JP7323853B1 - はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置 - Google Patents
はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置 Download PDFInfo
- Publication number
- JP7323853B1 JP7323853B1 JP2023002971A JP2023002971A JP7323853B1 JP 7323853 B1 JP7323853 B1 JP 7323853B1 JP 2023002971 A JP2023002971 A JP 2023002971A JP 2023002971 A JP2023002971 A JP 2023002971A JP 7323853 B1 JP7323853 B1 JP 7323853B1
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electronic circuit
- less
- alloy
- solder alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 173
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 121
- 239000000956 alloy Substances 0.000 title claims abstract description 121
- 229910052742 iron Inorganic materials 0.000 claims abstract description 11
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 4
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 4
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 4
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 description 41
- 239000010949 copper Substances 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 23
- 238000012360 testing method Methods 0.000 description 20
- 238000004781 supercooling Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 12
- 238000001556 precipitation Methods 0.000 description 12
- 230000007423 decrease Effects 0.000 description 11
- 230000004907 flux Effects 0.000 description 11
- 229910006913 SnSb Inorganic materials 0.000 description 10
- 239000013078 crystal Substances 0.000 description 10
- 238000007711 solidification Methods 0.000 description 10
- 230000008023 solidification Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 239000000470 constituent Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910016347 CuSn Inorganic materials 0.000 description 6
- 238000005304 joining Methods 0.000 description 6
- 239000002244 precipitate Substances 0.000 description 6
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 230000007257 malfunction Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- 238000005728 strengthening Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 230000005260 alpha ray Effects 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 1
- 101000993059 Homo sapiens Hereditary hemochromatosis protein Proteins 0.000 description 1
- 229910008336 SnCo Inorganic materials 0.000 description 1
- 229910008452 SnFe Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- -1 heat sinks Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023002971A JP7323853B1 (ja) | 2023-01-12 | 2023-01-12 | はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置 |
| CA3225073A CA3225073C (en) | 2023-01-12 | 2023-12-29 | Solder alloy, solder paste, solder ball, solder preform, soft solder joint, vehicle-mounted electronic circuit, electronic control unit electronic circuit, vehicle-mounted electronic circuit device, and ECU electronic circuit device |
| MX2024000652A MX2024000652A (es) | 2023-01-12 | 2024-01-11 | Aleacion de soldadura, pasta de soldadura, bola de soldadura, preforma de soldadura, junta de soldadura, circuito electronico montado en el vehiculo, circuito electronico ecu, dispositivo de circuito electronico montado en el vehiculo y dispositivo de circuito electronico ecu. |
| US18/410,462 US20240238914A1 (en) | 2023-01-12 | 2024-01-11 | Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device |
| TW113101178A TWI874093B (zh) | 2023-01-12 | 2024-01-11 | 焊料合金、焊膏、焊球、焊料預成型體、焊料接頭、車載電子電路、ｅｃｕ電子電路、車載電子電路裝置及ｅｃｕ電子電路裝置 |
| KR1020240005558A KR20240112761A (ko) | 2023-01-12 | 2024-01-12 | 땜납 합금, 땜납 페이스트, 땜납 볼, 땜납 프리폼, 솔더 조인트, 차량 탑재 전자 회로, ecu 전자 회로, 차량 탑재 전자 회로 장치 및 ecu 전자 회로 장치 |
| EP24151694.7A EP4400251A1 (en) | 2023-01-12 | 2024-01-12 | Solder alloy, solder paste, solder ball, solder preform, solder joint, vehicle-mounted electronic circuit, ecu electronic circuit, vehicle-mounted electronic circuit device, and ecu electronic circuit device |
