to (13), wherein the ratio is from / 3 to 9/10. It is in.

According to the present invention, when applying flux or cream solder to the metal balls 3 adsorbed in the metal ball suction holes 6 of the metal ball array jig 1, the use of the flux supply plate 5 as shown in FIG. The feature of. The flux supply plate 5 has a flux supply hole 7 on the surface. The position of the flux supply hole 7 is arranged at a position corresponding to the metal ball suction hole 6 of the metal ball arrangement jig 1. As shown in FIG. 1A, by supplying flux 8 from the back surface 15 of the flux supply plate 5 (the surface opposite to the surface on which the metal sphere 3 is brought into contact), the flux etc. 8 is filled (FIG. 1 (b)). In this state, the metal ball array jig 1
The metal spheres 3 adsorbed on the metal sphere adsorption holes 6 are brought into contact with the flux supply plate 5 (FIG. 1 (c)). At this time, each metal sphere 3 is brought into contact with the corresponding flux supply hole 7,
Flux or the like 8 in the flux supply hole 7 is applied to the surface of the metal sphere 3.

On the surface 14 of the flux supply plate 5,
Since flux or the like 8 does not adhere to the inside other than the inside of the flux supply hole 7, unlike the conventional technique of spreading and applying the flux or the like 8 on a flat plate, the flux or the like 8 that is unevenly applied is coated with a metal ball arrangement jig. 150μm with no risk of soiling 1
It is possible to stably apply the flux 8 or the like even on a fine metal sphere having a diameter smaller than the diameter. In addition, flux etc. 8
Is stored in a closed container, and only contacts the atmosphere at the opening of the flux supply hole 7, so that the flux does not deteriorate even after a long time. Furthermore, the size of the flux supply plate 5 can be the same size as the metal ball array jig 1, and the apparatus can be cleaned in a short cleaning time.

If the amount of the flux 8 supplied to each flux supply hole becomes uneven, the flux 8 overflows from the surface side due to too much flux or the surface of the flux supply hole 7 overflows from the surface side because the flux 8 is too small. Since flux or the like 8 is not uniformly filled in each of the flux supply holes, such as a case where the flux or the like 8 is not filled up to a certain extent, the flux or the like 8 may not be stably applied to each metal ball 3. In particular, when the number of metal spheres arranged in the metal sphere arrangement target 2 increases from several tens to several thousands, and the number of metal spheres to which flux is applied collectively increases, the number of metal spheres is uniform for each supply hole. It is important to fill flux 8 or the like.

In the present invention, as described in ( 1 ) above, when supplying the flux or the like 8 from the back surface 15 of the flux supply plate, the flux or the like 8 overflows from the opening of the flux supply hole 7 on the surface 14 side of the flux supply plate. (FIG. 2 (a)), the flux or the like 8 protruding from the surface 14 of the flux supply plate 5 is wiped off (FIG. 2 (b)), and thereafter, is attracted to the metal ball suction holes 6 of the metal ball array jig 1. The metal ball 3 is brought into contact with the flux supply hole 7 (FIG. 1).
(C)). As a result, the amount of the flux or the like 8 filled in each of the flux supply holes 7 becomes uniform, and even if the number of the metal spheres 3 to which the flux is applied collectively increases to several thousand, each of the metal spheres 3 is stably formed. Flux 8 or the like can be applied to the substrate.

In the present invention, as described in ( 2 ) above, the metal spheres 3 adsorbed on the metal sphere adsorption holes 6 of the metal sphere array jig 1 are first brought into contact with the flux supply holes 7 (FIG. 4).
(A)) Then, flux 8 or the like 8 can be supplied from the back surface of the flux supply plate 5 (FIG. 4B). When the flux or the like 8 is supplied to the flux supply hole 7, the opening of the tip of the flux supply hole 7 is covered with the metal ball 3, so that excess flux or the like 8 is prevented from overflowing from the tip opening to the surface side. be able to. Therefore, even when the flux 8 or the like 8 is supplied to a large number of the flux supply holes 7 at the same time, it is possible to suppress the variation in the supply amount of each of the flux supply holes and supply the flux uniformly. In this case, at the time of the second and subsequent flux application, since the previous flux or the like 8 remains in the flux supply hole, the metal ball 3 is brought into contact with the flux supply hole 7 and then a new flux is supplied into the flux supply hole. The amount of the flux or the like 8 to be supplied to the container may be small.

