JPH03108506A - Production of distributing substrate - Google Patents

Abstract

PURPOSE:To accurately hold a calcined sheet and to form a high-precision wiring by constituting the title distribution substrate so that a rectangular positioning part has a side part extended to the outside by estimating the shrinkage amount due to calcination for the side part of the rectangular positioning part formed on the calcined sheet. CONSTITUTION:A plurality of sheets of green sheet 1 are laminated at prescribed thickness. A plurality of pieces of rectangular holes 3 are arranged on the boundaries of the respective base bodies 2, punched and formed. These rectangular holes 3 are formed by sticking a rectangular pin to a press and punching the green sheet 1 and formed into a regular tetragon. The respective sides of the rectangular hole 3 are extended to the outsides while holding the extended amount estimating the shrinkage amount due to calcination of the green sheet for the respective sides of a rectangular hole 3A having size and dimension necessary to coincidently engage the positioning pin of a positioning jig. Thereby the base bodies 2 are accurately positioned and held. A wiring can be formed at high precision.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a manufacturing method for obtaining a wiring board having a positioning notch on the periphery of a base made of a fired ceramic body.

(Prior Art) One of the methods for manufacturing wiring boards used in electronic devices is to arrange the substrates of multiple wiring boards using a method such as a doctor blade method using ceramic powder.
In other words, there is a method of forming a green sheet large enough to make a large number of pieces, and firing this green sheet to produce a rectangular shape with a size in which the bases of a plurality of wiring boards are lined up.
This method has the advantage of being able to fabricate a plurality of wiring board substrates at once, resulting in good production efficiency.

According to this manufacturing method, a wiring board is manufactured by forming wiring on a manufactured base, but in order to form wiring on a base with high precision, the following method is being considered. That is, a square hole for positioning is punched out in a green sheet, and then, after firing, the square hole is divided and cut to form a base having a V-shaped notch serving as a positioning portion on the periphery. Then, this base body is placed on a positioning jig, and a positioning pin provided on the positioning jig is engaged with a notch formed in the base body to position the base body at a predetermined position, and wiring is formed on the base body in this state. be. In this method, since the notch in the base body is V-shaped, there is an advantage that the notch can easily receive the positioning pin stably, and the positioning pin can easily hold the base body stably.

(Problem to be Solved by the Invention) However, when this positioning method is implemented, the positioning pin of the positioning jig cannot match and engage with the V-shaped notch formed in the base, and the positioning pin cannot be used. The holding of the base was unstable and the characteristics of the V-shaped notch could not be utilized. The positioning pins may not be able to stably hold the base in a predetermined position. In this case, it may not be possible to accurately form wiring on the surface of the base. In particular, when wiring is formed by a thin film method such as vapor deposition, high positional accuracy is required with respect to the substrate in order to accurately form the wiring.

The present invention has been made based on the above-mentioned circumstances, and an object of the present invention is to provide a method for manufacturing a wiring board in which wiring can be formed with high accuracy by accurately positioning and holding a base.

[Structure of the Invention] (Means and Effects for Solving the Problems)) The inventor of the present invention has conducted various studies on means for positioning a substrate in manufacturing wiring boards.

First, the inventor punched out square holes for positioning at the green sheet stage, and then divided and cut the square holes after firing to create a substrate having a V-shaped notch on the periphery as a positioning part. In this method, we investigated the reason why the positioning pin of the positioning jig cannot match and engage with the V-shaped notch formed in the base, and the holding of the base by the positioning pin becomes unstable. As a result, we found the following. That is, the dimensions of the square holes formed in the fired sheet obtained by firing must be large enough to allow the positioning pins of the positioning jig to fit and engage. However, conventionally, the square holes formed in the green sheet have the same size as the square holes formed in the fired sheet after firing. For this reason, when the square hole shrinks due to firing of the green sheet, each side of the square hole shrinks and the opening area of the entire square hole becomes smaller, and the dimensions of the square hole match the positioning pin of the positioning jig. It turned out that it would be impossible to secure a size that would fit.

