JP7325904B2 - 切削ユニットの位置検出方法、及び切削装置 - Google Patents

切削ユニットの位置検出方法、及び切削装置 Download PDF

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Publication number
JP7325904B2
JP7325904B2 JP2019137608A JP2019137608A JP7325904B2 JP 7325904 B2 JP7325904 B2 JP 7325904B2 JP 2019137608 A JP2019137608 A JP 2019137608A JP 2019137608 A JP2019137608 A JP 2019137608A JP 7325904 B2 JP7325904 B2 JP 7325904B2
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Japan
Prior art keywords
cutting
unit
cutting blade
blade
height position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019137608A
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English (en)
Japanese (ja)
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JP2021020268A (ja
Inventor
治信 湯澤
雅史 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2019137608A priority Critical patent/JP7325904B2/ja
Priority to KR1020200073321A priority patent/KR20210012901A/ko
Priority to CN202010708611.7A priority patent/CN112297257B/zh
Priority to TW109125030A priority patent/TWI840594B/zh
Publication of JP2021020268A publication Critical patent/JP2021020268A/ja
Application granted granted Critical
Publication of JP7325904B2 publication Critical patent/JP7325904B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B23Q17/0904—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool before or after machining
    • B23Q17/0919—Arrangements for measuring or adjusting cutting-tool geometry in presetting devices
    • B23Q17/0923—Tool length
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/002—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring the holding action of work or tool holders
    • B23Q17/003—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring the holding action of work or tool holders by measuring a position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/10—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting speed or number of revolutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
    • B23Q17/2283—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work for adjusting the distance between coaxially rotating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/248—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves using special electromagnetic means or methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/026—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade carried by a movable arm, e.g. pivoted
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
JP2019137608A 2019-07-26 2019-07-26 切削ユニットの位置検出方法、及び切削装置 Active JP7325904B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019137608A JP7325904B2 (ja) 2019-07-26 2019-07-26 切削ユニットの位置検出方法、及び切削装置
KR1020200073321A KR20210012901A (ko) 2019-07-26 2020-06-17 절삭 유닛의 위치 검출 방법, 및 절삭 장치
CN202010708611.7A CN112297257B (zh) 2019-07-26 2020-07-22 切削单元的位置检测方法和切削装置
TW109125030A TWI840594B (zh) 2019-07-26 2020-07-24 切削單元的位置檢測方法、及切削裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019137608A JP7325904B2 (ja) 2019-07-26 2019-07-26 切削ユニットの位置検出方法、及び切削装置

Publications (2)

Publication Number Publication Date
JP2021020268A JP2021020268A (ja) 2021-02-18
JP7325904B2 true JP7325904B2 (ja) 2023-08-15

Family

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JP2019137608A Active JP7325904B2 (ja) 2019-07-26 2019-07-26 切削ユニットの位置検出方法、及び切削装置

Country Status (3)

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JP (1) JP7325904B2 (ko)
KR (1) KR20210012901A (ko)
CN (1) CN112297257B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116021654B (zh) * 2023-04-02 2023-07-25 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种晶片切割自动换刀装置的换刀方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150194354A1 (en) 2014-01-03 2015-07-09 Chi Wah Cheng Singulation apparatus comprising an imaging device
JP2017202546A (ja) 2016-05-11 2017-11-16 株式会社ディスコ 切削装置
JP2018069346A (ja) 2016-10-24 2018-05-10 株式会社ディスコ 切削装置
JP2019071334A (ja) 2017-10-06 2019-05-09 株式会社ディスコ 切削装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3101072B2 (ja) * 1992-03-23 2000-10-23 西部電機株式会社 Ｎｃ工作機械における刃先の経時変位補正装置
EP0737121B1 (en) * 1994-10-31 1999-05-06 Koninklijke Philips Electronics N.V. Method of measuring a reference position of a tool relative to a workpiece, and machine tool for carrying out said method
JP4590058B2 (ja) 2000-04-12 2010-12-01 株式会社ディスコ 切削装置の切削ブレード検出機構
JP2001293642A (ja) * 2000-04-14 2001-10-23 Toyoda Mach Works Ltd 工具刃先部突出量測定方法及び工具摩耗量測定方法並びにその測定方法を用いた数値制御工作機械
JP2003251546A (ja) * 2002-02-28 2003-09-09 Toyoda Mach Works Ltd 工具刃先測定方法及び装置
JP5452973B2 (ja) * 2009-04-28 2014-03-26 富士機械製造株式会社 撮像装置及びその撮像装置を備える切削機械
JP6727699B2 (ja) * 2016-04-19 2020-07-22 株式会社ディスコ 切削装置のセットアップ方法
JP6932436B2 (ja) * 2017-05-24 2021-09-08 株式会社ディスコ 切削装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150194354A1 (en) 2014-01-03 2015-07-09 Chi Wah Cheng Singulation apparatus comprising an imaging device
JP2017202546A (ja) 2016-05-11 2017-11-16 株式会社ディスコ 切削装置
JP2018069346A (ja) 2016-10-24 2018-05-10 株式会社ディスコ 切削装置
JP2019071334A (ja) 2017-10-06 2019-05-09 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
TW202106441A (zh) 2021-02-16
CN112297257B (zh) 2024-03-12
CN112297257A (zh) 2021-02-02
JP2021020268A (ja) 2021-02-18
KR20210012901A (ko) 2021-02-03

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