In the above ( 2 ), the flux supply holes 7
Is covered with the metal spheres 3 so that excess flux or the like 8 is prevented from overflowing to the surface side. However, when the number of the flux supply holes 7 increases, the flux may slightly overflow to the surface side. (FIG. 5 (a)). Therefore, the above ( 3 )
After the metal balls 3 coated with the flux 8 are separated from the flux supply plate 5 (FIG. 5B), the flux 8 protruding from the flux supply hole 7 to the surface 14 of the flux supply plate 5 is removed. It can be wiped off (FIG. 2 (b)). Thus, when the metal ball 3 is brought into contact with the flux supply hole 7 next time, the metal ball 3 and the metal ball arrangement jig 1 are not contaminated with the flux 8 or the like. Also,
Flux etc. that overflows to the surface compared to the above ( 1 ) 8
Therefore, the amount of the flux or the like 8 to be wiped out can be minimized and the wiping can be performed stably.

[0021]

DETAILED DESCRIPTION OF THE INVENTION In the present invention, solder balls are mainly used for the metal balls 3. The solder ball for semiconductor application to which the present invention is applied has a diameter of 60 μm to 800 μm.
m is mainly used.

The metal ball arrangement object 2 is a semiconductor chip or a semiconductor substrate. Solder balls are transferred to electrode positions where bumps of the metal ball arrangement object 2 are to be formed, and then the metal ball arrangement object 2 is heated so that the solder balls are heated. The ball fuses at the electrode location and forms a bump. These bumps serve as bumps as bonding media between the electrodes of the semiconductor chip and the external circuit, or bumps of the ball grid array.

The present invention will be described with reference to FIGS.

The transfer of the metal sphere 3 to the metal sphere array target 2 is as follows.
The metal spheres 3 are sucked into the metal sphere suction holes 6 of the metal sphere array jig 1 in which the metal sphere suction holes 6 are arranged, and then flux or cream solder is applied to the sucked metal spheres 3. This is performed by mounting the spheres 3 on the metal sphere arrangement target 2 collectively.

As shown in FIG. 1, the metal ball array jig 1
The metal ball 3 has a metal ball suction hole 6 on a flat surface to be sucked. The position of the metal sphere suction hole 6 corresponds to the position where the metal spheres 3 of the metal sphere arrangement target 2 are arranged. The metal sphere suction holes 6 are vacuum-sucked from the back of the metal sphere arrangement jig 1, whereby the metal spheres 3 are sucked into the respective metal sphere suction holes 6. For example, a large number of metal balls 3 are accommodated in a tray, the metal ball arrangement jig 1 is brought close to the metal balls 3 from above the tray, and the metal balls 3 can be sucked into the metal ball suction holes 6. Alternatively, a temporary arrangement plate having holding holes for holding the metal balls 3 corresponding to the positions where the metal balls 3 are arranged on the metal ball arrangement jig 1 is used, and the metal balls 3 are temporarily inserted into the holding holes on the temporary arrangement plate. The arrangement can be performed by adsorbing the provisionally arranged metal balls 3 into the metal ball adsorption holes 6 of the metal ball arrangement jig 1.

The flux supply plate 5 of the present invention has a flux supply hole 7 on the surface. The position of the flux supply hole 7 is arranged at a position corresponding to the metal ball suction hole 6 of the metal ball arrangement jig 1. The flux supply hole 7 penetrates the back surface 15 of the flux supply plate 5 (the surface opposite to the surface on which the metal balls 3 are brought into contact), and the flux 8 is pressed into the flux supply hole 7 from the back surface 15 to obtain the flux. The inside of the supply hole 7 is filled with a flux 8 or the like. Vessel 1 provided with piston pressurizing mechanism 10 on the back of flux supply plate 5
3 and the container 13 is filled with flux 8 or the like. By moving the piston 9 of the piston pressurizing mechanism 10 in the direction of compressing the container volume, the flux 8 or the like in the container is pressed into each of the flux supply holes 7 (FIG. 1).
(A)). When the flux or the like 8 in each flux supply hole reaches the opening on the surface side of the flux supply hole 7, the compression of the piston is stopped (FIG. 1B). As a mechanism for operating the piston 9 of the piston pressurizing mechanism 10, a drive by compressed air can be used, but a servo motor or a pulse motor or the like is used to control a fine stroke with high accuracy and good reproducibility. preferable. Further, the flux supply plate 5 and the container 13 may be formed integrally.

