JP7327410B2 - ポリアミック酸エステル樹脂組成物 - Google Patents

ポリアミック酸エステル樹脂組成物 Download PDF

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Publication number
JP7327410B2
JP7327410B2 JP2020553099A JP2020553099A JP7327410B2 JP 7327410 B2 JP7327410 B2 JP 7327410B2 JP 2020553099 A JP2020553099 A JP 2020553099A JP 2020553099 A JP2020553099 A JP 2020553099A JP 7327410 B2 JP7327410 B2 JP 7327410B2
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Japan
Prior art keywords
group
acid ester
polyamic acid
ester resin
resin composition
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JP2020553099A
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Japanese (ja)
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JPWO2020080206A5 (https=
JPWO2020080206A1 (ja
Inventor
友輝 臼井
拓矢 大橋
隼人 服部
和宏 澤田
雅久 遠藤
崇洋 坂口
一樹 平佐田
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Nissan Chemical Corp
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Nissan Chemical Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2020553099A 2018-10-15 2019-10-09 ポリアミック酸エステル樹脂組成物 Active JP7327410B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018194129 2018-10-15
JP2018194129 2018-10-15
PCT/JP2019/039733 WO2020080206A1 (ja) 2018-10-15 2019-10-09 ポリアミック酸エステル樹脂組成物

Publications (3)

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JPWO2020080206A1 JPWO2020080206A1 (ja) 2021-10-07
JPWO2020080206A5 JPWO2020080206A5 (https=) 2022-07-08
JP7327410B2 true JP7327410B2 (ja) 2023-08-16

Family

ID=70284628

Family Applications (1)

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JP2020553099A Active JP7327410B2 (ja) 2018-10-15 2019-10-09 ポリアミック酸エステル樹脂組成物

Country Status (3)

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JP (1) JP7327410B2 (https=)
TW (1) TW202028303A (https=)
WO (1) WO2020080206A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024033021A (ja) * 2021-01-14 2024-03-13 日産化学株式会社 感光性樹脂組成物中の金属不純物を除去する金属除去フィルターを用いた金属除去方法
CN117120512A (zh) * 2021-03-30 2023-11-24 富士胶片株式会社 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件、以及聚酰亚胺前驱体
WO2022210532A1 (ja) 2021-03-30 2022-10-06 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス、並びに、ポリイミド前駆体及びその製造方法
JPWO2025013140A1 (https=) * 2023-07-07 2025-01-16

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008107766A (ja) 2006-07-21 2008-05-08 Toray Ind Inc 位相差薄膜用樹脂組成物、液晶表示装置用カラーフィルター基板、および液晶表示装置、並びに位相差薄膜付き液晶表示装置用カラーフィルター基板の製造方法
WO2015159911A1 (ja) 2014-04-18 2015-10-22 ナガセケムテックス株式会社 レジスト樹脂及びその製造方法
JP2016021068A (ja) 2010-09-30 2016-02-04 大日本印刷株式会社 感光性樹脂組成物、パターン形成用材料及びパターン形成方法
US20160083509A1 (en) 2014-09-23 2016-03-24 Samsung Sdi Co., Ltd. Polyamide Ester Resin, Method for Preparing the Same, and Molded Article Including the Same
WO2017094898A1 (ja) 2015-12-03 2017-06-08 日産化学工業株式会社 液晶配向剤、液晶配向膜及びそれを用いた液晶表示素子

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0920865A (ja) * 1995-07-06 1997-01-21 Toray Ind Inc カラーペースト、樹脂ブラック・マトリクス用ペーストおよびカラーフィルタ
JPH09184912A (ja) * 1995-12-28 1997-07-15 Toray Ind Inc 樹脂ブラック・マトリクスおよび樹脂ブラック・マトリクス用ペースト

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008107766A (ja) 2006-07-21 2008-05-08 Toray Ind Inc 位相差薄膜用樹脂組成物、液晶表示装置用カラーフィルター基板、および液晶表示装置、並びに位相差薄膜付き液晶表示装置用カラーフィルター基板の製造方法
JP2016021068A (ja) 2010-09-30 2016-02-04 大日本印刷株式会社 感光性樹脂組成物、パターン形成用材料及びパターン形成方法
WO2015159911A1 (ja) 2014-04-18 2015-10-22 ナガセケムテックス株式会社 レジスト樹脂及びその製造方法
US20160083509A1 (en) 2014-09-23 2016-03-24 Samsung Sdi Co., Ltd. Polyamide Ester Resin, Method for Preparing the Same, and Molded Article Including the Same
WO2017094898A1 (ja) 2015-12-03 2017-06-08 日産化学工業株式会社 液晶配向剤、液晶配向膜及びそれを用いた液晶表示素子

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WO2020080206A1 (ja) 2020-04-23
TW202028303A (zh) 2020-08-01
JPWO2020080206A1 (ja) 2021-10-07

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