Therefore, the inventor set the size of the square hole formed in the green sheet to the size necessary to match and engage the positioning pin, plus the shrinkage of the square hole due to firing of the green sheet. It has been found that by doing this, even if the square hole shrinks as the green sheet is fired, the size of the square hole after firing can be ensured to be the size necessary for matching and engaging the positioning pin. When the substrate of the wiring board is formed by cutting the rectangular shape, the dimensions of the V-shaped notch formed in the substrate have the size required for matching and engaging the locating pin, and the locating pin It has been found that the base body can be stably held in a predetermined position by mating and engaging the notch.

The present invention has been made based on this knowledge.

The method for manufacturing a wiring board of the present invention includes a step of punching out a square positioning portion from a ceramic green sheet using a square punch, and a step of firing the green sheet, and forming the positioning portion in the positioning portion forming step. The rectangular positioning part is characterized in that it has a part of the side that is expanded outward in anticipation of the amount of shrinkage due to the firing with respect to the side part of the rectangular positioning part formed on the fired sheet. .

Specifically, the square positioning part formed in the positioning part forming step has an overhang in the range of 10 to 20% of the length of the -side with respect to the side of the square positioning part formed on the fired sheet. It is preferable to have a side portion that protrudes outward by a certain amount.

Several examples can be given for implementing the method for manufacturing a wiring board of the present invention. For example, each green sheet that will become the base of a wiring board is formed individually, positioning parts of various shapes such as square holes and cutouts are formed in each of these green sheets, and the green sheets are fired to produce the base. There is a way. In this case, the wiring is formed by positioning each substrate individually.

Furthermore, there is a method in which square holes are formed as positioning parts in a large green sheet in which the bases of multiple wiring boards are lined up, wiring is formed on each base of the fired sheet after firing, and then the bases are cut into multiple rectangular bases. There is. In addition, a square hole was formed as a positioning part in a large green sheet on which multiple wiring board substrates were lined up, and after firing, the square hole was divided and cut to create multiple substrates with V-shaped notches on the periphery. There is a way to do it. In this case, the wiring is formed by positioning each substrate individually. Among these methods, the third method is preferable because it has good productivity and allows effective use of the positioning section.

The method for manufacturing a wiring board according to the present invention will be explained based on the above-mentioned preferred method.

The ceramic forming the base of the wiring board targeted by the present invention can be various ceramic materials such as silicon nitride, silicon oxide, alumina, and zirconia.

First, as shown in FIG. 2, a green sheet 1 is formed by a forming method such as a doctor blade method using a material powder made by adding an organic binder to a predetermined ceramic material. This green sheet 1 is a base 2 of a plurality of wiring boards.
Let it be the size of the array.

Next, a plurality of green sheets 1 are laminated to a predetermined thickness, and the first
As shown in the figure, a plurality of square holes 3 are punched out and arranged on the boundary line of each base 2. The square hole 3 is formed by punching out the green sheet 1 by attaching a square pin to a press. The square hole 3 is a square hole, and each side of the square hole 3 has a size necessary for matching and engaging the positioning pin of the positioning jig, as shown in Fig. 6. 3
Each side of A (indicated by imaginary lines) protrudes outward by an amount that takes into account shrinkage due to firing of the green sheet. That is, if the length of one side of the square hole 3A having the required size is g and the amount of overhang of one side of the square hole 3 formed in the L1 green sheet 1 is g, then the relationship between the two is II/L-0,10. Set it so that it becomes ~0,20.

Next, the green sheet 1 is fired to obtain a fired sheet IA as shown in FIG. The fired sheet IA is shrunk from the green sheet 1, and the square hole 3 is accordingly shrunk by the overhang amount g on each side to form a square hole 3A having dimensions necessary for matching and engaging the positioning pin. becomes. In other words,
The length of one side of this square hole 3A is large enough to allow positioning pins provided on the positioning jig to match and engage on a pair of adjacent sides.

Next, as shown in FIG. 4, a plurality of substrates 2 are produced by cutting the fired sheet IA along the boundaries of the substrates 2 of each wiring board with a cutting blade of a saw. Square hole 3 is located on the line, and square hole 3 is located by cutting the boundary line.
is divided into two parts into a V shape. A plurality of V-shaped notches 4 are formed at the peripheral edge of each base 2 thus produced.