Next, the metal sphere array jig 1 having the metal spheres 3 sucked into the metal sphere suction holes 6 is moved to the flux supply plate 5.
1 (FIG. 1 (b)), the metal balls 3 are brought close to the flux supply plate 5 in accordance with the positions of the corresponding flux supply holes 7, and the respective metal balls 3 are brought into contact with the respective flux supply holes 7 (FIG. c)). At this time, each metal ball 3 comes into contact with the upper edge of the flux supply hole 7 and stops. The surface of the metal sphere 3 that has entered the inside of the flux supply hole 7 comes into contact with the flux 8 or the like. After that, when the metal ball arrangement jig 1 is pulled away from the flux supply plate 5, the surface of the metal ball 3 is coated with flux 8 or the like (FIG. 1 (d)).

In this state, the metal balls 3 on the metal ball array jig 1 are arranged so as to face the metal ball array object 2, and both are brought close to each other until the metal ball 3 contacts the metal ball array object 2 (FIG. 1
(E)). Thereafter, the vacuum suction of the metal ball suction holes 6 of the metal ball array jig 1 is released, and the metal ball array jig 1 is separated from the metal ball array target 2. The image is transferred onto the ball array target 2, and the batch mounting is completed (FIG. 1 (f)).

As the material of the metal ball array jig 1 and the flux supply plate, a metal plate such as stainless steel or a resin plate having conductivity is suitable.

The diameter of the flux supply hole 7 is preferably １ ／ to 9/10 of the diameter of the metal ball 3. If it is less than 1/3, flux or the like cannot be sufficiently applied to the metal spheres 3. If it exceeds 9/10, the surface tension acting between the flux 8 in the flux supply hole and the metal sphere 3 becomes too strong, and when the metal sphere 3 is separated from the flux supply plate 5 after the flux is applied, the surface tension is increased. This is because the tension may exceed the suction force of the metal ball array jig 1 and the metal ball 3 may fall off the metal ball array jig 1.

In a more preferred embodiment of the present invention, as shown in FIG. 2A, when the flux or the like 8 is pressed into the flux supply hole 7, the flux or the like 8 is opened on the surface side of the flux supply hole 7. Continue press-fitting until it slightly overflows from the part. This makes it possible to eliminate the flux supply holes 7 with insufficient filling from the flux supply holes 7 ranging from several tens to several thousands. If a servo motor or a pulse motor is used to operate the piston 9, the piston 9 can be controlled with a small stroke with high accuracy and high reproducibility. Next, the flux or the like 8 protruding from the surface 14 of the flux supply plate 5 is wiped off (FIG. 2).
(B)). Thereby, it is possible to fill all the flux supply holes 7 with the flux 8 or the like up to the surface, and to realize a state in which the flux 8 does not exist on the surface 14 of the flux supply plate 5. Even in the case where the amount is large, it is possible to stably apply the flux 8 or the like.

As shown in FIG. 2, the squeegee 11 is wiped off the surface 14 of the flux supply plate 5 by wiping the flux 8 or the like.
And moving (sweeping) it in parallel to the object. The squeegee is a spatula-shaped part capable of sweeping and removing a fluid substance existing on a flat surface. As the material of the squeegee 11, a resin made of urethane rubber or a thin metal plate such as stainless steel is suitable. Since the amount of the flux or the like 8 that overflows to the surface 14 of the flux supply plate 5 is small, and the size of the flux supply plate 5 is almost equal to the size of the metal ball array target 2, the flux by the squeegee 11 Wiping of 8 etc. can be performed very easily.