| CN202410225028.9A CN118321783A (zh) | 2023-01-12 | 2024-02-29 | 软钎料合金、焊膏、焊料球、预成型软钎料、钎焊接头、车载电子电路、ecu电子电路、车载电子电路装置和ecu电子电路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023002971A JP7323853B1 (ja) | 2023-01-12 | 2023-01-12 | はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP7323853B1 true JP7323853B1 (ja) | 2023-08-09 |
| JP2024099203A JP2024099203A (ja) | 2024-07-25 |
Family
ID=87519486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023002971A Active JP7323853B1 (ja) | 2023-01-12 | 2023-01-12 | はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20240238914A1 (enExample) |
| EP (1) | EP4400251A1 (enExample) |
| JP (1) | JP7323853B1 (enExample) |
| KR (1) | KR20240112761A (enExample) |
| CN (1) | CN118321783A (enExample) |
| CA (1) | CA3225073C (enExample) |
| MX (1) | MX2024000652A (enExample) |
| TW (1) | TWI874093B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7530027B1 (ja) | 2024-03-22 | 2024-08-07 | 千住金属工業株式会社 | はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119035866A (zh) * | 2024-10-09 | 2024-11-29 | 云南锡业新材料有限公司 | 一种高可靠性无铅焊料合金 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011102034A1 (ja) | 2010-02-16 | 2011-08-25 | 株式会社タムラ製作所 | 鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品 |
| JP2019104029A (ja) | 2017-12-12 | 2019-06-27 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置 |
| JP2019141880A (ja) | 2018-02-21 | 2019-08-29 | 千住金属工業株式会社 | Ｆｅ食われ防止用はんだ合金、やに入りはんだ、線はんだ、やに入り線はんだ、フラックス被覆はんだ、はんだ継手およびはんだ付け方法 |
| WO2021261486A1 (ja) | 2020-06-23 | 2021-12-30 | 千住金属工業株式会社 | はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015077601A (ja) * | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| JP6365653B2 (ja) * | 2016-08-19 | 2018-08-01 | 千住金属工業株式会社 | はんだ合金、はんだ継手およびはんだ付け方法 |
| JP2019072770A (ja) * | 2018-12-05 | 2019-05-16 | 千住金属工業株式会社 | 鉛フリーはんだ合金と車載電子回路 |
| JP6624322B1 (ja) * | 2019-03-27 | 2019-12-25 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手 |
| TWI814081B (zh) * | 2019-09-02 | 2023-09-01 | 美商阿爾發金屬化工公司 | 高溫超高可靠性合金、其製造方法及其應用 |
| CN115768591A (zh) * | 2020-04-10 | 2023-03-07 | 千住金属工业株式会社 | 软钎料合金、软钎料粉末、焊膏、焊料球、预成型软钎料和钎焊接头 |
| JP6836040B1 (ja) * | 2020-07-31 | 2021-02-24 | 千住金属工業株式会社 | はんだ合金 |
| JP7376133B2 (ja) * | 2021-06-23 | 2023-11-08 | 株式会社タツミ | 焚火台 |
-
2023
- 2023-01-12 JP JP2023002971A patent/JP7323853B1/ja active Active
- 2023-12-29 CA CA3225073A patent/CA3225073C/en active Active
-
2024
- 2024-01-11 US US18/410,462 patent/US20240238914A1/en active Pending
- 2024-01-11 MX MX2024000652A patent/MX2024000652A/es unknown
- 2024-01-11 TW TW113101178A patent/TWI874093B/zh active
- 2024-01-12 EP EP24151694.7A patent/EP4400251A1/en active Pending
- 2024-01-12 KR KR1020240005558A patent/KR20240112761A/ko active Pending
- 2024-02-29 CN CN202410225028.9A patent/CN118321783A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011102034A1 (ja) | 2010-02-16 | 2011-08-25 | 株式会社タムラ製作所 | 鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品 |
| JP2019104029A (ja) | 2017-12-12 | 2019-06-27 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置 |
| JP2019141880A (ja) | 2018-02-21 | 2019-08-29 | 千住金属工業株式会社 | Ｆｅ食われ防止用はんだ合金、やに入りはんだ、線はんだ、やに入り線はんだ、フラックス被覆はんだ、はんだ継手およびはんだ付け方法 |
| WO2021261486A1 (ja) | 2020-06-23 | 2021-12-30 | 千住金属工業株式会社 | はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置 |
| JP2022002855A (ja) | 2020-06-23 | 2022-01-11 | 千住金属工業株式会社 | はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置 |
Cited By (2)
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|---|---|---|---|---|
| JP7530027B1 (ja) | 2024-03-22 | 2024-08-07 | 千住金属工業株式会社 | はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置 |
| WO2025197903A1 (ja) * | 2024-03-22 | 2025-09-25 | 千住金属工業株式会社 | はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202434385A (zh) | 2024-09-01 |
| EP4400251A1 (en) | 2024-07-17 |
| CA3225073A1 (enExample) | 2025-02-27 |
| KR20240112761A (ko) | 2024-07-19 |
| JP2024099203A (ja) | 2024-07-25 |
| MX2024000652A (es) | 2024-07-15 |
| TWI874093B (zh) | 2025-02-21 |
| US20240238914A1 (en) | 2024-07-18 |
| CN118321783A (zh) | 2024-07-12 |
| CA3225073C (en) | 2025-05-20 |
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