This V-shaped notch 4 has dimensions as large as necessary for matingly engaging the locating pin.

Next, wiring in a predetermined pattern is formed on the surface of the base 2 thus produced by a thin film method.

In this case, as shown in FIG. 5, the base body 2 is placed in a positioning jig (not shown), and a positioning pin 5 provided on the positioning jig is engaged with a notch 4 formed in the peripheral portion of the base body 2. In this case, as shown in FIG. 7, the notch 5 of the base body 2 has a size that allows the positioning pin 5 to match and engage with a pair of adjacent sides, so that the positioning pin 5 is Match and engage. For this reason, the base body 2 is attached to the positioning pin 5.
This allows the wiring to be stably held in a predetermined position and to form wiring on the surface of the base 2 with high precision.

In addition, when cutting the fired sheet IA along the substrate boundary as shown in FIGS. 1 to 5 and 7, the cutting blade of the saw machine cuts the center of the square hole 3A located on the boundary line. Since cutting is performed, the size of the square hole 3A is set including the cutting allowance S by this cutting blade. In this case, the cutting distance S
is set to a size that can absorb processing errors within the required range and alignment errors of the cutting blade during cutting.

In addition, in order to form wiring with high accuracy using the thin film method, it is necessary to maintain a high accuracy in the positional relationship between the external dimensions of the base 2 of the wiring board and the positioning notch 4. Therefore, the peripheral edge of the base body 2 cut from the fired sheet IA is polished to finish the outer shape with high dimensional accuracy. Therefore, the external dimensions of the base body 2 when cut from the fired sheet IA are set to include the polishing allowance T. In accordance with this, the size of the square hole 2 is set including the polishing allowance Tx2.

In this case, the polishing allowance T is set to a size that can absorb processing errors within the required range.

Therefore, the size of the square hole 3A after firing formed in the fired sheet is set so that the positioning pin of the positioning jig matches and engages with the square hole 3A, and also includes the cutting allowance S and the polishing allowance TX2 described above. That is, the size of the square holes 3 formed in the green sheet 1 before firing is the same as that of the square holes 3 after firing as described above.
Set this by considering the size of A.

(Example) An example of the method for manufacturing a wiring board according to the present invention will be described below.

First, as shown in FIG.
A green sheet 1 having a size of 50 mm x 150 mm is formed. This green sheet 1 has the size of four wiring board bases 2 arranged side by side.

Next, a plurality of green sheets 1 are laminated to a predetermined thickness, and the first
As shown in the figure, two square holes 3 each having a square shape are punched out on the boundary line of each base body 2.

The square hole 3 is formed by punching out the green sheet 1 by attaching a square pin to a press. As shown in Fig. 6, each side of the square hole 3 extends outward by an amount that takes into account shrinkage due to the firing of the green sheet relative to each side of the square hole 3A (indicated by imaginary lines) after firing the green sheet. It is.

Here, the length of one side of the square hole 3A after firing is set to be 1H. Taking into consideration the amount of shrinkage of one side of the square hole 3 due to firing of the green sheet 1, one side of the square hole 3 is set to a size that projects outward from the square hole 3A by setting the overhang amount g to 0.11. . That is, it is set as II/L-0,1.

Next, the green sheet 1 is fired to obtain a fired sheet IA as shown in FIG. The fired sheet IA is shrunk from the green sheet 1, and accordingly, the square hole 3 is shrunk by the amount g of protrusion on each side, becoming a square hole 3A having dimensions large enough to match and engage the positioning pin.

Next, as shown in FIG. 4, the fired sheet IA was cut along the boundaries of the base bodies 2 of each wiring board using a cutting blade of a saw to produce a plurality of base bodies 2.

By this cutting, each square hole 3A located on the boundary line of the base body 2 is divided into V-shapes. Two plurality of V-shaped notches 4 are formed on two peripheral edges of each base body 2 thus produced.

Next, the periphery of the fabricated base 2 was polished.