The wiping of the flux or the like 8 can be performed by using a tape 12 (cleaning tape 12) as shown in FIG. 3A or FIG.
The cleaning tape 12 is applied to the surface of the roller 17 of FIG.
And the cleaning tape 12 wound thereon is brought into contact with the surface of the flux supply plate 5 and laterally moved as indicated by an arrow 21 to wipe off the flux 8 or the like. At the same time, the entire wiping device is moved laterally as indicated by an arrow 21, and at the same time, the cleaning tape 12 is wound by rotating the winding roll 19. As a result, the flux 8 overflowing onto the surface of the flux supply plate 5 adheres to the cleaning tape and is wound (20). As the cleaning tape 12, a wiping cloth generally used in semiconductor manufacturing can be used.

In the present invention, as shown in FIG.
Metal ball 3 adsorbed to metal ball adsorption hole 6 of metal ball array jig 1
Is first brought into contact with the flux supply hole 7 (FIG. 4A),
Next, flux 8 or the like 8 can be supplied from the back surface of the flux supply plate 5 (FIG. 4B). In this case, since the opening at the tip end of each flux supply hole 7 is covered by the metal sphere 3, when the flux or the like 8 is press-fitted from the back surface 15 of the flux supply plate 5, the flux or the like 8 is filled and reaches the metal sphere 3. Further, a large pressure is required for further press-fitting so that the flux or the like 8 overflows from the slight gap between the contact portion between the flux supply hole 7 and the metal ball 3 to the surface side. Therefore, even when the supply amount of the flux or the like 8 varies for each of the flux supply holes, the flux or the like 8 is further supplied to the flux supply hole 7 where the flux or the like 8 reaches the metal ball position first. Without filling, the flux or the like 8 does not overflow from the filled flux supply hole 7 even when the filling is continued into the delayed flux supply hole 7. Filling of the flux etc. 8 into all the flux supply holes 7 can be completed uniformly. When the filling is completed, the flux or the like 8 adheres to all the metal balls 3 in contact with the flux supply holes 7.

When a large number of flux supply holes 7 are simultaneously filled with flux 8 or the like, even when the surface of the flux supply holes and the metal spheres 3 are in contact with each other, the resistance when the flux 8 is pushed out from the contact portion. Is not constant,
It is not possible to completely suppress the overflow of the flux or the like 8 from the flux supply hole 7 having a small resistance (FIG. 5).
(A)). Therefore, preferably, the adhesion of the flux 8 or the like to the metal sphere 3 is completed and the metal sphere 3 is supplied to the flux supply plate 5.
(Fig. 5 (b)), and the next flux etc. 8
Before the metal balls 3 to be coated are brought into contact with the flux supply plate 5, the overflowing flux 8 on the flux supply plate is wiped off (FIG. 2 (b)). For the wiping of the flux 8 or the like, the method using the squeegee 11 or the tape 12 described above can be employed as it is. In the present embodiment, since the amount of the flux or the like 8 that overflows to the surface is small, it is possible to minimize the amount of the flux or the like 8 to be wiped and to stably perform the wiping.

After compressing the piston 9 of the flux pressurizing device to the compression limit, it is necessary to newly fill the container 13 with flux 8 or the like. In the present invention, the container 13
If necessary, make a cartridge including the flux pressurizing device, remove the empty container 13 etc. from the flux supply plate 5 when the flux etc. is used up, and install another container 13 etc. filled with flux etc. can do. This makes it possible to shorten the time required for replacing the flux and the like, and also to prevent the trouble that the surroundings of the apparatus are contaminated with the flux and the like when the flux and the like are replaced.

[0037]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The method of arranging metal balls according to the present invention was used for mounting solder balls on a semiconductor substrate to form solder bumps on the semiconductor substrate. Table 1 shows the solder ball diameter. There are three types shown as 1-3, and the number of solder balls to be mounted is 336 in each case. A flux is applied to the solder balls.

[0038]

[Table 1]

Flux supply plate 5 and metal ball arrangement jig 1
1 was used, the material of the flux supply plate 5 was stainless steel, and the material of the metal ball array jig 1 was a conductive resin. The diameter of the flux supply hole 7 is no. No. 1 was 250 μm (１ ／ of the solder ball diameter); No. 2 was 135 μm (9/10 of the solder ball diameter). 3 is 200 μm (１ ／ of the solder ball diameter).