Next, a predetermined pattern of wiring was formed on the surface of each substrate 2 by a thin film method. In this case, as shown in FIG.
is placed on a positioning jig (not shown), and a positioning pin 5 provided on the positioning jig is engaged with a notch 4 formed on the peripheral edge of the base body 2. In this case, as shown in FIG. 7, the notch 5 of the base body 2 has a size that allows the positioning pin 5 to match and engage with a pair of adjacent sides, so that the positioning pin 5 is Match and engage. For this reason, the base 2
is stably held in a predetermined position by the positioning pin 5,
Wiring could be formed on the surface of the base 2 with high precision.

In addition, in the explanation so far, the positioning parts formed on the green sheet, such as square holes, are used to cut and form wiring, but in addition to this, for example, corners are placed on each corner of the base 2 to be cut from the green sheet. By forming holes, connecting and cutting these square holes, it is possible to create a base body 2 in which each corner is diagonally cut out, as shown in FIG. When the corner portions are in the so-called zero plane in this manner, damage due to stress concentration at the corner portions of the base body 2 can be prevented.

Therefore, when manufacturing the wiring board of the present invention, it is possible to manufacture the wiring board with even higher productivity by employing the method described below.

Conventionally, when punching blanks, forming through-holes, and cutting external shapes on green sheets, specialized equipment such as a mold press, punching device, and knife cutter is used in each process, which requires a lot of processing time. It requires equipment and a large number of man-hours for processing.
Further, since processing is carried out using dedicated jigs for each step, dimensional deviations between the jigs may cause deviations in the positional relationship between the outer shape of the green sheet and the through holes.

Therefore, by preparing a mold with pins and holding the green sheet in a fixed position with the pins of this mold, blank punching, through-hole formation, and outline cutting can be performed in one process.

For example, through holes with a diameter of 0.10+u+ are formed at intervals of 1.0+gm in a green sheet with a thickness of 2 mm and a size of 150 ma + x 150 mm, and the external dimension is 50.0 a.
uiX50. Cutting with O was carried out using the present method and the conventional method. As a result, the accuracy of the through holes was 0.10±0.02mm in diameter and 1.0±0.05mm in pitch using this method.
ts, but in the conventional method the diameter was 0.10±0,
The 0411% interval was 1.0±0.10■. The external dimensions were 50.0±0.1 mm according to the present method, whereas they were 50.0±0.5 IIm according to the conventional method. The time required to process one green sheet using this method was 115 to 1/6 of that of the conventional method.

[Effects of the Invention] As described above, according to the method for manufacturing a wiring board of the present invention, the positioning portion is formed at the green sheet stage with a size that takes into account shrinkage due to firing, so the green sheet is not fired. The positioning part can be maintained at the required size at the stage where the square is formed. Therefore, when forming wiring on the surface of the fired sheet, the positioning pin of the positioning jig can be aligned and engaged with the positioning part of the fired sheet. It is possible to accurately hold the sheet in various square positions and form wiring on the surface of the fired sheet with high precision.

[Brief explanation of drawings]

1 to 4 are diagrams for explaining the steps of the wiring board manufacturing method of the present invention, FIGS. 5 and 6 are diagrams for explaining the positioning portion formed on the base of the wiring board, and FIGS. 8
The figure shows the base of the wiring board. 1...green sheet, IA...fired sheet, 2.
...Base, 3.3A...Square hole (positioning part), 4...
- Notch part (positioning part), 5... positioning pin. Figure 5

Claims (3)

[Claims] (1) A step of punching and forming a square positioning part on a ceramic green sheet using a square punch,
and a step of firing a green sheet to obtain a fired sheet, and the square positioning part formed in the positioning part forming step has a shrinkage amount due to the firing with respect to the side part of the square positioning part formed on the fired sheet. 1. A method of manufacturing a wiring board, characterized in that the wiring board has a side portion enlarged outwardly in consideration of the above. (2) The rectangular positioning part formed in the positioning part forming step has a side that extends outward by 10 to 20% of the length of one side of the side of the finally obtained rectangular positioning part. The method for manufacturing a wiring board according to claim 1. (3) Rectangular square holes are formed in the green sheet in the positioning portion forming step, and after the firing step, the fired sheet is cut by dividing the square holes to form a fired body having a V-shaped positioning portion on the periphery. A method of manufacturing the wiring board described above.