As the wiping device, No. Reference numerals 1 and 3 employ the cleaning tape system shown in FIG. 3A, and a wiping cloth used in semiconductor manufacturing is employed as the cleaning tape. No. 2, a squeegee shown in FIG. 2 was employed, and a stainless steel thin plate was used as a material of the squeegee.

As shown in FIG. 1A, a space surrounded by the flux supply plate 5 and the container 13 is filled with flux.
The flux is charged into the flux supply hole 7 by moving the piston 9. Example No. For (1) and (2), the filling is continued until the flux overflows from the surface openings of all the flux supply holes 7 as shown in FIG. Then, No. In 1, as shown in FIG. 2B, the squeegee 11 is scanned in the direction of the arrow 21 to wipe off the flux 8 overflowing to the surface of the slack supply plate 7. No. 3, the entire wiping device is moved on the flux supply plate 5 while the cleaning tape 12 is wound up by the winding roll 19, as shown in FIG. At this time, since the cleaning tape 12 is pressed against the flux supply plate 5 by the support 12, the flux that has overflowed onto the flux supply plate 5 is wiped on the tape (20).

As shown in FIG. 1B, the solder balls 3 are previously sucked into the metal ball suction holes 6 of the metal ball array jig 1. Then, as shown in FIG. 1 (c), the surface of the flux supply plate 5 faces upward, the surface of the metal ball array jig 1 on which the solder balls 3 are adsorbed faces downward, and the adsorbed solder balls 3 correspond to each other. The contact is made to the flux supply hole 7. At this time, the flux 8 is applied to the tip of the solder ball 3, and FIG.
As shown in (d), when the metal ball arrangement jig 1 is separated from the flux supply plate 5, the flux 8 adheres to the tip of the solder ball 3.

Example No. As shown in FIG. 4 (a), after the solder balls 3 are brought into contact with the flux supply holes 7 as shown in FIG. 4 (a), the filling of the flux 8 is carried out, and as shown in FIG. Continue filling until the surface overflows. Thereafter, as shown in FIG. 5B, the metal ball array jig 1 was separated from the flux supply plate 5, and the metal ball arrangement jig 1 was further removed. As in the case of No. 1, the flux 8 spilled over the surface of the flux supply plate 5 was wiped off by the method shown in FIG.

On the transfer plate 4, a semiconductor substrate as the metal ball arrangement target 2 is arranged. As shown in FIG. 1E, by pressing the semiconductor arrangement jig 1 against the semiconductor substrate 2, the sucked solder balls 3 are pressed onto predetermined electrodes on the semiconductor substrate 2. Next, the suction of the metal ball suction holes 6 of the metal ball array jig 1 is released, and the metal ball array jig is released as shown in FIG.
When the solder ball 3 is separated from the semiconductor substrate 2 as shown in FIG.
Is transferred to

No. For each of Examples 1 to 3, the arrangement processing was continuously performed on each of the 100 semiconductor substrates 2. As a result, no mounting abnormality of the solder balls occurred in any of the examples, and all the solder balls could be stably transferred to the semiconductor substrate. Further, no trouble occurred that the surface of the metal ball array jig 1 was contaminated by the flux 8. Further, since the flux 8 was not exposed to the air, the material of the flux 8 did not deteriorate even after a long time.

Example No. No. 3 is No. One, two
, The consumption of the flux 8 was reduced to 1/10. However, it is converted to the case of the same solder ball diameter.

[0047]

According to the present invention, since the flux and the like are not attached to the surface of the flux supply plate except for the inside of the flux supply hole, the flux and the like are unevenly spread unlike the case where the flux or the like is spread and applied on a flat plate. The applied flux or the like does not contaminate the metal ball arrangement jig, and the flux or the like can be stably applied even to fine metal spheres having a diameter of less than 150 μm. Further, the flux or the like is stored in a closed container and comes into contact with the atmosphere only at the opening of the flux supply hole, so that the flux does not deteriorate even after a long time. Further, the size of the flux supply plate can be the same size as the metal ball arrangement jig, and the apparatus can be cleaned in a short cleaning time.

The present invention further wipes off the flux or the like that has protruded from the surface of the flux supply plate, and then brings the metal spheres adsorbed into the metal sphere adsorption holes of the metal sphere arrangement jig into contact with the flux supply holes, thereby obtaining each flux. Even when the amount of the flux or the like filled in the supply hole becomes uniform, the flux or the like can be stably applied to each metal sphere even if the number of metal spheres to which the flux is applied is increased to several thousand. .

According to the present invention, the flux or the like overflowing from the flux supply hole can be suppressed by filling the flux supply hole with the flux or the like after the metal sphere is brought into contact with the flux supply hole.

Since the present invention does not employ a method of printing flux or the like on a metal ball arrangement target using a mask, there is no problem that excess flux enters the back surface of the mask and contaminates the surface of the metal ball arrangement target. In addition, the present invention does not employ a method of transferring the flux or the like remaining on the tip of the pin to the metal ball arrangement target, so that the problem of hindering the stability of the flux transfer amount does not occur.

[Brief description of the drawings]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a conceptual diagram showing a method and an apparatus for arranging metal spheres of the present invention. FIG. 1 (a) shows a state where a flux or the like is being filled in a flux supply hole, and FIG. A situation in which the jig is being lowered, (c) a situation in which the metal sphere is in contact with the flux supply plate, (d) a situation in which the metal sphere array jig is raised after applying flux or the like to the metal sphere,
(E) is a diagram showing a situation where a metal sphere coated with flux or the like is brought into contact with a metal sphere arrangement target, and (f) is a view showing a situation where a metal sphere is transferred to the metal sphere arrangement target.

FIGS. 2A and 2B are conceptual diagrams illustrating a situation in which a flux or the like that has overflowed to the surface of the flux supply plate of the present invention is wiped with a squeegee. FIG. FIG. 4 is a diagram showing a situation in which squeegee wipes out overflowing flux and the like.

FIGS. 3A and 3B are conceptual diagrams showing a situation where a flux or the like which has overflowed to the surface of a flux supply plate of the present invention is wiped off with a tape. FIG. 3A shows a case where a support is used, and FIG. It is.

FIG. 4 is a diagram showing a state in which a flux or the like is filled into a flux supply hole after a metal ball is brought into contact with the flux supply plate of the present invention.

FIG. 5 is a view showing a state in which a flux or the like is filled in a flux supply hole after a metal ball is brought into contact with the flux supply plate of the present invention, and thereafter the flux or the like overflows on the flux supply plate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal ball arrangement jig 2 Metal ball arrangement object 3 Metal ball (solder ball) 4 Transfer plate 5 Flux supply plate 6 Metal ball adsorption hole 7 Flux supply hole 8 Flux etc. 9 Piston 10 Pressure mechanism 11 Squeegee 12 Tape 13 Container 14 Front surface 15 Back surface 16 Support material 17 Roller 18 Feeding roll 19 Winding roll 20 Tape adhesion flux, etc.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 H05K 3/34 505

Claims (14)

(57) [Claims] 1. A metal ball is adsorbed on the metal ball adsorbing hole of a metal ball arraying jig having a metal ball adsorbing hole, and then a flux or cream solder is applied to the adsorbed metal ball. In the metal sphere arrangement method of mounting metal spheres on an arrangement target by transferring the spheres to the arrangement target, a flux supply hole is arranged on the flux supply plate at a position corresponding to the metal sphere suction hole of the metal sphere arrangement jig. is, the flux or cream solder filled in the flux supply hole by supplying backside flux or cream solder from the flux supply plate, then the Flak
Of the flux that has protruded from the
Box or wiping the cream solder, and then flux or cream on the surface of the metal balls by contacting the adsorbed metal sphere metal ball suction holes of the metallic ball aligning jig in flux supply holes filled with solder the flux or cream A method for arranging metal spheres, comprising applying solder. 2. A metal ball adsorbing hole of a metal ball adsorbing jig having a metal ball adsorbing hole disposed thereon, wherein a metal ball is adsorbed to the metal ball adsorbing hole, and then a flux or cream solder is applied to the adsorbed metal ball. In the metal sphere arrangement method of mounting metal spheres on an arrangement target by transferring the spheres to the arrangement target, a flux supply hole is arranged on the flux supply plate at a position corresponding to the metal sphere suction hole of the metal sphere arrangement jig. Then, the metal spheres adsorbed to the metal sphere suction holes of the metal sphere array jig are brought into contact with the flux supply holes, and then the flux or cream solder is supplied from the back surface of the flux supply plate, whereby the flux is supplied to the flux supply holes. Alternatively, a flux or cream solder is applied to the surface of the metal sphere by filling with cream solder. 3. After applying a flux or cream solder to the surface of the metal ball and separating the metal ball from the flux supply plate, the flux or cream solder protruding from the flux supply hole to the surface of the flux supply plate is removed. The method for arranging metal spheres according to claim 2 , wherein the wiping is performed. 4. The flux supply hole is filled with flux or cream solder by a flux pressurizing device disposed on the back side of the flux supply plate.
4. The method for arranging metal spheres according to any one of claims 1 to 3 . 5. A metal ball sequence method according to claim 1 or 3, characterized in that wiping the flux or cream solder protruded on the surface of the flux supply plate by the squeegee. 6. A metal ball sequence method according to claim 1 or 3, characterized in that wiping the flux or cream solder protruded on the surface of the flux supply plate by tape. 7. The method according to claim 1, wherein the diameter of the flux supply hole is 1/3 to 9/10 of the diameter of the metal sphere.
7. The method for arranging metal spheres according to any one of claims 1 to 6 . 8. A metal ball arrangement jig having a metal ball adsorption hole disposed therein, a transfer table for transferring the metal ball adsorbed to the metal ball adsorption hole of the metal ball arrangement jig to an arrangement target, and the metal ball. A flux supply plate in which a flux supply hole is arranged at a position corresponding to the metal ball suction hole of the array jig; and a flux or cream solder supplied from the back surface of the flux supply plate to fill the flux supply hole with flux or cream solder. Flux supply device, and a flow through the flux supply hole.
Flux or cleats protruding from the surface of the
Has a wiping device and wiping solder over arm, adsorbs metal sphere metal ball suction holes of the metallic ball aligning jig, said flat
Apply flux or cream solder from the back of the
To supply flux or flux to the flux supply hole.
Fills with cream solder and then supplies the flux
Flux protruding from the hole to the surface of the flux supply plate
Or, wipe the cream solder, and then apply the flux or cream solder to the surface of the metal sphere by bringing the adsorbed metal sphere into contact with the flux supply hole, and apply the flux or cream to the arrangement target placed on the transfer table. An apparatus for arranging metal spheres, which transfers a metal sphere coated with solder. 9. A metal ball arrangement jig having metal ball adsorption holes arranged thereon, a transfer table for transferring the metal balls adsorbed to the metal ball adsorption holes of the metal ball arrangement jig to an arrangement target, and the metal balls. A flux supply plate in which a flux supply hole is arranged at a position corresponding to the metal ball suction hole of the array jig; and a flux or cream solder supplied from the back surface of the flux supply plate to fill the flux supply hole with flux or cream solder. to and a flux supply device, a metal ball adsorbed on metal ball suction holes of the metallic ball aligning jig, before the absorbing wearing metal balls
Contact the flux supply hole, and then
Supply flux or cream solder from the back of the supply plate
To the flux supply hole.
A metal characterized in that flux or cream solder is applied to the surface of the metal sphere by filling it with solder, and the metal sphere coated with the flux or cream solder is transferred to an arrangement target placed on the transfer table. Ball array device. 10. The metal ball arrangement device according to claim 8, wherein the flux supply device is a flux pressurizing device disposed on the back side of the flux supply plate. 11. The metal ball arranging device according to claim 9, further comprising a wiping device for wiping off the flux or cream solder that has protruded from the flux supply hole to the surface of the flux supply plate. 12. The apparatus according to claim 8, wherein the flux wiping device is a squeegee wiping device.
Or the metal ball arrangement device according to 11. 13. The apparatus according to claim 8, wherein said flux wiping device is a wiping device using a tape.
Is a metal ball arrangement device according to item 11. 14. The method according to claim 1, wherein the diameter of the flux supply hole is 1/3 to 9/10 of the diameter of the metal sphere.
14. The metal ball arrangement device according to any one of 8 to 13.